CN114302555A - Circuit board and electronic equipment - Google Patents
Circuit board and electronic equipment Download PDFInfo
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- CN114302555A CN114302555A CN202111616099.4A CN202111616099A CN114302555A CN 114302555 A CN114302555 A CN 114302555A CN 202111616099 A CN202111616099 A CN 202111616099A CN 114302555 A CN114302555 A CN 114302555A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The application discloses circuit board and electronic equipment belongs to communication technology field. The method comprises the following steps: a conductive substrate, a base and a board-to-board connector; wherein, the base body is provided with a through hole, and the conductive substrate is arranged in the through hole; the first conductive connecting layer is arranged between the conductive substrate and the board-to-board connector, the conductive substrate inputs current to the board-to-board connector through the first conductive connecting layer, and the board-to-board connector is used for outputting the current to the battery module.
Description
Technical Field
The application belongs to the technical field of communication, and particularly relates to a circuit board and electronic equipment.
Background
At present, the application programs in the electronic devices are frequently used, and the power consumption of the electronic devices is getting larger and larger, so that the endurance time of the electronic devices is difficult to maintain daily requirements. Generally, the charging time of the electronic device can be greatly reduced by increasing the charging power of the electronic device, and the electronic device requires a wider Flexible Printed Circuit (FPC) due to the increase of the charging power of the electronic device, so as to ensure that the electronic device can pass a larger charging current.
However, in the above method, the FPC is too wide, so that the middle frame of the electronic device is avoided from the FPC area to be enlarged, and therefore, the overall structural strength of the electronic device is low, and meanwhile, the increase of the FPC area causes the adhesive area between the battery and the middle frame to be small, and the firmness of the battery is poor.
Disclosure of Invention
An object of the embodiments of the present application is to provide a circuit board and an electronic device, which can solve the problem of a large FPC area.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a circuit board, including: a conductive substrate, a base, and a board-to-board connector (i.e., a BTB connector); wherein, the base body is provided with a through hole, and the conductive substrate is arranged in the through hole; the first conductive connecting layer is arranged between the conductive substrate and the board-to-board connector, the conductive substrate inputs current to the board-to-board connector through the first conductive connecting layer, and the board-to-board connector is used for outputting the current to the battery module.
In a second aspect, embodiments of the present application provide an electronic device, which includes a processor, a memory, and a program or instructions stored on the memory and executable on the processor, and when executed by the processor, implement the steps of the method according to the first aspect.
In the embodiment of the present application, the circuit board includes a conductive substrate, a base (e.g., an insulator), and a board-to-board connector, and by providing a through hole in the base, the conductive substrate is disposed in the through hole of the base, and a conductive connection layer is disposed between the conductive substrate and the board-to-board connector, so that current can be output to the battery module. In the scheme, the middle dielectric layer and the bottom adhesive layer in the circuit board are hollowed and replaced by the conductive substrate (such as a high-conductivity metal body), namely, the overcurrent medium in the circuit board is the high-conductivity metal body, so that the width of the circuit board does not need to be increased, and the overcurrent capacity of the circuit board per unit width is also improved. This scheme is through the through-hole department in the circuit board sets up conductive substrate and improves the ability of overflowing of circuit board promptly, has avoided broadening FPC to make electronic equipment's center dodge the regional grow of FPC to the increase of FPC area has been avoided leading to the viscose area reduction of battery and center, thereby has promoted the firmness of battery.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a T-shaped high-conductivity metal body according to an embodiment of the present disclosure;
fig. 3 is a second schematic structural diagram of a circuit board according to an embodiment of the present disclosure;
fig. 4 is a third schematic structural diagram of a circuit board according to an embodiment of the present disclosure;
fig. 5 is a fourth schematic view illustrating a structure of a circuit board according to an embodiment of the present disclosure;
fig. 6 is a fifth schematic view illustrating a structure of a circuit board according to an embodiment of the present disclosure;
fig. 7 is a sixth schematic view illustrating a structure of a circuit board according to an embodiment of the present application;
fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The circuit board provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
With the rapid development of mobile interconnection and the popularization of 5G communication, the use frequency of application programs in electronic equipment is frequent, and the power consumption of the electronic equipment becomes larger and larger, so that the daily requirement of endurance time is difficult to maintain. Generally, anxiety of users to insufficient electric quantity is solved by improving charging power, so the requirement on quick charging is higher and higher, the popularization of 120 watt quick charging means that the charging current of electronic equipment is increased, the FPC is designed according to the thinnest thickness under the condition that the thickness of the whole machine is not influenced, so that the FPC is wider and wider before being compared, and the FPC mostly passes through the bottom of a battery bin, so the connection reliability of the adhesive area of the bottom of a battery and an alloy middle frame is poorer under the condition that the FPC is widened.
In order to solve the technical problem, in the embodiment of the application, the conductive substrate can be replaced by hollowing the middle dielectric layer and the bottom adhesive layer of the circuit board, so that the overcurrent capacity of the unit width of the circuit board is improved.
The embodiment of the application provides a circuit board, and fig. 1 shows a schematic structural diagram of the circuit board provided by the embodiment of the application. As shown in fig. 1, a circuit board 10 provided in the embodiment of the present application may include: a conductive substrate 11, a base 12 and a board-to-board connector 13.
In the embodiment of the present application, the base 12 has a through hole, and the conductive substrate 11 is disposed in the through hole and used for overcurrent; and a first conductive connecting layer is arranged between the conductive substrate and the board-to-board connector, the conductive substrate inputs current to the board-to-board connector through the first conductive connecting layer, and the board-to-board connector is used for outputting the current to the battery module.
Optionally, in this embodiment of the present application, the circuit board may be any one of the following: flexible Printed Circuit boards, FPCs, Printed Circuit Boards (PCBs) (e.g., single panel, double panel, or multi-layer Board), and the like. The specific method can be determined according to actual use requirements, and the embodiment of the application is not limited.
Alternatively, in the embodiment of the present application, the conductive substrate may be a metal body having high conductivity or a liquid having high conductivity.
Alternatively, in an embodiment of the present application, the metal body having high conductivity may be any one of: copper core aluminum stranded wire, copper alloy, chromium zirconium copper strip, and the like. The specific method can be determined according to actual use requirements, and the embodiment of the application is not limited.
Optionally, in an embodiment of the present application, the substrate may be any one of: mica insulators, solid insulators (e.g. plastic, rubber, glass or ceramic), liquid insulators (e.g. natural mineral oil, silicone oil or trichlorobiphenyl), or gaseous insulators (e.g. air, carbon dioxide or sulphur hexafluoride), etc. The specific method can be determined according to actual use requirements, and the embodiment of the application is not limited.
Optionally, in this embodiment of the application, the first conductive connection layer may be any one of: copper foil layers, aluminum foil layers, silver foil layers, gold foil layers, or the like. The specific method can be determined according to actual use requirements, and the embodiment of the application is not limited.
Alternatively, in the embodiment of the present application, the conductive base includes a first metal body 14 and a second metal body 15.
In an embodiment of the present invention, the first metal body and the second metal body are attached and connected in a T-shaped manner.
Optionally, in this embodiment of the application, the attaching connection between the first metal body and the second metal body in a T-shaped manner may specifically be: the first metal body and the second metal body are welded, attached and connected in an ultrasonic mode.
Optionally, in this embodiment of the application, the conductive materials of the first metal body and the second metal body may be the same or different. The specific method can be determined according to actual use requirements, and the embodiment of the application is not limited.
Illustratively, as shown in fig. 2, the T-shaped high-permittivity metal body may include a base 12, a single copper foil 14 (i.e., a first metal body) disposed at the bottom of the through-hole, and a second metal body 15 disposed over the single copper foil. The second metal body and the single-layer copper foil are welded, attached and connected in an ultrasonic mode, and the thickness of the second metal body is 3 times of that of the single-layer copper foil.
In the embodiment of the present invention, in order to more clearly illustrate the structure of the T-shaped high-conductivity metal body, fig. 2 is a planar view illustrating the structure of the T-shaped high-conductivity metal body.
In the embodiment of the application, the conductive substrate is divided into the first metal body and the second metal body, and the first metal body and the second metal body are connected in a T-shaped mode, so that the firmness of the conductive substrate is improved, and the overcurrent capacity of the unit width of the circuit board is improved.
