TW501792U - High heat dissipation package device - Google Patents
High heat dissipation package deviceInfo
- Publication number
- TW501792U TW501792U TW90209475U TW90209475U TW501792U TW 501792 U TW501792 U TW 501792U TW 90209475 U TW90209475 U TW 90209475U TW 90209475 U TW90209475 U TW 90209475U TW 501792 U TW501792 U TW 501792U
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- high heat
- package device
- dissipation package
- package
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90209475U TW501792U (en) | 2001-06-07 | 2001-06-07 | High heat dissipation package device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90209475U TW501792U (en) | 2001-06-07 | 2001-06-07 | High heat dissipation package device |
Publications (1)
Publication Number | Publication Date |
---|---|
TW501792U true TW501792U (en) | 2002-09-01 |
Family
ID=21684402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW90209475U TW501792U (en) | 2001-06-07 | 2001-06-07 | High heat dissipation package device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW501792U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7411790B2 (en) | 2003-12-26 | 2008-08-12 | Advanced Semiconductor Engineering Inc. | Heat sink with built-in heat pipes for semiconductor packages |
-
2001
- 2001-06-07 TW TW90209475U patent/TW501792U/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7411790B2 (en) | 2003-12-26 | 2008-08-12 | Advanced Semiconductor Engineering Inc. | Heat sink with built-in heat pipes for semiconductor packages |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MK4K | Expiration of patent term of a granted utility model |