CN114262927B - Electroplating device and electroplating method for substrate - Google Patents
Electroplating device and electroplating method for substrate Download PDFInfo
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- CN114262927B CN114262927B CN202111412286.0A CN202111412286A CN114262927B CN 114262927 B CN114262927 B CN 114262927B CN 202111412286 A CN202111412286 A CN 202111412286A CN 114262927 B CN114262927 B CN 114262927B
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Abstract
The invention provides an electroplating device and an electroplating method for a substrate, wherein the electroplating device is used for electroplating the substrate, the electroplating device is provided with an electroplating cavity for containing electrolyte, the substrate to be electroplated is arranged in the electrolyte in the electroplating cavity and is connected with a positive electrode of a power supply, at least one side of the substrate to be electroplated is provided with an anode plate connected with a negative electrode of the power supply, an insulating plate is arranged between the anode plate and the substrate to be electroplated, and a plurality of through holes are formed in the insulating plate. When the substrate is electroplated, the insulating plate swings in the electrolyte, and electroplating ions flow to the substrate through the through holes and are electroplated to the surface of the substrate. According to the electroplating device and the electroplating method for the substrate, which are provided by the invention, the electric field distribution which is in a uniform state from the whole to the part can be generated on the surface of the substrate, and the electroplating quality of the surface of the substrate is finally improved.
Description
Technical Field
The invention relates to the technical field of electroplating, in particular to an electroplating device and an electroplating method for a substrate.
Background
In the production of semiconductor devices, some processes require plating a metal layer on the surface of a substrate, preparing a seed layer on the surface of the substrate, and electroplating a desired metal layer on the seed layer by electroplating.
When double-sided or single-sided electroplating is performed on a large-sized substrate, cathode current must be conducted from the edge of the substrate to the entire substrate surface through a Seed Metal Layer (or referred to as a Seed Layer), and since the voltage is gradually reduced due to the effect of resistance voltage drop when the current passes through the Seed Layer, the electric field on the substrate surface has a problem of uneven distribution in all directions, and thus the electroplated Metal Layer has defects such as uneven distribution.
Disclosure of Invention
The invention provides an electroplating device and an electroplating method for a substrate, which aims to solve the technical problem of improving the uniformity of electric field distribution on the surface of the substrate.
According to the electroplating device for the substrate, provided by the invention, the electroplating device is used for electroplating the substrate, the electroplating device is provided with an electroplating cavity for containing electrolyte, the substrate to be electroplated is arranged in the electrolyte in the electroplating cavity and is connected with the positive electrode of a power supply, at least one side of the substrate to be electroplated is provided with an anode plate connected with the negative electrode of the power supply, an insulating plate is arranged between the anode plate and the substrate to be electroplated, and a plurality of through holes are formed in the insulating plate;
when the substrate is electroplated, the insulating plate swings in the electrolyte, and electroplating ions flow to the substrate through the through holes and are electroplated on the surface of the substrate.
According to the electroplating device for the substrate, provided by the invention, the insulating plate with the plurality of through holes is added into the electroplating device, the electric fields are distributed in a compensating way from the center to the edge through the through holes on the two sides of the substrate, so that the electric fields after compensation are in an overall uniform state, the electric fields are distributed unevenly locally by utilizing the swinging of the insulating plate, the electric field distribution in an uniform state from the whole to the local is generated on the surface of the substrate, and finally the electroplating quality of the surface of the substrate is improved.
According to some embodiments of the invention, the insulating plate swings in the electrolyte in a pendulum type simple harmonic manner.
In some embodiments of the invention, the substrate to be electroplated is movably arranged in the electroplating cavity along the vertical direction, and the substrate is in simple harmonic motion along the vertical direction during the electroplating process of the substrate.
According to some embodiments of the invention, the substrate to be electroplated is fixed in the electroplating cavity by a spring.
In some embodiments of the invention, the insulating plate oscillates in a pendulum type simple harmonic manner in a vertical plane.
According to some embodiments of the invention, the anode plate connected with the power negative electrode is arranged on two sides of the substrate to be electroplated, and the insulating plate is arranged between the anode plate and the substrate to be electroplated.
In some embodiments of the invention, the surface of the substrate to be electroplated has a seed metal layer.
According to some embodiments of the invention, the plurality of through holes are uniformly arranged on the insulating plate.
In some embodiments of the invention, the substrate is a wafer substrate.
