JP2008098555A - Configuration of backlight panel having built-in led and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the configuration of a backlight panel having a built-in light-emitting diode, and to provide a method of manufacturing the same. <P>SOLUTION: The backlight panel includes a number of arc-shaped dents, a printed circuit board having an electric circuit required for backlighting, and a nano-gold plated layer formed on the printed circuit board and the surfaces of the arc-shaped dents by sputtering. An LED chip is embedded in each of the arc-shaped dents, is fixed at the center of the arc-shaped dent by high frequency welding, and is coated with fluorescent paste composed of a mixture of fluorescent powder and silicon. Further, the arc-shaped dents and the surrounding surfaces of the printed circuit board are covered with a translucent layer made of transparent silicon. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention has a structure of a backlight panel having an implantable LED, in particular, by installing an arc-shaped depression on a printed circuit board, and sputtering and plating nano gold on the entire printed circuit board. It enhances the product's conductivity and heat conduction capability, facilitates the implantation of LED light emitting chips, and improves the production efficiency and quality of LCD backlight panels.

  Currently, the LCD backlight panel is mainly composed of white light CCFL (cold cathode tube). CCFL is installed behind the LCD to emit light onto the light guide plate, diffuser plate, and light-intensifying sheet, and then projected onto the LCD. The screen on the LCD appears to light up. As the size of LCDs grows larger, so does the demand for CCFLs and drive circuits. In order to achieve a large-size LCD backlight illumination function, a large number of CCFLs must be connected in series and in parallel. However, due to the inherent elements, CCFLs have the following drawbacks.

1. The brightness of the CCFL is uneven, and even if the CCFLs are connected in series / parallel to the maximum, the brightness obtained is still not uniform within the LCD size range. is there;
2. The lifespan of CCFL is short, the brightness starts to decay after about 4000-6000 hours of use, and it is not easy to replace, greatly reducing the service life of LCD;
3. CCFL lacks color saturation, its color temperature is about 4800K, so it can only achieve 80% of the color gamut standardized by NTSC, especially the poor red color expression, can not meet the high standard color needs , For example, when measuring with a meter or in an environment that requires a specific color representation, the color defect is clearly seen;
4). CCFLs consume relatively large amounts of electricity, and contain “mercury”, which is a harmful substance at the time of production. This is obviously harmful to environmental protection, so the Kyoto Protocol is prohibited from July 1, 2006. Is clearly stated. Therefore, the use of other backlight light sources is an inevitable trend for LCD development.
5. CCFLs produce ultraviolet light during use and can cause serious damage to human eyes when used for long periods.

  Currently, the technology that is universally adopted in the industry is that LED (light emitting diode) is used as a backlight light source, and the application of LED to a small-size LCD screen has already been performed for a certain period of time. In recent years, the brightness of LEDs has been greatly improved with improvements in technology, such as mobile phones and PDAs. In addition, it is light and solid, has a relatively long life, and has a fast startup response. It is targeted.

  In general, in the installation method using LEDs as LCD backlight light sources, unequal quantities of LEDs are mounted on one or both sides of the LCD, and when the power is turned on, the LED light source projects onto the LCD and displays the image on the LCD. . However, general LED rays do not scatter uniformly and are concentrated within a small range, so that they are particularly bright in areas where the LED projection rays on the LCD are, and on the other hand, there is a clear attenuation of brightness around the bright areas. It is seen and the color is not evenly expressed.

  Therefore, an improved method is to place the LED behind the LCD backlight panel and increase the brightness of the LED so that the light beam can be projected onto the LCD uniformly. However, an LCD backlight panel employing LEDs has a relatively high thermal energy when the brightness of the LEDs is increased because the brightness is determined by the power of the LEDs. Since the conventional LCD backlight panel does not have a good heat dissipation method, the function of the LED cannot be fully exhibited, especially in the high-intensity white light LED, resulting in the overall deterioration of the LCD backlight panel quality, In addition, overheating damage is likely to occur.

