CN114235622A - Manufacturing method of peel strength test pattern of prepreg and PCB - Google Patents
Manufacturing method of peel strength test pattern of prepreg and PCB Download PDFInfo
- Publication number
- CN114235622A CN114235622A CN202111535144.3A CN202111535144A CN114235622A CN 114235622 A CN114235622 A CN 114235622A CN 202111535144 A CN202111535144 A CN 202111535144A CN 114235622 A CN114235622 A CN 114235622A
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- China
- Prior art keywords
- prepreg
- test pattern
- peel strength
- manufacturing
- adhesive
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 238000007719 peel strength test Methods 0.000 title claims abstract description 23
- 238000012360 testing method Methods 0.000 claims abstract description 38
- 230000000903 blocking effect Effects 0.000 claims abstract description 34
- 239000002390 adhesive tape Substances 0.000 claims abstract description 29
- 239000000853 adhesive Substances 0.000 claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000010030 laminating Methods 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 12
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 239000011889 copper foil Substances 0.000 claims description 15
- 238000002955 isolation Methods 0.000 claims description 10
- 239000000872 buffer Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000003698 laser cutting Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 238000000608 laser ablation Methods 0.000 abstract description 8
- 238000005530 etching Methods 0.000 abstract description 6
- 239000006229 carbon black Substances 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007853 buffer solution Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/62—Manufacturing, calibrating, or repairing devices used in investigations covered by the preceding subgroups
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The invention relates to the technical field of PCBs (printed circuit boards), and discloses a manufacturing method of a peel strength test pattern of a prepreg and a PCB. The manufacturing method of the peel strength test pattern comprises the following steps: providing a glue blocking tape, a prepreg and a base material; manufacturing a hollow pattern on the adhesive tape, wherein the hollow pattern is the same as a preset stripping test pattern; laminating and pressing the glue blocking adhesive tape to the surface of the base material according to the sequence of the prepreg, the glue blocking adhesive tape and the base material; and tearing off the adhesive blocking tape, and removing the part of the prepreg covering the surface of the non-hollow area of the adhesive blocking tape in parallel so as to reserve the part of the prepreg covering the hollow area of the adhesive blocking tape to form a preset stripping test pattern. Aiming at the redundant prepregs, the embodiment of the invention adopts a mode of removing the prepregs by adhesive tape, replaces the conventional laser ablation removal mode, and can not generate the carbon black phenomenon and the side etching phenomenon, thereby improving the manufacturing precision of the test pattern and ensuring the accuracy of the test result.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a manufacturing method of a peel strength test pattern of a prepreg and a PCB.
Background
Multiple interfaces exist in the manufacture of the PCB, and the multiple interfaces need to meet certain reliability. There is a conventional test item in material property testing: and (5) testing the peel strength. In order to realize the peel strength test, one of the two pressed components is often manufactured into a preset test pattern, and then the two pressed components are peeled off from each other to complete the peel strength test.
At present, the general test target is the peel strength between the prepreg and the copper face; for this reason, the test pattern is usually produced by: the method comprises the steps of firstly pressing a prepreg and a copper layer, and then removing a non-pattern area of the prepreg by an etching method, so that the prepreg reserved on the surface of the copper layer is in a preset stripping pattern.
When the test target is the peel strength between the prepreg and the non-copper surface, the above manufacturing method of the test pattern cannot be adopted, and another manufacturing method is often adopted: and exposing the surface of the prepreg after pressing, and removing a non-pattern area of the prepreg by adopting a laser ablation method so that the prepreg reserved on the surface of the copper layer is in a preset stripping pattern. However, the energy is difficult to control when laser ablation is used, carbon black is generated by large-area ablation, and the laser energy generates side etching on a peeling pattern to be reserved, so that the peeling strength test result is often inaccurate.
