CN114274386B - High-precision wafer cutting and positioning device and wafer cutting machine - Google Patents
High-precision wafer cutting and positioning device and wafer cutting machine Download PDFInfo
- Publication number
- CN114274386B CN114274386B CN202111659770.3A CN202111659770A CN114274386B CN 114274386 B CN114274386 B CN 114274386B CN 202111659770 A CN202111659770 A CN 202111659770A CN 114274386 B CN114274386 B CN 114274386B
- Authority
- CN
- China
- Prior art keywords
- wafer
- base
- suction plate
- plate
- sliding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 34
- 238000007789 sealing Methods 0.000 claims description 40
- 238000005485 electric heating Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000002349 favourable effect Effects 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 84
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000009471 action Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a high-precision wafer cutting and positioning device and a wafer cutting machine, comprising a base and a sliding frame arranged at the top of the base in a sliding manner, wherein a rotating frame is arranged at the top of the sliding frame, a supporting plate is fixedly connected to the inside of the rotating frame, and a wafer supporting component is arranged on the supporting plate; a limiting column is arranged on the supporting plate in a sliding manner, a limiting block is arranged on the top of the rotating frame in a sliding manner, and when the sliding frame moves upwards to jack up the limiting column; through driving suction plate and sliding frame upward movement, when the suction plate upward movement contacts spacing post gradually, can drive spacing post upward movement, when spacing post upward movement and support the outer periphery of tight with the supporting seat gradually, can drive the supporting seat through spacing post and upwards move to make the top of supporting seat support tight with the stopper, can fix a position supporting seat and wafer through the cooperation of spacing post and stopper and fix, and then be favorable to cutting the wafer.
Description
Technical Field
The invention relates to the technical field of wafer cutting, in particular to a high-precision wafer cutting positioning device and a wafer cutting machine.
Background
A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape; various circuit element structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions; the wafer is diced before being used as a processor core.
Chinese patent No. CN109175726a discloses an automatic wafer dicing and positioning device, comprising: the device comprises a base, a pneumatic lifting table, a vacuum ceramic sucker and a mounting rack; the base is of a rectangular plate-shaped structure; the pneumatic lifting table is arranged on the upper side of the base and is fixedly connected with the base through bolts; the vacuum ceramic sucker is arranged on the upper side of the pneumatic lifting table and is fixedly connected with the pneumatic lifting table through bolts; the mounting frame is arranged on the upper side of the base, and the mounting frame is connected with the base in a welding mode; through the structural improvement, the device has the advantages of accurate and convenient processing and positioning, high cutting efficiency, good effect, high automation degree and high universality, thereby effectively solving the problems and defects existing in the prior device.
However, the positioning and fixing structure of the device for the wafer in the process of cutting the wafer is simple, the stability and the position accuracy of the wafer in the cutting process cannot be guaranteed, once the wafer is offset in the cutting process, the whole wafer plate can be scrapped, so that the positioning and fixing structure is required to be optimized in the actual use production, and the stability of the wafer in the cutting process is kept.
Therefore, it is necessary to provide a high-precision wafer dicing and positioning device and a wafer dicing machine to solve the above-mentioned problems.
Disclosure of Invention
The invention aims to provide a high-precision wafer cutting and positioning device, which solves the problems that in the prior art, the positioning and fixing structure for a wafer in the process of cutting the wafer is simple, the stability and the position accuracy of the wafer in the cutting process cannot be ensured, and once the wafer is offset in the cutting process, the whole wafer plate is scrapped, so that the positioning and fixing structure is required to be optimized in the actual use production, and the stability of the wafer in the cutting process is ensured.
Based on the thought, the invention provides the following technical scheme: the wafer processing device comprises a base and a sliding frame arranged at the top of the base in a sliding manner, wherein a rotating frame is arranged at the top of the sliding frame, a supporting plate is fixedly connected inside the rotating frame, and a wafer supporting assembly is arranged on the supporting plate;
The support plate is provided with a limiting column in a sliding manner, the top of the rotating frame is provided with a limiting block in a sliding manner, and when the sliding frame moves upwards to jack up the limiting column, the side face of the limiting column is contacted with the wafer support assembly and lifted upwards to be contacted with the limiting block.