  Also, in the conventional LCD backlight panel processing method, the LED light-emitting chip must be welded onto the electric circuit board, which is difficult to process and not only lowers the production pass rate but also against the electric circuit board. This can cause thermal destruction and damage the entire LCD backlight panel. And since the brightness of the conventional LCD backlight panel is unintentional, a filter, a diffusion sheet and a light guide sheet are installed between the LCD and the LED light emitting chip, the light source is guided by the light guide sheet, and evenly The light is uniformly distributed by the diffusion sheet, and the colored light having a deviation is filtered by the filter. All these external mounting structures increase the cost of LCD backlight panels and hinder industrial development.

  Note that the above-mentioned arbitrary LCD device cannot be replaced individually when the elements of some backlight devices are damaged, and the entire device must be replaced, resulting in an increase in cost. And for large size LCDs, it is not only wasteful to replace a single element that is damaged, but LCD waste also increases the burden of environmental protection.

    In view of the above, the inventor of the present invention, as a solution, removes the heat generation failure of the high power LED by a special heat dissipation mechanism, solves problems such as brightness attenuation, and further simplifies the manufacturing process and increases production efficiency. Through the long-term research and development and experiments, we finally succeeded in the research and development of the structure of the backlight panel having the implantable LED according to the present plan and the manufacturing method thereof.

  The main object of the present invention is to provide a structure of a backlight panel having an implantable LED and a method for manufacturing the same, and a special heat-dissipating mechanism greatly reduces the failure rate caused by heat. It is to improve the brightness.

Another object of the present invention is to provide a structure of a backlight panel having an implantable LED and a method for manufacturing the same, simplify the overall structure of the product, and eliminate complicated processing steps. It is to improve quality.

Another object of the present invention is to provide a structure of a backlight panel having an implantable LED and a method for manufacturing the same. By adopting small module production, if a single element is damaged, the damaged part The module is directly exchanged to make the maintenance of the large size LCD easier and more feasible.

The next object of the present invention is to provide a structure of a backlight panel having an implantable LED and a method for manufacturing the same, and to reduce the manufacturing process, thereby eliminating processing steps such as welding or waste, and meeting environmental protection requirements. The goal is to match.

    A structure of a backlight panel having an implantable LED that can achieve the aforementioned object and a method for manufacturing the same include a printed circuit board on which a large number of arc-shaped depressions are installed and an electric circuit necessary for the backlight panel is installed; A nano gold plating layer is laid on the surface of the printed circuit board and the arc-shaped depression by a sputtering method, and the heat conductivity of the LCD backlight panel is greatly increased by the good conductivity and heat conductivity of the nano gold plating layer; An LED light-emitting chip is implanted in one arc-shaped recess, and the LED light-emitting chip is high-frequency welded due to the presence of the nano gold plating layer, fixed in the arc-shaped recess, and the lead wire is extended to an electric circuit board. Fluorescence made of a suitable proportion of fluorescent powder and silicon mixture on the LED light emitting chip The LED light emitting chip can emit a high brightness and uniform white light by coating the surface of the arc; and the arc-shaped depression and the surface of the surrounding printed circuit board are also covered with a transparent layer such as transparent silicon. Thus, the conductive wire in the arc-shaped depression is protected and the light rays of the LED light emitting chip are scattered.

  The present invention makes it possible to express colors with high brightness and high saturation in the LCD, reduce the manufacturing cost, further improve the production pass rate of the large size LCD, and facilitate the maintenance. It is suitable for use.

1 and 2, the structure of a backlight panel having an implantable LED provided by the present invention is formed by installing a number of LEDs 3 (light emitting diodes) on a printed circuit board 2. The LCD backlight panel 1 is installed behind the LCD (not shown), and light is projected onto the LCD by a number of LEDs 3 to obtain the necessary color and brightness.