Disclosure of Invention
The invention aims to provide a manufacturing method of a peel strength test pattern of a prepreg and a PCB (printed Circuit Board), so as to solve the problem of low peel strength test accuracy in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method for manufacturing a peel strength test pattern comprises the following steps:
providing a glue blocking tape, a prepreg and a base material;
manufacturing a hollow pattern on the adhesive tape, wherein the hollow pattern is the same as a preset stripping test pattern;
laminating and pressing the glue blocking adhesive tape to the surface of the base material according to the sequence of the prepreg, the glue blocking adhesive tape and the base material;
and tearing off the adhesive blocking tape, and removing the part of the prepreg covering the surface of the non-hollowed-out area of the adhesive blocking tape in a connecting manner, so that the part of the prepreg covering the hollowed-out area of the adhesive blocking tape is reserved to form the preset stripping test pattern.
Optionally, a laser cutting mode or a die cutting and punching mode is adopted, and the hollow-out pattern is manufactured on the adhesive tape.
Optionally, the method for laminating the stacked plates includes:
and providing a buffer backing plate and an isolation layer, laminating and pressing the buffer backing plate, the isolation layer, the prepreg, the adhesive blocking tape and the base material in sequence, and then removing the backing plate and the copper foil.
Optionally, the isolation layer is a copper foil.
Optionally, in the step of laminating, the smooth surface of the copper foil faces the prepreg.
Optionally, the preset peeling pattern is in a strip shape or a circular shape.
Optionally, the viscosity of the adhesive blocking tape exceeds a preset threshold.
A PCB manufactured according to the method for manufacturing the peel strength test pattern as described in any one of the above.
Compared with the prior art, the invention has the beneficial effects that:
according to the embodiment of the invention, after the prepreg, the adhesive blocking tape with the hollowed-out pattern and the base material are laminated in sequence, the prepreg covering the non-hollowed-out area can be jointly removed when the adhesive blocking tape is torn off, so that the prepreg covering the hollowed-out area of the adhesive blocking tape can be completely reserved; meanwhile, the graph of the hollow area is completely consistent with the preset stripping test image, so that the prepreg reserved on the surface of the substrate is the preset stripping test graph.
Aiming at the redundant prepregs, the embodiment of the invention adopts a mode of removing the prepregs by adhesive tape, replaces the conventional laser ablation removal mode, and does not generate any carbon black phenomenon and side etching phenomenon after removal, thereby effectively improving the manufacturing precision and the manufacturing efficiency of the test pattern and ensuring the accuracy of the test result.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing a peel strength test pattern according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a manufacturing process of a peel strength test pattern according to an embodiment of the present invention.
Illustration of the drawings: the adhesive tape comprises an adhesive tape blocking tape 1, a prepreg 2, a substrate 3 and a hollow pattern 11.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Because the laser ablation prepreg is easy to generate a large amount of carbon black and cause the problem of side etching, the precision of the stripping test pattern is reduced, and the accuracy of the test result of the stripping strength is reduced, the embodiment of the invention provides a novel manufacturing method of the stripping strength test pattern, and a laser ablation mode is not needed, so that various adverse effects caused by the laser ablation mode are avoided.
Specifically, referring to fig. 1 and 2, with the peel strength between the prepreg and the substrate as a test target, the method for manufacturing the peel strength test pattern according to the embodiment of the present invention includes:
102, manufacturing a hollow pattern 11 on the adhesive tape 1, wherein the hollow pattern 11 is the same as a preset stripping test pattern.
And 103, laminating and pressing the glue blocking adhesive tape 1 to the surface of the substrate 3 according to the sequence of the prepreg 2, the glue blocking adhesive tape 1 and the substrate 3.
And 104, tearing off the adhesive blocking tape 1, and removing the part of the prepreg 2 covering the surface of the non-hollow area of the adhesive blocking tape 1 in a parallel connection manner, so that the part of the prepreg 2 covering the hollow area of the adhesive blocking tape 1 is reserved to form a preset stripping test pattern.
In the embodiment of the invention, after the prepreg 2, the adhesive tape 1 with the hollowed-out pattern 11 and the substrate 3 are laminated and pressed in sequence, the prepreg 2 covering the non-hollowed-out area can be continuously removed when the adhesive tape 1 is torn off, so that the prepreg 2 covering the hollowed-out area of the adhesive tape 1 can be completely reserved; meanwhile, the pattern of the hollow area is completely consistent with the preset stripping test pattern, so that the prepreg 2 reserved on the surface of the substrate 3 is the preset stripping test pattern.
