1312265 九、發明說明： 【發明所屬之技術領域】 本發明為一種具有植入式發光二極體的背光板，特別指 一種在印刷電路板上設置圓弧狀凹杯，並對整個印刷電路板 全面濺鍍奈米金，以增加產品的導電與導熱能力，且進一步 方便LED發光晶粒的植裝，提高LCD背光板的產能與品質。 【先前技術】 目前的LCD背光板，主要是以白光CCFL(冷陰極燈管） 為主，將CCFL設置在LCD背後，然後發光投射到導光板、 擴散片、增光片後，再投光於LCD上，使LCD上的晝面得 以顯現。而面對LCD尺寸愈做愈大，所需的CCFL與其驅動 電路也必須有所增加。要達成大尺寸LCD的背光照明功能， 必須將多數的CCFL進行串/並聯，然而，由於先天上的因 素，CCFL具有以下缺點： 1. CCFL亮度不均，即使串/並聯最多數的CCFL，在LCD 的尺寸範圍之内，其所能得到的亮度仍然不均，尤其對於大 尺寸LCD更為明顯； 2. CCFL壽命較短，約使用4000〜6000小時就會開始亮 度衰減，且不易更換，造成LCD的使用壽命大幅縮短； 3. CCFL色彩飽和度不足，其色溫大約在4800K左右， 故僅能達成NTSC所規範的色域在80%左右，特別對於紅光 的表現更差，無法滿足高規格的色彩需求，例如面對儀器量 1312265 測的情況與特定色彩表現的環境下，就能明顯的發現其色彩 缺失； 4. CCFL使用上較為耗電，且製作時内含有害物質 「汞」，對於環境保護無疑是一種傷害，故京都預定書明訂 在2006年7月1日起禁制使用。因此，採行其它背光來源， 乃為LCD發展的必然趨勢。 5. CCFL使用時會產生紫外線’長期使用下對人類的眼 睛會造成嚴重傷害。 目前業界普遍採行的技術，乃為利用LED(發光二極體） 作為背光來源，LED應用在小尺寸的LCD螢幕上已有一段 時間’例如手機、PDA上，近年來更由於技術提升，使㈣ 的亮度大為提升’加上重量輕巧、堅固’且壽命較長，開機 反應較快，故已成為許多大尺寸LCD的選擇對象。 -般LED作為LCD背光來源的設置方法，係在lcd 一 側或兩側裝置數量不等的LED，當開啟電源時，LED光源即 技射在LCD上’使LCD上的影像得以顯現。唯，一般LED 的光線並非均句散射，而係集中在—小範圍内，使該led投 射光線的LCD上有一區域特別明亮，但該明亮區域四周可看 出明顯的亮度衰減，且色彩亦無法均勻呈現。 為此，改善方法係將咖設置在lcd背光板後方，並 且提高LED亮度，讓光線得以均勻投射在lcd上。然而， 1312265 採用LED的LCD背光板，其亮度取決於該LED的功率，當 LED亮度提高時，相對地會產生更高的熱量。而傳統咖 背光板由於其散熱方法不佳，故無法發揮LED的完整功能， 特別是高亮度白光LED ’造成整個LCD背光板的品質下降， 且谷易發生過熱損壞的情形。 另外，傳統LCD背光板的加工方法，丨LED發光晶粒 必須焊接在電路板上’不僅加工困難，降低生產良率，且容 易對電路板產生熱破壞，使整個LCD背光板損壞。而傳統 LCD背光板由於亮度不佳，在LCD與led發光晶粒之間尚 設置有滤光片、擴散片與導光片等，讓該導光片導引光源並 均句分佈，再由擴散片進一步將光線均句分散，並以遽光片 過濾偏差的色光。這些外加結構都會提冑lcd背光板的成 本’有礙其產業的發展。 再者，前述任何LCD裝置在部份背光板的元件發生損壞 時’無法單獨更換’而必須整體汰換，成本甚高。且對於大 尺寸LCD而π僅因單一元件損換即必須淘汰，不僅浪費， 且LCD廢棄品亦會增加環保的負擔。 有鑑於此’本案發明人即構思解決之方法，以特殊散熱 機制去除N功率LED發熱故障及亮度衰減等問題，並進一步 可以簡化製程與提高產能，經由長期研發與實驗後，終能成 功研成本件具有植入式發光二極體的背光板結構及其 1312265 '製作方法。 【發明内容j 本發明之主要目的即在於提_ 種具有植入式發光二極 體的背光板結構及其製竹古、土 u 、 / ’〃、藉由特殊的散熱機制，可 大幅降低因熱度產生的故障機率 丨早钱手以鈇咼大尺寸LCD的生產 良率與亮度。 本發明之另一目的即在於 於挺供一種具有植入式發光二極 體的背光板結構及其製作方 云，、間化產品的整體結構，無 需繁瑣的加工過程，進而提高產能與產品品質。 之再目的即在於提供一種具有植入式發光二極 體的背光板結構及其製作方法，其可採小型模組生產，故在 單-元件損壞時，可將損壞部份的模組直接更換使大尺寸 LCD的維護變為簡便可行。 本發明之下一目的即在 磁目女站 仕於徒供一種具有植入式發光二極1312265 IX. Description of the Invention: [Technical Field] The present invention relates to a backlight board having an implantable light-emitting diode, in particular to an arc-shaped concave cup provided on a printed circuit board, and the entire printed circuit board The nano-gold is completely sputtered to increase the conductivity and thermal conductivity of the product, and further facilitates the assembly of the LED light-emitting dies, thereby improving the productivity and quality of the LCD backlight. [Prior Art] The current LCD backlight panel is mainly based on white light CCFL (Cold Cathode Lamp). The CCFL is placed behind the LCD, and then the light is projected onto the light guide plate, the diffusion sheet, the brightness enhancement sheet, and then projected on the LCD. On top, the face on the LCD is revealed. In the face of increasing LCD size, the required CCFL and its driver circuit must also increase. To achieve the backlighting function of large-size LCDs, most CCFLs must be serial/parallel. However, due to inherent factors, CCFL has the following disadvantages: 1. CCFL brightness is uneven, even if the maximum number of CCFLs in series/parallel is Within the size range of the LCD, the brightness that can be obtained is still uneven, especially for large-size LCDs. 2. The CCFL has a short life span, and the brightness decay will start after about 4000~6000 hours, and it is not easy to replace, resulting in The service life of LCD is greatly shortened. 