CN219040446U

CN219040446U - Wafer paster adds clamping apparatus

Info

Publication number: CN219040446U
Application number: CN202223547898.3U
Authority: CN
Inventors: 全宰弘; 尹培云; 陈欣鑫
Original assignee: Yaxin Semiconductor Technology Wuxi Co ltd
Current assignee: Yaxin Semiconductor Technology Wuxi Co ltd
Priority date: 2022-12-29
Filing date: 2022-12-29
Publication date: 2023-05-16
Anticipated expiration: 2032-12-29

Abstract

The utility model provides a wafer patch processing clamp, and relates to the technical field of wafer processing. This wafer paster adds clamping apparatus, the on-line screen storage device comprises a base, the base top is provided with the jacking board, jacking board top fixedly connected with backup pad, the inside rotation of base is connected with the sleeve, the inside sliding connection of sleeve has the threaded rod, base top fixedly connected with thread bush, the threaded rod runs through the thread bush and with thread bush threaded connection, threaded rod top rotation is connected with communicating pipe, communicating pipe top fixedly connected with a plurality of adsorption tubes, a plurality of the adsorption tubes all run through the jacking board and with jacking board fixedly connected with, a plurality of the equal fixedly connected with sucking disc in adsorption tube top, a plurality of the equal fixedly connected with sucking disc in backup pad of sucking disc. This wafer paster adds clamping apparatus, slide bar drive clamp plate carry out spacingly to the wafer outer lane, improve fixed effect, prevent that the wafer from breaking away from, conveniently carry out the paster.

Description

Wafer paster adds clamping apparatus

Technical Field

The utility model relates to a clamp, in particular to a wafer patch processing clamp, and belongs to the technical field of wafer processing.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and when a wafer pasting process is performed, the wafer is usually required to be clamped and fixed, and then pasting is performed; however, the existing wafer patch processing clamp cannot carry out omnibearing clamping when clamping a wafer patch, and the wafer patch is very thin, so that the wafer patch is easy to tilt during clamping.

The utility model provides a wafer paster adds clamping apparatus of open application number CN217306477U, this wafer paster adds clamping apparatus makes its use of mutually supporting through being provided with first gag lever post, the second gag lever post, the third gag lever post, handle and helmet, and first gag lever post, the second is spacing and the third gag lever post can form three-jaw chuck, make can carry out the omnidirectional centre gripping when centre gripping to the wafer paster fixed, avoided appearing rocking to the wafer paster when processing the wafer paster, and the helmet can protect the wafer paster, avoid the side of wafer paster to appear scraping, the result of use of wafer paster adds clamping apparatus has been improved well, this wafer paster adds clamping apparatus is through being provided with vacuum chuck, connecting pipe and vacuum pump, make its use of mutually supporting, thereby make the wafer paster can firmly adsorb on placing the seat, avoid when handling the wafer paster, the wafer paster appears the state of perk when fixing, the planarization of wafer paster when fixing has been guaranteed well.

When the scheme is used, the wafer is only adsorbed at the bottom and the side edge of the wafer are contracted inwards for positioning, and in the processing process, the stability of sucking disc adsorption and side edge clamping is lower, because the contact area between the three limiting rods and the wafer is smaller, the friction force is also smaller, the wafer is easy to loose, and the processing effect is influenced.

Disclosure of Invention

(one) solving the technical problems

The utility model aims to solve the problems by providing the wafer patch processing clamp, which is used for solving the problems that in the prior art, only the bottom adsorption and the side edge inward contraction positioning of a wafer are aimed, and in the processing process, the stability of suction cup adsorption and side edge clamping is lower, because the contact area between three limiting rods and the wafer is smaller, the friction force is smaller, the wafer is easy to loose, and the processing effect is affected.

