CN114423144B

CN114423144B - PCB (printed circuit board) and PCIE (peripheral component interconnect express) board card

Info

Publication number: CN114423144B
Application number: CN202111656776.5A
Authority: CN
Inventors: 计晶; 刘铁军; 陈三霞
Original assignee: Suzhou Inspur Intelligent Technology Co Ltd
Current assignee: Suzhou Inspur Intelligent Technology Co Ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2023-07-11
Anticipated expiration: 2041-12-30
Also published as: CN114423144A

Abstract

The application discloses PCB board and PCIE integrated circuit board thereof, wherein the PCB board includes: the PCB main part be equipped with the radiator on the PCB main part surface, the inside water conservancy diversion piece that stretches into the inside water conservancy diversion piece of PCB main part that is equipped with of radiator, water conservancy diversion piece and the inside ground wire layer contact connection of PCB main part realize the backward flow to the ground wire layer. The ground wire layer inside the PCB main body is subjected to a part of reflux function through the guide piece, so that the reflux of the ground wire layer can be increased through the radiator embedded with the guide piece under the condition that the size of the PCB main body board card and the lamination layer number of the PCB main body are not increased, and meanwhile, a good heat dissipation function is exerted.

Description

PCB (printed circuit board) and PCIE (peripheral component interconnect express) board card

Technical Field

The application relates to the technical field of data processing equipment, in particular to a PCB and a PCIE board card thereof.

Background

Currently, mainstream accelerator cards and intelligent network cards are usually made into standard PCIE cards. Standard PCIE boards typically include full length, three quarters of full length, half length, and 1.6mm thick boards, mainly for insertion into a server PCIE card slot. The main devices of the board generally comprise the following devices, such as CPU, GPU, DPU, FPGA, which are basically various power sources and high power consumption. For the standard PCIE card, the size and thickness of the board card are fixed, so that the power layout and heat dissipation are important due to the multiple power sources and high power consumption.

In order to meet the requirements of multiple power supplies and high power consumption, the common practice is to enlarge the size of the board, increase the number of layers of the PCB (Printed Circuit Board) laminated layers, enlarge the size of the board and increase the number of layers of the PCB laminated layers. Therefore, the power supply can be reasonably distributed, the voltage drop on the ground wire layer of the PCB can be effectively reduced, and the integrity of the power supply is ensured.

However, if the size of the board is increased, for example, the size of the board is changed from full half length to three-fourths length, which increases the cost, and some servers only fit the full half length of the board, so that the increase of the size of the board affects the fit. If the number of lamination layers is increased, the cost is greatly increased, because the thickness of the standard board card is fixed, the lamination is increased, the process difficulty is increased, and meanwhile, the upper limit of the lamination layers can not be increased infinitely due to the fixed thickness. Therefore, both the above methods cannot effectively solve the problems of voltage drop and heat dissipation on the ground plane of the PCB.

Disclosure of Invention

The purpose of this application is to provide a PCB board and PCIE integrated circuit board thereof to through increasing the mode to ground wire layer backward flow, under the prerequisite that does not increase PCB main part integrated circuit board size and number of piles, realize effectively reducing the pressure drop on ground wire layer right side in the PCB main part, in the meantime with the ground wire layer copper sheet heating in time scatter away, guarantee high-speed signal integrity.

According to some embodiments, the application provides a PCB board, comprising: the PCB main part be equipped with the radiator on the PCB main part surface, the inside water conservancy diversion piece that stretches into the inside water conservancy diversion piece of PCB main part that is equipped with of radiator, water conservancy diversion piece and the inside ground wire layer contact connection of PCB main part realize the backward flow to the ground wire layer.

Preferably, the guide member comprises a metal screw penetrating the PCB body and extending to the inside thereof to be in contact with the ground plane.

Preferably, a plurality of metal through holes are formed in the surface of the PCB main body, the inner walls of the metal through holes are in contact with the ground wire layer, and the metal screws are arranged in the metal through holes in a penetrating mode.

Preferably, a metal cover plate is arranged on one side of the PCB main body, which is away from the radiator, and the metal screw is threaded in the metal cover plate after penetrating through the metal via hole.

Preferably, the radiator is embedded with a radiator inside.