3. The color saturation of CCFL is insufficient, and its color temperature is about 4800K. Therefore, only the color gamut specified by NTSC is about 80%, especially for red light, which can not meet high specifications. The color requirements, such as the situation of the instrumental quantity 1312265 and the specific color performance, can clearly reveal the lack of color; 4. CCFL is more power-consuming, and contains harmful substances "mercury" during production. It is undoubtedly an injury to environmental protection. Therefore, the Kyoto reservation book is scheduled to be banned from use on July 1, 2006. Therefore, adopting other backlight sources is an inevitable trend in the development of LCD. 5. CCFL generates ultraviolet light when used. It can cause serious damage to human eyes under long-term use. At present, the technology commonly used in the industry is to use LED (Light Emitting Diode) as a backlight source. LED has been used on small-size LCD screens for a period of time, such as mobile phones and PDAs. (4) The brightness is greatly improved 'plus light weight, strong' and long life, and the boot response is faster, so it has become the object of choice for many large-size LCDs. As a way to set the LED backlight source, the LEDs are arranged on the side of the LCD or on both sides of the LED. When the power is turned on, the LED light source is on the LCD to make the image on the LCD appear. However, the light of a general LED is not scattered uniformly, but is concentrated in a small range, so that a region on the LCD that projects the light of the LED is particularly bright, but the brightness of the bright region can be seen around the bright region, and the color cannot be Evenly presented. To this end, the improvement method is to set the coffee behind the lcd backlight and increase the brightness of the LED so that the light is evenly projected onto the lcd. However, 1312265 LED backlight panel with LED, the brightness depends on the power of the LED, when the brightness of the LED is increased, relatively higher heat is generated. However, the conventional coffee backlight board cannot perform the full function of the LED due to its poor heat dissipation method, especially the high-brightness white LED ’, which causes the quality of the entire LCD backlight panel to be degraded, and the valley is prone to overheating damage. In addition, in the processing method of the conventional LCD backlight panel, the LED light-emitting die must be soldered on the circuit board. Not only processing is difficult, the production yield is lowered, and thermal damage to the circuit board is easily caused, and the entire LCD backlight panel is damaged. However, due to the poor brightness of the conventional LCD backlight panel, a filter, a diffusion sheet and a light guide sheet are disposed between the LCD and the LED light-emitting die, so that the light guide sheet guides the light source and distributes the sentence evenly, and then spreads. The film further spreads the ray uniforms and filters the deviations of the colored light with a calender. These additional structures will increase the cost of the LCD backlight, which hinders the development of its industry. Furthermore, any of the aforementioned LCD devices cannot be replaced individually when the components of some of the backlights are damaged, and must be replaced as a whole, which is costly. For large-size LCDs, π must be eliminated only due to single component loss, which is not only wasteful, but LCD waste products also increase the burden of environmental protection. In view of the fact that the inventor of the present invention conceived the solution, the special heat dissipation mechanism was used to remove the problems of N power LED heating failure and brightness attenuation, and the process and the production capacity were further simplified, and the cost was successfully developed after long-term research and development and experiment. A backlight structure having an implantable light-emitting diode and a 1312265' manufacturing method thereof. SUMMARY OF THE INVENTION The main purpose of the present invention is to provide a backlight structure having an implantable light-emitting diode and a bamboo-like structure, a soil u, / '〃, with a special heat dissipation mechanism, which can greatly reduce the cause. The probability of failure caused by heat is the production yield and brightness of large-size LCDs. Another object of the present invention is to provide a backlight structure with an implantable light-emitting diode and a square structure thereof, and an overall structure of the product, without cumbersome processing, thereby improving productivity and product quality. . A further object of the invention is to provide a backlight structure with an implantable light-emitting diode and a manufacturing method thereof, which can be produced by a small module, so that when a single-element is damaged, the damaged part can be directly replaced. Make the maintenance of large-size LCDs simple and feasible. The next object of the present invention is to provide an implantable light-emitting diode for the magnetic eye station.
體的背光板結構及盆掣你士、A 偁及八裏作方法，其減化製作流程，沒有嬋接 等加工過程或廢棄物’符合環保要求。 可達成刖述目的之—箱且亡括λ , 種八有植入式發光二極體的背光板 結構及其製作方法，盆白4工士 ，、匕括有一印刷電路板，該印刷電路板 可設置有多數的圓狐m h 杯’並且在印刷電路板上設置有背 光板所需電路；該印席丨丨番i ^ P刷電路板與圓弧型凹杯表面以濺鍍方法 佈設有一層奈米金，拉 错由该奈米金層的良好導電性與導熱 1312265 性’使該LCD背光板的散熱能力大增；而在每一個圓弧型凹 杯中，植設有- LED發光晶粒，由於奈米金層的建立，使該 LED發光晶粒可高周㈣合並定位在圓弧型凹杯中，然後將 導線延伸到電路板上’·另在該LED發光晶粒上覆蓋有一螢光 粉谬’係由適當比例的螢光粉與㈣混合物製成，其可協助 該LED發光晶粒發出高亮度均勻的白光；又在該圓弧型凹杯 與周圍的印刷電路板表面’包覆有—透光層，該透光層可為 透明矽膠’用來保護該圓弧型凹杯内的導線，同時將該咖 發光晶粒的光線散射出去。 【實施方式】 請參閱圖一、圖二所示，本發明係提供一種具有植入式 發光一極體的背光板結構，其係在一印刷電路板2上設置 有多數的LED 3(發光二極體），將此所形成的LCD背光板i， β又置在LCD後方（圖未示出）’藉由多數的LED 3發光投射在 LCD上，以得到所需的色澤與亮度。 前述LED 3單元，包括有一設置在該印刷電路板2上的 圓弧型凹杯3 1，而該印刷電路板2中設置有背光板所需的電 路；該印刷電路板2與圓弧型凹杯31表面，全面濺鍍有一 層奈米金4，由於奈米金4具有良好的導電與導熱能力，故 可提高該印刷電路板2的散熱能力；於前述圓弧型凹杯31 中，設置有一 LED發光晶粒32，由於奈米金4的佈設，該 1312265 ' LED發光晶粒32係以高周波炼合在圓弧型凹杯31的奈米金 • 4層上固定，同時其導線33延伸到兩側的印刷電路板2上， 經由該印刷電路板2上的電路提供LED發光晶粒32進行發 光；而在該LED發光晶粒32上，另包覆有一 f光粉膠 該螢光⑥膠34係由-定比例的螢光粉與⑦膠混合物製成， 其中該螢光粉係由歐斯朗公司授權，使其混合物得產生混色 光座標X=0.33; Y=0.33, 8000K色溫的單一波長白光，以形 成所需的高亮度白光LED 3;而在該圓弧型凹杯31與周圍的 印刷電路板2表面，另外包覆有—透光層35，該透光層35 為透明石夕膠，用來保護該圓弧型凹杯51内的導線Μ，同時 將該LED發光晶粒52的光線散射出去。 