Aiming at the redundant prepreg 2, the embodiment of the invention adopts a mode of removing by adhesive tape, replaces the conventional laser ablation removal mode, and does not generate any carbon black phenomenon and side etching phenomenon after removal, thereby effectively improving the manufacturing precision of the test pattern and ensuring the accuracy of the test result.
The way of making the hollowed-out pattern 11 on the adhesive tape 1 can be any way, for example, a laser cutting way or a die cutting and punching way is adopted, as long as the required specified pattern can be made.
In the step of laminating and stitching, in order to obtain a good stitching effect, the method may further include:
providing a buffer backing plate and an isolation layer, laminating and pressing the buffer backing plate, the isolation layer, the prepreg 2, the adhesive blocking tape 1 and the base material 3 in sequence, and then removing the backing plate and the copper foil.
In the laminating method, the isolating layer is used for isolating the prepreg 2 from the outside, so that the influence on the manufacturing precision of the subsequent stripping test pattern caused by the adhesion of the prepreg 2 to the buffer base plate in the laminating process is avoided. Therefore, the isolation layer only needs to have a certain isolation function and avoid being adhered to the prepreg 2.
The isolation layer may be specifically a copper foil, which is a common material in the art. When the copper foil is applied, in order to ensure that the bonding degree of the prepreg 2 and the copper foil after pressing is low so that the copper foil can be easily removed, the smooth surface of the copper foil can be stacked towards the prepreg 2 in the laminating process so as to reduce the friction force between the copper foil and the prepreg 2, thereby reducing the bonding degree between the copper foil and the prepreg 2 and easily separating the copper foil and the prepreg 2.
In order to prevent the adhesive tape 1 from being pressed quickly after the adhesive tape 1 is attached, and to reduce the contamination of the exposed interface of the adhesive tape 1 during the quick pressing, the adhesive tape 1 with viscosity exceeding the preset threshold value can be selected to have medium and high viscosity, and the adhesive tape 1 does not need to be pressed quickly to increase the attachment degree with the substrate 3.
It should be noted that the preset peeling test pattern in the embodiment of the present invention may be actually any required pattern, such as a bar shape, a circle shape, and the like, and may be set according to the current test requirement.
No matter how the shape and size of the preset stripping test pattern are, the corresponding hollowed-out pattern 11 can be quickly and accurately made on the adhesive blocking tape 1 through a laser cutting mode or a die cutting and punching mode, and finally, the prepreg 2 with the pattern consistent with the preset stripping test pattern can be obtained only by tearing off the adhesive blocking tape 1.
Based on the same inventive concept, the embodiment of the invention also provides a PCB which is manufactured according to the manufacturing method of the peel strength test pattern. Because the test pattern on the PCB is manufactured by adopting the method, the pattern precision is higher, a good foundation is laid for the subsequent peeling strength test, and the accuracy of the test result is ensured.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. A method for manufacturing a peel strength test pattern is characterized by comprising the following steps:
providing a glue blocking tape, a prepreg and a base material;
manufacturing a hollow pattern on the adhesive tape, wherein the hollow pattern is the same as a preset stripping test pattern;
laminating and pressing the glue blocking adhesive tape to the surface of the base material according to the sequence of the prepreg, the glue blocking adhesive tape and the base material;
and tearing off the adhesive blocking tape, and removing the part of the prepreg covering the surface of the non-hollowed-out area of the adhesive blocking tape in a connecting manner, so that the part of the prepreg covering the hollowed-out area of the adhesive blocking tape is reserved to form the preset stripping test pattern.
2. The method for manufacturing a peel strength test pattern according to claim 1, wherein the adhesive tape is provided with a hollow pattern by a laser cutting method or a die cutting punching method.
3. The method for forming a peel strength test pattern according to claim 1, wherein the method for laminating the stacked plates comprises:
and providing a buffer backing plate and an isolation layer, laminating and pressing the buffer backing plate, the isolation layer, the prepreg, the adhesive blocking tape and the base material in sequence, and then removing the backing plate and the copper foil.