Preferably, the heat sink comprises a heat dissipation copper tube or an aluminum sheet.

Preferably, the two ends of the heat dissipation copper pipe are provided with sleeved parts, the metal screws penetrate through the sleeved parts at the two ends of the heat dissipation copper pipe, and the outer walls of the metal screws are in contact with the inner walls of the sleeved parts.

Preferably, the radiator is provided with a through hole for the metal screw to pass through, the sleeve arranged at the end part of the radiating copper pipe is positioned in the through hole, an elastic piece is arranged in the through hole, and the metal screw is elastically fixed under the action of the elastic piece.

Preferably, the through hole is a stepped hole, the head of the metal screw is provided with an annular boss matched with the large hole of the stepped hole, and the elastic piece comprises a spring, and the spring is sleeved on the metal screw and is fixed between the boss on the head of the metal screw and the bottom of the large hole of the stepped hole.

According to some embodiments, the application further provides a PCIE board card, including the PCB board.

Embodiments of the present disclosure have at least the following advantages:

adopt the radiator of PCB main part customization, share the inside ground wire layer's of PCB main part some backward flow function through the water conservancy diversion piece to can effectively reduce the pressure drop on ground wire layer right side, the radiator can also in time give off the heat on ground wire layer away simultaneously, guarantees high-speed signal integrality.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the drawings that are required to be used in the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

Fig. 1 is a schematic plan view of a PCB board according to an embodiment of the present application;

fig. 2 is a schematic cross-sectional view showing the interior of the PCB body and the heat sink in an embodiment of the present application.

Description of the drawings: 1. a PCB main body; 11. a metal via; 12. a ground plane; 2. a heat sink; 21. a through hole; 3. a metal screw; 31. a boss; 4. a metal cover plate; 5. a heat dissipation copper pipe; 51. a sleeving part; 6. and (3) a spring.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the embodiments of the present application will be described in detail below with reference to the accompanying drawings. However, as will be appreciated by those of ordinary skill in the art, in the various embodiments of the present application, numerous technical details have been set forth in order to provide a better understanding of the present application. However, the technical solutions claimed in the present application can be implemented without these technical details and with various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not be construed as limiting the specific implementation of the present application, and the embodiments may be combined with each other and cited with each other without contradiction.

At present, the mainstream accelerator card and the intelligent network card are generally made into standard PCIE cards, the types of power supplies of the boards are various, the power consumption is large, the power supply layout is usually compact, the ground line voltage drop of PCB (Printed Circuit Board) is too large, and the power supply integrity and the signal integrity are affected.

Therefore, in order to solve the above-mentioned problems, as described with reference to fig. 1 and 2, an embodiment of the present application provides a PCB board, including: the PCB main body 1 is provided with the radiator 2 in the front of the PCB main body 1, the inside of the radiator 2 is provided with the guide piece, and the guide piece stretches into the inside of the PCB main body 1 and is in contact connection with the ground wire layer 12, so that the reflux function of the ground wire layer 12 is realized.

Through set up the radiator 2 that has the water conservancy diversion piece in inside on PCB main part 1, can be under the circumstances that does not increase PCB main part 1 card size and PCB stromatolite layer number, share the function of partly backward flow of ground wire layer 12 in the PCB main part 1 through the water conservancy diversion piece to can effectively reduce the pressure drop on ground wire layer 12 right side, thereby make the pressure drop of power reduce, reduced the power loss of PCB main part 1 simultaneously, guarantee the power integrality. Meanwhile, the radiator 2 plays a good heat dissipation function, so that the copper sheet of the ground wire layer 12 is heated and timely dissipated, and the integrity of high-speed signals is guaranteed. Therefore, when the power layout on the PCB main body 1 is concentrated and the power is larger, the voltage drop on the ground layer 12 is not required to be reduced by increasing the card size of the PCB main body 1 and the PCB lamination, and the power integrity and the high-speed signal integrity are ensured, thereby realizing the cost reduction.

In this embodiment, a plurality of metal vias 11 are formed on the PCB main body 1, and the plurality of metal vias 11 are distributed at four end portions and a middle portion of the PCB main body 1, and the metal vias 11 are in contact connection with a ground layer 12 inside the PCB main body 1. The metal via 11 is formed by first penetrating the PCB body 1 through opposite sides thereof, and then plating copper on the inner wall of the hole, thereby realizing a metal via 11 having a conductive function.