As a further scheme of the invention: the top of base has seted up the spout along its direction of height, the sliding frame passes through spout and base sliding connection to be provided with first spring in the spout inside, first spring is arranged in between base and the sliding frame.
As a further scheme of the invention: the wafer supporting component comprises a wafer and a supporting seat for supporting the wafer, and a diaphragm is adhered between the supporting seat and the wafer.
As a further scheme of the invention: the spacing post sets up to round platform form, the bottom of backup pad is located spacing post outside fixedly connected with guide bar, the guide bar passes bar groove and spacing post sliding connection on the spacing post.
As a further scheme of the invention: the utility model discloses a suction plate, including the sliding frame, the inboard fixedly connected with suction plate of sliding frame, be provided with the round hole that runs through on the suction plate, the suction plate top is located round hole regional outside fixedly connected with kicking block, and the kicking block is coaxial with spacing post setting in the vertical direction, the bottom rotation of suction plate is provided with the closing plate, the closing plate sets up to the semicircle form, and the closing plate articulates mutually with the suction plate through the articulated seat that its outside set up, and when two closing plates that the symmetry set up rotated towards the suction plate direction and contacted with the suction plate, two suction plates enclose into the round hole region on the suction plate and seal.
As a further scheme of the invention: the air pump is arranged outside the base, the air pump is provided with a first guide pipe and a second guide pipe, and the first guide pipe penetrates through the base and extends to the inside of the base.
As a further scheme of the invention: the two sides of the rotating frame are fixedly connected with rotating shafts, the rotating frame is driven to turn over by the rotating shafts, one end of the limiting block extending to the outer side of the rotating frame is fixedly connected with a magnetic block, a second spring is fixedly connected between the magnetic block and the side surface of the rotating frame, the magnetic strip is characterized in that vertical plates are arranged on two sides of the base, magnetic strips are arranged on the inner sides of the vertical plates, the magnetic strips and the vertical plates are fixed through fixing rods, and when the rotating frame rotates 180 degrees, the magnetic blocks on the outer side of the rotating frame and the magnetic strips on the inner sides of the vertical plates are located on the same horizontal plane.
As a further scheme of the invention: the inside corner fixedly connected with branch of base, branch top fixedly connected with thimble is provided with the through-hole that sets up with the thimble coaxially on the suction plate, and when the suction plate moved downwards, the thimble can pass the through-hole.
As a further scheme of the invention: an electric heating wire is arranged on the inner side surface of the base.
A wafer dicing machine uses a high-precision wafer dicing positioning device for positioning.
Compared with the prior art, the invention has the beneficial effects that: through the inside atmospheric pressure of base constantly increases, can drive suction plate and slipframe upward movement, when the suction plate upward movement gradually contacts spacing post, can drive spacing post upward movement, when spacing post upward movement and gradually support tightly with the outer periphery of supporting seat, can drive the supporting seat upward movement through spacing post to make the top of supporting seat tightly support with the stopper, can fix a position supporting seat and wafer through the cooperation of spacing post and stopper and fix, and then be favorable to cutting the wafer.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic perspective view of the present invention;
FIG. 3 is a schematic view of the connection structure of the slide frame and suction plate of the present invention;
FIG. 4 is a schematic view of the connection structure of the rotating frame and the support plate of the present invention;
FIG. 5 is an exploded view of the present invention;
FIG. 6 is a schematic view of the seal plate structure of the present invention;
FIG. 7 is a schematic view of the wafer support assembly of the present invention after being flipped 180;
FIG. 8 is a schematic view of a circular aperture arrangement of the present invention;
FIG. 9 is a schematic view of the slider and seal block construction of the present invention;
FIG. 10 is a cross-sectional view of the present invention;
FIG. 11 is an enlarged schematic view of the structure of FIG. 4B in accordance with the present invention;
FIG. 12 is an enlarged schematic view of the structure of FIG. 1A according to the present invention;
Fig. 13 is an enlarged schematic view of the structure of fig. 9C according to the present invention.