4. The method for forming a peel strength test pattern according to claim 3, wherein the separator is a copper foil.
5. The method for forming a peel strength test pattern according to claim 4, wherein a smooth surface of the copper foil faces the prepreg in the step of laminating the laminate.
6. The method for manufacturing a peel strength test pattern according to claim 1, wherein the predetermined peel pattern is a strip or a circle.
7. The method for forming a peel strength test pattern according to claim 1, wherein the viscosity of the adhesive tape exceeds a predetermined threshold.
8. A PCB manufactured according to the method of manufacturing a peel strength test pattern of any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111535144.3A CN114235622B (en) | 2021-12-15 | 2021-12-15 | Manufacturing method of peel strength test pattern of prepreg and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111535144.3A CN114235622B (en) | 2021-12-15 | 2021-12-15 | Manufacturing method of peel strength test pattern of prepreg and PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114235622A true CN114235622A (en) | 2022-03-25 |
| CN114235622B CN114235622B (en) | 2024-07-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111535144.3A Active CN114235622B (en) | 2021-12-15 | 2021-12-15 | Manufacturing method of peel strength test pattern of prepreg and PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114235622B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0493926A (en) * | 1990-08-07 | 1992-03-26 | Optrex Corp | Patterning method of electroless plating film and production of liquid crystal display element |
| TW466895B (en) * | 1997-06-30 | 2001-12-01 | Matsushita Electric Ind Co Ltd | Printed-circuit board having projection electrodes and method for producing the same |
| JP2001337239A (en) * | 2000-05-30 | 2001-12-07 | Matsushita Electric Ind Co Ltd | Optical waveguide and its manufacturing method |
| CN101888749A (en) * | 2010-06-28 | 2010-11-17 | 王爱军 | Process for laminating PCB with internal through-hole structure |
| CN102941642A (en) * | 2012-11-09 | 2013-02-27 | 上海长园电子材料有限公司 | Sample preparation method and mould for hot melt adhesive peel strength test |
| CN108834337A (en) * | 2018-08-31 | 2018-11-16 | 生益电子股份有限公司 | A kind of production method and PCB of PCB |
| CN112525659A (en) * | 2020-12-07 | 2021-03-19 | 深圳先进技术研究院 | Preparation device of adhesive force test sample of adhesive and adhesive force test method |
| CN113795080A (en) * | 2021-08-18 | 2021-12-14 | 景旺电子科技(珠海)有限公司 | Surface treatment method of printed circuit board and printed circuit board |
-
2021
- 2021-12-15 CN CN202111535144.3A patent/CN114235622B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0493926A (en) * | 1990-08-07 | 1992-03-26 | Optrex Corp | Patterning method of electroless plating film and production of liquid crystal display element |
| TW466895B (en) * | 1997-06-30 | 2001-12-01 | Matsushita Electric Ind Co Ltd | Printed-circuit board having projection electrodes and method for producing the same |
| JP2001337239A (en) * | 2000-05-30 | 2001-12-07 | Matsushita Electric Ind Co Ltd | Optical waveguide and its manufacturing method |
| CN101888749A (en) * | 2010-06-28 | 2010-11-17 | 王爱军 | Process for laminating PCB with internal through-hole structure |
| CN102941642A (en) * | 2012-11-09 | 2013-02-27 | 上海长园电子材料有限公司 | Sample preparation method and mould for hot melt adhesive peel strength test |
| CN108834337A (en) * | 2018-08-31 | 2018-11-16 | 生益电子股份有限公司 | A kind of production method and PCB of PCB |
| CN112525659A (en) * | 2020-12-07 | 2021-03-19 | 深圳先进技术研究院 | Preparation device of adhesive force test sample of adhesive and adhesive force test method |
| CN113795080A (en) * | 2021-08-18 | 2021-12-14 | 景旺电子科技(珠海)有限公司 | Surface treatment method of printed circuit board and printed circuit board |
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| Publication number | Publication date |
|---|---|
| CN114235622B (en) | 2024-07-16 |
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