CN114335284B - Packaging structure and packaging method of edge-sealed coating LED bracket - Google Patents
Packaging structure and packaging method of edge-sealed coating LED bracket Download PDFInfo
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- CN114335284B CN114335284B CN202111658423.9A CN202111658423A CN114335284B CN 114335284 B CN114335284 B CN 114335284B CN 202111658423 A CN202111658423 A CN 202111658423A CN 114335284 B CN114335284 B CN 114335284B
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- 238000000576 coating method Methods 0.000 title claims abstract description 94
- 239000011248 coating agent Substances 0.000 title claims abstract description 90
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 55
- 229910052709 silver Inorganic materials 0.000 claims abstract description 55
- 239000004332 silver Substances 0.000 claims abstract description 55
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 28
- 239000010949 copper Substances 0.000 claims abstract description 28
- 229910052793 cadmium Inorganic materials 0.000 claims abstract description 20
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 19
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims description 41
- 239000003292 glue Substances 0.000 claims description 35
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 24
- 229910052737 gold Inorganic materials 0.000 claims description 21
- 239000010931 gold Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 19
- 238000005253 cladding Methods 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 11
- 230000001681 protective effect Effects 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 10
- 229920002120 photoresistant polymer Polymers 0.000 claims description 6
- 238000007664 blowing Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 239000013078 crystal Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000002035 prolonged effect Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The invention provides a packaging structure of an edge sealing coating LED support, which comprises an LED support, wherein a protection frame is arranged on the upper end face of the LED support, a light emitting diode is fixedly arranged on the upper end face of the LED support through crystal bonding, the light emitting diode is internally protected by the protection frame, two groups of electrode wires are welded on two groups of electrodes on the light emitting diode, two groups of electrode grooves are respectively arranged on two sides of the upper end face of the LED support, electrodes are arranged in the electrode grooves, each electrode comprises a silver coating, a copper coating, a nickel coating, a cadmium coating and a wiring groove, the silver coating is coated on the upper end face of the copper coating, the nickel coating is coated on the lower end face of the copper coating, the cadmium coating is coated on the lower end face of the nickel coating, and the wiring groove is arranged on the upper end face of the silver coating.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to a packaging structure and a packaging method of an edge sealing coating LED bracket.
Background
The LED is used as a fourth-generation green illumination light source, the LED is widely applied at present, wherein a color-adjustable dimming full-color LED device light source can be used for special occasions such as outdoor landscape brightening, markets, counters, advertising walls, coffee shops and the like, the main factors influencing the service life and luminous efficiency of an LED product are mainly the design of a packaging structure except a chip, the LED electrode is LED out in the traditional LED packaging mode in a wire bonding mode, then the LED is integrally sealed by using packaging glue, but the electrode wire LED out by wire bonding is thinner, the electrode wire can be contacted with the packaging glue, so that heat generated by the electrode wire can be conducted to the packaging glue, the service life of the packaging glue is further effectively prolonged, and the heat generated by the LED can only be conducted through the packaging glue, so that the service life of the LED is greatly reduced.
Disclosure of Invention
(One) solving the technical problems
Aiming at the defects of the prior art, the invention provides a packaging structure and a packaging method of an edge sealing coating LED bracket, which are used for solving the problems in the prior art.
(II) technical scheme
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a packaging structure of banding cladding material LED support, includes the LED support, LED support up end is provided with the protection frame, LED support up end has emitting diode through solid brilliant, just emitting diode is protected the frame inside, two sets of electrode wires of welding on two sets of electrodes on the emitting diode, LED support up end both sides respectively are provided with a set of electrode groove, electrode inslot portion is provided with the electrode wire, the electrode wire includes silver-colored cladding material, copper cladding material, nickel cladding material, cadmium cladding material and wiring groove, silver cladding material plates at copper cladding material up end, nickel cladding material plates at copper cladding material lower extreme face, cadmium cladding material plates at nickel cladding material lower extreme face, the wiring groove sets up at silver cladding material up end.
As a further preferable mode, the inner wall of the protective frame is inclined, a layer of light reflecting film is arranged on the inclined inner wall of the protective frame, and one side of fluorescent powder is coated on the light reflecting film.
As a further preferable mode, the protection frame is internally filled with packaging glue, two groups of holes are formed in two electrode wires of the light-emitting diode by the packaging glue, and the lower end face of the light-emitting diode is fixed on the upper end face of the LED bracket through fixing glue.
As a further preference, the cadmium plating layer is plated at the bottom of the electrode groove, the thickness of the cadmium plating layer is 30-50A, the thickness of the nickel plating layer is 350-350A, the thickness of the copper plating layer is 450-500A, and the thickness of the silver plating layer is 700-800A.
As a further preferable mode, a gold layer is plated on one side, away from the wiring groove, of the upper end face of the silver plating layer, and the thickness of the gold layer is 500-600A.
As a further preferable aspect, the electrode wire welded to the light emitting diode electrode is welded to the inside of the wiring groove.
The packaging method of the packaging structure of the edge sealing coating LED bracket is characterized by comprising the following steps of: comprises the following steps
S1: symmetrically arranging a group of electrode grooves on two sides of the upper end surface of the LED bracket, arranging a layer of photoresist on other areas except the electrode grooves on the upper end surface of the LED bracket, then sequentially plating a cadmium coating, a nickel coating, a copper coating and a silver coating in the electrode grooves, scribing wiring grooves on the adjacent sides of the upper end surfaces of the two groups of silver coatings, covering the adjacent side areas of the upper end surfaces of the two groups of silver coatings by using the same photoresist, and then plating a layer of gold on the silver coating;
S2: removing photoresistors on the LED support and the silver coating, fixing the protective frame on the upper end face of the LED support, and fixing the light-emitting diode on the upper end face of the LED support through fixing glue;
S3: respectively welding a gold wire on two groups of electrodes of the light-emitting diode, and then respectively welding the other ends of the gold wires on the two groups of electrodes into wiring grooves on silver plating layers on two sides of the light-emitting diode;
S4: injecting packaging glue into the protective frame, after the packaging glue is completely filled into the protective frame, blowing a group of bubbles on a motor of the LED by using a group of glass air pipes which penetrate through the packaging glue and extend into the LED, and polishing the surface of the packaging glue smoothly after the packaging glue is completely solidified, so that the LED bracket packaging is completed.
As a further preferred feature, the potting compound withdraws the glass tubing in a semi-cured state while the holes of the glass tubing are plugged with the potting compound.
(III) beneficial effects
The invention provides a packaging structure and a packaging method of an edge sealing coating LED bracket, and the packaging structure has the following beneficial effects:
According to the LED packaging structure, the light reflection film is arranged on the inner wall of the protection frame, the maximum utilization of light emitted by the LED is realized through the light reflection effect of the light reflection film, the brightness of the LED is improved, the cavity is arranged at the electrode position of the LED, the LED is fixedly arranged on the LED bracket, two groups of electrodes of the LED are welded with electrode wires through bonding wires, the electrode wires take copper plating layers as base materials, the copper plating layers have good heat dissipation effect, silver plating layers and cadmium plating layers are respectively plated above and below the copper plating layers, the silver plating layers have light reflection effect and excellent conductivity, meanwhile, the upper end face of the silver plating layers is provided with the wiring groove, the wiring groove is welded with the other end of the LED electrode wire, the welding fastening of the electrode wire and the silver plating layers is effectively ensured, the light-emitting brightness is improved through the light reflection effect of the silver plating layers, the light-emitting loss of the LED is effectively reduced, meanwhile, a gold layer is plated on one side of the upper end face of the silver plating layers, which is far away from the wiring groove, is outside the protection frame, the silver plating layers are protected through the gold layer, the silver plating layers are prevented from being oxidized, the gold layer can also serve as pins of the packaging structure, and the packaging structure is convenient to use; when the LED electrode is positioned in the protection frame filled with the packaging adhesive, two groups of holes are blown out through the glass air pipe, so that the electrode wires are not contacted with the packaging adhesive, the packaging adhesive is effectively prevented from being damaged due to heating of the wires, heat in the holes is discharged through the copper plating layer, the LED bracket package has strong heat dissipation capacity, and the service life of the bracket package is further prolonged.
Drawings
FIG. 1 is a schematic diagram of an encapsulation structure of an edge sealing coating LED support;
fig. 2 is a schematic diagram of a cross-sectional structure of a package structure of the edge-sealed plating LED support of the present invention;
FIG. 3 is a schematic cross-sectional view of an electrode of the present invention;
Fig. 4 is a schematic top view of an electrode according to the present invention.
In the figure: 1LED bracket, 2 protection frame, 3 electrode wires, 4 electrode grooves, 5 light emitting diode, 6 silver coating, 7 copper coating, 8 nickel coating, 9 cadmium coating and 10 wiring grooves.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
The embodiment of the invention provides a packaging structure of an edge sealing coating LED support, which comprises an LED support 1, wherein a protection frame 2 is arranged on the upper end face of the LED support 1, a light-emitting diode 5 is fixedly arranged on the upper end face of the LED support 1 through crystal bonding, the light-emitting diode 5 is internally framed by the protection frame 2, two groups of electrode wires are welded on two groups of electrodes on the light-emitting diode 5, two groups of electrode grooves 4 are respectively arranged on two sides of the upper end face of the LED support 1, an electrode wire 3 is arranged in each electrode groove 4, each electrode wire 3 comprises a silver coating 6, a copper coating 7, a nickel coating 8, a cadmium coating 9 and a wiring groove 10, the silver coating 6 is coated on the upper end face of the copper coating 7, the nickel coating 8 is coated on the lower end face of the copper coating 7, the cadmium coating 9 is coated on the lower end face of the nickel coating 8, and the wiring groove 10 is arranged on the upper end face of the silver coating 6.
In this embodiment, the inner wall of the protection frame 2 is inclined, and a layer of light reflective film is disposed on the inclined inner wall of the protection frame 2, and a side of phosphor is coated on the light reflective film, so that the light emitting efficiency of the light emitting diode 5 is effectively improved by changing the light emitting route of the light emitting diode 5 through the light reflective film.
Specifically, the protection frame 2 is internally filled with packaging glue, the packaging glue is provided with two groups of hollows on two electrode wires of the light-emitting diode 5, the lower end face of the light-emitting diode 5 is fixed on the upper end face of the LED support 1 through fixing glue, the contact between the electrode wires and the packaging glue is avoided through the hollows, the ageing rate of the packaging glue is reduced, heat generated by the light-emitting diode 5 can be in the hollows and then discharged through the electrode wires 3, and the service life of the LED support package is greatly prolonged.
In this embodiment, the cadmium coating 9 is coated at the bottom of the electrode groove 4, the thickness of the cadmium coating 9 is 30-50A, the thickness of the nickel coating 8 is 350-350A, the thickness of the copper coating 7 is 450-500A, the thickness of the silver coating 6 is 700-800A, the copper coating 7 is used as a conductive and heat dissipation base material, the nickel coating 8 is used as a ductile material, the possibility of warping of the electrode wire 3 is reduced, the silver coating 6 can reflect light of the light emitting diode 5, the light emitting efficiency of the light emitting diode 5 is further improved, the electrode wire 3 is tightly combined with the electrode groove 4 through the cadmium coating 9, and the electrode wire 3 is placed to be separated from the inside of the electrode groove 4.
Specifically, the upper end face of the silver coating 6 is plated with a gold layer at the side away from the wiring groove 10, the thickness of the gold layer is 500-600A, wherein the surface of the electrode wire 3 extending out of the side end face of the LED bracket 1 is also plated with the gold layer, the outside of the electrode wire 3 is protected through the gold layer, the electrode wire 3 is prevented from being oxidized, and the gold layer can also serve as an electrode pin, so that the welding wire is facilitated.
Wherein the electrode wire is completely in the cavity and is not contacted with the packaging glue.
Further, the electrode wire welded on the electrode of the light emitting diode 5 is welded inside the wiring groove 10, and the electrode wire is firmly welded with the silver coating 6 when passing through the wiring groove 10.
The packaging method of the packaging structure of the edge-sealed coating LED bracket further comprises the following steps of
S1: symmetrically arranging a group of electrode grooves 4 on two sides of the upper end surface of the LED bracket 1, arranging a layer of photoresist on other areas except the electrode grooves 4 on the upper end surface of the LED bracket 1, then sequentially plating a cadmium plating layer 9, a nickel plating layer 8, a copper plating layer 7 and a silver plating layer 6 in the electrode grooves 4, scribing a wiring groove 10 on the adjacent side of the upper end surfaces of the two groups of silver plating layers 6, covering the adjacent side areas of the upper end surfaces of the two groups of silver plating layers 6 by using the same photoresist, and then plating a layer of gold on the silver plating layers 6;
S2: removing photoresistors on the LED support 1 and the silver coating 6, fixing the protection frame 2 on the upper end face of the LED support 1, and fixing the light-emitting diode 5 on the upper end face of the LED support 1 through fixing glue;
S3: respectively welding a gold wire on two groups of electrodes of the light-emitting diode 5, and respectively welding the other ends of the gold wires on the two groups of electrodes into the wiring grooves 10 on the silver plating layers 6 on the two sides of the light-emitting diode 5;
S4: injecting packaging glue into the protective frame 2, after the packaging glue is completely filled into the protective frame 2, blowing a group of bubbles on a motor of the LED 5 by using a group of glass air pipes penetrating through the packaging glue, and polishing the surface of the packaging glue to be smooth after the packaging glue is completely solidified, thereby completing the packaging of the LED bracket.
Furthermore, the glass air pipe is extracted by the packaging adhesive in a semi-solidification state, and meanwhile, the hole of the glass air pipe is blocked by the packaging adhesive, so that the whole LED bracket packaging is sealed.
In summary, the packaging structure of the edge sealing coating LED bracket provided by the invention has the advantages that the light reflection film is arranged on the inner wall of the protection frame 2, the maximum utilization of light emitted by the light emitting diode 5 is realized through the reflection effect of the light reflection film, the brightness of the LED is improved, the cavity is arranged at the motor of the light emitting diode 5, the light emitting diode 5 is fixedly crystallized on the LED bracket 1, two groups of electrodes of the light emitting diode 5 are welded with the electrode wire 3 through bonding wires, the electrode wire 3 takes the copper coating 7 as a base material, the copper coating 7 has good heat dissipation effect, the silver coating 6 and the cadmium coating 9 are respectively coated above and below the copper coating 7, the silver coating 6 has a reflection effect and has excellent conductive performance, meanwhile, the upper end surface of the silver coating 6 is provided with the wiring groove 10, the wiring groove 10 is welded with the other end of the electrode wire of the light emitting diode 5, the welding fastening of the electrode wire and the silver coating 6 is effectively ensured, the brightness of light emitting is improved through the reflection effect of the silver coating 6, the light emitting loss of the light emitting diode 5 is effectively reduced, simultaneously, one side of the upper end surface of the silver coating 6, which is far from the wiring 10, is coated with the gold layer, and the gold layer is coated outside the protection frame 2, and the silver coating 6 is further protected by the silver coating 6, so that the silver coating is conveniently packaged by the gold coating, and the packaging structure; when the electrode of the light-emitting diode 5 is positioned in the protection frame 2 filled with the packaging adhesive, two groups of holes are blown out through the glass air pipe, so that electrode wires are not contacted with the packaging adhesive, the packaging adhesive is effectively prevented from being damaged due to heating of the wires, heat in the holes is discharged through the copper plating 7, the LED bracket package has strong heat dissipation capacity, and the service life of the bracket package is further prolonged.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a packaging structure of banding cladding material LED support, includes LED support (1), its characterized in that: the LED lamp is characterized in that a protection frame (2) is arranged on the upper end face of the LED lamp support (1), a light emitting diode (5) is arranged on the upper end face of the LED lamp support (1) through die bonding, the light emitting diode (5) is internally framed by the protection frame (2), two groups of electrode wires are welded on two groups of electrodes on the light emitting diode (5), a group of electrode grooves (4) are respectively arranged on two sides of the upper end face of the LED lamp support (1), an electrode wire (3) is arranged in the electrode grooves (4), the electrode wire (3) comprises a silver coating (6), a copper coating (7), a nickel coating (8), a cadmium coating (9) and a wiring groove (10), the silver coating (6) is coated on the upper end face of the copper coating (7), the nickel coating (8) is coated on the lower end face of the copper coating (7), and the wiring groove (10) is arranged on the upper end face of the silver coating (6).
The inner wall of the protective frame (2) is inclined, a layer of light reflecting film is arranged on the inclined inner wall of the protective frame (2), and one side of fluorescent powder is coated on the light reflecting film;
The LED protection device is characterized in that the protection frame (2) is internally filled with packaging glue, two groups of holes are formed in two electrode wires of the LED (5) by the packaging glue, and the lower end face of the LED (5) is fixed on the upper end face of the LED bracket (1) through fixing glue.
2. The packaging structure of the edge sealing coating LED bracket according to claim 1, wherein: the cadmium plating layer (9) is plated at the bottom of the electrode groove (4), the thickness of the cadmium plating layer (9) is 30-50A, the thickness of the nickel plating layer (8) is 350-350A, the thickness of the copper plating layer (7) is 450-500A, and the thickness of the silver plating layer (6) is 700-800A.
3. The packaging structure of the edge sealing coating LED bracket according to claim 2, wherein: the upper end face of the silver plating layer (6) is plated with a gold layer at one side away from the wiring groove (10), and the thickness of the gold layer is 500-600A.
4. A package structure of a sealed edge coating LED support according to claim 3, wherein: electrode wires welded on the electrodes of the light emitting diode (5) are welded inside the wiring groove (10).
5. The method for packaging the packaging structure of the edge-sealed coated LED support according to any one of claims 1 to 4, wherein: comprises the following steps
S1: symmetrically arranging a group of electrode grooves (4) on two sides of the upper end face of the LED bracket (1), coating a layer of photoresist on other areas except the electrode grooves (4) on the upper end face of the LED bracket (1), sequentially coating a cadmium coating (9), a nickel coating (8), a copper coating (7) and a silver coating (6) in the electrode grooves (4), scribing wiring grooves (10) on the adjacent sides of the upper end faces of the two groups of silver coatings (6), covering the adjacent side areas of the upper end faces of the two groups of silver coatings (6) by using the same photoresist, and coating a layer of gold on the silver coating (6);
S2: removing photoresistors on the LED support (1) and the silver coating (6), fixing the protection frame (2) on the upper end face of the LED support (1), and fixing the light emitting diode (5) on the upper end face of the LED support (1) through fixing glue;
S3: respectively welding a gold wire on two groups of electrodes of the light-emitting diode (5), and respectively welding the other ends of the gold wires on the two groups of electrodes into the wiring grooves (10) on the silver plating layers (6) on the two sides of the light-emitting diode (5);
S4: injecting packaging glue into the protective frame (2), after the packaging glue is completely filled into the protective frame (2), blowing a group of bubbles on a motor of the LED (5) by using a group of glass air pipes to penetrate through the packaging glue, and polishing the surface of the packaging glue to be smooth after the packaging glue is completely solidified, thereby completing the packaging of the LED bracket.
6. The method for packaging the packaging structure of the edge-sealed coated LED bracket according to claim 5, wherein the method comprises the following steps: and the packaging adhesive is used for extracting the glass air tube in a semi-solidification state, and simultaneously, the packaging adhesive is used for plugging the hole of the glass air tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111658423.9A CN114335284B (en) | 2021-12-30 | 2021-12-30 | Packaging structure and packaging method of edge-sealed coating LED bracket |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111658423.9A CN114335284B (en) | 2021-12-30 | 2021-12-30 | Packaging structure and packaging method of edge-sealed coating LED bracket |
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| CN114335284B true CN114335284B (en) | 2024-04-26 |
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| KR20150081089A (en) * | 2014-01-03 | 2015-07-13 | 삼성디스플레이 주식회사 | Light emitting diode package |
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| KR20040098191A (en) * | 2003-05-14 | 2004-11-20 | (주)나노팩 | Light emitting diode and package structure and method of manufacturing thereof |
| JP2008098555A (en) * | 2006-10-16 | 2008-04-24 | Genki Koden Handotai Kofun Yugenkoshi | Configuration of backlight panel having built-in led and method of manufacturing the same |
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| CN114335284A (en) | 2022-04-12 |
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