(II) technical scheme

In order to achieve the above purpose, the utility model is realized by the following technical scheme: the utility model provides a wafer paster adds clamping apparatus, includes the base, the base top is provided with the jacking plate, jacking plate top fixedly connected with backup pad, the inside rotation of base is connected with the sleeve, the inside sliding connection of sleeve has the threaded rod, base top fixedly connected with thread bush, the threaded rod runs through the thread bush and with thread bush threaded connection, threaded rod top rotation is connected with communicating pipe, communicating pipe top fixedly connected with a plurality of adsorption tubes, a plurality of the adsorption tubes all run through the jacking plate and with jacking plate fixedly connected with, a plurality of the equal fixedly connected with sucking disc in adsorption tube top, a plurality of the equal fixedly connected with sucking disc in backup pad.

Preferably, the bottom of the communicating pipe is fixedly connected with a plurality of air suction barrels, the air suction barrels are communicated with the communicating pipe, a piston is slidably connected in the air suction barrels, a vertical rod is fixedly connected to the bottom of the piston, the vertical rod penetrates through the bottom of the air suction barrels and is slidably connected with the air suction barrels, the bottom end of the vertical rod is fixedly connected with the base, and the jacking plate drives the communicating pipe to ascend when ascending, so that the air suction barrels are driven to ascend, and the piston slides in the air suction barrels.

Preferably, a plurality of fixed sleeves are fixedly connected to the outer side of the jacking plate, a plurality of slide bars are slidably connected to the inner parts of the fixed sleeves, and a pressing plate is fixedly connected to the top end of each slide bar, so that the slide bars drive the pressing plates to fix the wafer.

Preferably, the slide bar bottom and base fixed connection, the slide bar runs through the fixed cover and with fixed cover sliding connection, slide bar outside fixedly connected with limiting plate, limiting plate bottom fixedly connected with spring, spring bottom and fixed cover fixed connection are favorable to spacing the slide bar.

Preferably, a plurality of gag levers are fixedly connected with the top of the base, and the gag levers penetrate through the jacking plate and are in sliding connection with the jacking plate, and the top ends of the gag levers are fixedly connected with the pressing plate, so that the position of the pressing plate is limited, and the stability is improved.

Preferably, a plurality of sliding grooves are formed in the sleeve, a plurality of sliding blocks are fixedly connected to the bottom end of the threaded rod, the sliding blocks are respectively and slidably connected to the inner portions of the sliding grooves, and therefore limiting of the sliding blocks is facilitated, and the threaded rod is limited, so that the sleeve drives the threaded rod to rotate.

Preferably, the sleeve bottom fixedly connected with transmission shaft, the transmission shaft runs through the base and rotates with the base to be connected, base bottom fixedly connected with a plurality of supporting legs.

The utility model provides a wafer patch processing clamp, which has the following beneficial effects:

1. this wafer paster adds clamping apparatus places the wafer at the backup pad top, make sucking disc and wafer bottom contact, make the transmission shaft rotate and drive the sleeve and rotate, drive the slider and rotate when the sleeve rotates, thereby drive the threaded rod and rotate, because threaded rod and thread bush threaded connection, upwards move when making the threaded rod rotate, the threaded rod drives communicating pipe and rises, drive the jacking plate when rising communicating pipe and rise, and make the jacking plate drive backup pad and wafer rise, drive on the suction cylinder when rising communicating pipe, the suction cylinder rises and makes the piston slide in the suction cylinder is inside, thereby make the piston take out communicating pipe inside air, thereby make inside formation negative pressure of suction tube and sucking disc, thereby adsorb the wafer at the sucking disc top, improve fixed effect, increase stability.

2. This wafer paster adds clamping apparatus drives fixed cover and rises when the jacking plate rises, and fixed cover rises and makes the slide bar slide in fixed cover inside to the slide bar extrudees the spring through the limiting plate when fixed cover inside is removed, and the slide bar drives the clamp plate and carries out spacingly to the wafer outer lane, improves fixed effect, prevents that the wafer breaks away from, conveniently carries out the paster.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a front cross-sectional view of the present utility model;

FIG. 3 is an enlarged view of the portion A of FIG. 2 in accordance with the present utility model;

FIG. 4 is a schematic view of a slide bar according to the present utility model.

In the figure: 1. a base; 2. a jacking plate; 3. a support plate; 4. a sleeve; 5. a threaded rod; 6. a thread sleeve; 7. a communicating pipe; 8. an adsorption tube; 9. a suction cup; 10. an air suction cylinder; 11. a vertical rod; 12. a piston; 13. a fixed sleeve; 14. a slide bar; 15. a pressing plate; 16. a limiting plate; 17. a spring; 18. a limit rod; 19. a chute; 20. a slide block; 21. and a transmission shaft.

Detailed Description

The embodiment of the utility model provides a wafer patch processing clamp.

Referring to fig. 1, fig. 2, fig. 3 and fig. 4, the device comprises a base 1, the top of the base 1 is provided with a jacking plate 2, the top of the jacking plate 2 is fixedly connected with a supporting plate 3, a sleeve 4 is rotationally connected inside the base 1, a threaded rod 5 is slidingly connected inside the sleeve 4, a threaded sleeve 6 is fixedly connected to the top of the base 1, the threaded rod 5 penetrates through the threaded sleeve 6 and is in threaded connection with the threaded sleeve 6, a communicating pipe 7 is rotationally connected to the top of the threaded rod 5, a plurality of adsorption pipes 8 are fixedly connected to the top of the communicating pipe 7, the plurality of adsorption pipes 8 penetrate through the jacking plate 2 and are fixedly connected with the jacking plate 2, a plurality of suction cups 9 are fixedly connected to the top of the plurality of adsorption pipes 8, the plurality of suction cups 9 are fixedly connected inside the supporting plate 3, a plurality of suction cylinders 10 are fixedly connected to the bottom of the communicating pipe 7, the suction cylinders 10 are communicated with the communicating pipe 7, pistons 12 are slidingly connected inside the suction cylinders 10, vertical rods 11 are fixedly connected to the bottoms of the pistons 12, the bottoms of the vertical rods 11 penetrate through the bottoms of the suction cylinders 10 and are slidingly connected with the suction cylinders 10, the bottoms of the vertical rods 11 are fixedly connected with the base 1, the jacking plate 2 are fixedly connected with the bottoms of the base 1, and drive the jacking plate 2 to lift the plurality of adsorption pipes 8 to be fixedly connected with the suction cylinders 7, and then drive the suction cylinders 10 to lift up, and drive the suction cylinders 10.

The jacking plate 2 outside fixedly connected with a plurality of fixed sleeves 13, the equal sliding connection of a plurality of fixed sleeves 13 inside has slide bar 14, slide bar 14 top fixedly connected with clamp plate 15, make slide bar 14 drive clamp plate 15 and fix the wafer, slide bar 14 bottom and base 1 fixed connection, slide bar 14 runs through fixed sleeve 13 and with fixed sleeve 13 sliding connection, slide bar 14 outside fixedly connected with limiting plate 16, limiting plate 16 bottom fixedly connected with spring 17, spring 17 bottom and fixed sleeve 13 fixed connection are favorable to spacing slide bar 14, base 1 top fixedly connected with a plurality of gag lever posts 18, gag lever post 18 runs through jacking plate 2 and with jacking plate 2 sliding connection, gag lever post 18 top and clamp plate 15 fixed connection are favorable to spacing clamp plate 15, improve stability, a plurality of spouts 19 have been seted up to the sleeve 4 inside, threaded rod 5 bottom fixedly connected with a plurality of sliders 20, a plurality of sliders 20 are respectively sliding connection are inside a plurality of spouts 19, thereby be favorable to spacing to carrying out spacing to slider 20, make sleeve 4 drive 5 rotation, sleeve 4 bottom fixedly connected with transmission shaft 21, transmission shaft 21 runs through base 1 and is connected with a plurality of support legs 1 with base 1.

