CN114423144A

CN114423144A - PCB and PCIE board card thereof

Info

Publication number: CN114423144A
Application number: CN202111656776.5A
Authority: CN
Inventors: 计晶; 刘铁军; 陈三霞
Original assignee: Suzhou Inspur Intelligent Technology Co Ltd
Current assignee: Suzhou Inspur Intelligent Technology Co Ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2022-04-29
Anticipated expiration: 2041-12-30
Also published as: CN114423144B

Abstract

The application discloses PCB board and PCIE integrated circuit board thereof, wherein the PCB board includes: the PCB main part is equipped with the radiator on the surface, the inside water conservancy diversion spare that stretches into to the inside of PCB main part that is equipped with of radiator, the water conservancy diversion spare is connected with the inside ground plane contact of PCB main part, realizes the backward flow to the ground plane. The ground plane in the PCB main body is subjected to a part of backflow function through the flow guide piece, backflow of the ground plane can be increased through the radiator with the flow guide piece embedded under the condition that the size of a PCB main body board card and the number of laminated layers of the PCB main body are not increased, and meanwhile, a good heat dissipation function is achieved.

Description

PCB and PCIE board card thereof

Technical Field

The application relates to the technical field of data processing equipment, in particular to a PCB and a PCIE board card thereof.

Background

Currently, the mainstream accelerator card and the smart network card are usually made into a standard PCIE card. The standard PCIE board card generally comprises a full-height full-length board, a full-height half-length board, a full-height three-quarter length board and a half-height half-length board, the thickness of the board card is 1.6mm, and the board card is mainly inserted into a PCIE card slot of a server to work. The main devices of the board card generally include the following devices, such as a CPU, a GPU, a DPU, an FPGA, and the like, which basically require a plurality of types of power supplies and have large power consumption. For a standard PCIE card, the size and thickness of the board card are fixed, so that multiple power supplies and high power consumption make power supply layout and heat dissipation important.

In order to meet the requirements of multiple power supplies and high power consumption, the common practice is to increase the size of the board, increase the number of layers of the PCB (printed Circuit board) lamination, and increase the size of the board and the number of layers of the PCB lamination. Therefore, the power supply can be reasonably arranged, the voltage drop on the ground plane of the PCB can be effectively reduced, and the integrity of the power supply is ensured.

But if increase the integrated circuit board size, if the integrated circuit board size becomes three quarters of full height by full height half a long, can increase the cost on the one hand like this, on the other hand some servers only adapt to the card of full height half a long, like this, increase the integrated circuit board size and can influence the adaptation. If the number of laminated layers is increased, the cost is increased greatly, the process difficulty is increased due to the fact that the thickness of the standard board card is fixed, and meanwhile the number of laminated layers is limited due to the fixed thickness and cannot be increased infinitely. Therefore, the above two methods cannot effectively solve the problems of voltage drop and heat dissipation on the ground plane of the PCB.

Disclosure of Invention

The utility model provides a PCB board and PCIE integrated circuit board thereof to through increasing the mode to the ground plane backward flow, under the prerequisite that does not increase PCB main part board card size and number of piles, realize effectively reducing the pressure drop on ground plane right side in the PCB main part, generate heat with the ground plane copper skin simultaneously and in time scatter away, guarantee high-speed signal integrality.

According to some embodiments, the present application provides a PCB board comprising: the PCB main part is equipped with the radiator on the surface, the inside water conservancy diversion spare that stretches into to the inside of PCB main part that is equipped with of radiator, the water conservancy diversion spare is connected with the inside ground plane contact of PCB main part, realizes the backward flow to the ground plane.

Preferably, the current guiding element comprises a metal screw, and the metal screw penetrates through the PCB main body and extends to the inside of the PCB main body to be in contact connection with the ground plane.

Preferably, a plurality of metal through holes are formed in the surface of the PCB main body, the inner walls of the metal through holes are in contact with the ground line layer, and the metal screws penetrate through the metal through holes.

Preferably, one side of the PCB main body, which is far away from the radiator, is provided with a metal cover plate, and the metal screw penetrates through the metal through hole and is then in threaded connection with the metal cover plate.

Preferably, a heat sink is embedded inside the heat sink.

Preferably, the heat sink includes a heat dissipating copper pipe or an aluminum sheet.

Preferably, the two ends of the heat dissipation copper pipe are provided with sleeving parts, the metal screws penetrate through the sleeving parts at the two ends of the heat dissipation copper pipe, and the outer walls of the metal screws are in contact with the inner walls of the sleeving parts.

Preferably, the radiator is provided with a through hole for a metal screw to penetrate through, the sleeved part of the end part of the radiating copper pipe is positioned in the through hole, an elastic part is arranged in the through hole, and the metal screw is elastically fixed under the action of the elastic part.

Preferably, the through hole is a stepped hole, the head of the metal screw is provided with an annular boss matched with the large hole of the stepped hole, the elastic element comprises a spring, and the spring is sleeved on the metal screw and fixed between the boss on the head of the metal screw and the bottom of the large hole of the stepped hole.

According to some embodiments, the present application further provides a PCIE board including the PCB.

Embodiments of the present disclosure have at least the following advantages:

adopt the radiator of PCB main part customization, share a part backward flow function of the inside ground plane of PCB main part through the water conservancy diversion spare to can effectively reduce the pressure drop on ground plane right side, the radiator can also in time distribute away the heat on ground plane simultaneously, guarantees high-speed signal integrality.

Drawings

In order to more clearly illustrate the embodiments of the present application or technical solutions in the conventional technology, the drawings needed to be used in the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic plan view of a PCB board with a PCB body shown therein according to an embodiment of the present application;

fig. 2 is a schematic cross-sectional view showing the inside of the PCB body and the heat sink in the embodiment of the present application.

Description of the drawings: 1. a PCB body; 11. a metal via; 12. a ground plane; 2. a heat sink; 21. a through hole; 3. a metal screw; 31. a boss; 4. a metal cover plate; 5. a heat dissipation copper pipe; 51. a housing portion; 6. a spring.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the embodiments of the present application will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in the examples of the present application, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not constitute any limitation to the specific implementation manner of the present application, and the embodiments may be combined with each other and cited as reference to each other without contradiction.

At present, a mainstream accelerator card and an intelligent network card are generally made into a standard PCIE card, the types of board power supplies are various, the power consumption is large, and the power supply layout is generally compact, so that the ground plane voltage drop of a pcb (printed Circuit board) is too large, and the power supply integrity and the signal integrity are affected.

Therefore, in order to solve the above problem, referring to fig. 1 and 2, an embodiment of the present application provides a PCB including: PCB main part 1 is provided with radiator 2 in PCB main part 1's front, and the inside of radiator 2 is provided with the water conservancy diversion spare, and the water conservancy diversion spare stretches into to PCB main part 1 inside and be connected with the contact of ground plane 12 to the realization is to the backward flow function of ground plane 12.

Through set up inside radiator 2 that has the water conservancy diversion spare on PCB main part 1, can share a part backward flow function of ground layer 12 in PCB main part 1 through the water conservancy diversion spare under the condition that does not increase 1 calorie of size of PCB main part and PCB stromatolite number of piles to can effectively reduce the pressure drop on ground layer 12 right side, thereby make the pressure drop of power reduce, reduced PCB main part 1's power loss simultaneously, guarantee power integrality. Meanwhile, the radiator 2 plays a good radiating function, the copper sheet on the ground plane 12 is heated and timely radiated, and the integrity of high-speed signals is guaranteed. Therefore, when the power layout on the PCB body 1 is concentrated and the power is large, it is not necessary to reduce the voltage drop on the ground plane 12 by increasing the card size of the PCB body 1 and the PCB lamination, and the integrity of the power and the high-speed signal is ensured, thereby realizing the cost reduction.

In this embodiment, it should be noted that a plurality of metal vias 11 are opened on the PCB body 1, the plurality of metal vias 11 are distributed at four end portions and a middle portion of the PCB body 1, and the metal vias 11 are in contact connection with the ground plane 12 inside the PCB body 1. The metal via hole 11 is formed by penetrating the PCB body 1 through opposite sides thereof first and then plating copper on the inner wall of the hole to realize a metal via hole 11 having a conductive function.

In this embodiment, it should be noted that the flow guiding member includes metal screws 3, the number of the metal screws 3 is the same as the number of the metal vias 11 on the PCB main body 1, and when the heat sink 2 is mounted on the front surface of the PCB main body 1, the positions of the metal screws 3 correspond to the positions of the metal vias 11, so that the heat sink 2 can be fixedly mounted on the PCB main body 1 through the metal screws 3 of the heat sink 2 itself. In order to make the stress of the PCB body 1 uniform, a metal cover plate 4 is further disposed on the back surface of the PCB body 1, and by screwing the metal screw 3, the tip of the metal screw 3 protrudes from the heat sink 2 and penetrates out of the metal via hole 11 to act on the metal cover plate 4, so that the stress is transferred to the metal cover plate 4. In one example, a hole may be formed in the metal cover plate 4, and the metal screw 3 may be fastened by a nut after passing through the hole. Or a threaded hole is formed in the metal cover plate 4, and the metal screw 3 is directly in threaded connection in the threaded hole.

On one hand, the metal screw 3 plays a role in fixing the heat sink 2, on the other hand, the metal screw 3 also plays a role in reflowing to the ground plane 12, and when the metal screw 3 is inserted into the metal via hole 11, the metal screw is in contact connection with the ground plane 12 inside the PCB body 1. The electric current of ground plane 12 partly flows from self, another part conducts radiator 2 to upper portion through metal screw 3, flow from PCB main part 1 on the surface, thereby can share a part backward flow function of ground plane 12, effectively reduce the pressure drop on ground plane 12 right side, thereby make the pressure drop of power reduce, the power loss of PCB main part 1 has been reduced simultaneously, guarantee power integrality, simultaneously with the copper skin heating of ground plane 12 in time scattering away, guarantee high-speed signal integrality.

In this embodiment, it should be further described that a heat dissipation member is further embedded inside the heat sink 2, and heat dissipation is further achieved through the heat dissipation member, where the heat dissipation member includes a heat dissipation copper tube 5 or an aluminum sheet, and the heat dissipation member is taken as the heat dissipation copper tube 5 in this embodiment for example. The heat dissipation copper pipe 5 is embedded in the heat sink 2, the heat sink 2 is further provided with through holes 21, the number of the through holes 21 is consistent with that of the metal screws 3, and the through holes and the metal screws are matched. Preferably, the through hole 21 is a stepped hole, wherein one side of the stepped hole close to the PCB body 1 where the metal cover plate 4 is disposed is a small hole, and one side of the stepped hole far away from the PCB body 1 where the metal cover plate 4 is disposed is a large hole. The head of the metal screw 3 is provided with an annular boss 31 matched with the large hole of the stepped hole, the metal screw 3 is arranged in the stepped hole, and the boss 31 of the metal screw 3 is matched with the large hole. An elastic part is arranged between the boss 31 of the metal screw 3 and the bottom of the large hole, the metal screw 3 can be elastically fixed in the stepped hole through the elastic part, and when the elastic part is in a natural state, the distance between the boss 31 of the metal screw 3 and the bottom of the large hole is larger than the distance between the tail part of the metal screw 3 and the end part of the small hole. Therefore, in the process of pressing the metal screw 3 down, the tail part of the metal screw 3 can be ensured to extend out of the stepped hole. In one example, the elastic member includes a spring 6, and the spring 6 is sleeved on the metal screw 3 and has one end fixed to the boss 31 and the other end fixed to the bottom of the large hole, so that the metal screw 3 can be elastically supported in the stepped hole by the spring 6. When the radiator 2 needs to be installed, the head of the metal screw 3 is operated, the tail of the metal screw 3 extends out of the stepped hole and penetrates through the metal through hole 11 to be connected to the metal cover plate 4, and therefore fixed installation is achieved.

In another example, the two ends of the heat dissipating copper pipe 5 may be further provided with a sleeve portion 51, the sleeve portion 51 is annular and is parallel to the axis direction of the heat dissipating copper pipe 5, the sleeve portion 51 is located in the small hole of the stepped hole, the outer wall of the sleeve portion 51 is attached to the inner wall of the small hole of the stepped hole, the metal screw 3 is inserted into the sleeve portion 51, and the outer wall of the metal screw 3 is in contact with the inner wall of the sleeve portion 51. Thereby, the connection of the heat dissipation copper pipe 5, the metal screw 3 and the ground plane 12 in the PCB body 1 can be realized.

Principle of embodiment of the present embodiment: firstly, arranging a metal through hole 11 on a PCB main body 1, connecting the metal through hole 11 with a ground plane 12 inside the PCB main body 1, and operating a metal screw 3 to ensure that the tail part of the metal screw 3 passes through the metal through hole 11 and is in threaded connection with a metal cover plate 4, thereby realizing the fixation of a radiator 2; the portion 51 is established through the cover to the inside heat dissipation copper pipe 5 of burying of metal screw 3 and radiator 2 links to each other, consequently, heat dissipation copper pipe 5, metal screw and PCB main part 1's ground plane 12 three links to each other, make partly self backward flow of electric current on ground plane 12, another part passes through metal screw 3, heat dissipation copper pipe 5 shares to PCB main part 1 surface backward flow, thereby can effectively reduce the pressure drop on ground plane 12 right side in PCB main part 1, the copper skin of ground plane 12 is generated heat and in time is dispelled through radiator 2 simultaneously, guarantee high-speed signal integrality.

It is to be understood that the above-described embodiments of the present application are merely illustrative of or illustrative of the principles of the present application and are not to be construed as limiting the present application. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present application shall be included in the protection scope of the present application. Further, it is intended that the appended claims cover all such changes and modifications that fall within the scope and range of equivalents of the appended claims, or the equivalents of such scope and range.

Claims

1. A PCB board comprising: PCB main part (1) is equipped with radiator (2) on the surface, radiator (2) inside is equipped with and stretches into the inside water conservancy diversion spare of PCB main part (1), the water conservancy diversion spare is connected with the inside ground plane (12) contact of PCB main part (1), realizes the backward flow to ground plane (12).

2. The PCB board according to claim 1, wherein the current guiding element comprises a metal screw (3), and the metal screw (3) penetrates through the PCB body (1) and extends to the inside to be in contact connection with a ground plane (12).

3. The PCB board of claim 2, wherein the PCB body (1) is provided with a plurality of metal through holes (11) on the surface, the inner walls of the metal through holes (11) are in contact with a ground plane (12), and the metal screws (3) are arranged in the metal through holes (11) in a penetrating way.

4. The PCB board of claim 3, wherein a metal cover plate (4) is arranged on one side of the PCB main body (1) departing from the heat sink (2), and the metal screw (3) is threaded into the metal cover plate (4) after penetrating through the metal through hole (11).

5. The PCB board according to claim 2, wherein a heat sink is embedded inside the heat sink (2).

6. The PCB board of claim 5, wherein said heat sink comprises a heat sink copper tube (5) or an aluminum sheet.

7. The PCB board according to claim 6, wherein two ends of the heat dissipation copper pipe (5) are provided with sleeving parts (51), the metal screw (3) penetrates through the sleeving parts (51) at the two ends of the heat dissipation copper pipe (5), and the outer wall of the metal screw (3) is in contact with the inner wall of the sleeving parts (51).

8. The PCB board according to claim 7, wherein the heat sink (2) is provided with a through hole (21) for a metal screw (3) to pass through, the sleeving part (51) at the end of the heat dissipation copper tube (5) is positioned in the through hole (21), an elastic element is arranged in the through hole (21), and the metal screw (3) is elastically fixed under the action of the elastic element.

9. The PCB board according to claim 8, wherein the through hole (21) is a stepped hole, the head of the metal screw (3) is provided with an annular boss (31) matched with the large hole of the stepped hole, the elastic member comprises a spring (6), and the spring (6) is sleeved on the metal screw (3) and fixed between the boss (31) on the head of the metal screw (3) and the bottom of the large hole of the stepped hole.

10. A PCIE board comprising the PCB of any one of claims 1 to 9.