In this embodiment, it should be noted that, the flow guiding member includes the metal screws 3, the number of the metal screws 3 corresponds to the number of the metal vias 11 on the PCB main body 1, and when the heat sink 2 is mounted on the front surface of the PCB main body 1, the positions of the metal screws 3 correspond to the positions of the metal vias 11, so that the heat sink 2 can be fixedly mounted on the PCB main body 1 through the metal screws 3 of the heat sink 2 itself. In order to make the stress of the PCB main body 1 uniform, a metal cover plate 4 is further provided on the back surface of the PCB main body 1, and by screwing the metal screw 3, the tip of the metal screw 3 extends out of the heat sink 2 and penetrates out of the metal via 11 and acts on the metal cover plate 4, so that the stress is transferred to the metal cover plate 4. In one example, the metal cover plate 4 may be perforated, and the metal screw 3 is fastened by a nut after being passed out from the position of the hole. Or the metal cover plate 4 is provided with a threaded hole, and the metal screw 3 is directly connected in the threaded hole in a threaded way.

The metal screws 3 on the one hand perform the fixing function for the heat sink 2, and on the other hand the metal screws 3 perform the reflow function for the ground plane 12, and the metal screws 3 are in contact connection with the ground plane 12 inside the PCB body 1 when they are inserted into the metal vias 11. The current of the ground wire layer 12 partially flows through the heat radiator 2 on the upper part from the ground wire layer 12, and the other part is conducted to the heat radiator 2 on the upper part through the metal screw 3, so that a part of the reflux function of the ground wire layer 12 can be shared, the voltage drop on the right side of the ground wire layer 12 is effectively reduced, the voltage drop of a power supply is reduced, the power loss of the PCB main body 1 is reduced, the integrity of the power supply is ensured, and the copper sheet of the ground wire layer 12 is heated and timely dispersed, and the integrity of a high-speed signal is ensured.

In this embodiment, it should be further noted that a heat dissipation member is further embedded in the heat sink 2, and heat dissipation is further achieved through the heat dissipation member, where the heat dissipation member includes a heat dissipation copper pipe 5 or an aluminum sheet, and in this embodiment, the heat dissipation member is taken as an example of the heat dissipation copper pipe 5. The heat dissipation copper pipe 5 is embedded in the radiator 2, through holes 21 are further formed in the radiator 2, the number of the through holes 21 is consistent with that of the metal screws 3, and the through holes 21 are matched with that of the metal screws 3. Preferably, the through hole 21 is provided as a stepped hole, wherein a side of the stepped hole, which is provided with the metal cover plate 4 near the PCB main body 1, is provided as a small hole, and a side of the stepped hole, which is provided with the metal cover plate 4 away from the PCB main body 1, is provided as a large hole. The head of the metal screw 3 is provided with an annular boss 31 which is matched with the large hole of the stepped hole, the metal screw 3 is arranged in the stepped hole, and the boss 31 of the metal screw 3 is matched with the large hole. An elastic piece is arranged between the boss 31 of the metal screw 3 and the bottom of the big hole, the metal screw 3 can be elastically fixed in the stepped hole through the elastic piece, and when the elastic piece is in a natural state, the distance between the boss 31 of the metal screw 3 and the bottom of the big hole is larger than the distance between the tail of the metal screw 3 and the end of the small hole. Therefore, in the process of pressing down the metal screw 3, the tail part of the metal screw 3 can be ensured to extend out of the stepped hole. In one example, the elastic member includes a spring 6, and the spring 6 is sleeved on the metal screw 3, and one end of the spring is fixed on the boss 31, and the other end of the spring is fixed on the bottom of the large hole, so that the metal screw 3 can be elastically supported in the stepped hole through the spring 6. When the radiator 2 is required to be installed, the head of the metal screw 3 is operated, so that the tail of the metal screw 3 extends out of the stepped hole and penetrates through the metal via hole 11 to be connected to the metal cover plate 4, and therefore fixed installation is achieved.