  The LED 3 unit includes an arc-shaped depression 31 installed on the printed circuit board 2, and an electric circuit necessary for a backlight panel is installed in the printed circuit board 2; The surface of the arc-shaped depression 31 is entirely sputtered and plated with nano gold 4. The nano gold 4 has good conductivity and heat conduction ability, so that the heat dissipation ability of the printed circuit board 2 is enhanced. An LED light emitting chip 32 is installed in the arc-shaped depression 31, and the LED light-emitting chip 32 is fixed to the nanogold 4 plating layer of the arc-shaped depression 31 by high-frequency welding by laying the nano gold 4. At the same time, the conductive wire 33 is extended to the printed circuit boards 2 on both sides, and causes the LED light emitting chip 32 to emit light via the electric circuit of the printed circuit board 2; The D light emitting chip 32 is coated with a fluorescent paste 34 that is separately mixed with a certain proportion of fluorescent powder and silicon, and the fluorescent powder is authorized by Oslon, Mixed-color coordinates X = 0.33; Y = 0.33, single wavelength white light of 8000K color temperature can be obtained, and the necessary high-intensity white light LED 3 can be formed; the arc-shaped depression 31 and the surrounding printed board 2 By covering the surface with a transparent layer 35 made of transparent silicon, the conductor 33 in the arc-shaped depression 51 is protected and the light from the LED light emitting chip 52 is scattered. In this way, the high brightness white light necessary for the present invention can be obtained. Therefore, it is only necessary to install a diffusion sheet between the LCD and the LCD backlight panel. Therefore, the structure of the product can be greatly simplified.

With the above structure, as shown in FIG. 3, the heat dissipation effect according to the present invention is partly eliminated by the nano gold 4 and the printed circuit board 2 at the bottom, and upward and laterally. Since the thermal energy flowing toward the arc-shaped depression 31 causes a spiral thermal convection phenomenon, most of the thermal energy passes through the spiral path, and the opportunity to come into contact with the nano gold 4 in the arc-shaped depression 31. Is further eliminated by the nano gold 4 and the printed circuit board 2. Therefore, the present invention can surely achieve a more significant heat dissipation effect than the conventional structure.

The manufacturing method according to the present invention includes the following steps as shown in FIG.
a. Creating an arc-shaped depression 31 on the printed circuit board 2 and laying an associated electrical circuit;
b. Sputtering and plating the nano gold 4 on the entire surface of the printed circuit board 2 and the arc-shaped depression 31;
c. The LED light emitting chip 32 is implanted, fixed to the surface of the nano gold 4 of the arc-shaped depression 31 by high frequency, and the conductive wire 33 is laid;
d. Coat fluorescent paste 34 around LED light emitting chip 32;
e. Finally, the translucent layer 35 is placed on the arc-shaped depression 31 and the surrounding printed board 2.

As shown in FIG. 5, the structure of the LCD backlight panel 1 according to the present invention is composed of a small module, and a small LCD backlight panel 1 is manufactured with a printed board 2 of an appropriate size. According to these dimensions, a large number of small LCD backlight panels 1 can be combined as a large LCD backlight panel 1, thus improving the production efficiency of LCD production and increasing the acceptance rate.

The LEDs 3 of the LCD backlight panel 1 are arranged in parallel rows. Of course, as shown in FIGS. 6 and 7, the LEDs 3 of the LCD backlight panel 1 are arranged in cross rows. Visual perception may be provided.

The present invention thus completed can surely achieve the patented high brightness and low heat generation effect, and its detailed temperature change is as shown in each of FIGS. 8 to 8H. On the surface of the 32-inch LCD backlight panel 10 in which the structure of the present invention is completed, temperature checkpoints N1 to N8 and a contrasting room temperature checkpoint N9 are installed from left to right and from top to bottom. Inferred from the position, the temperature checkpoint in the upper position should be higher than the temperature checkpoint below, and no matter where the temperature checkpoint is, it will typically exceed 100 ° C on a conventional LCD There is also. Therefore, in the conventional LCD, it is strictly forbidden for the user to remove the outer case to prevent an electric shock and to avoid burns. With the structure according to the present invention, the temperature is clearly lower than that of the conventional design and the maximum temperature is 50 ° C. or less. In the present invention, a long life can be maintained even when used for a long time with high brightness. It is an excellent invention that is difficult to obtain.

