CN112525659A - Preparation device of adhesive force test sample of adhesive and adhesive force test method - Google Patents

Abstract

The invention provides a preparation device of a bonding force test sample of an adhesive, which comprises a lower clamp, a substrate, a template and an upper clamp, wherein the lower clamp, the substrate, the template and the upper clamp are sequentially arranged from bottom to top; the template is provided with a die cavity for containing an adhesive to form a test sample; wherein the side walls of the mold cavity comprise at least one planar side wall extending from the bottom to the top of the mold cavity. The invention also provides a method for testing the adhesive force, which comprises the steps of preparing a test sample by adopting the device, and applying thrust to the plane side wall of the test sample by using the push knife of the push knife tester to carry out adhesive force test. According to the test sample prepared by the invention, only one connecting interface exists between the adhesive layer and the substrate, the sample is provided with the plane side wall, and the applied acting force is in a line contact mode during testing, so that the phenomenon of substrate fracture caused by over-concentrated thrust load is avoided, and the accuracy and the success rate of the test are improved.

Description

Preparation device of adhesive force test sample of adhesive and adhesive force test method

Technical Field

The invention belongs to the technical field of adhesive testing, and particularly relates to a preparation device of a bonding force test sample of an adhesive and a bonding force test method.

Background

The adhesive is generally composed of resin, curing agent, coupling agent, toughening agent, diluent and other small amount of auxiliary agents. Part of the adhesive also comprises inorganic filler and other components, for example, more than 50% of silicon dioxide microspheres are contained in the chip bottom filling adhesive. The adhesive has the main function of firmly bonding two interfaces together, and is widely applied to the industries of electronic packaging, building materials, aerospace, automobile manufacturing, medical treatment and health care and the like.

The most important index parameter of the adhesive is the bonding performance, i.e. the bonding strength, or firmness, of the adhesive at the bonding interface. At present, the method for measuring the adhesive force of the adhesive is mainly to measure the adhesive strength of the adhesive on a certain substrate interface by adopting a thrust shear test method. The existing method for testing the bonding force based on the sandwich structure comprises the steps of firstly preparing a test sample shown in figure 1, wherein a bottom substrate 1 and a middle layer of the test sample are an adhesive layer 2 and a top stress block 3, the bottom substrate 1 is usually made of materials such as silicon, copper and the like, the middle layer is the adhesive layer 2 and usually ranges from 10 micrometers to 50 micrometers, and the top stress block 3 can be the same as or different from the bottom substrate. During testing, a shear force is applied to the top layer stress block 3 of the sandwich structure by an instrument push broach, so that the adhesive layer 2 is separated from the bottom substrate 1 or the top layer stress block 3, and the shear force value during separation is recorded as the bonding force value of the adhesive.

In the above-mentioned testing method, the test sample has a three-layer structure and includes two main interfaces (the interface between the adhesive layer 2 and the bottom substrate 1 and the interface between the adhesive layer 2 and the top stress block 3), so that in the testing process, cracks are likely to fluctuate back and forth between the upper and lower interfaces and the middle adhesive layer material, the bonding strength at the interfaces cannot be accurately reflected, and the testing accuracy is low.

Disclosure of Invention

In view of the defects in the prior art, the invention provides a preparation device of a bonding strength test sample of an adhesive and a bonding strength test method, which aim to solve the problem of low test accuracy in the conventional bonding strength test method of the adhesive.

In order to achieve the above object, an aspect of the present invention provides an apparatus for preparing a sample for testing adhesive force of an adhesive, comprising a lower fixture, a substrate, a template, and an upper fixture, which are sequentially disposed from bottom to top, wherein a locking mechanism is connected between the lower fixture and the upper fixture; a mold cavity used for containing an adhesive to form a test sample is arranged in the template, one end of the mold cavity is communicated to the substrate so that the formed test sample is bonded to the substrate, the other end of the mold cavity is communicated to the upper clamp, a through hole is formed in the corresponding position of the upper clamp, and the through hole is used for injecting the adhesive; wherein the side walls of the mold cavity comprise at least one planar side wall extending from the bottom to the top of the mold cavity.

Preferably, the side walls of the mold cavity consist of n planar side walls extending from the bottom to the top of the mold cavity, such that the interior space of the mold cavity has an n-truncated pyramid shape, n being an integer of 3 or more.

Preferably, n is 3, 4, 5 or 6.