The invention also provides a method for electroplating a substrate, which is characterized in that the method adopts the electroplating device for the substrate according to some embodiments of the invention to electroplate the substrate, and the method comprises the following steps:
vertically placing a substrate to be electroplated in the electroplating cavity, and connecting with a positive electrode of a power supply;
enabling the substrate to be electroplated to perform simple harmonic motion in the vertical direction, and enabling the insulating plate to perform pendulum type simple harmonic motion in the vertical plane;
and electrifying the substrate connected to the positive electrode of the power supply and the anode plate connected to the negative electrode of the power supply, and electroplating the substrate.
According to the electroplating method for the substrate, provided by the invention, the insulating plate with the plurality of through holes is added into the electroplating device, the electric field is distributed in a compensation way from the center to the edge through the through holes on the two sides of the substrate, so that the compensated electric field is in an overall uniform state, and the uneven distribution of the electric field on the local part is decomposed by utilizing the pendulum type simple harmonic motion of the insulating plate and the simple harmonic motion of the substrate in the vertical direction, so that the electric field distribution in the uniform state from the whole to the local part is generated on the surface of the substrate, and finally the electroplating quality of the surface of the substrate is improved.
Drawings
FIG. 1 is a schematic view showing the constitution of an electroplating apparatus for a substrate according to an embodiment of the present invention;
fig. 2 is a schematic structural view of an insulating plate of an electroplating apparatus for a substrate according to an embodiment of the present invention;
fig. 3 is a schematic diagram showing the swing of an insulating plate of an electroplating apparatus for a substrate according to an embodiment of the present invention;
fig. 4 is a schematic diagram showing the swing of an insulating plate of an electroplating apparatus for a substrate according to an embodiment of the present invention;
FIG. 5 is a schematic diagram showing the distribution of electric fields on a substrate before compensation of an electroplating apparatus for a substrate according to an embodiment of the present invention;
fig. 6 is a flow chart of an electroplating method for a substrate according to an embodiment of the invention.
Reference numerals:
the electroplating apparatus 100 is configured to provide a plurality of electroplating cells,
a substrate 1, a seed layer 11, an elastic member 12,
the insulating plate 2, the through-hole 21,
anode plate 3, electroplating cavity 4, base plate simple harmonic direction of motion A.
Detailed Description
In order to further describe the technical means and effects adopted by the present invention for achieving the intended purpose, the following detailed description of the present invention is given with reference to the accompanying drawings and preferred embodiments.
The invention provides an electroplating device and an electroplating method for a substrate, which aims to solve the technical problem of improving the uniformity of electric field distribution on the surface of the substrate.
According to the electroplating device 100 for a substrate provided by the invention, the electroplating device 100 is used for electroplating the substrate, as shown in fig. 1 and 2, the electroplating device 100 is provided with an electroplating cavity 4 for containing electrolyte, the substrate 1 to be electroplated is arranged in the electrolyte of the electroplating cavity 4 and is connected with the positive electrode of a power supply, at least one side of the substrate 1 to be electroplated is provided with an anode plate 3 connected with the negative electrode of the power supply, an insulating plate 2 is arranged between the anode plate 3 and the substrate 1 to be electroplated, and a plurality of through holes 21 are formed in the insulating plate 2.
In plating the substrate 1, as shown in fig. 1, 3 and 4, the insulating plate 2 is swung in the electrolyte, and plating ions flow to the substrate 1 through the through holes 21 and are plated to the surface of the substrate 1.
The insulating plate 2 mainly plays a role of compensating for electric field uniformity, so the insulating plate 2 may also be called a compensating insulating plate or an insulating compensating plate, which is not limited in the present invention. As shown in fig. 5, the electric field distribution on the substrate before compensation is in a non-uniform state due to the resistance voltage drop of the current on the seed layer 11 of the substrate 1.
According to the electroplating device 100 for the substrate, provided by the invention, the insulating plate 2 with the plurality of through holes 21 is added into the electroplating device 100, the electric field is distributed in a compensating way from the center to the edge through the through holes 21 at two sides of the substrate 1, so that the compensated electric field is in an overall uniform state, the uneven distribution of the electric field on the local part is compensated by utilizing the swinging of the insulating plate 2, the electric field distribution in the uniform state from the whole to the local part is generated on the surface of the substrate 1, and finally the electroplating quality of the surface of the substrate 1 is improved.
According to some embodiments of the present invention, as shown in fig. 3 and 4, the insulating plate 2 swings in the electrolyte in a pendulum type simple harmonic manner. Wherein, through the pendulum type simple harmonic oscillation of the insulating plate 2, the uniformity of the electric field distributed locally in the left-right direction of the substrate 1 is improved by the through holes 21 on the insulating plate 2.
In some embodiments of the present invention, as shown in fig. 1, a substrate 1 to be plated is movably placed in a plating chamber 4 in a vertical direction, and during the plating of the substrate 1, the substrate 1 makes a simple harmonic motion in the vertical direction along an arrow a. Wherein, through the simple harmonic motion of the substrate 1 along the vertical direction and the matching of the through holes 21 on the insulating plate 2, the uniformity of the electric field distributed locally in the vertical direction of the substrate 1 is improved. The frequency of the simple harmonic motion of the base plate 1 in the vertical direction should be identical to the frequency of the pendulum-type simple harmonic oscillation of the insulating plate 2.
According to some embodiments of the present invention, the substrate 1 to be plated is fixed in the plating chamber 4 by the elastic member 12.
In some embodiments of the invention, as shown in fig. 3 and 4, the insulating plate 2 makes a pendulum-type simple harmonic oscillation in a vertical plane.
According to some embodiments of the present invention, anode plates 3 connected to the negative electrode of the power source are disposed on both sides of the substrate 1 to be electroplated, and insulating plates 2 are disposed between the anode plates 3 and the substrate 1 to be electroplated.
In some embodiments of the invention, the surface of the substrate 1 to be electroplated has a seed layer 11. Wherein, the current of the power supply is conducted to the seed layer 11 of the substrate 1 through the elastic member 12, and the surface to be plated of the substrate 1 can be selected from one side surface, a plurality of surfaces or all surfaces of the substrate 1.
According to some embodiments of the present invention, the plurality of through holes 21 are uniformly arranged on the insulating plate 2. The size of the through holes 21 is uniformly reduced from the central area of the substrate 1 to the periphery, through the size difference between the through holes 21, the electric field transmitted by the central through holes 21 of the insulating plate 2 is stronger, the electric field transmitted by the peripheral through holes 21 is smaller, and the electric field on the surface of the substrate 1 is comprehensively compensated from the whole to the part by combining the pendulum simple harmonic motion of the insulating plate 2 and the simple harmonic motion of the substrate 1 in the vertical direction, so that a better electroplating effect is realized.
In some embodiments of the invention, the substrate 1 is a wafer substrate.
The present invention also provides a plating method for a substrate, as shown in fig. 6, the method performing plating of the substrate using the plating apparatus 100 for a substrate according to some embodiments of the present invention, the plating method comprising:
s100: the substrate to be electroplated is vertically placed in an electroplating cavity and is connected with a positive electrode of a power supply;
s200: enabling the substrate to be electroplated to perform simple harmonic motion in the vertical direction, and enabling the insulating plate to perform pendulum type simple harmonic motion in the vertical plane;
s300, electrifying a substrate connected to the positive electrode of the power supply and an anode plate connected to the negative electrode of the power supply, and electroplating the substrate.
According to the electroplating method for the substrate, as shown in fig. 1 to 4, by adding the insulating plate 2 with the plurality of through holes 21 in the electroplating device 100, the electric field is compensated and distributed from the center to the edge through the through holes 21 at two sides of the substrate 1, so that the compensated electric field is in an overall uniform state, and the uneven distribution of the electric field at local is decomposed by utilizing the pendulum-type simple harmonic motion of the insulating plate 2 and the simple harmonic motion of the substrate 1 in the vertical direction, so that the electric field distribution in the uniform state from the whole to the local is generated on the surface of the substrate 1, and finally, the electroplating quality of the surface of the substrate 1 is improved. And the seed layer 11 may be selectively formed on one side surface, a plurality of surfaces, or all surfaces of the substrate 1, and the insulating plate 2 may be disposed on a side corresponding to the seed layer 11, thereby selectively plating a part of or all surfaces of the substrate 11.
The steps of the method flow described in the specification and the flow chart shown in the drawings of the specification are not necessarily strictly executed according to step numbers, and the execution order of the steps of the method may be changed. Moreover, some steps may be omitted, multiple steps may be combined into one step to be performed, and/or one step may be decomposed into multiple steps to be performed.
While the invention has been described in connection with specific embodiments thereof, it is to be understood that these drawings are included in the spirit and scope of the invention, it is not to be limited thereto.
Claims (8)
1. The electroplating device is used for electroplating the substrate, and is characterized by comprising an electroplating cavity for containing electrolyte, wherein the substrate to be electroplated is arranged in the electrolyte in the electroplating cavity and is connected with a negative electrode of a power supply, at least one side of the substrate to be electroplated is provided with an anode plate connected with the positive electrode of the power supply, an insulating plate is arranged between the anode plate and the substrate to be electroplated, and a plurality of through holes are formed in the insulating plate;
when the substrate is electroplated, the insulating plate swings in the electrolyte in a pendulum type simple harmonic manner, and electroplating ions flow to the substrate through the through holes and are electroplated on the surface of the substrate;
the substrate to be electroplated is movably arranged in the electroplating cavity along the vertical direction, and the substrate is in simple harmonic motion along the vertical direction in the process of electroplating the substrate.
