KR100876221B1 - Light emitting diode module and manufacturing method - Google Patents

Abstract

A light emitting diode module and a method for manufacturing the same are provided to maximize the optical efficiency of a light source by forming a reflective layer with a metal having a high reflectivity. A metal plate(121) having an upper conductive layer, or an insulating plate with upper and lower conductive layers is prepared. A pad(123a) is formed by patterning the upper conductive layer according to a preset pattern circuit. A resist(124) is coated on a region except the pad. A reflective layer(125) is coated on an upper surface of the resist corresponding to the remaining region except the surroundings of the pad. A light emitting source is electrically mounted on the pad which is exposed to the outside through the reflective layer. The reflective layer is made of aluminum, silver, and an alloy thereof through deposition, sputtering, or plating. The reflective layer coating process is performed after a pad protective member is attached on the pad.

Description

Light Emitting Diode Module and the manufacturing method

1 is a schematic diagram illustrating a general direct-emitting backlight unit.

2 shows a conventional light emitting diode module,

a) is a configuration diagram of a light emitting diode module using an insulating layer printed circuit board,

b) is a configuration diagram of a light emitting diode module using a metal printed circuit board.

3 is a configuration diagram showing a first embodiment of a light emitting diode module according to the present invention.

4 is a configuration diagram showing a second embodiment of the LED module according to the present invention.

5 (a) (b) (c) (d) are process diagrams for manufacturing the LED module according to the present invention.

6 (a) and 6 (b) are another process diagram of manufacturing a light emitting diode module according to the present invention.

Explanation of symbols on the main parts of the drawings

101: light emitting source 110, 120: substrate portion

111: insulated disc 121: metal disc

112: lower conductive layer 113,123: upper conductive layer

113a, 123a: Pad 114,124: Resist

115,125: reflective layer 119: through hole for heat dissipation

The present invention relates to a light emitting diode module and a method of manufacturing the same, and more particularly, to maximize the efficiency of using the light of the light emitting source and to improve the ability to emit heat generated during light emission to extend the service life of the light source, The present invention relates to a light emitting diode module and a method of manufacturing the same, which may improve the reliability of an application by improving light efficiency.

In general, light emitting diodes (LEDs) are being used in various applications and their application fields are continuously increasing.

Recently, as the luminous efficiency of such light emitting diodes is improved, efforts are being made to replace general lighting such as incandescent lamps, cold cathode fluorescent lamps, and hot cathode fluorescent lamps, which have been used for conventional lighting, with light emitting diodes.

In addition, as the prices of PDP, LCD-TV, and Projection-TV decrease, the flat-panel display market is greatly increasing. The competition for technology to replace cold cathode fluorescent lamps (CCFL), which are used as backlights, with light emitting diodes, is heating up.

In addition, the fluorescent lamp for refrigerators used in the field of special fluorescent lamps, especially at low temperatures, the luminous efficiency at low temperatures is greatly reduced and replaced with a light emitting diode light source has also been released.

When a high output light emitting diode is applied as a light source and a light for a backlight of a large LCD-TV, since a very high brightness is required in a limited space, the density of a plurality of light emitting diode light sources provided as a light emitting source is increased in a limited area. When emitting light, a lot of heat is generated. Accordingly, when the heat generated from the light emitting diode, which is a light emitting source, is not discharged to the outside, the lifespan of the light emitting diode is shortened, which in turn acts as a factor of degrading the performance of an applied product.

In general, a backlight unit provided in a display such as an LCD-TV includes a direct light type in which a plurality of light emitting diodes disposed directly below the liquid crystal panel irradiate light directly to the liquid crystal panel according to the arrangement of the light source; A plurality of light emitting diodes installed at the edge of the light guide pannel is classified as an edge light type that irradiates light and transmits light refracted through the light guide plate to the liquid crystal panel.

Back Light Unit (BLU) used for LCD-TV requires very thin thickness and the thickness of large LCD-TV BLU with screen size of 37 ”, 40”, 42 ”, 47”, etc. Is usually 30 ~ 50mm, and because the screen size is large, the direct-emitting backlight unit is mainly employed to attach the light emitting diode to the entire bottom surface.