It is the perspective view and LED partial enlarged view of the single LED structure which concern on this invention. FIG. 3 is a cross-sectional view of a backlight panel structure having an implantable LED. It is a heat dissipation principle diagram of a backlight panel structure having an implantable LED. 6 is a manufacturing flowchart of a backlight panel structure having an implantable LED. It is a combination example figure of the backlight panel structure which has implantable LED. FIG. 5 is another example of a backlight panel structure with implantable LEDs. FIG. 7 is a combination example of the backlight panel structure of FIG. 6. It is the temperature change figure which applied this invention to 32 inch LCD backlight panel and was checked for 8 hours. FIG. 9 is a temperature change diagram for 8 hours at different positions in FIG. 8. FIG. 9 is a temperature change diagram for 8 hours at different positions in FIG. 8. FIG. 9 is a temperature change diagram for 8 hours at different positions in FIG. 8. FIG. 9 is a temperature change diagram for 8 hours at different positions in FIG. 8. FIG. 9 is a temperature change diagram for 8 hours at different positions in FIG. 8. FIG. 9 is a temperature change diagram for 8 hours at different positions in FIG. 8. FIG. 9 is a temperature change diagram for 8 hours at different positions in FIG. 8. FIG. 9 is a temperature change diagram for 8 hours at different positions in FIG. 8.

Explanation of symbols

N1 to N9 Temperature checkpoint 1 LCD backlight panel 2 Printed circuit board 3 LED
31 Arc-shaped depression 32 LED light emitting chip 36 Conductor 37 Fluorescent paste 38 Translucent layer 4 Nano gold 10 LCD backlight panel

Claims (6)

A method for manufacturing a backlight panel, the following steps:
a. Creating an arc-shaped depression on the printed circuit board and laying the associated electrical circuit;
b. Sputtering and plating nano gold on the entire surface of the printed circuit board;
c. An LED light emitting chip is implanted in the arc-shaped depression and a conductor is laid;
d. Coat fluorescent paste around LED light emitting chip;
e. Finally, a translucent layer is placed over the arc-shaped depression and the surrounding printed circuit board;
A method for manufacturing a backlight panel having an implantable LED. The method of manufacturing a backlight panel having an implantable LED according to claim 1, wherein the LED light emitting chip is fixed on a nano gold surface layer of an arc-shaped depression by high frequency. The structure of the backlight panel,
A printed circuit board with the necessary electrical circuits for the backlight panel;
A number of arc-shaped depressions molded on the printed circuit board;
Nano gold that is entirely sputtered and plated on the surface of the printed circuit board and the arc-shaped depression;
A plurality of LED light-emitting chips fixed one by one in the arc-shaped depressions and having their conductors extended on the printed circuit board;
A fluorescent paste coated on the LED light emitting chip;
A light-transmitting layer protecting the surface of the arc-shaped depression and the printed circuit board surrounding the week;
A structure of a backlight panel having an implantable LED characterized by comprising: 4. The phosphor paste is a mixture of phosphor powder and silicon, and forms white light with a single wavelength of mixed color coordinates X = 0.33; Y = 0.33, 8000K color temperature. Backlight panel structure with implantable LEDs. The structure of a backlight panel having an implantable LED according to claim 3, wherein the translucent layer is made of transparent silicon. 4. The implant according to claim 3, wherein the structure of the LCD backlight panel is a small module, and a plurality of small LCD backlight panels are combined to form a large LCD backlight panel. Structure of a backlight panel having an LED.