In the figure: 1. a base; 2. a sliding frame; 3. a motor; 4. a rotating shaft; 5. a wafer support assembly; 6. a first draft tube; 7. an air pump; 8. a vertical plate; 9. a magnetic stripe; 10. a limit column; 11. a limiting block; 12. a top block; 13. a suction plate; 14. a through groove; 15. a rotating frame; 16. a sealing strip; 17. a magnetic block; 18. a wafer; 19. a diaphragm; 20. a support base; 21. a chute; 22. a support rod; 23. a thimble; 24. a sealing plate; 25. a slide block; 26. a sealing block; 27. a hinge base; 28. a round hole; 29. a through hole; 30. a pull rope; 31. a support plate; 32. a guide rod; 33. a first spring; 34. a second spring; 35. an electric heating wire; 36. and (5) positioning blocks.
Detailed Description
As shown in fig. 1-4, a high-precision wafer cutting and positioning device and a wafer cutting machine, which comprises a base 1 and a sliding frame 2 arranged at the top of the base 1 in a sliding manner, wherein a sliding groove 21 is formed in the top of the base 1 along the height direction of the sliding frame, the sliding frame 2 is slidably connected with the base 1 through the sliding groove 21, a first spring 33 is arranged in the sliding groove 21, and the first spring 33 is arranged between the base 1 and the sliding frame 2, so that the sliding stability between the sliding frame 2 and the base 1 is improved.
The top of the sliding frame 2 is provided with a rotating frame 15, the bottom of the rotating frame 15 is contacted with a sealing strip 16 arranged at the top of the sliding frame 2, the center positions of two sides of the rotating frame 15 are fixedly connected with rotating shafts 4, the rotating frame 15 can be driven to rotate by rotating with the center line of the rotating shaft 4, and when the rotating frame 15 rotates, the sliding frame 2 can be extruded, so that the sliding frame 2 is driven to slide along a sliding groove 21 towards the base 1.
Further, a support plate 31 is fixedly connected to the inside of the rotating frame 15, and the wafer support assembly 5 is provided on the support plate 31, so that the wafer support assembly 5 can be supported by the support plate 31.
The wafer supporting assembly 5 specifically includes a wafer 18 and a supporting seat 20 for supporting the wafer 18, a diaphragm 19 is disposed between the supporting seat 20 and the wafer 18, in practical use, the wafer 18 is adhered to the top of the diaphragm 19, and the diaphragm 19 is adhered to the supporting seat 20, so that the wafer 18 is supported by the supporting seat 20.
As shown in fig. 5-6 and 9-13, a through groove 14 is formed in the supporting plate 31, a limiting column 10 is arranged at the through groove 14, the limiting column 10 is in a round table shape, the top diameter of the limiting column is smaller than the bottom diameter of the limiting column, a guide rod 32 is fixedly connected to the outer side of the limiting column 10 at the bottom of the supporting plate 31, the guide rod 32 penetrates through a strip-shaped groove in the limiting column 10 to be in sliding connection with the limiting column 10, and the limiting column 10 can only reciprocate in the vertical direction through limiting of the guide rod 32.
The notch that runs through has been seted up on the lateral surface of rotating frame 15, notch department is provided with stopper 11, stopper 11 passes through notch and rotating frame 15 sliding connection, and the stopper 11 extends to the one end fixedly connected with magnet 17 in the rotating frame 15 outside, fixedly connected with second spring 34 between the side of magnet 17 and rotating frame 15, stopper 11 top sets up to the inclined plane, be favorable to placing wafer supporting component 5 on backup pad 31, when wafer supporting component 5 down move with the inclined plane extrusion on the stopper 11 drive stopper 11 outside and remove to be convenient for place wafer supporting component 5 wholly on backup pad 31.
In actual use, because the spacing post 10 is set to round platform form, when spacing post 10 upwards moves, its lateral surface gradually contacts with the outer periphery of supporting seat 20 and supports tightly, follow spacing post 10 to continue upwards to move and can drive whole wafer supporting component 5 upwards to move, thereby make the top of supporting seat 20 contact with stopper 11 and support tightly, at this moment through spacing post 10 and stopper 11's cooperation, can fix a position and fasten supporting seat 20, thereby fix a position wafer 18, be favorable to cutting wafer 18, preferably, the quantity of spacing post 10 sets up four and is annular array and distributes in the supporting seat 20 outside this moment, and stopper 11 sets up two, distribute on the side that rotating frame 15 is close to pivot 4.
