TW419115U - Structure for enhancing heat dissipation of microelectronic device - Google Patents

Structure for enhancing heat dissipation of microelectronic device

Info

Publication number
TW419115U
TW419115U TW88202828U TW88202828U TW419115U TW 419115 U TW419115 U TW 419115U TW 88202828 U TW88202828 U TW 88202828U TW 88202828 U TW88202828 U TW 88202828U TW 419115 U TW419115 U TW 419115U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
microelectronic device
enhancing heat
enhancing
microelectronic
Prior art date
Application number
TW88202828U
Other languages
Chinese (zh)
Inventor
Ji-Ming Li
Guo-Ming Chen
Original Assignee
Caesar Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Caesar Technology Inc filed Critical Caesar Technology Inc
Priority to TW88202828U priority Critical patent/TW419115U/en
Publication of TW419115U publication Critical patent/TW419115U/en

Links

TW88202828U 1999-02-23 1999-02-23 Structure for enhancing heat dissipation of microelectronic device TW419115U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88202828U TW419115U (en) 1999-02-23 1999-02-23 Structure for enhancing heat dissipation of microelectronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88202828U TW419115U (en) 1999-02-23 1999-02-23 Structure for enhancing heat dissipation of microelectronic device

Publications (1)

Publication Number Publication Date
TW419115U true TW419115U (en) 2001-01-11

Family

ID=21645217

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88202828U TW419115U (en) 1999-02-23 1999-02-23 Structure for enhancing heat dissipation of microelectronic device

Country Status (1)

Country Link
TW (1) TW419115U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114423144A (en) * 2021-12-30 2022-04-29 苏州浪潮智能科技有限公司 PCB and PCIE board card thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114423144A (en) * 2021-12-30 2022-04-29 苏州浪潮智能科技有限公司 PCB and PCIE board card thereof
CN114423144B (en) * 2021-12-30 2023-07-11 苏州浪潮智能科技有限公司 PCB (printed circuit board) and PCIE (peripheral component interconnect express) board card

Similar Documents

Publication Publication Date Title
TW453628U (en) Assembly of heat dissipation device
TW407753U (en) Improvement of heat dissipating structure for CPU
TW559337U (en) Semiconductor packaging apparatus having heat dissipation structure
TW458314U (en) Heat dissipation apparatus
TW423674U (en) Buckle of heat dissipation device
TW443716U (en) Wing-spread type heat dissipation device
TW474458U (en) Heat dissipation apparatus
GB2379266B (en) Heat dissipating device
TW413350U (en) Holder for heat dissipation device of CPU
TW467480U (en) Fastening structure of heat dissipation device
TW452119U (en) Heat dissipation device
TW419115U (en) Structure for enhancing heat dissipation of microelectronic device
TW449251U (en) Heat dissipation device
TW511730U (en) Heat dissipating device
TW461696U (en) Fixing structure of heat dissipating apparatus
TW450511U (en) Terminal structure of heat dissipation device
TW463985U (en) Holding structure of heat dissipation device of chip
TW590276U (en) Heat dissipation apparatus for IC
TW527061U (en) Fixing device of heat dissipation plate
TW446131U (en) Heat-tube type heat dissipation device for CPU
TW467479U (en) Structure for fixing heat dissipation device of electronic device
TW406824U (en) Fixing structure of heat dissipation base
TW501792U (en) High heat dissipation package device
TW549793U (en) Heat dissipating device
TW595752U (en) Heat dissipating device

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees