CN114284259A - LED lamp bead, preparation method thereof and LED lamp strip - Google Patents
LED lamp bead, preparation method thereof and LED lamp strip Download PDFInfo
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- CN114284259A CN114284259A CN202210091203.0A CN202210091203A CN114284259A CN 114284259 A CN114284259 A CN 114284259A CN 202210091203 A CN202210091203 A CN 202210091203A CN 114284259 A CN114284259 A CN 114284259A
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- led lamp
- zener diode
- support
- lamp bead
- substrate
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Abstract
The invention provides an LED lamp bead, a preparation method thereof and an LED lamp strip, wherein the LED lamp bead comprises a substrate, a bracket bowl cup, a Zener diode and an LED chip, a bracket area is arranged on the substrate, the bracket bowl cup and the substrate are integrally arranged, the Zener diode is electrically connected with the surface of the substrate, the Zener diode and the bracket bowl cup are both positioned in the bracket area, the bracket bowl cup covers the Zener diode, a die bonding area is formed in the bracket bowl cup in a hollow mode, and the LED chip is positioned in the die bonding area. According to the LED lamp bead, the support bowl cup covers the Zener diode, namely the Zener diode is sealed in the support bowl cup, so that the space utilization rate of a die bonding area of the support bowl cup is improved, the Zener diode can be prevented from absorbing light emitted by an LED chip, and the overall brightness of the LED lamp bead and the product yield of the LED lamp bead are improved.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to an LED lamp bead, a preparation method thereof and an LED lamp bar.
Background
With the progress of science and technology, the life of people is also continuously improved, the requirement on illumination is higher and higher, and nowadays, the LED is put into the illumination market and is widely favored by users due to the advantages of low energy consumption, long service life, light adjustment, environmental protection and the like.
As LEDs enter various industries, users have higher and higher requirements for performance of LEDs, wherein ESD (Electro-Static discharge) resistance is particularly important in real life. The existing LED utilizes the silver colloid to bond the Zener diode in the bracket bowl cup to play the role of ESD protection, however, the LED chip is also arranged in the bracket bowl cup, because the space in the bracket bowl cup is limited, the addition of the Zener diode can limit the mountable size of the LED chip, and further the luminous brightness of the LED chip is limited, in addition, the outer surface of the Zener diode is black, the LED chip has an absorption effect on the light emitted by the LED chip, and the whole brightness of the LED is influenced.
Disclosure of Invention
Based on the above, the invention aims to provide an LED lamp bead, a preparation method thereof and an LED lamp strip, so as to solve the problems that in the prior art, a Zener diode and an LED chip are arranged in a bracket bowl together, the Zener diode occupies a certain space, the size of the LED chip is limited, the Zener diode has an absorption effect on light emitted by the LED chip, and the overall brightness of the LED is influenced.
The utility model provides a LED lamp pearl, includes base plate, support bowl cup, zener diode and LED chip, it is regional to be provided with the support on the base plate, the support is regional to be used for settling support bowl cup, support bowl cup with the base plate integration sets up, zener diode with the surperficial electric connection of base plate, zener diode with support bowl cup all is located in the support region, just support bowl cup covers zener diode, the inside hollow solid brilliant region that forms of support bowl cup, the LED chip is located gu in the brilliant region.
The invention has the beneficial effects that: through set up the support region on the base plate, set up zener diode and support bowl cup at the support region jointly, and utilize support bowl cup to cover zener diode, be about to seal in the zener diode in the support bowl cup, be different from prior art, not only solved zener diode and occupy the space that is used for solid brilliant in the support bowl cup, restrict LED chip size's problem, the space utilization who has promoted support bowl cup's solid brilliant region, simultaneously can also avoid zener diode to absorb the light that the LED chip sent, and then promoted the whole luminance of LED lamp pearl and the product yield of LED lamp pearl.
Preferably, the zener diode is fixedly connected to the substrate by soldering.
Preferably, the thickness of the LED chip is smaller than the height of the support bowl.
Preferably, the LED chip is fixedly connected to the substrate through die attach adhesive or solder paste.
Preferably, the support bowl is made of an insulating material, and the substrate is made of a conductive material.
Preferably, the substrate comprises an anode pad and a cathode pad, and the anode end and the cathode end of the LED chip are electrically connected to the cathode pad and the anode pad respectively through bonding wires.
Preferably, the holder bowl is formed by injection molding.
The application also provides a method for preparing the LED lamp bead, which comprises the following steps:
etching the substrate;
welding the Zener diode on the etched substrate;
forming a bracket bowl in the bracket area on the substrate through an injection molding process, and covering the bracket bowl with the Zener diode;
welding a bonding wire in a die bonding area formed by the support bowl cup and bonding an LED chip in the die bonding area through die bonding glue;
and filling a fluorescent layer in the support bowl cup, and covering the LED chip and the bonding wire with the fluorescent layer.
The application also provides an LED lamp strip, including the LED lamp pearl in the above-mentioned.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is a schematic structural diagram of an LED lamp bead according to a first embodiment of the present invention;
fig. 2 is a cross-sectional view of an LED lamp bead provided in the first embodiment of the present invention.
Description of the main element symbols:
| |
10 | Die |
21 |
| |
20 | |
40 |
| Zener |
30 | |
50 |
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Several embodiments of the invention are presented in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 2, an LED lamp bead according to a first embodiment of the present invention is shown, which includes a substrate 10, a support bowl 20, a zener diode 30, and an LED chip 40.
Wherein: the base plate 10 is made of a conductive material, the support bowl 20 is made of an insulating material, specifically, the support bowl 20 is of an annular structure made of an epoxy resin material, and the base plate 10 is a copper sheet made of a copper material. In the embodiment, a support region is disposed on the substrate 10, the support region is used for placing the support bowl 20, the support bowl 20 and the substrate 10 are integrally disposed, the zener diode 30 is electrically connected to the surface of the substrate 10, the zener diode 30 and the support bowl 20 are both located in the support region, and the support bowl 20 covers the zener diode 30, that is, the zener diode 30 is enclosed in the support bowl 20.
In this embodiment, support bowl cup 20 is inside hollow to form solid brilliant regional 21, LED chip 40 is located solid brilliant regional 21, be different from prior art, not only solved zener diode 30 and taken up the space that is used for solid brilliant in support bowl cup 20, restrict the problem of 40 sizes of LED chip, the space utilization of the solid brilliant regional 21 of support bowl cup 20 has been promoted, can also avoid zener diode 30 to absorb the light that LED chip 40 sent simultaneously, the whole luminance of LED lamp pearl has been promoted. The zener diode 30 is fixedly connected to the substrate 10 by soldering.
It can be understood that the thickness of the LED chip 40 is smaller than the height of the support bowl cup 20, and the LED chip 40 can be prevented from being collided in the process of transferring to the next procedure, so that the LED chip 40 is damaged, and the protection of the LED chip 40 is facilitated.
In this embodiment, the LED chip 40 is a normal chip, and the LED chip is fixedly connected to the substrate 10 through a die attach adhesive, it can be understood that in other embodiments, the LED chip 40 may also be a flip chip, and correspondingly, when the LED chip 40 is a flip chip, the LED chip 40 is fixedly connected to the substrate 10 through solder paste.
In this embodiment, the die bonding region 21 is provided with two LED chips 40, it can be understood that the LED chips 40 in the die bonding region 21 can be determined according to actual situations, and in other embodiments, one or other number of LED chips 40 can be provided, it should be noted that the LED chip 40 is also called an LED light emitting chip, is a solid semiconductor device, is a core component of an LED lamp, and has the main functions of: the electric energy is converted into the light energy, so that the emitted light can be considered. The zener diode 30 is also called a zener diode, which is a semiconductor device having a very high resistance before the critical reverse breakdown voltage is known, and the zener diode 30 discharges the static electricity of the LED lamp bead to improve the antistatic capability of the LED lamp bead.
In this embodiment, the support bowl 20 is formed by injection molding, the support bowl 20 has an annular structure, and an opening area of an end portion of the support bowl 20 facing the substrate 10 is smaller than an opening area of an end portion of the support bowl 20 away from the substrate 10.
In the present embodiment, the substrate 10 includes a positive pad and a negative pad, and the positive end and the negative end of the LED chip 40 are electrically connected to the negative pad and the positive pad respectively through the bonding wire 50, that is, the positive end of the LED chip 40 is connected to the negative pad, and the negative end of the LED chip 40 is connected to the positive pad.
It should be noted that the support cup 20 may have a symmetrical structure or an asymmetrical structure, in this embodiment, the support cup 20 has a symmetrical structure, and in other embodiments, the support cup 20 may have an asymmetrical structure.
When concrete implementation, it is regional to set up the support on base plate 10, set up zener diode 30 and support bowl cup 20 at the support region jointly, and utilize support bowl cup 20 to cover zener diode 30, be about to seal in zener diode 30 in support bowl cup 20, be different from prior art, not only solved zener diode 30 and occupy the space that is used for solid brilliant in support bowl cup 20, limit the problem of 40 sizes of LED chip, the space utilization who has promoted support bowl cup 20's solid brilliant regional 21, can also avoid zener diode 30 to absorb the light that LED chip 40 sent simultaneously, and then promoted the whole luminance of LED lamp pearl and the product yield of LED lamp pearl.
It should be noted that the implementation process described above is only for illustrating the applicability of the present application, but this does not mean that the LED lamp bead of the present application has only the above-mentioned one implementation flow, and on the contrary, the LED lamp bead of the present application can be incorporated into the feasible embodiments of the present application as long as the LED lamp bead of the present application can be implemented.
A second embodiment of the present invention provides a method for preparing the LED lamp bead in the first embodiment, and when the method is implemented specifically, the method includes the following steps:
etching the substrate 10;
soldering a zener diode 30 on the etched substrate 10;
forming a holder bowl 20 on the substrate 10 by an injection molding process, and covering the holder bowl 20 with the zener diode 30;
welding a bonding wire 50 in a die bonding area 21 formed by the support bowl 20 and bonding the LED chip 40 in the die bonding area 21 through die bonding glue;
the support cup 20 is filled with a phosphor layer, and the phosphor layer covers the LED chip 40 and the bonding wires 50.
When the method is specifically implemented, the Zener diode 30 and the LED chip 40 can be effectively and separately arranged, and meanwhile, the Zener diode 30 and the LED chip 40 can be effectively and electrically connected together, so that the space utilization rate of the die bonding area 21 is further improved, the product yield of the LED lamp beads is improved, and the method is favorable for large-scale production and use.
In a specific embodiment, the LED light bar includes the LED light bead in the first embodiment.
In summary, the LED lamp bead, the preparation method thereof and the LED lamp strip in the embodiments of the present invention can effectively separate the zener diode 30 from the LED chip 40, and at the same time, can effectively electrically connect the zener diode 30 and the LED chip 40 together, thereby further improving the space utilization rate of the die bonding region 21, and simultaneously improving the product yield of the LED lamp bead, which is beneficial to large-scale production and use.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. The utility model provides a LED lamp pearl, its characterized in that, includes base plate, support bowl cup, zener diode and LED chip, it is regional to be provided with the support on the base plate, the support is regional to be used for settling support bowl cup, support bowl cup with the base plate integration sets up, zener diode with the surperficial electric connection of base plate, zener diode with support bowl cup all is located in the support region, just support bowl cup covers zener diode, the inside hollow solid brilliant region of formation of support bowl cup, the LED chip is located gu in the brilliant region.
2. The LED lamp bead according to claim 1, wherein the Zener diode is fixedly connected with the substrate by soldering.
3. The LED lamp bead according to claim 1, wherein the thickness of the LED chip is less than the height of the support bowl.
4. The LED lamp bead according to claim 1, wherein the LED chip is fixedly connected to the substrate through die attach adhesive or solder paste.
5. The LED lamp bead according to claim 1, wherein said support bowl is made of an insulating material, and said substrate is made of a conductive material.
6. The LED lamp bead according to claim 1, wherein the substrate includes a positive electrode bonding pad and a negative electrode bonding pad, and the positive electrode end and the negative electrode end of the LED chip are electrically connected to the negative electrode bonding pad and the positive electrode bonding pad respectively through bonding wires.
7. The LED lamp bead of claim 1, wherein the cradle bowl is formed by injection molding.
8. A method for preparing the LED lamp bead as claimed in any one of claims 1 to 7, characterized by comprising the following steps:
etching the substrate;
welding the Zener diode on the etched substrate;
forming a bracket bowl in the bracket area on the substrate through an injection molding process, and covering the bracket bowl with the Zener diode;
welding a bonding wire in a die bonding area formed by the support bowl cup and bonding an LED chip in the die bonding area through die bonding glue;
and filling a fluorescent layer in the support bowl cup, and covering the LED chip and the bonding wire with the fluorescent layer.
9. An LED lamp strip, characterized by comprising the LED lamp bead of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210091203.0A CN114284259A (en) | 2022-01-26 | 2022-01-26 | LED lamp bead, preparation method thereof and LED lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210091203.0A CN114284259A (en) | 2022-01-26 | 2022-01-26 | LED lamp bead, preparation method thereof and LED lamp strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114284259A true CN114284259A (en) | 2022-04-05 |
Family
ID=80881525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210091203.0A Pending CN114284259A (en) | 2022-01-26 | 2022-01-26 | LED lamp bead, preparation method thereof and LED lamp strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114284259A (en) |
-
2022
- 2022-01-26 CN CN202210091203.0A patent/CN114284259A/en active Pending
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