In order to drive the limit post 10 to move upwards, the inner side of the sliding frame 2 is fixedly connected with a suction plate 13, the suction plate 13 is provided with a through round hole 28, the top of the suction plate 13 is positioned at the outer side of the round hole 28, the top block 12 is coaxially arranged with the limit post 10 in the vertical direction, the suction plate 13 can drive the limit post 10 to move upwards in the upward moving process, the bottom of the suction plate 13 is rotationally provided with a sealing plate 24, the sealing plate 24 is arranged in a semicircular shape, the sealing plate 24 is hinged with the suction plate 13 through a hinging seat 27 arranged at the outer side of the sealing plate 24, when two symmetrically arranged sealing plates 24 rotate towards the suction plate 13 and are contacted with the suction plate 13, the round hole 28 on the suction plate 13 is sealed by surrounding the two suction plates 13 into a circular shape, and when the two sealing plates 24 rotate towards the direction away from the suction plate 13, the sealing block 36 fixedly arranged on the hinging seat 27 can limit the sealing plate 24 to rotate within a certain angle range, and the maximum angle of 30 DEG of the outward rotation of the sealing plate 24 is preferred, and when the sealing plate 24 rotates outwards 30 DEG outwards, the round hole 28 is exposed to the outside environment.
Further, an air pump 7 is arranged outside the base 1, the air pump 7 is provided with a first flow guide pipe 6 and a second flow guide pipe, the first flow guide pipe 6 penetrates through the base 1 and extends into the base 1, when the two sealing plates 24 are combined to seal the round hole 28 area on the suction plate 13, the base 1, the sliding frame 2 and the suction plate 13 inside the sliding frame 2 enclose a sealed space, and air is fed into the base 1 or sucked into the base 1 through the air pump 7 so that the air pressure inside the base 1 is increased or decreased, so that the sliding frame 2 is promoted to ascend or descend along the sliding groove 21 on the base 1.
In order to assist in supporting the sealing plate 24, a pull rope 30 is fixedly connected between the sealing plate 24 and the suction plate 13, one end of the pull rope 30 is fixed to the sealing plate 24, the other end is fixed to the suction plate 13, and the pull rope 30 is made of a material having a certain elasticity, such as rubber.
The gas pump 7 that specifically uses is characterized in that the gas is sent into the base 1 through the gas pump 7 that sets up so as to increase the internal atmospheric pressure of the base 1, and the pulling force to the sealing plate 24 through the stay cord 30 that sets up, make the initial state of sealing plate 24 be nearer to the distance of suction plate 13, consequently, can drive sealing plate 24 upwards to rotate when gas enters into the base 1 inside and upwards flows, thereby make the sealing plate 24 of both sides press close to suction plate 13 gradually and finally seal the round hole 28 region on suction plate 13, at this moment, follow the gas pump 7 and continue to inject gas into the base 1 inside, can make the atmospheric pressure in the base 1 constantly increase, can drive suction plate 13 and sliding frame 2 upwards move, the kicking block 12 that makes its top gradually contacts spacing post 10 when suction plate 13 upwards moves, can drive spacing post 10 upwards through the kicking block 12 that upwards moves, when spacing post 10 upwards moves and gradually supports tightly with the outer periphery of supporting seat 20, thereby make the top and the stopper 11 of supporting seat 20 tightly support, can carry out the location and the wafer 18 through the cooperation of spacing post 10 and stopper 11 and can fix the wafer 18, and then be favorable to cutting.
As shown in fig. 1-2 and 7-8, a supporting rod 22 is fixedly connected to the inner corner of the base 1, a thimble 23 is fixedly connected to the top of the supporting rod 22, a through hole 29 which is coaxially arranged with the thimble 23 is arranged on the suction plate 13, when the suction plate 13 moves downwards, the thimble 23 can pass through the through hole 29, two sides of the base 1 are respectively provided with a vertical plate 8, the rotating shaft 4 penetrates through the vertical plates 8 and is rotationally connected with the vertical plates 8, one side of one vertical plate 8 is provided with a motor 3, an output shaft of the motor 3 is connected with the rotating shaft 4, during use, the motor 3 can drive the rotating shaft 4 to rotate so as to drive the rotating frame 15 to rotate, the inner side of the vertical plate 8 is provided with a magnetic strip 9, the magnetic strip 9 and the vertical plates 8 are fixed through a fixing rod, when the rotating frame 15 rotates 180 degrees, the magnetic block 17 outside the rotating frame 15 and the magnetic strip 9 inside the vertical plate 8 are on the same horizontal plane, and the limiting block 11 can be driven to move towards the vertical plate 8 by overcoming the acting force of the second spring 34 through the attraction of the magnetic strip 9, so that the limiting block 11 is gradually separated from the supporting seat 20.
Further, the circular holes 28 on the suction plate 13 are arranged in a plurality of groups, as shown in fig. 8, and each group of circular holes 28 is arranged corresponding to each wafer 18 after dicing, so that each small wafer 18 after dicing corresponds to one group of circular holes 28.
Still further, an electric heating wire 35 is disposed on the inner side surface of the base 1, and the inner space inside the base 1 and the slide frame 2 can be heated by the electric heating wire 35.
The bottom of the suction plate 13 is provided with a sealing block 26 and a sliding block 25 at a through hole 29, the sliding block 25 is fixedly arranged on two sides of the through hole 29 and is fixed with the suction plate 13, the sealing block 26 is arranged on one side opposite to the sliding block 25 and is in sliding connection with the sliding block 25, a third spring is arranged in the sliding block 25 and is arranged between the sliding block 25 and the sealing block 26, the through hole 29 can be sealed when the two sealing blocks 26 are mutually attached, and one side opposite to the sealing block 26 is set to be an inclined plane.
When the wafer 18 is cut, the rotating frame 15 can be driven to rotate by the motor 3, the sliding frame 2 can be gradually extruded to drive the sliding frame 2 to move downwards in the process that the rotating frame 15 rotates 180 degrees, the sliding frame 2 can be driven to move upwards under the acting force of the first spring 33 after the rotating frame 15 rotates 90 degrees, the sliding frame 2 moves upwards to the initial position when the rotating frame 15 rotates 180 degrees, the rotating frame 15 can be prevented from interfering with the suction plate 13 in the overturning process by the structure, the rotating block overturns 180 degrees, the magnetic block 17 at the outer side of the rotating block corresponds to the magnetic strip 9 at one side of the vertical plate 8, the magnetic force of the magnetic block 17 is attracted by the magnetic strip 9, The limit is gradually far away from the supporting seat 20, so that the limit block 11 loses the limit to the supporting seat 20, the limit column 10 at the outer side of the supporting seat 20 is insufficient to support the supporting seat 20, so that the limit column falls into the circular hole 28 area on the top of the suction plate 13 gradually under the action of self gravity and covers the circular hole 28 area, the air in the base 1 is discharged through the air pump 7, the inside of the base 1 is in a negative pressure state, the sealing plate 24 at the bottom of the suction plate 13 rotates downwards under the action of gravity, the sealing of the circular hole 28 is lost, the supporting seat 20 is placed in the circular hole 28 area on the top of the suction plate 13, Therefore, when the inside of the base 1 is in a negative pressure state, the supporting seat 20 can be adsorbed on the top of the suction plate 13, and as the air pump 7 continuously discharges the air in the base 1, the air pressure in the base 1 is gradually reduced, at the moment, the sliding frame 2 slides downwards against the acting force of the first spring 33 under the atmospheric pressure, so as to drive the suction plate 13 and the wafer supporting component 5 on the top thereof to move downwards, when the suction plate 13 moves to the thimble 23, the thimble 23 contacts with and presses the inclined surfaces of the sealing blocks 26 positioned on the two sides of the through holes 29 at the bottom of the suction plate 13, so that the sealing blocks 26 move towards the