FIG. 1 is a schematic view showing a general direct emitting type backlight unit, which includes a light emitting diode module 1 having a plurality of light emitting diodes 2 mounted on an upper surface thereof, and light irradiated from the light emitting diodes toward a liquid crystal panel. Diffuser plate 3 for diffusing the light into various directions, prism sheets 4 and 5 for collecting the light passing through them in a front viewing angle, and a protective film 6 for protecting it.

Here, since the backlight unit has a very thin thickness of 30 to 50 mm, the light directing angle of the light emitting diode 2, which is a light emitting source, is sufficiently wide to ensure uniformity of light. Accordingly, light emitted below the horizontal level is absorbed from the printed circuit board, or Only part of the light is reflected, which reduces the utilization efficiency of light.

In addition, the light emitting diode module 1 includes a light emitting diode module 1a in which a plurality of light emitting diodes 2 are mounted on an insulating layer printed circuit board, and a plurality of light emitting diodes 2 mounted on a metal printed circuit board. Light emitting diode module 1b.

As shown in FIG. 2A, the light emitting diode module 1a adheres the copper plate 12 to the lower surface of the insulator original plate 11 employed as FR-1 or FR-4, and insulates the original plate 11. The copper plate bonded to the upper surface of the panel) is patterned according to a predetermined circuit design to produce a pad 13 capable of mounting the light emitting diodes 2, and a white, green or A substrate was fabricated with the black resist 14 coated, and the module was fabricated by mounting the light emitting diodes 2 on the pads 13.

In addition, as shown in FIG. 2B, the light emitting diode module 1b is formed of a thin high heat resistant resist or film on the upper surface of the metal disc 21 made of a material having excellent conductivity such as copper or aluminum. The pad 23 is provided with an insulating adhesive layer 22, and a copper plate is adhered thereon, and then patterned according to a predetermined circuit design to manufacture a pad 23 for mounting the light emitting diode 2, and the pad 23 Manufacturing a module called MCPCB (Metal Core Printed Circuit Board) by coating the resist 24 of white, green or black on the area except for this, and manufacturing the module by mounting the light emitting diode 2 on the pad 23 Completed.

However, the light emitting diode module 1a in which the light emitting diodes 2 are mounted on a substrate having the insulator original plate 11 has a maximum of 60 even though the light propagating downward with respect to the light emitting diodes 2 is almost absorbed and reflected. As it reflects only about%, the efficiency of light utilization is very low, which acts as a factor of lowering the brightness of the backlight unit, and since the resist 14 is coated on the upper surface of the substrate, a plurality of integrated arrangements are made on the substrate. Since the heat emitted from the light emitting diodes was not effectively discharged to the outside, the heat radiation characteristics of the backlight unit were reduced.

The light emitting diode module 1b in which the light emitting diodes 2 are mounted on a substrate having the metal original plate 21 is made of a metal material having excellent thermal conductivity. As with the substrate having the insulator disc 11, it was very low, which lowered the brightness and limited the brightness.

Therefore, the present invention is to solve the above conventional problems, the object is to maximize the efficiency of using the light of the light source of the LCD-TV backlight unit and the light emitting diode light source for illumination and to emit heat generated during light emission to the outside The present invention provides a light emitting diode module and a method of manufacturing the same, which can extend the service life of a light source and improve light efficiency to improve the reliability of an application.

In order to achieve the above object, the present invention, at least one light emitting source;
And a substrate part electrically mounted to the light emitting source and configured to reflect light generated when the light emitting source emits light upward. The substrate part includes at least one insulating disc, an image of the insulating disc, Upper and lower conductive layers provided on the lower surface, pads patterned on the upper conductive layer to mount the light emitting source, resists applied to the remaining areas except the pads, and uniformity on the upper surfaces of the resists. To provide a light emitting diode module characterized in that it comprises a reflective layer is coated to reflect the light of the light emitting source.