Preferably, in the n planar sidewalls, an included angle between each planar sidewall and a normal of the substrate is equal.

Preferably, the included angle between the planar side wall and the normal of the substrate is 0-10 °.

Preferably, the width of the top of the die cavity is 3 mm-6 mm, the width of the bottom of the die cavity is 4 mm-8 mm, and the height of the die cavity is 2 mm-6 mm; wherein the top width of the mold cavity refers to a width between two points farthest away in the top of the mold cavity, and the bottom width of the mold cavity refers to a width between two points farthest away in the bottom of the mold cavity.

Preferably, the included angle between the planar side wall and the normal of the substrate is 3-10 °.

Preferably, n is 4, and the inner space of the mold cavity has a regular quadrangular frustum pyramid shape.

Preferably, the locking mechanism is a removable threaded fastener.

Another aspect of the present invention is to provide a method for testing adhesive force of an adhesive, which includes:

preparing to obtain a test sample by adopting the preparation device of the adhesion test sample, wherein the test sample comprises an adhesive curing piece connected on the substrate, and the shape of the adhesive curing piece is the same as that of the mold cavity;

providing a bonding force testing device, wherein the bonding force testing device comprises a base and a push-type broach tester, the test sample is fixedly connected to the base of the bonding force testing device, and a push-type broach of the push-type broach tester exerts pushing force on a plane side wall of the test sample until an adhesive curing piece is peeled off from a substrate;

and recording the thrust value of the adhesive solidified piece when the adhesive solidified piece is stripped from the substrate to obtain the adhesion force parameter.

According to the preparation device for the adhesion test sample and the corresponding adhesion test method provided by the embodiment of the invention, in the test sample prepared and obtained by the preparation device for the test sample: on one hand, the adhesive layer and the substrate only have one connecting interface, so that the bonding strength between the adhesive and the substrate can be more accurately reflected, and the test result is more accurate; on the other hand, the adhesive layer in the test sample is provided with a plane side wall, when the test is carried out, the push knife of the push knife tester applies thrust to the plane side wall of the test sample, and the applied acting force is in a line contact mode, so that the phenomenon that the substrate is cracked due to too concentrated thrust load is avoided, and the test accuracy and the test success rate are improved.

Drawings

FIG. 1 is a schematic structural view of a conventional adhesion test specimen;

FIG. 2 is an exploded view of an apparatus for preparing a sample for adhesion test according to an embodiment of the present invention;

FIG. 3 is a bottom view of a template in the test sample preparation apparatus in accordance with the preferred embodiment of the present invention;

FIG. 4 is a cross-sectional view of the template shown in FIG. 3;

FIG. 5 is a schematic structural view of a test sample prepared in a preferred embodiment of the present invention;

FIG. 6 is an exemplary illustration of a bond test using a bond testing apparatus in an embodiment of the present invention;

FIG. 7 is a schematic structural view of a sample to be tested prepared in example 1 of the present invention;

FIG. 8 is a schematic structural view of a specimen to be tested prepared in comparative example 1 of the present invention;

FIGS. 9a to 9c are photographic illustrations of the peel interface of the present invention for testing a sample to be tested;

fig. 10a to 10c are exemplary illustrations of the peeling path for testing a sample to be tested in the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. Examples of these preferred embodiments are illustrated in the accompanying drawings. The embodiments of the invention shown in the drawings and described in accordance with the drawings are exemplary only, and the invention is not limited to these embodiments.

It should be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and/or processing steps closely related to the scheme according to the present invention are shown in the drawings, and other details not so relevant to the present invention are omitted.

The embodiment of the invention firstly provides an adhesive, as shown in fig. 2, the device comprises a lower clamp 10, a substrate 20, a template 30 and an upper clamp 40 which are arranged from bottom to top in sequence, and a locking mechanism is connected between the lower clamp 10 and the upper clamp 20.

Wherein, a mold cavity 31 for containing an adhesive to form a test sample is provided in the mold plate 30, one end of the mold cavity 31 is communicated to the substrate 20 to bond the formed test sample to the substrate 20, the other end of the mold cavity 31 is communicated to the upper clamp 40 and the upper clamp 40 is provided with a through hole 41 at a position corresponding to the mold cavity 31, the through hole 41 is used for injecting the adhesive.

Wherein the side walls of the mold cavity 31 comprise at least one planar side wall extending from the bottom to the top of the mold cavity 31, such that the side walls of the finally prepared test sample comprise at least one planar side wall extending from the bottom to the top.

The lower fixture 10 and the upper fixture 40 are made of hard materials and are resistant to high temperature, for example, plates made of stainless steel, aluminum, iron, and the like can be selected, the template 30 is made of teflon plates, the substrate 20 is made of silicon, silicon dioxide, silicon nitride, polyimide, copper, tin-silver-copper alloy, and the like, and a PCB may also be directly used.

In a preferred embodiment, the thickness of the lower jig 10 and the upper jig 40 may be set to be in a range of 3mm to 6mm, the thickness of the template 30 may be set to be in a range of 2mm to 8mm, and the thickness of the substrate 20 may be set to be in a range of 0.4mm to 2 mm.

The preparation device of the sample for testing the adhesive force of the adhesive can prepare the sample for testing according to the following steps:

s1, ultrasonically cleaning the lower clamp 10, the substrate 20, the template 30 and the upper clamp 402-3 times by adopting an ethanol solution, and drying for later use.

S2, the substrate 20 is placed at the center of the lower jig 10, the template 30 is completely covered on the substrate 20, the upper jig 40 is covered on the template 30, the upper jig 40 and the lower jig 10 are locked by the locking mechanism, and the substrate 20 and the template 30 are fixedly clamped between the upper and lower jigs.

S3, an appropriate amount of adhesive is injected into the cavity 31 of the mold plate 30 through the through-hole 41 of the upper jig 40. Care should be taken to avoid spillage of the adhesive as much as possible.

And S4, waiting for the adhesive to be cured (normal temperature curing or heating curing).

S5, after the adhesive is cured, detaching the locking mechanism and removing the lower clamp 10, the upper clamp 40, and the mold plate 30, thereby preparing a test sample, wherein the test sample comprises a base plate 20 and an adhesive layer adhered on the base plate 20, and the shape of the adhesive layer is the same as that of the mold cavity 31, i.e. the test sample comprises at least one plane side wall extending from the bottom to the top.

Among the test samples obtained: on one hand, the adhesive layer and the substrate only have one connecting interface, so that the bonding strength between the adhesive and the substrate can be more accurately reflected, and the test result is more accurate; on the other hand, the adhesive layer in the test sample is provided with a plane side wall, when the test is carried out, the push knife of the push knife tester applies thrust to the plane side wall of the test sample, and the applied acting force is in a line contact mode, so that the phenomenon that the substrate is cracked due to too concentrated thrust load is avoided, and the test accuracy and the test success rate are improved.

The width of the top of the die cavity is set to be within the range of 3-6 mm, the width of the bottom of the die cavity is set to be within the range of 4-8 mm, and the height of the die cavity is set to be within the range of 2-6 mm. Wherein the top width of the mold cavity refers to a width between two points farthest away in the top of the mold cavity, and the bottom width of the mold cavity refers to a width between two points farthest away in the bottom of the mold cavity.

In a preferred scheme, the locking mechanism is a detachable threaded fastener, and specifically, referring to fig. 1, four corners of the lower clamp 10 and the upper clamp 40 are respectively provided with a through hole, the threaded fastener comprises a screw rod 51 and a nut 52, and the screw rod 51 is passed through the through holes on the corners of the lower clamp 10 and the upper clamp 40 and is matched and locked with the nut 52, so that the purpose of locking each layer structure in the device is achieved.

In a preferred embodiment, the side wall of the mold cavity 31 is composed of n planar side walls extending from the bottom to the top of the mold cavity 31, so that the inner space of the mold cavity 31 has an n-truncated pyramid shape, and n is an integer of 3 or more. The adhesive layer of the test sample thus prepared was in the shape of a poly (n) prism.

In a further preferred embodiment, n is 3, 4, 5 or 6, and the adhesive layer of the test specimen thus obtained is in the form of a triangular, square, pentagonal or hexagonal prism.

In a further preferred embodiment, among the n planar sidewalls, an included angle between each planar sidewall and a normal of the substrate is equal. The adhesive layer of the test sample thus prepared is in the shape of a regular poly (n) prism table, such as a regular triangular prism table, a regular rectangular prism table, a regular pentagonal prism table, or a regular hexagonal prism table.

In a further preferred embodiment, an angle between the planar sidewall and a normal of the substrate is 0 ° to 10 °. More preferably, the angle between the planar sidewall and the normal of the substrate is 3 ° to 10 °.

It should be noted that, when the included angle between the planar side wall and the normal line of the substrate is 0 °, the adhesive layer of the test sample prepared from the adhesive is a straight prism, theoretically, the push broach is in surface contact with the adhesive layer, and the thrust load is more uniformly dispersed on the colloid, which is more favorable for preventing the colloid or the substrate from being damaged in advance in the test process, thereby improving the success rate of the test. However, this structure also has significant drawbacks: due to the solidification and shrinkage of the colloid, a standard sample of the straight prism is difficult to prepare, the side wall of the straight prism is uneven, so that the straight prism is not in surface contact with the push broach but in point contact or line contact which is randomly distributed, the force application position of the push broach is not repeated, and the accuracy of a test result is reduced. Therefore, it is also preferable to set the angle of the planar side wall of the cavity 31 to the normal of the base plate to be larger than 0 °, i.e., to have a planar side wall in an inclined shape.

In a specific embodiment, referring to fig. 3 and 4, n is 4, and the inner space of the cavity 31 has a regular quadrangular frustum pyramid shape, so as to prepare a test sample as shown in fig. 5, where the test sample includes a substrate 20 and an adhesive layer 21 bonded to the substrate 20, and the shape of the adhesive layer 21 is a regular quadrangular frustum pyramid-shaped structure.

The embodiment of the invention also provides a method for testing the adhesive force of the adhesive, which comprises the following steps:

(1) a test sample is prepared by using the preparation device of the adhesion test sample as described in the above embodiment, the test sample comprises an adhesive layer connected on the substrate, and the shape of the adhesive layer is the same as that of the mold cavity. Such as the test sample shown in fig. 5.

(2) And providing a bonding force testing device to carry out bonding force test on the prepared test sample.

Specifically, the adhesion testing device comprises a thrust tester, a multi-angle adjustable base and a sample bonding plate. Referring to fig. 6, the thrust tester includes a base with an adjustable position (XOY plane adjustable) and a push-type broach 100 capable of moving up and down, and the multi-angle adjustable base 200 includes a clamping device for a sample bonding plate 300.

Referring to fig. 6, the test procedure is as follows:

and S10, adhering the base plate 20 of the sample to be tested to the sample bonding plate 300 by using other quick-drying adhesives with stronger adhesive force.

S20, fixing the sample bonding plate 300 bonded with the sample to be measured on the multi-angle adjustable base 200, and adjusting a proper angle to enable the plane side wall of the sample to be measured to be parallel to the push broach 100.

S30, adjusting the relative position of the push broach 100 and the sample to be measured, and enabling the force application position of the push broach to be 10-200 μm higher than the surface of the substrate 20 of the sample to be measured.

S40, starting the thrust tester, the push-type broach 100 never contacts the contact sample (as shown in the direction of force F in fig. 6), and the thrust gradually increases until the adhesive layer 21 of the sample to be tested is peeled off from the substrate 20, and the push-type broach automatically stops.

And S50, recording the thrust value of the sample when the adhesive layer is peeled off, and obtaining the adhesion parameter after the test is finished.

Example 1

Providing a test sample preparation device as described above in accordance with an embodiment of the present invention, with reference to fig. 2, 3 and 4, wherein: the lower clamp 10 is a stainless steel plate with the thickness of 5 mm; the upper clamp 40 is a stainless steel plate with the thickness of 5mm, and a circular through hole with the diameter of 10mm is formed in the center; the template 30 is a Teflon plate with the thickness of 5mm, and the die cavity 31 in the template 30 is a quadrangular frustum inverse die (the size is that the top is a square with the side length of 3mm, the bottom is a square with the side length of 4mm, and the height is 5 mm); the substrate 20 is a 0.4mm thick silicon substrate with sides of 15mm by 15 mm.

Test samples were prepared as follows:

(1) ultrasonically cleaning the upper clamp, the lower clamp, the template and the substrate twice by adopting an ethanol solution, and drying for 2 hours at 100 ℃ for later use.

(2) The base plate is placed at the center of the lower clamp, the template is completely covered on the base plate, the upper clamp covers the template and is aligned with the periphery of the lower clamp, the screw and the nut are connected with the upper clamp and the lower clamp and are fastened, and the base plate and the template are firmly clamped between the upper clamp and the lower clamp.

(3) And taking a proper amount of adhesive to inject into the die cavity in the die plate, and paying attention to the fact that the adhesive cannot overflow.

(4) And (4) putting the whole piece obtained in the step (3) into an oven to cure the adhesive at the temperature of 150 ℃ for 100 minutes.

(5) And after the solidification is finished, disassembling the screw and the nut, taking out the regular quadrangular frustum pudding mould from the template, and bonding the bottom of the regular quadrangular frustum pudding mould with the substrate to obtain a sample to be tested for the bonding force test, wherein the structure of the sample is shown in figure 7 and comprises a substrate 20A and an adhesive layer 21A of the regular quadrangular frustum structure bonded on the substrate 20A, and the adhesive layer is marked as the sample A to be tested.

Comparative example 1

The preparation device of the test sample provided in the embodiment of the present invention is adjusted, specifically, the mold cavity 31 in the mold plate 30 is set to be a truncated cone-shaped cavity, the diameter of the top is 3mm, and the diameter of the bottom is 4 mm. The remaining structure of the test sample preparation apparatus was the same as that of example 1. The sample to be tested was prepared in the manner of reference example 1 using the apparatus as above. As shown in fig. 8, the sample to be tested prepared in this embodiment includes a substrate 20B and an adhesive layer 21B of a circular truncated cone structure bonded to the substrate 20B, and is denoted as a sample to be tested B.

Comparative example 2

Referring to the sample to be tested prepared and obtained in the prior art and shown in fig. 1, in the sample to be tested prepared and obtained in this example, the bottom substrate is a silicon wafer (with a thickness of 0.5mm and a side length of 5mm × 5mm), the top stress block is a silicon wafer (with a thickness of 0.5mm and a side length of 2mm × 2mm), the side length of the top surface of the adhesive layer is 2mm × 2mm, and the side length of the bottom surface is 4.5mm × 4.5 mm. The sample prepared in this example is designated as sample C to be tested.

The sample a to be tested of example 1, the sample B to be tested of comparative example 1, and the sample C to be tested of comparative example 2 were subjected to adhesion tests, respectively. The testing apparatus and the testing process refer to fig. 6 and the testing process steps S10 to S50 described above.

Wherein, the test of the sample A to be tested is completely performed by referring to the steps S10 to S50. Fig. 9a is a photographic illustration of the peeling interface of the sample a to be measured, and fig. 10a is an exemplary illustration of the peeling path L1 of the sample a to be measured.

The difference between the test of the sample B to be tested and the test process of the sample A to be tested is as follows: because the adhesive layer of the sample B to be detected is in a circular truncated cone structure, the contact start of the push broach and the adhesive layer is point (tangent point) contact. Fig. 9B is a photographic illustration of the peeling interface of the sample B to be measured, and fig. 10B is an exemplary illustration of the peeling path L2 of the sample B to be measured.

The difference between the test of the sample C to be tested and the test process of the sample A to be tested is as follows: according to the existing test mode, the force of the push broach is applied to the top stress block. Fig. 9C is a photographic illustration of the peeling interface of the sample C to be measured, and fig. 10C is an exemplary illustration of the peeling path L3 of the sample C to be measured.

The test results of the above samples to be tested are shown in the following table 1 (5 samples were tested for each sample).

Table 1:

sample (I)	Mean value (MPa)	Mean square error (MPa)
			Sample A to be tested	50.3	3.6
Sample B to be tested	55.7	11.4
			Sample C to be tested	90.5	16.2

Based on the test data of fig. 9a to 9c, fig. 10a to 10c and table 1, it can be seen that: according to the sample (sample A to be tested) prepared by the preparation device for the test sample provided by the embodiment of the invention, the stripping interface of the adhesive layer and the substrate is clean, no pit or residual colloid exists, the fracture path is a connection interface, and based on the data in the table 1, the mean square error of the test result is small, the data stability is good, and the accuracy is higher. In the sample (sample B to be tested) of comparative example 1 and the sample (sample C to be tested) of comparative example 2, the peeling interface between the adhesive layer and the substrate has pits and residual colloid, which indicates that the breaking path is in the substrate body or the colloid body, and the peeling interface has fluctuation, and based on the data in table 1, the mean square error of the test result is large, and the data stability is poor.

Compared with the sample of the comparative example 1, the adhesive layer in the sample of the embodiment 1 has the plane side wall, when the test is carried out, the push knife of the push knife tester applies the thrust force to the plane side wall of the test sample, and the applied acting force is in a line contact mode, so that the phenomenon that the substrate is cracked due to too concentrated thrust load is avoided, and the test accuracy and the test success rate are improved. The sample of comparative example 1 has a circular truncated cone structure as the adhesive layer, and the contact between the push broach and the adhesive layer is point (tangent point) contact, so that a stress concentration point is easily formed at the tangent point during testing, a fracture path is easily caused to be in the substrate body or the colloid body, and the testing stability is poor.

Compared with the sample of the comparative example 2, the adhesive layer in the sample of the embodiment 1 of the invention only has a connection interface with the substrate, so that the bonding strength between the adhesive and the substrate can be more accurately reflected, and the test result is more accurate. The sample of comparative example 1, which contains two major interfaces (the interface between the adhesive layer and the bottom substrate and the interface between the adhesive layer and the top stress piece), had a tendency for cracks to fluctuate back and forth between the upper and lower interfaces and the middle adhesive layer material during the test, failing to accurately reflect the bond strength at the interface, and having a lower test accuracy.

The foregoing is directed to embodiments of the present application and it is noted that numerous modifications and adaptations may be made by those skilled in the art without departing from the principles of the present application and are intended to be within the scope of the present application.

Claims (10)

1. The preparation device of the adhesion test sample of the adhesive is characterized by comprising a lower clamp, a base plate, a template and an upper clamp which are sequentially arranged from bottom to top, wherein a locking mechanism is connected between the lower clamp and the upper clamp; a mold cavity used for containing an adhesive to form a test sample is arranged in the template, one end of the mold cavity is communicated to the substrate so that the formed test sample is bonded to the substrate, the other end of the mold cavity is communicated to the upper clamp, a through hole is formed in the corresponding position of the upper clamp, and the through hole is used for injecting the adhesive; wherein the side walls of the mold cavity comprise at least one planar side wall extending from the bottom to the top of the mold cavity.

2. The apparatus for preparing a sample for adhesion test of adhesive according to claim 1, wherein the side wall of the cavity is composed of n planar side walls extending from the bottom to the top of the cavity so that the inner space of the cavity has an n-truncated pyramid shape, n being an integer of 3 or more.

3. The apparatus for preparing samples for testing adhesion of adhesives according to claim 2, wherein n is 3, 4, 5 or 6.

4. The apparatus for preparing a sample for adhesion test of adhesive according to claim 2, wherein each of the n planar sidewalls has an equal angle with respect to the normal line of the substrate.

5. The apparatus for preparing samples for testing adhesive force of adhesive according to any of claims 1 to 4, wherein the angle between the plane side wall and the normal of the substrate is 0 ° to 10 °.

6. The apparatus for preparing a sample for adhesion test of adhesive according to claim 5, wherein the width of the top of the cavity is 3mm to 6mm, the width of the bottom of the cavity is 4mm to 8mm, and the height of the cavity is 2mm to 6 mm; wherein the top width of the mold cavity refers to a width between two points farthest away in the top of the mold cavity, and the bottom width of the mold cavity refers to a width between two points farthest away in the bottom of the mold cavity.

7. The apparatus for preparing samples for testing adhesive force of adhesive according to claim 5, wherein the angle between the planar sidewall and the normal of the substrate is 3 ° to 10 °.

8. The apparatus for preparing a sample for adhesion test of adhesive according to claim 6, wherein n is 4, and the inner space of the cavity has a regular quadrangular frustum pyramid shape.

9. The apparatus for preparing samples for adhesion test of adhesives according to claim 1, wherein the locking mechanism is a detachable threaded fastener.

10. A method for testing the adhesion of an adhesive, comprising:

preparing a test sample using the apparatus for preparing a cohesive force test sample according to any one of claims 1 to 9, the test sample including a cured adhesive member attached to the substrate, the cured adhesive member having a shape identical to that of the cavity;

providing a bonding force testing device, wherein the bonding force testing device comprises a base and a push-type broach tester, the test sample is fixedly connected to the base of the bonding force testing device, and a push-type broach of the push-type broach tester exerts pushing force on a plane side wall of the test sample until an adhesive curing piece is peeled off from a substrate;

and recording the thrust value of the adhesive solidified piece when the adhesive solidified piece is stripped from the substrate to obtain the adhesion force parameter.

Images