two sides against the acting force of the third spring, And then the ejector pin 23 is forced to pass through the through hole 29 and gradually contact and squeeze the diaphragm 19 covered on the base 1, at this time, when the suction plate 13 continues to move downwards, as each group of round holes 28 on the suction plate 13 corresponds to each wafer 18 after cutting, each wafer 18 after cutting can be adsorbed at each group of round holes 28 on the suction plate 13 by utilizing negative pressure in the base 1, the ejector pin 23 limits the base 1 and the diaphragm 19 to stop the downward movement, therefore, at this time, the cut wafer 18 and the diaphragm 19 have a mutual separation trend, and the diaphragm 19 has a certain viscosity at normal temperature, so that the wafer 18 is stably connected with the supporting seat 20, The cutting is convenient, but when the suction plate 13 and the wafer 18 at the top of the suction plate 13 move downwards due to the heating of the inner space of the base 1 by the electric heating wire 35 in the base 1, the diaphragm 19 is heated, the viscosity of the wafer 18 after the cutting is gradually lost, so that the wafer 18 after the cutting can be easily separated from the diaphragm 19, the wafer 18 after the cutting continues to move downwards under the suction of the suction plate 13, the supporting seat 20 and the diaphragm 19 stop moving under the blocking of the ejector pin 23, so that the wafer 18 and the diaphragm 19 are separated from each other, and then the air pump 7 stops working, and the wafer 18 on the suction plate 13 is removed.
In summary, the limiting post 10 is lifted up by the suction plate 13 through the structure, the wafer supporting component 5 is supported by the cooperation of the limiting post 11, the wafer 18 is cut, the wafer supporting component 5 is turned over 180 degrees and then falls on the top of the suction plate 13, the diaphragm 19 is separated from the cut wafer 18 by the cooperation of the ejector pin 23 in the downward movement process of the suction plate 13, the cut wafer 18 is conveniently taken down, the wafer 18 is more efficient in practical use, the wafer 18 can be quickly taken down after the cutting, and the practicability is strong.
Working principle: when the rotating frame 15 rotates to 180 degrees, the sliding frame 2 moves upwards to an initial position, the rotating frame 15 can be prevented from interfering with the suction plate 13 in the overturning process by the structure, the rotating block overturns 180 degrees, the magnet 17 at the outer side of the rotating block corresponds to the magnetic strip 9 at one side of the vertical plate 8, the limit is gradually far away from the supporting seat 20 by the magnetic attraction of the magnetic strip 9 to the magnet 17, the limit block 11 loses the limit to the supporting seat 20, the limit column 10 at the outer side of the supporting seat 20 is insufficient to support the supporting seat 20, therefore, the rotating frame can gradually fall into the circular hole 28 area on the top of the suction plate 13 under the action of self gravity and cover the circular hole 28 area, the air in the base 1 is exhausted by the air pump 7 at the moment, the inside of the base 1 is in a negative pressure state, the sealing plate 24 at the bottom of the suction plate 13 rotates downwards under the action of gravity, the sealing of the round hole 28 is lost, the supporting seat 20 is placed in the round hole 28 area at the top of the suction plate 13, so when the inside of the base 1 is in a negative pressure state, the supporting seat 20 can be adsorbed at the top of the suction plate 13, and the air pressure in the base 1 is gradually reduced along with the continuous discharge of the air in the base 1 by the air pump 7, at the moment, the sliding frame 2 slides downwards against the acting force of the first spring 33 under the atmospheric pressure, so as to drive the suction plate 13 and the wafer supporting component 5 at the top thereof to move downwards, when the suction plate 13 moves to the ejector pins 23, the ejector pins 23 are contacted with the sealing blocks 26 at the two sides of the through holes 29 at the bottom of the suction plate 13 and press the inclined surfaces thereof, so that the sealing blocks 26 move towards two sides against the acting force of the third spring, and the ejector pins 23 are further promoted to pass through the through holes 29 and gradually contact and press the diaphragms 19 covered on the base 1, at this time, when the suction plate 13 continues to move downwards, since the groups of round holes 28 on the suction plate 13 correspond to the cut wafers 18, the cut wafers 18 can be adsorbed at the groups of round holes 28 on the suction plate 13 by using the negative pressure in the base 1, and the ejector pins 23 limit the base 1 and the diaphragm 19 to stop the continuous downwards movement, so that the cut wafers 18 and the diaphragm 19 are separated from each other.