In another example, the heat dissipation copper pipe 5 may be provided with a sleeve portion 51 at both ends, the sleeve portion 51 is annular and is disposed parallel to the axial direction of the heat dissipation copper pipe 5 itself, the sleeve portion 51 is located in the small hole of the stepped hole, the outer wall of the sleeve portion 51 is attached to the inner wall of the small hole of the stepped hole, the metal screw 3 is inserted into the sleeve portion 51, and the outer wall of the metal screw 3 is in contact with the inner wall of the sleeve portion 51. So that the connection of the heat sink copper tube 5, the metal screw 3 and the ground plane 12 in the PCB body 1 can be achieved.

The principle of the embodiment of the present embodiment: firstly, arranging metal through holes 11 on a PCB main body 1, wherein the metal through holes 11 are connected with a ground wire layer 12 in the PCB main body 1, and the tail parts of the metal screws 3 penetrate through the metal through holes 11 and are connected to a metal cover plate 4 in a threaded manner through the operation of the metal screws 3, so that the heat radiator 2 is fixed; the metal screw 3 is connected with the heat dissipation copper pipe 5 buried in the radiator 2 through the sleeve part 51, so the heat dissipation copper pipe 5, the metal screw and the ground wire layer 12 of the PCB main body 1 are connected, one part of current on the ground wire layer 12 flows back through the metal screw 3 and the heat dissipation copper pipe 5, and the other part of current is shared to the surface of the PCB main body 1 to flow back, so the pressure drop on the right side of the ground wire layer 12 in the PCB main body 1 can be effectively reduced, and meanwhile, the copper sheet of the ground wire layer 12 is heated and timely dissipated through the radiator 2, so the high-speed signal integrity is ensured.

It is to be understood that the above-described embodiments of the present application are merely illustrative of or explanation of the principles of the present application and are in no way limiting of the present application. Accordingly, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present application are intended to be included within the scope of the present application. Furthermore, the appended claims are intended to cover all such changes and modifications that fall within the scope and boundary of the appended claims, or equivalents of such scope and boundary.

Claims

1. A PCB board, comprising: PCB main part (1) be equipped with radiator (2) on PCB main part (1) surface, radiator (2) inside is equipped with stretches into the inside water conservancy diversion piece of PCB main part (1), water conservancy diversion piece is connected with the inside ground wire layer (12) contact of PCB main part (1), realizes backward flow to ground wire layer (12), wherein, water conservancy diversion piece includes metal screw (3), metal screw (3) wear to locate PCB main part (1) and extend to its inside and ground wire layer (12) contact connection, the inside of radiator (2) is embedded to have the radiator, the radiator includes heat dissipation copper pipe (5) or aluminum sheet, the both ends of heat dissipation copper pipe (5) are provided with cover portion of establishing (51), the outer wall of metal screw (3) wear to establish the cover portion of establishing (51) inner wall contact at heat dissipation copper pipe (5) both ends.

2. The PCB board according to claim 1, wherein a plurality of metal vias (11) are provided on the surface of the PCB body (1), the inner walls of the metal vias (11) are in contact with the ground plane (12), and the metal screws (3) are arranged in the metal vias (11) in a penetrating manner.

3. The PCB board of claim 2, wherein a side of the PCB body (1) facing away from the heat sink (2) is provided with a metal cover plate (4), and the metal screw (3) is threaded into the metal cover plate (4) after passing through the metal via hole (11).

4. The PCB according to claim 1, wherein the radiator (2) is provided with a through hole (21) for the metal screw (3) to penetrate, the sleeve part (51) at the end part of the heat dissipation copper pipe (5) is positioned in the through hole (21), an elastic piece is arranged in the through hole (21), and the metal screw (3) is elastically fixed under the action of the elastic piece.

5. The PCB board of claim 4, wherein the through hole (21) is provided as a stepped hole, the head of the metal screw (3) is provided with an annular boss (31) adapted to a large hole of the stepped hole, the elastic member comprises a spring (6), and the spring (6) is sleeved on the metal screw (3) and is fixed between the boss (31) on the head of the metal screw (3) and the bottom of a large hole of the stepped hole.

6. PCIE board card, characterized by comprising a PCB board according to any of claims 1 to 5.