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In addition, the present invention is at least one light emitting source; And a substrate unit on which the light emitting source is electrically mounted, and configured to reflect light generated when the light emitting source emits light upward. The substrate unit includes at least one metal source plate and an upper surface of the metal source plate. An upper conductive layer adhered to an insulating adhesive layer provided on the upper surface, a pad patterned on the upper conductive layer to mount the light emitting source, a resist applied to the remaining areas except the pad, and a top surface of the resist. It provides a light emitting diode module characterized in that it comprises a reflective layer is uniformly coated to reflect the light of the light emitting source.

More preferably, the reflective layer is made of any one of aluminum, silver or an alloy containing these metals.

More preferably, the reflective layer is provided with an area of 2/3 or more with respect to the entire upper surface of the substrate portion.

More preferably, the insulating disc includes at least one heat dissipation through hole connecting the pad and the lower conductive layer.

In addition, the present invention provides a method of manufacturing a semiconductor device comprising: providing at least one insulating disk including upper and lower conductive layers on upper and lower surfaces, or at least one metallic disk including an upper conductive layer on an upper surface and an insulating adhesive layer; Patterning the upper conductive layer according to a predetermined pattern circuit to form a pad; Applying a resist to the remaining area excluding the pad; Coating a reflective layer on an upper surface of the resist corresponding to the remaining areas except for the pads; And electrically mounting a light emitting source on a pad exposed to the outside through the reflective layer. It provides a light emitting diode module manufacturing method comprising a.

In addition, the present invention provides a method comprising: providing at least one insulating disk having upper and lower conductive layers on upper and lower surfaces, or at least one metal disk having an upper conductive layer on an upper surface thereof with an insulating adhesive layer; Patterning the upper conductive layer according to a predetermined pattern circuit to form a pad; Applying a resist to the remaining area excluding the pad; Electrically mounting a light emitting source on the pad; And coating a reflective layer on an upper surface of a resist corresponding to the remaining areas except around the pad on which the light emitting source is mounted.

Preferably, the reflective layer is formed by any one of deposition, sputtering or plating using a reflective material made of any one of aluminum, silver, or an alloy containing these metals.

More preferably, the reflective layer is deposited in the order of UV paint coating, reflective material deposition and UV paint coating.

More preferably, the coating of the reflective layer is performed after attaching the pad protection member to the pad on which the light emitting source is mounted.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

3 is a configuration diagram showing a first embodiment of a light emitting diode module according to the present invention. As shown, the light emitting diode module 100a includes a light emitting source 101 and a substrate unit 110. do.

The light emitting source 101 is a light emitting device such as a light emitting diode that is electrically mounted on at least one light emitting source on the substrate unit 110 to generate light when power is applied.

The substrate unit 110 is provided to reflect light generated when the light emitting source 101 emits light from the uppermost layer to the upper side to increase light utilization efficiency.

The substrate unit 110 includes at least one insulating disc 111, and upper and lower conductive layers 112 and 113 on upper and lower surfaces of the insulating disc 111 using a conductive metal such as copper as a material. It is provided with each.

The pad 113a is formed on the upper conductive layer 113 by patterning the circuit pattern according to a predetermined circuit pattern, and the light emitting source 101 is formed on the pad 113a through the conductive adhesive 101a. It can be connected in series or parallel and electrically connected to a circuit connected to an external power source.

In addition, a resist 114 is applied to the remaining areas excluding the pad 113a, and a reflective layer 115 reflecting light emitted from the light emitting source 101 upwards is applied to an upper surface of the resist 114. The reflective layer 115 is provided by coating a reflective material having a high light reflectance to a predetermined thickness in the remaining area except for the pad 113a on which the light emitting source 101 is mounted.

On the other hand, at least one of the insulating disk 111 is connected between the pad 113a and the lower conductive layer 112 so that heat generated when the light emitting source 101 emits light can be easily released to the outside. It is provided with a heat dissipation through-hole 119, the inside of the through-hole 119 is filled or coated with a metal material having excellent thermal conductivity.

In addition, the lower conductive layer 112 may be separately patterned to be electrically connected to the main substrate (not shown) or to constitute an electric circuit, but is not limited thereto and may be maintained as it is not patterned.

4 is a configuration diagram showing a second embodiment of a light emitting diode module according to the present invention. As shown, the light emitting diode module 100b includes a light emitting source 101 and a substrate unit 120. do.

The substrate unit 120 includes at least one metal disc 121 made of a metal having excellent thermal conductivity, such as copper and aluminum, and adheres an insulating adhesive layer 121a to an upper surface of the metal disc 121. The upper conductive layer 123 is formed of a conductive metal such as copper.

In addition, the upper conductive layer 123 is patterned according to a predetermined circuit pattern to form a pad 123a, and the pad 123a is formed by the conductive adhesive 101a in the same manner as above. 101) to configure a circuit electrically connected to the external power source.

In addition, a resist 124 is applied to the remaining areas excluding the pad 123a, and the remaining area except the pad 123a on which the light emitting source 101 is mounted on the upper surface of the resist 124. The reflective layer 125 is provided with a predetermined thickness using a reflective material having high light reflectance.

In this case, the reflective layers 115 and 125 provided in the substrate parts 110 and 120 include aluminum, silver, or metals so as to increase the reflection efficiency of reflecting the light generated when the light emitting source emits light directly onto the upper part. It is preferable to be provided with any one of alloys.

In addition, the reflective layers 115 and 125 may be provided with an area of 2/3 or more with respect to the entire upper surface of the substrate parts 110 and 210.

5 (a) (b) (c) (d) are process diagrams for manufacturing the LED module according to the present invention.

As shown in FIG. 3 to FIG. 5A, the LED module 100a or 100b according to the embodiment of the present invention may include a substrate part 110 and 120 including an insulating disc 111 or a metal disc 121. Will be provided.

As shown in FIG. 3, the substrate unit 110 includes upper and lower conductive layers 112 and 113 on the upper and lower surfaces of the insulating disc 111, respectively. As shown in FIG. 4, the upper conductive layer 123 is provided on the upper surface of the metal disc 121 via the insulating adhesive layer 121a.

Subsequently, as shown in FIG. 5 (a), a pattern circuit set in advance is formed on the upper conductive layer 113 provided on the insulating original plate 111 or the upper conductive layer 123 provided on the metal original plate 121. Patterning to form pads 113a and 123a on which the light emitting sources 101 are electrically mounted.

In addition, as illustrated in FIG. 5B, the upper conductive layers 113 and 123 on which the pads 113a and 123a are formed are provided with a resist 114 in the remaining areas except for the pads 113a and 123a. The pads 113a and 123a are externally exposed by including 124, while the circuit areas corresponding to the remaining areas are protected by the resists 114 and 124 from the external environment.

As shown in FIG. 5 (c), the reflective layers 115 and 125 are coated on the upper surfaces of the resists 114 and 124 with a metal having a high light reflectivity, and the coating layers have a predetermined thickness. 115) 125 should be provided on the top surface of the resist corresponding to the pad and the rest of the area except the surroundings.

Here, the reflective layers 115 and 125 may be formed of a reflective material made of any one of aluminum, silver, or an alloy containing these metals. It is formed in any way.

In addition, when the reflective layers 115 and 125 are provided by a deposition method, a UV coating is primarily coated to protect light reflectance, adhesion to a substrate, and a reflective layer after deposition, and a reflective material on an upper surface thereof. After the deposition is preferably deposited in the order of secondary coating the UV coating.

 In addition, when the pads 113a and 123a are exposed to the outside, the pads 113a and 123a may be damaged in the process of depositing or plating the reflective layers 115 and 125 in a high temperature working environment. The pad protection member (not shown), such as a high temperature tape or a mask, is attached to the pad, and the pad protection member is removed after the coating operation of the reflective layer.

Finally, as shown in FIG. 5 (d), the light emitting source 101 is electrically mounted on the pads 113a and 123a externally exposed through the reflective layers 115 and 125 by a conductive adhesive. The reflective layer manufactures and completes the light emitting diode modules 100a and 100b having improved light reflectance.

On the other hand, the process of mounting the light emitting source 101 to the pad is not always performed after coating the reflective layers 115 and 125 on the upper surface of the resist (114) (124).