Claims (3)
1. A high-precision wafer cutting and positioning device is characterized in that: the wafer processing device comprises a base and a sliding frame arranged at the top of the base in a sliding manner, wherein a rotating frame is arranged at the top of the sliding frame, a supporting plate is fixedly connected inside the rotating frame, and a wafer supporting assembly is arranged on the supporting plate;
the support plate is provided with a limit post in a sliding manner, the top of the rotating frame is provided with a limit block in a sliding manner, and when the slide frame moves upwards to jack up the limit post, the side surface of the limit post is contacted with the wafer support assembly and lifted upwards to be contacted with the limit block;
The top of the base is provided with a sliding groove along the height direction of the base, the sliding frame is in sliding connection with the base through the sliding groove, a first spring is arranged in the sliding groove, and the first spring is arranged between the base and the sliding frame;
The wafer supporting assembly comprises a wafer and a supporting seat for supporting the wafer, and a diaphragm is adhered between the supporting seat and the wafer;
The limiting column is arranged in a round table shape, a guide rod is fixedly connected to the bottom of the supporting plate, located on the outer side of the limiting column, and penetrates through a strip-shaped groove on the limiting column to be in sliding connection with the limiting column;
The inner side of the sliding frame is fixedly connected with a suction plate, a penetrating round hole is formed in the suction plate, a jacking block is fixedly connected to the top of the suction plate, the jacking block is coaxially arranged with the limiting column in the vertical direction, a sealing plate is rotatably arranged at the bottom of the suction plate, the sealing plate is semicircular, the sealing plate is hinged with the suction plate through a hinging seat arranged at the outer side of the sealing plate, and when two symmetrically arranged sealing plates rotate towards the suction plate and are contacted with the suction plate, the two suction plates encircle to form a circle shape to seal the round hole area on the suction plate;
a supporting rod is fixedly connected to the inner corner of the base, a thimble is fixedly connected to the top of the supporting rod, a through hole which is coaxial with the thimble is formed in the suction plate, and when the suction plate moves downwards, the thimble penetrates through the through hole;
The air pump is arranged outside the base, and is provided with a first guide pipe and a second guide pipe, and the first guide pipe penetrates through the base and extends into the base;
The two sides of the rotating frame are fixedly connected with rotating shafts for overturning, one end of the limiting block extending to the outer side of the rotating frame is fixedly connected with a magnetic block, a second spring is fixedly connected between the magnetic block and the side face of the rotating frame, the magnetic strip is characterized in that vertical plates are arranged on two sides of the base, magnetic strips are arranged on the inner sides of the vertical plates, the magnetic strips and the vertical plates are fixed through fixing rods, and when the rotating frame rotates 180 degrees, the magnetic blocks on the outer side of the rotating frame and the magnetic strips on the inner sides of the vertical plates are located on the same horizontal plane.
2. The high-precision wafer dicing and positioning apparatus according to claim 1, wherein: an electric heating wire is arranged on the inner side surface of the base.