Optionally, in this embodiment of the present application, the circuit board further includes a second conductive connection layer 16, and the second conductive connection layer is disposed in the through hole.
In an embodiment of the present invention, the through hole includes a groove, the conductive connection layer in the groove is a first metal body, and the second metal body is vertically disposed on the first metal body.
It should be noted that the conductive connection layer in the groove is a part of the second conductive connection layer; for the description of the second conductive connection layer, reference may be made to the description of the first conductive connection layer, which is not repeated herein.
Optionally, in this embodiment, referring to fig. 2, as shown in fig. 3, the circuit board may include a second copper foil layer 16, a through hole 17 in the substrate 12, and an insulating cover film 18, where the through hole includes a groove 19, the copper foil layer in the groove is the first metal body 14, and the second metal body 15 is vertically disposed on the first metal body, and the insulating cover film 18 is attached to the substrate 12.
It should be noted that, in the embodiment of the present invention, in order to more clearly illustrate the structure of the circuit board, fig. 3 is a schematic planar view of the circuit board structure.
In the embodiment of the application, the conductive connecting layer in the groove of the circuit board is used as the first metal body, and the second metal body is vertically arranged on the first metal body, namely, the second metal body is directly attached and connected with the conductive connecting layer in the groove, so that the firmness of the second metal body is improved, and the overcurrent capacity of the unit width of the circuit board is improved.
Optionally, in this embodiment of the application, the length of the first metal body is greater than the length of the second metal body, and the thickness of the second metal body is greater than the thickness of the second copper foil layer.
It should be noted that the second conductive connection layer includes the conductive connection layer in the groove, that is, the thickness of the second metal body is greater than that of the first metal body.
Optionally, in this embodiment of the application, the thickness of the second metal body is greater than the thickness of the second conductive connection layer, and specifically, the thickness of the second metal body may be: the thickness of the second metal body is N times of that of the second conductive connecting layer, and N is an integer greater than 1.
In the embodiment of the application, the length of the first metal body is greater than that of the second metal body, so that the firmness between the second metal body and the circuit board is improved, and the thickness of the second metal body is greater than that of the first metal body, so that the overcurrent capacity of the circuit board in unit width is improved.
Alternatively, in the embodiment of the present application, as shown in fig. 4 in conjunction with fig. 3, the flexible printed circuit board may include a top insulating double-sided tape 20, an insulating cover film and adhesive tape 21, a first copper foil and plating layer 22, a base insulating layer 23, a second copper foil layer and plating 24, and a T-type high-conductivity metal and ultrasonic bonding area 25, wherein the T-type high-conductivity metal body and ultrasonic bonding area 25 includes a T-type high-conductivity metal body wide-sided copper foil 25-1, a T-type high-conductivity metal body wide-sided insulating cover tape and adhesive tape 25-2, a T-type high-conductivity metal body narrow-sided tape 25-3, and a base body 12.
It should be noted that fig. 4 is a schematic plan view of the structure of the circuit board in order to more clearly illustrate the structure of the flexible printed circuit board.
The embodiment of the application provides a circuit board, and the circuit board includes electrically conductive base plate, base member and board to board connector, through set up the through-hole in the base member, sets up electrically conductive base plate in the through-hole of base member to export electric current to battery module through board to board connector. In the scheme, the middle dielectric layer and the bottom adhesive layer in the circuit board are hollowed and replaced by the conductive substrate (such as a high-conductivity metal body), namely, the overcurrent medium in the circuit board is the high-conductivity metal body, so that the overcurrent capacity of the circuit board per unit width can be improved without increasing the width of the circuit board. This scheme is through the through-hole department in the circuit board sets up conductive substrate and improves the ability of overflowing of circuit board promptly, has avoided broadening FPC to make electronic equipment's center dodge the regional grow of FPC to the increase of FPC area has been avoided leading to the viscose area reduction of battery and center, thereby has promoted the firmness of battery.
Optionally, in this embodiment of the present application, the circuit board further includes a board-to-board connector and a third conductive connection layer 26.
In an embodiment of the present invention, the third conductive connecting layer is attached to the second metal body, and the third conductive connecting layer extends to a bending region of the board-to-board connector.