藉由上述的結構，本發明的散熱效果如圖三所示，其中 該LED發光晶粒32所產生的熱^，一部份可直接由底部的 不米金4與印刷電路板2排除’而往上與側邊的熱量，則由 於該圓弧型凹杯31產生渦流狀的熱對流現象，如此，大部 如的’、、、量在經由渦流狀的路徑後，會與該圓弧型凹杯3 1的 不米金4產生更多接觸的機會，然後再由奈米金4與印刷電 路板2進仃排除。因此，本發明確可產生較一般習用結構更 為顯著的散熱效果。 刖述之本發明的製作方法如圖四所示，係包括： a.於印刷電路板2上製作圓弧型凹杯3 1，並佈設相關電路； 1312265 b.將該印刷電路板2與圓弧型凹杯31全面賴奈采金4; £_將1^發光晶粒32植人並以高周波固定在圓孤型凹杯 3 1的奈米金4表層上，並且佈設導線3 3 ; d·將-榮光粉膠34包覆在LED發光晶粒32周圍； e•最後於圓弧型凹# 31與周圍印刷電路板2上覆蓋一透 光層3 5。 U =外，如圖五所示，本發明的LCD背光板ι結構係為小 ，的模組，可取適當大小的印刷電路板2，製作小型的⑽ 背光板卜再根據所需LCD尺寸，將多數的小型LCD背光 板1結合為—大型LCD背光板卜如此可增加LCD生產的 產能，以及提高良率。 妙前述LCD背光板【的LED 3係以平行式陣列佈設當 然亦可如圖六 '圖七所示，# LCD背光板丨的[ED 3係呈 交錯式陣列佈設，以提供不同的視覺感受。 經此完成的本發明，確可完成專利目的的高亮度、低發 熱效果，其詳細溫度變化如圖八〜圖八Η各圖所示，發明人 於本發明結構完成的32吋LCD背光板1〇表面，由左而由、 由上而上設置N1〜N8號的溫度檢測點，以及對照的室溫檢 測點N9,由實際位置推論，位在上方的溫度檢測點，其溫 度應高於下方的溫度檢測點，而無論是何方溫度檢測點，傳 統的LCD，通常會到達甚至超越1〇(rc。故傳統的嚴禁 1312265 使用者拆卸外殼包裝，除預防電搫外， 免烫傷亦是重要因 素 而經由本發明的結構，里择An 明顯低於傳統的設計， 即使最高溫亦在5〇t上下。使本發 本毛月可以長期高亮度使 下，仍能維持長久的壽命，實為不 』夕侍的優良發 上列詳細說明係針對本發明之— J仃實施例之且體古兒 明，惟該實施例並非用以限制本發 八° <寻利靶圍，凡未脫 本發明技藝精神所為之等效實施或變 X雯更，均應包含於本案 專利範圍中。 【圖式簡單說明】 圖-為本發明具有植入式發光二極體的背光板結構立 明。 用 離 之 圖； 體 圖二為該具有植入式發光二極體的背光板結面 圖； 圖三為該具有植入式發光二極體的背光板結構的散埶原 理圖； ^ 圖四為該具有植入式發光二極體的背光板結構的製作流 程圖； 圖五為該具有植入式發光二極體的背光板結構的組合例 圖； 圖六為該具有植入式發光二極體的背光板結構的另一實 施例圖； 12 1312265 圖七為圖六背光板結構的的組合例圖； 圖八為本發明應用於32吋LCD背光板點測8小時的溫 度變化圖； 圖八A〜Η為圖八不同位置的8小時溫度變化圖。 【主要元件符號說明】 Ν1 〜Ν9 溫度檢測點 1 LCD背光板 2 印刷電路板 3 LED 31 圓弧型凹杯 32 LED發光晶 36 導線 37 螢光粉膠 38 透光層 4 奈米金 10 LCD背光板 13The backlight structure of the body and the method of basin, A, and Bali are used to reduce the production process, and there is no processing such as splicing or waste. A backlight panel structure having an implantable light-emitting diode and a method for fabricating the same, and a printed circuit board, the printed circuit board It can be provided with a majority of round fox mh cups and the circuit required for the backlight board is provided on the printed circuit board; the printed circuit board and the surface of the arc-shaped concave cup are provided with a layer by sputtering method. Nano gold, the wrong conductivity of the nano-gold layer by the good conductivity and thermal conductivity 1312265 'to make the LCD backlight board heat dissipation capacity; and in each arc-shaped concave cup, planted - LED light crystal Granules, due to the establishment of the nano-gold layer, the LED light-emitting dies can be positioned in a circular arc-shaped concave cup in a high-circle (four), and then the wires are extended onto the circuit board. Fluorescent powder 谬 ' is made of a mixture of appropriate proportions of phosphor powder and (4), which can assist the LED illuminating crystal grains to emit high brightness and uniform white light; and in the arc-shaped concave cup and the surrounding printed circuit board surface' Covered with a light transmissive layer, the light transmissive layer can be used for transparent silicone Protective conductor within the arc concave cup, but the scattering of light emitting coffee grains out. [Embodiment] Referring to FIG. 1 and FIG. 2, the present invention provides a backlight structure having an implantable light-emitting diode, which is provided with a plurality of LEDs 3 on a printed circuit board 2 (light-emitting two) In this case, the formed LCD backlight i, β is placed behind the LCD (not shown), and is projected onto the LCD by a plurality of LEDs 3 to obtain desired color and brightness. The LED 3 unit includes a circular arc-shaped concave cup 3 1 disposed on the printed circuit board 2, and the printed circuit board 2 is provided with a circuit required for the backlight board; the printed circuit board 2 and the circular arc concave The surface of the cup 31 is completely sputtered with a layer of nano gold 4. Since the nano gold 4 has good electrical and thermal conductivity, the heat dissipation capability of the printed circuit board 2 can be improved; in the arc-shaped concave cup 31, the setting is There is an LED light-emitting die 32. Due to the layout of the nano gold 4, the 1312265' LED light-emitting die 32 is fixed on the nano-gold layer 4 of the arc-shaped concave cup 31 by high-frequency refining, and the wire 33 is extended. On the printed circuit board 2 on both sides, the LED light-emitting die 32 is provided to emit light through the circuit on the printed circuit board 2; and the LED light-emitting die 32 is additionally covered with a f-gloss adhesive. The glue 34 is made up of a proportioned phosphor powder and a 7-gum mixture, wherein the phosphor powder is authorized by the Osram company to produce a mixed color coordinate X=0.33; Y=0.33, 8000K color temperature. Single wavelength white light to form the desired high brightness white LED 3; The surface of the concave cup 31 and the surrounding printed circuit board 2 is additionally covered with a light transmissive layer 35, which is a transparent stone enamel for protecting the wire turns in the arc-shaped concave cup 51, and The light of the LED light-emitting die 52 is scattered. With the above structure, the heat dissipation effect of the present invention is as shown in FIG. 3, wherein a portion of the heat generated by the LED light-emitting die 32 can be directly excluded from the bottom of the non-meter gold 4 and the printed circuit board 2 The heat of the upper side and the side is caused by a vortex-like heat convection phenomenon in the arc-shaped concave cup 31. Thus, if the amount of the large part is ',, the amount is after the path through the eddy current, the arc type The non-rice gold 4 of the concave cup 3 1 creates a greater chance of contact and is then removed by the nano gold 4 and the printed circuit board 2. Therefore, the present invention can produce a more pronounced heat dissipation effect than the conventional structure. As shown in FIG. 4, the manufacturing method of the present invention includes: a. forming an arc-shaped concave cup 3 1 on the printed circuit board 2 and arranging the relevant circuit; 1312265 b. the printed circuit board 2 and the circle The arc-shaped concave cup 31 is fully relining gold 4; £_1 luminescence crystal 32 is implanted and fixed on the surface of the nano gold 4 of the circular recessed cup 3 1 by high frequency, and the wire 3 3 is laid; d - Wrap the glory powder 34 around the LED illuminating die 32; e• Finally, the arc-shaped recess #31 and the surrounding printed circuit board 2 are covered with a light-transmitting layer 35. U = outside, as shown in Figure 5, the LCD backlight panel of the present invention is a small module, which can take a suitable size of the printed circuit board 2, to make a small (10) backlight panel, and then according to the required LCD size, Most of the small LCD backlights 1 are combined into a large LCD backlight panel, which increases the productivity of LCD production and improves yield. The LED backlights of the aforementioned LCD backlights are arranged in a parallel array. As shown in Figure VII, Figure 7 shows the ED 3 series of LCD backlights in a staggered array to provide different visual perceptions. The invention completed by this invention can achieve the high-brightness and low-heating effect of the patent purpose, and the detailed temperature change thereof is shown in the figures of FIG. 8 to FIG. 8 , and the 32-inch LCD backlight board completed by the inventor in the structure of the invention 1 The surface of the crucible is set by the left and the temperature detection points of the N1 to N8 from the top, and the room temperature detection point N9 of the comparison, which is inferred from the actual position. The temperature is above the temperature detection point, and the temperature should be higher than the lower temperature. The temperature detection point, regardless of the temperature detection point, the traditional LCD, usually reaches or even exceeds 1 〇 (rc. Therefore, the traditional 1312265 users are strictly prohibited to disassemble the outer casing, in addition to preventing electricity, it is also important to avoid burns. Factors through the structure of the present invention, the choice of An is significantly lower than the traditional design, even the highest temperature is also above 5 〇 t. This hair can be long-term high brightness, can still maintain a long life, actually The detailed description of the above-mentioned details of the present invention is directed to the present invention, and the embodiment is not intended to limit the present invention. Technical spirit of the present invention For the equivalent implementation or change X Wen, it should be included in the scope of this patent. [Simplified illustration of the diagram] Figure - is a schematic diagram of the backlight panel structure with implantable light-emitting diode of the present invention. Figure 2 is a junction diagram of the backlight panel with the implantable LED; Figure 3 is a schematic diagram of the dilation panel of the backlight panel with the implanted LED; ^ Figure 4 shows the implant FIG. 5 is a schematic diagram of a combination of a backlight structure having an implantable light-emitting diode; FIG. 5 is a combination of the backlight structure having an implantable light-emitting diode; FIG. 7 is a combination diagram of the structure of the backlight panel of FIG. 6; FIG. 8 is a diagram showing the temperature change of the 32-inch LCD backlight panel for 8 hours; FIG. 8A 8 is the 8-hour temperature change diagram at different positions in Figure 8. [Main component symbol description] Ν1 ~ Ν9 Temperature detection point 1 LCD backlight 2 Printed circuit board 3 LED 31 Arc-shaped concave cup 32 LED illuminating crystal 36 Conductor 37 Fluorescent Powder glue 38 light transmission layer 4 nano gold 10 LCD backlight board 13