3. A wafer cutting machine, characterized in that: positioning using a high precision wafer dicing positioning apparatus according to any one of claims 1-2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111659770.3A CN114274386B (en) | 2021-12-30 | 2021-12-30 | High-precision wafer cutting and positioning device and wafer cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111659770.3A CN114274386B (en) | 2021-12-30 | 2021-12-30 | High-precision wafer cutting and positioning device and wafer cutting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114274386A CN114274386A (en) | 2022-04-05 |
| CN114274386B true CN114274386B (en) | 2024-07-02 |
Family
ID=80878991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111659770.3A Active CN114274386B (en) | 2021-12-30 | 2021-12-30 | High-precision wafer cutting and positioning device and wafer cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114274386B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210379002U (en) * | 2019-09-04 | 2020-04-21 | 深圳市海德精密陶瓷有限公司 | Ceramic mechanical arm for transmitting wafer |
| CN212070819U (en) * | 2020-04-13 | 2020-12-04 | 争丰半导体科技(苏州)有限公司 | Wafer laser scribing cutting machine with general function |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080034725A (en) * | 2006-10-17 | 2008-04-22 | 삼성전자주식회사 | Loadlock chamber and method for loading and unloading wafers |
| CN104227247A (en) * | 2013-06-24 | 2014-12-24 | 江苏香江科技股份有限公司 | Sucker fixing device for laser cutting of LED (light emitting diode) wafers |
| JP6189700B2 (en) * | 2013-10-03 | 2017-08-30 | 株式会社ディスコ | Wafer processing method |
| CN104362107B (en) * | 2014-10-23 | 2017-03-01 | 浙江中纳晶微电子科技有限公司 | Wafer vacuum bonder and bonding method |
| CN111063651A (en) * | 2019-12-25 | 2020-04-24 | 荆门欧曼凯机电设备有限公司 | Contact extrusion type self-centering wafer clamping manipulator |
| CN211727984U (en) * | 2020-02-12 | 2020-10-23 | 上海根派半导体科技有限公司 | Laser scribing positioning mechanism |
-
2021
- 2021-12-30 CN CN202111659770.3A patent/CN114274386B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210379002U (en) * | 2019-09-04 | 2020-04-21 | 深圳市海德精密陶瓷有限公司 | Ceramic mechanical arm for transmitting wafer |
| CN212070819U (en) * | 2020-04-13 | 2020-12-04 | 争丰半导体科技(苏州)有限公司 | Wafer laser scribing cutting machine with general function |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114274386A (en) | 2022-04-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2022121168A1 (en) | Film tearing and pressure maintaining integrated assembly line | |
| KR102084792B1 (en) | Method for detaching a semiconductor chip from a foil | |
| CN204053287U (en) | The solar battery sheet grass-hopper of solar battery sheet automatic string welding machine | |
| CN114346474B (en) | Full-automatic laser wafer cutting device and cutting method | |
| CN107591356A (en) | Wafer mounting apparatus and its application method | |
| CN114274386B (en) | High-precision wafer cutting and positioning device and wafer cutting machine | |
| CN115513110A (en) | Wafer intelligent production equipment for semiconductor production | |
| CN114872210B (en) | Wafer scribing machine for processing electronic products | |
| CN213922977U (en) | Turning device is used in chip production | |
| CN113697488A (en) | Carousel formula integrated circuit chip handling device | |
| CN211428136U (en) | Separation device of comb type chip and membrane | |
| KR102127695B1 (en) | Semiconductor die detachment apparatus | |
| CN108861572B (en) | Wafer suction nozzle assembly with large and small sizes | |
| CN209963038U (en) | XY self-correcting thimble module | |
| CN217641233U (en) | Fool-proof wafer receiving device | |
| CN209871605U (en) | Semiconductor wafer flip-chip stirring device | |
| CN221304658U (en) | Wafer detection platform | |
| CN220499170U (en) | Integrated circuit material grabbing structure | |
| CN216487963U (en) | Wafer bonding equipment that separates | |
| CN217229416U (en) | Monocrystalline silicon piece arrangement machine | |
| CN114454093B (en) | Step-by-step wafer positioning and supporting device | |
| CN219040446U (en) | Wafer paster adds clamping apparatus | |
| CN220456384U (en) | Thimble-free wafer fixing device and process chamber | |
| CN109205288B (en) | Silicon wafer loading equipment and loading method thereof | |
| CN204462638U (en) | The positioning fixture of exposure and exposure machine thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Country or region after: China Address after: 518000 401, rongzhan Industrial Park, building A4, No. 440, Hengkeng Hedong Village, Guancheng community, Guanhu street, Longhua District, Shenzhen, Guangdong Province Applicant after: Bojiexin (Shenzhen) Semiconductor Co.,Ltd. Address before: 518000 401, rongzhan Industrial Park, building A4, No. 440, Hengkeng Hedong Village, Guancheng community, Guanhu street, Longhua District, Shenzhen, Guangdong Province Applicant before: Shenzhen Luxin Semiconductor Co.,Ltd. Country or region before: China |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant |