TW501792U - High heat dissipation package device - Google Patents

High heat dissipation package device

Info

Publication number
TW501792U
TW501792U TW90209475U TW90209475U TW501792U TW 501792 U TW501792 U TW 501792U TW 90209475 U TW90209475 U TW 90209475U TW 90209475 U TW90209475 U TW 90209475U TW 501792 U TW501792 U TW 501792U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
high heat
package device
dissipation package
package
Prior art date
Application number
TW90209475U
Other languages
Chinese (zh)
Inventor
Jiun-Ren Weng
Original Assignee
Macronix Int Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macronix Int Co Ltd filed Critical Macronix Int Co Ltd
Priority to TW90209475U priority Critical patent/TW501792U/en
Publication of TW501792U publication Critical patent/TW501792U/en

Links

TW90209475U 2001-06-07 2001-06-07 High heat dissipation package device TW501792U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90209475U TW501792U (en) 2001-06-07 2001-06-07 High heat dissipation package device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90209475U TW501792U (en) 2001-06-07 2001-06-07 High heat dissipation package device

Publications (1)

Publication Number Publication Date
TW501792U true TW501792U (en) 2002-09-01

Family

ID=21684402

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90209475U TW501792U (en) 2001-06-07 2001-06-07 High heat dissipation package device

Country Status (1)

Country Link
TW (1) TW501792U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7411790B2 (en) 2003-12-26 2008-08-12 Advanced Semiconductor Engineering Inc. Heat sink with built-in heat pipes for semiconductor packages

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7411790B2 (en) 2003-12-26 2008-08-12 Advanced Semiconductor Engineering Inc. Heat sink with built-in heat pipes for semiconductor packages

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model