It should be noted that, for the description of the third conductive connection layer, reference may be made to the description of the first conductive connection layer or the second conductive connection layer, which is not repeated herein.
Illustratively, in conjunction with fig. 4, as shown in fig. 5, the flexible printed circuit board may include a top insulating double-sided tape 20, an insulating cover film and adhesive tape 21, a first copper foil and plating layer 22, a base insulating layer 23, a second copper foil layer and plating 24, a T-type high-conductivity metal and ultrasonic bonding region 25, a base body 12, and a third copper foil 26. The T-shaped high-conductivity metal body and ultrasonic welding area 25 comprises a wide copper foil 25-1 of the T-shaped high-conductivity metal body, a wide insulating cover glue 25-2 of the T-shaped high-conductivity metal body and an adhesive glue 25-3 of the T-shaped high-conductivity metal body.
It should be noted that, in the embodiment of the present invention, in order to more clearly illustrate the structure of the circuit board, fig. 5 is a side cross-sectional view illustrating the structure of the circuit board.
In the embodiment of the invention, the third conductive connecting layer is added on the second metal body and is extended to the bending area of the BTB, so that the overcurrent capacity of the bending area of the BTB is improved, and the bonding strength between the second metal body and the circuit board is increased.
Optionally, in this embodiment of the application, as shown in fig. 6 in combination with fig. 1, a width of the bending region of the circuit board is smaller than a width of the over-current area of the circuit board.
In the embodiment of the application, because the width of the bending area of the circuit board is less than the width of the overcurrent area, namely, the middle frame avoiding area of the circuit board is reduced, the situation that the adhesive area between a battery and a middle frame support in the electronic equipment is small is avoided, the firmness of the battery is poor, and therefore, the firmness of the electronic equipment is improved.
Optionally, in the embodiment of the present application, the circuit board further includes a reinforcing steel sheet 27.
In the embodiment of the present application, the reinforcing steel sheet 27 is attached to the outer surface of the first insulator 1 of the circuit board, the inner surface of the first insulator is attached to the third conductive connecting layer of the circuit board, the third conductive connecting layer is connected to the second conductive connecting layer 16 through the narrow surface of the T-shaped conductive substrate, and the second conductive connecting layer is connected to the board-to-board connector.
Exemplarily, referring to fig. 4, as shown in fig. 7, the circuit board may include an overcurrent area 1 under the battery, a T-shaped high conductivity metal body narrow side 2, a T-shaped high conductivity metal body wide side 3, a reinforcing steel sheet 27, a board-to-board connector 13, a second copper foil 26, and a third copper foil 26, wherein the third copper foil is a copper foil added on the T-shaped high conductivity metal body narrow side 2.
It should be noted that, in the embodiment of the present invention, in order to more clearly illustrate the structure of the circuit board, fig. 7 is a side cross-sectional view illustrating the structure of the circuit board.
An embodiment of the present application provides an electronic device, and fig. 8 shows a schematic structural diagram of an electronic device provided in an embodiment of the present application. As shown in fig. 8, an electronic device 28 provided by the embodiment of the present application may include a circuit board 10.
It should be noted that the circuit board 10 may be the circuit board described in the above embodiment, and for the description of the circuit board 10, reference may be made to the description in the above embodiment, and details are not described here again.
The embodiment of the application provides an electronic equipment, and electronic equipment includes the circuit board, and this circuit board is through setting up the through-hole in the insulator to with circuit board intermediate dielectric layer and bottom surface viscose layer hollowing out and replacing for conducting baseplate. In the scheme, the middle dielectric layer and the bottom adhesive layer in the circuit board are hollowed and replaced by the conductive substrate, so that the overcurrent capacity of the unit width of the circuit board is improved without increasing the width of the circuit board in the electronic equipment, the situation that the adhesive area of the alloy middle frame of the battery and the electronic equipment is small due to the fact that the circuit board in the electronic equipment is too wide is avoided, the connection reliability of the adhesive area of the bottom of the alloy middle frame of the battery and the alloy is poor, the overall structural strength of the electronic equipment is improved, and the overcurrent capacity of the electronic equipment is improved.
Optionally, in this embodiment of the application, the electronic device further includes a battery module.
In this embodiment, the battery module is connected to a board-to-board connector in a circuit board, and the battery module is configured to supply power to an electronic device by using a current output by the board-to-board connector.
In the embodiment of the application, the battery module in the electronic device can be connected with the board-to-board connector in the circuit board, so that the electronic device can be charged by large current passing through the circuit board.
In the embodiment of the application, the electronic equipment can be connected with the battery module through the board-to-board connector in the circuit board, so that the electronic equipment can receive larger current, and the charging efficiency of the electronic equipment is improved.
Optionally, in this embodiment of the application, the electronic device further includes a first insulator and a second insulator.
In an embodiment of the present invention, the first insulator is attached to a first outer surface of the circuit board, and the second insulator is attached to a second outer surface of the circuit board.
Optionally, in this embodiment of the application, the first outer surface of the circuit board may be an upper surface of the circuit board, and the second outer surface of the circuit board may be an upper surface of the circuit board; or the second outer surface of the circuit board is the lower layer surface of the circuit board, and the first outer surface of the circuit board is the lower layer surface of the circuit board. The specific method can be determined according to actual use requirements, and the embodiment of the application is not limited.
In the embodiment of the application, the first outer surface and the second outer surface of the circuit board are attached with the insulators, so that the bonding strength between the circuit board and the electronic equipment is enhanced.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present application.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A circuit board, comprising: a conductive substrate, a base and a board-to-board connector;
wherein a through hole is provided in the base body, and the conductive substrate is disposed in the through hole;
the battery module comprises a conductive substrate and a board-to-board connector, wherein a first conductive connecting layer is arranged between the conductive substrate and the board-to-board connector, the conductive substrate inputs current to the board-to-board connector through the first conductive connecting layer, and the board-to-board connector is used for outputting the current to the battery module.
2. The circuit board of claim 1, wherein the conductive substrate comprises a first metal body and a second metal body;
the first metal body and the second metal body are attached and connected in a T-shaped mode.
3. The circuit board of claim 2, further comprising a second conductive connection layer disposed in the via;
the through hole comprises a groove, the conductive connecting layer in the groove is the first metal body, and the second metal body is vertically arranged on the first metal body.
4. The circuit board of claim 2, wherein the first metal body has a length greater than a length of the second metal body;
the thickness of the second metal body is greater than the thickness of the second conductive connection layer.
5. The circuit board of claim 2, further comprising a board-to-board connector and a third conductive connection layer;
the third conductive connecting layer is attached to the second metal body and extends to the bending area of the board-to-board connector.
6. The circuit board of claim 1, wherein the width of the bending region of the circuit board is smaller than the width of the over-flow region of the circuit board.
7. The circuit board of claim 1, further comprising a reinforcing steel sheet;
the reinforcing steel sheet with the surface laminating of the first insulator of circuit board, the internal surface of first insulator with the laminating of the electrically conductive articulamentum of third of circuit board, the electrically conductive articulamentum of third pass through T type electrically conductive base plate with the electrically conductive articulamentum of second of circuit board is connected, the electrically conductive articulamentum of second and board-to-board connector are connected.
8. An electronic device characterized by comprising the circuit board according to any one of claims 1 to 7.
9. The electronic device of claim 8, further comprising a battery module;
the battery module is connected with a board-to-board connector in the circuit board, and the battery module is used for supplying power to the electronic equipment by adopting the current output by the board-to-board connector.
10. The electronic device according to claim 8 or 9, characterized in that the electronic device further comprises a first insulator and a second insulator;
the first insulator is attached to the first outer surface of the circuit board, and the second insulator is attached to the second outer surface of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111616099.4A CN114302555A (en) | 2021-12-27 | 2021-12-27 | Circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111616099.4A CN114302555A (en) | 2021-12-27 | 2021-12-27 | Circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114302555A true CN114302555A (en) | 2022-04-08 |
Family
ID=80969646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111616099.4A Pending CN114302555A (en) | 2021-12-27 | 2021-12-27 | Circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114302555A (en) |
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2021
- 2021-12-27 CN CN202111616099.4A patent/CN114302555A/en active Pending
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