That is, as shown in FIG. 6 (a), the light emitting source 101 is mounted on the pad exposed externally through the resists 114 and 124 through the conductive adhesive, and then, in FIG. 6 (b). As shown, a process of coating the reflective layers 115 and 125 on the upper surfaces of the resists 114 and 124 may be finally performed.

In this case, the pads are not attached to the pad as described above when the reflective layers 115 and 125 are prevented from being contaminated or damaged by the high heat generated in the reflow process for mounting the light emitting source. It is possible to stably ensure the reflection efficiency of the reflective layer by preventing the area on which the light emitting source is mounted from being contaminated by the reflective material to be coated when the reflective layer is coated.

While the invention has been shown and described in connection with specific embodiments, it is to be understood that various changes and modifications can be made in the art without departing from the spirit or the scope of the invention as set forth in the claims below. It will be appreciated that those skilled in the art can easily know.

According to the present invention as described above, by providing a reflective layer made of a metal material with high light reflectivity on the uppermost layer of the substrate portion on which at least one light emitting source is electrically mounted, it is possible to totally reflect the light generated when the light emitting source emits light. Therefore, the light efficiency of the light source provided in the LCD-TV backlight unit and the light source provided for illumination can be maximized to improve the reliability of the product.

In addition, it is possible to improve the ability to release the heat generated during light emission to the outside by securing a heat emission path for emitting heat generated from the light source to the outside, thereby extending the service life of the light source and reliability of the application product The effect which can raise is obtained.

Claims (11)

delete At least one light emitting source; And a substrate unit on which the light emitting source is electrically mounted and provided to reflect light generated when the light emitting source emits light upwards. The substrate part includes at least one insulating disc, upper and lower conductive layers provided on upper and lower surfaces of the insulating disc, pads patterned on the upper conductive layer to mount the light emitting source, and the pads. And a reflective layer uniformly coated on the upper surface of the resist and a reflective layer reflecting light of the light emitting source. At least one light emitting source; And a substrate unit on which the light emitting source is electrically mounted and provided to reflect light generated when the light emitting source emits light upwards. The substrate part includes at least one metal disc, an upper conductive layer adhered to an insulating adhesive layer provided on an upper surface of the metal disc, a pad patterned on the upper conductive layer to mount the light emitting source, and the pad. And a reflective layer that is uniformly coated on the upper surface of the resist and a reflective layer reflecting light of the light emitting source. The method according to claim 2 or 3, The reflective layer is a light emitting diode module, characterized in that made of any one of aluminum, silver or an alloy containing these metals. delete The method of claim 2, And the at least one heat dissipation through-hole connecting the pad and the lower conductive layer to the insulating disc. Providing at least one insulating disc having upper and lower conductive layers on upper and lower surfaces, or at least one metal disc having an upper conductive layer on an upper surface thereof via an insulating adhesive layer; Patterning the upper conductive layer according to a predetermined pattern circuit to form a pad; Applying a resist to the remaining area excluding the pad; Coating a reflective layer on the upper surface of the resist corresponding to the remaining areas except for the pads; And And mounting a light emitting source on a pad exposed to the outside through the reflective layer. Providing at least one insulating disc having upper and lower conductive layers on upper and lower surfaces, or at least one metal disc having an upper conductive layer on an upper surface thereof via an insulating adhesive layer; Patterning the upper conductive layer according to a predetermined pattern circuit to form a pad; Applying a resist to the remaining area excluding the pad; Electrically mounting a light emitting source on the pad; And Coating a reflective layer on the upper surface of the resist corresponding to the remaining area except the pad around the light emitting source is mounted. The method according to claim 7 or 8, The reflective layer is a method of manufacturing a light emitting diode module, characterized in that formed by any one of deposition, sputtering or plating with a reflective material made of any one of aluminum, silver or an alloy containing these metals. The method of claim 9, The reflective layer is a light emitting diode module manufacturing method characterized in that the deposition in the order of UV coating coating, reflective material deposition and UV coating coating. The method of claim 7, wherein Coating the reflective layer is performed after attaching a pad protective member to a pad on which the light emitting source is mounted.

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