Specifically, place the wafer at backup pad 3 top, make sucking disc 9 and wafer bottom contact, make transmission shaft 21 rotate and drive sleeve 4 and rotate, drive slider 20 when sleeve 4 rotates and rotate, thereby drive threaded rod 5 and rotate, because threaded rod 5 and thread bush 6 threaded connection, upwards move when making threaded rod 5 rotate, threaded rod 5 drives communicating pipe 7 and rises, drive jacking plate 2 when communicating pipe 7 rises, and make jacking plate 2 drive backup pad 3 and wafer rise, drive suction tube 10 when communicating pipe 7 rises, suction tube 10 rises and makes piston 12 slide in suction tube 10 inside, thereby make piston 12 take out communicating pipe 7 inside air, thereby make inside formation negative pressure of absorption pipe 8 and sucking disc 9, thereby adsorb the wafer at sucking disc 9 top, improve fixed effect, increase stability.

The fixed sleeve 13 is driven to rise when the jacking plate 2 rises, the fixed sleeve 13 rises to enable the slide rod 14 to slide inside the fixed sleeve 13, the spring 17 is extruded through the limiting plate 16 when the slide rod 14 moves inside the fixed sleeve 13, the slide rod 14 drives the pressing plate 15 to limit the outer ring of the wafer, the fixing effect is improved, the wafer is prevented from being separated, and the wafer is convenient to patch.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. Wafer paster adds clamping apparatus, including base (1), its characterized in that: the utility model discloses a lifting device for a water heater, including base (1), backup pad (2), backup pad (3) are provided with at base (1) top, jacking plate (2) top fixedly connected with backup pad (3), base (1) inside rotation is connected with sleeve (4), sleeve (4) inside sliding connection has threaded rod (5), base (1) top fixedly connected with thread bush (6), threaded rod (5) run through thread bush (6) and with thread bush (6) threaded connection, threaded rod (5) top rotation is connected with communicating pipe (7), communicating pipe (7) top fixedly connected with a plurality of adsorption tube (8), a plurality of adsorption tube (8) all run through jacking plate (2) and with jacking plate (2) fixedly connected with, a plurality of adsorption tube (8) top equal fixedly connected with sucking disc (9), a plurality of sucking disc (9) are inside backup pad (3).

2. The wafer patch processing jig of claim 1, wherein: the novel air suction device is characterized in that a plurality of air suction cylinders (10) are fixedly connected to the bottom of the communicating pipe (7), the air suction cylinders (10) are communicated with the communicating pipe (7), pistons (12) are slidably connected to the inside of the air suction cylinders (10), vertical rods (11) are fixedly connected to the bottoms of the pistons (12), the vertical rods (11) penetrate through the bottoms of the air suction cylinders (10) and are slidably connected with the air suction cylinders (10), and the bottoms of the vertical rods (11) are fixedly connected with the base (1).

3. The wafer patch processing jig of claim 1, wherein: the jacking plate (2) outside fixedly connected with a plurality of fixed cover (13), a plurality of fixed cover (13) inside all sliding connection has slide bar (14), slide bar (14) top fixedly connected with clamp plate (15).

4. A wafer bonding jig according to claim 3, wherein: the bottom of the sliding rod (14) is fixedly connected with the base (1), the sliding rod (14) penetrates through the fixed sleeve (13) and is in sliding connection with the fixed sleeve (13), a limiting plate (16) is fixedly connected to the outer side of the sliding rod (14), a spring (17) is fixedly connected to the bottom of the limiting plate (16), and the bottom of the spring (17) is fixedly connected with the fixed sleeve (13).

5. The wafer patch processing jig of claim 1, wherein: the base (1) top fixedly connected with a plurality of gag lever posts (18), gag lever posts (18) run through jacking plate (2) and with jacking plate (2) sliding connection, gag lever post (18) top and clamp plate (15) fixed connection.

6. The wafer patch processing jig of claim 1, wherein: the sleeve (4) is internally provided with a plurality of sliding grooves (19), the bottom end of the threaded rod (5) is fixedly connected with a plurality of sliding blocks (20), and the sliding blocks (20) are respectively and slidably connected inside the sliding grooves (19).

7. The wafer patch processing jig of claim 1, wherein: the novel socket is characterized in that a transmission shaft (21) is fixedly connected to the bottom end of the sleeve (4), the transmission shaft (21) penetrates through the base (1) and is rotationally connected with the base (1), and a plurality of supporting legs are fixedly connected to the bottom of the base (1).