2. The plating apparatus for a substrate as recited in claim 1, wherein said substrate to be plated is fixed in said plating chamber by a spring member.
3. The plating apparatus for a substrate according to claim 1, wherein said insulating plate makes a pendulum type simple harmonic oscillation in a vertical plane.
4. The plating apparatus for a substrate according to claim 1, wherein both sides of the substrate to be plated are provided with anode plates connected to a positive electrode of a power source, and the insulating plate is provided between the anode plates and the substrate to be plated.
5. The plating apparatus for a substrate according to claim 1, wherein the surface to be plated of the substrate has a seed metal layer.
6. The plating apparatus for a substrate according to claim 1, wherein a plurality of said through holes are uniformly arranged on said insulating plate.
7. The plating apparatus for a substrate according to any of claims 1 to 6, wherein said substrate is a wafer substrate.
8. A plating method for a substrate, characterized in that the method employs the plating apparatus for a substrate according to any one of claims 1 to 7 for plating a substrate, the method comprising:
vertically placing a substrate to be electroplated in the electroplating cavity, and connecting with a power supply negative electrode;
enabling the substrate to be electroplated to perform simple harmonic motion in the vertical direction, and enabling the insulating plate to perform pendulum type simple harmonic motion in the vertical plane;
and electrifying the substrate connected to the negative electrode of the power supply and the anode plate connected to the positive electrode of the power supply, and electroplating the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111412286.0A CN114262927B (en) | 2021-11-25 | 2021-11-25 | Electroplating device and electroplating method for substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111412286.0A CN114262927B (en) | 2021-11-25 | 2021-11-25 | Electroplating device and electroplating method for substrate |
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| Publication Number | Publication Date |
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| CN114262927A CN114262927A (en) | 2022-04-01 |
| CN114262927B true CN114262927B (en) | 2023-06-06 |
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Citations (3)
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| KR20050062227A (en) * | 2003-12-20 | 2005-06-23 | 삼성전자주식회사 | Electroplating apparatus |
| JP2006089810A (en) * | 2004-09-24 | 2006-04-06 | Noge Denki Kogyo:Kk | Plating device and method for wafer using auxiliary cathode |
| CN106087008A (en) * | 2014-08-20 | 2016-11-09 | 江苏理工学院 | Method for machining drill bit through supercritical composite electroplating based on moving anode with good effect |
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| JP2007177307A (en) * | 2005-12-28 | 2007-07-12 | Sharp Corp | Electroplating apparatus and electroplating method |
| JP5184308B2 (en) * | 2007-12-04 | 2013-04-17 | 株式会社荏原製作所 | Plating apparatus and plating method |
| CN102534733B (en) * | 2010-12-24 | 2016-01-06 | 北大方正集团有限公司 | Electroplanting device and electro-plating method |
| CN202558952U (en) * | 2012-05-10 | 2012-11-28 | 吴燕 | Shield for printed circuit board or wafer electroplating device |
| CN206127457U (en) * | 2016-10-09 | 2017-04-26 | 苏州道蒙恩电子科技有限公司 | Rectangle anodic oxidation groove of flow equalizing |
| CN107034506B (en) * | 2017-03-31 | 2019-01-01 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer electroplating device and electroplating method |
| CN107034505B (en) * | 2017-03-31 | 2019-02-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer electroplating device and electroplating method |
| CN108396347B (en) * | 2018-05-04 | 2019-12-31 | 陈蓓 | Electroplating barrier, manufacturing method thereof and pattern electroplating method |
| KR102639119B1 (en) * | 2018-12-31 | 2024-02-20 | 엘지디스플레이 주식회사 | Electroplating apparatus and electroplating method using the same |
| CN111405775B (en) * | 2020-03-25 | 2021-07-13 | 盐城维信电子有限公司 | Substrate electroplating method and substrate manufactured by same |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050062227A (en) * | 2003-12-20 | 2005-06-23 | 삼성전자주식회사 | Electroplating apparatus |
| JP2006089810A (en) * | 2004-09-24 | 2006-04-06 | Noge Denki Kogyo:Kk | Plating device and method for wafer using auxiliary cathode |
| CN106087008A (en) * | 2014-08-20 | 2016-11-09 | 江苏理工学院 | Method for machining drill bit through supercritical composite electroplating based on moving anode with good effect |
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