CN215525477U

CN215525477U - Interface drawing force test sample of adhesive and preparation device thereof

Info

Publication number: CN215525477U
Application number: CN202120527051.5U
Authority: CN
Inventors: 汪斌; 吴厚亚; 朱朋莉; 李刚; 张超; 林浩良
Original assignee: Shenzhen Institute of Advanced Technology of CAS
Current assignee: Shenzhen Institute of Advanced Technology of CAS
Priority date: 2021-03-11
Filing date: 2021-03-11
Publication date: 2022-01-14
Anticipated expiration: 2031-03-11

Abstract

The utility model provides a preparation device of an interface drawing force test sample of an adhesive, which comprises a lower clamp, a base plate, a template and an upper clamp which are sequentially arranged from bottom to top, wherein a die cavity for containing the adhesive to form the test sample is arranged in the template, one end of the die cavity is communicated to the base plate so that the formed test sample is bonded to the base plate, the preparation device is also provided with a metal connecting piece, one end of the metal connecting piece is formed into a tip, the metal connecting piece is inserted into the die cavity, and the tip is in abutting connection with the base plate. Based on the preparation device, the utility model also provides an interface drawing force test sample which comprises a substrate, an adhesive pudding die connected to the substrate and a metal connecting piece inserted in the adhesive pudding die. The preparation device and the interface drawing force test sample provided by the utility model can improve the stability and accuracy of the interface drawing force test of the adhesive.

Description

Interface drawing force test sample of adhesive and preparation device thereof

Technical Field

The utility model belongs to the technical field of adhesive testing, and particularly relates to an interface drawing force test sample of an adhesive and a preparation device thereof.

Background

The adhesive is generally composed of resin, curing agent, coupling agent, toughening agent, diluent and other small amount of auxiliary agents. Part of the adhesive also comprises inorganic filler and other components, for example, more than 50% of silicon dioxide microspheres are contained in the chip bottom filling adhesive. The adhesive has the main function of firmly bonding two interfaces together, and is widely applied to the industries of electronic packaging, building materials, aerospace, automobile manufacturing, medical treatment and health care and the like.

The most important index parameter of the adhesive is the bonding performance, i.e. the bonding strength, or firmness, of the adhesive at the bonding interface. The method for measuring the bonding performance mainly comprises a shear force test and a drawing force test, wherein the shear force is parallel to the bonding material and the drawing force is perpendicular to the bonding material.

As for the method for measuring the interfacial drawing force of the adhesive, Chinese patent application (publication No. CN111257223A) discloses a device for testing the drawing force of a soft adhesive, which is to prepare two sample plates with the length of 50mm, the width of 15-20 mm and the thickness of 2-5 mm, wherein the sample plates are made of plastic materials or metal materials, cross-wise stack the two sample plates together, coat the adhesive to be tested on the crossed and contacted part, and then solidify the adhesive under certain solidification conditions. During testing, the lower sample plate is fixed by a designed clamp, the upper sample plate is clamped by the designed clamp and is upwards stretched at the speed of 0.5-1 mm/min, and when the upper sample plate is separated from the adhesive, the drawing force at the moment is the drawing force between the sample plate and the adhesive. The above test protocol mainly suffers from the following disadvantages: (1) the scheme is only suitable for soft adhesives with low fluidity, but is not suitable for adhesives which need high-temperature curing and have high fluidity before curing; (2) the test sample in the scheme is a sandwich structure test sample, the number of bonding interfaces is large, the crack path is tortuous and complex during the test of the sample, and the drawing force between the adhesive and the connecting interface cannot be accurately reflected; (3) when the scheme is used for testing, because the adhesive is coated on the sample plate, the dosage of the adhesive is not easy to control, the testing result is influenced when the dosage is too much or too little, and the testing stability needs to be improved.

SUMMERY OF THE UTILITY MODEL

In view of the defects in the prior art, the utility model provides an adhesive interface pull force test sample, a preparation device and a test method thereof, so as to improve the stability and the accuracy of the adhesive interface pull force test.

In order to achieve the above object of the present invention, an aspect of the present invention provides a device for preparing an interface pull test sample of an adhesive, comprising a lower fixture, a substrate, a template, and an upper fixture, which are sequentially arranged from bottom to top, wherein a locking mechanism is connected between the lower fixture and the upper fixture; a mold cavity used for containing an adhesive to form a test sample is arranged in the template, one end of the mold cavity is communicated to the substrate so that the formed test sample is bonded to the substrate, the other end of the mold cavity is communicated to the upper clamp, the upper clamp is provided with a first through hole at a corresponding position, and the first through hole is used for injecting the adhesive; the manufacturing device is further provided with a metal connecting piece, one end of the metal connecting piece is formed into a tip, the metal connecting piece is inserted into the die cavity through the first through hole, and the tip is connected with the substrate in an abutting mode.

Preferably, a fixing plate is assembled in the first through hole, the size of the fixing plate is matched with that of the first through hole, a second through hole is formed in the fixing plate, the size of the second through hole is matched with that of the metal connecting piece, and the metal connecting piece is inserted into the die cavity through the second through hole.

Preferably, the width of the top of the die cavity is 3 mm-6 mm, the width of the bottom of the die cavity is 4 mm-8 mm, and the height of the die cavity is 4 mm-6 mm; wherein the top width of the mold cavity refers to a width between two points farthest away in the top of the mold cavity, and the bottom width of the mold cavity refers to a width between two points farthest away in the bottom of the mold cavity.

Preferably, the inner space of the mold cavity of the mold plate has the shape of a truncated cone or a truncated pyramid.

Preferably, the length of the tip of the metal connecting piece is 2 mm-5 mm, and the included angle of the tip is 20-40 degrees.

Preferably, the metal connecting piece is a metal sheet structure, the thickness of the metal sheet structure is 0.3 mm-1 mm, and the width of the metal sheet structure is 3 mm-5 mm.

Another aspect of the present invention is to provide an adhesive interfacial drawing force test specimen, which includes a substrate, an adhesive pudding mold connected to the substrate, and a metal connecting member inserted in the adhesive pudding mold; the adhesive pudding die is prepared by an adhesive to be tested through a curing process, the metal connecting piece is inserted into the adhesive pudding die in the curing process, and the bonding interface of the adhesive pudding die and the substrate is an interface to be subjected to a drawing force test; one end of the metal connecting piece is formed into a tip, and the tip of the metal connecting piece is connected with the substrate in an abutting mode.

Specifically, the width of the top of the adhesive pudding die is 3-6 mm, the width of the bottom of the adhesive pudding die is 4-8 mm, and the height of the adhesive pudding die is 4-6 mm; the width of the top of the adhesive pudding die is the width between two points which are farthest away in the top of the adhesive pudding die, and the width of the bottom of the adhesive pudding die is the width between two points which are farthest away in the bottom of the adhesive pudding die.

Specifically, the length of the tip of the metal connecting piece is 2 mm-5 mm, and the included angle of the tip is 20-40 degrees.

Specifically, the metal connecting piece is of a metal sheet structure, the thickness of the metal connecting piece is 0.3 mm-1 mm, and the width of the metal connecting piece is 3 mm-5 mm.

The utility model also provides a method for testing the interface drawing force of the adhesive, which comprises the following steps:

preparing and obtaining the interface drawing force test sample by adopting the preparation device;

providing a drawing force testing device, wherein the drawing force testing device comprises a sample bonding plate, a first clamp and a second clamp; fixedly connecting a base plate of the interface drawing force test sample to the sample bonding plate, clamping a metal connecting piece of the interface drawing force test sample by the first clamp, and clamping the sample bonding plate by the second clamp;

and starting the drawing force testing device, controlling the first clamp and the second clamp to draw along the opposite direction, and recording the drawing force value on the drawing force testing device when the adhesive pudding die is stripped from the substrate to obtain the drawing force parameter.

The preparation device of the interface drawing force test sample and the corresponding interface drawing force test sample provided by the embodiment of the utility model are as follows: on one hand, the adhesive pudding die and the substrate only have one connecting interface, so that the bonding strength between the adhesive and the substrate can be more accurately reflected, and the test result is more accurate; on the other hand, the adhesive pudding mold is cured and formed in the mold cavity of the preparation device, is not only suitable for soft adhesives with low fluidity, but also suitable for adhesives which need high-temperature curing and have high fluidity before curing, and the dosage of the adhesives is easy to control, thereby being beneficial to improving the stability of test results.

Drawings

Fig. 1 is an exploded view of an apparatus for preparing an interfacial drawing force test sample according to an embodiment of the present invention;

FIG. 2 is a bottom view of a template of the test sample preparation device in a preferred embodiment of the present invention;

FIG. 3 is a cross-sectional view of the template shown in FIG. 2;

FIG. 4 is a bottom view of a template of the test sample preparation device in another preferred embodiment of the present invention;

FIG. 5 is a cross-sectional view of the template shown in FIG. 4;

FIG. 6 is a schematic structural view of a metal connection in an embodiment of the present invention;

FIG. 7 is a front view of an interfacial pullout force test specimen provided by an embodiment of the present invention;

FIG. 8 is a side view of an interfacial pull force test specimen provided by an embodiment of the present invention;

fig. 9 is an exemplary illustration of an interface pull force test method provided by an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. Examples of these preferred embodiments are illustrated in the accompanying drawings. The embodiments of the utility model shown in the drawings and described in accordance with the drawings are exemplary only, and the utility model is not limited to these embodiments.

It should be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and/or processing steps closely related to the scheme according to the present invention are shown in the drawings, and other details not so relevant to the present invention are omitted.

The embodiment of the utility model firstly provides a preparation device of an interface drawing force test sample of an adhesive, as shown in fig. 1, the preparation device comprises a lower clamp 10, a substrate 20, a template 30 and an upper clamp 40 which are arranged from bottom to top in sequence, and a locking mechanism is connected between the lower clamp 10 and the upper clamp 40.

Wherein, a mold cavity 31 for containing an adhesive to form a test sample is arranged in the mold plate 30, one end of the mold cavity 31 is communicated to the substrate 20 to enable the formed test sample to be bonded to the substrate 20, the other end of the mold cavity 31 is communicated to the upper clamp 40, and the upper clamp 40 is provided with a first through hole 41 at a position corresponding to the mold cavity 31, and the first through hole 41 is used for injecting the adhesive.

Wherein, the preparation apparatus is further provided with a metal connecting member 50, one end of the metal connecting member 50 is formed into a tip 51, the metal connecting member 50 is inserted into the mold cavity 31 through the first through hole 41, and the tip 51 is in interference connection with the substrate 20.

The lower clamp 10 and the upper clamp 40 are made of hard and high-temperature-resistant materials, such as plates made of stainless steel, aluminum, iron and the like; the material of the template 30 can be a teflon plate; the substrate 20 may be made of hard materials such as copper, PCB, aluminum, and stainless steel, or may be made of brittle materials such as silicon, silicon nitride, and gallium arsenide.

In a preferred embodiment, as shown in fig. 1, a fixing plate 60 is fitted into the first through hole 41, the fixing plate 60 is sized to fit the first through hole 41, a second through hole 61 is provided in the fixing plate 60, the second through hole 61 is sized to fit the metal connecting member 50, and the metal connecting member 50 is inserted into the mold cavity 31 through the second through hole 61. By providing the fixing plate member 60, the position of inserting the metal connecting member 50 into the mold cavity 31 can be defined, and the insertion of the metal connecting member 50 into the mold cavity 31 can be better ensured to be in a central position. Specifically, the material of the fixing plate 60 may be selected from plastic or metal.

In a preferred embodiment, the thickness of the lower jig 10 and the upper jig 40 may be set to be in a range of 4mm to 8mm, the thickness of the template 30 may be set to be in a range of 4mm to 6mm, the thickness of the base plate 20 may be set to be in a range of 0.4mm to 2mm, and the thickness of the fixing plate 60 is set to be identical to the thickness of the upper jig 40.

In a preferred embodiment, the first through hole 41 in the upper jig 40 is a circular through hole, and the diameter thereof may be set in a range of 8mm to 12 mm.

In a preferred embodiment, the width of the top of the mold cavity 31 is set to be in the range of 3mm to 6mm, the width of the bottom of the mold cavity 31 is set to be in the range of 4mm to 8mm, and the height of the mold cavity 31 is set to be in the range of 4mm to 6 mm. Wherein the top width of the cavity 31 is the width between two points farthest from each other in the top of the cavity 31, and the bottom width of the cavity 31 is the width between two points farthest from each other in the bottom of the cavity 31.

In a specific embodiment, referring to fig. 2 and 3, the inner space of the cavity 31a of the die plate 30 has a circular truncated cone shape, the top of which is circular with a diameter of 3mm to 6mm, and the bottom of which is circular with a diameter of 4mm to 8 mm. In another embodiment, referring to fig. 4 and 5, the inner space of the cavity 31b of the mold plate 30 has a quadrangular frustum shape with a top portion having a square shape with a side length of 3mm to 6mm and a bottom portion having a square shape with a side length of 4mm to 8 mm.

In a preferred scheme, the locking mechanism is a detachable threaded fastener, and specifically, referring to fig. 1, four corners of the lower clamp 10 and the upper clamp 40 are respectively provided with a through hole, the threaded fastener comprises a screw rod 71 and a nut 72, and the screw rod 71 passes through the through holes on the corners of the lower clamp 10 and the upper clamp 40 and is matched and locked with the nut 72, so that the purpose of locking each layer structure in the device is achieved.

In a preferred embodiment, referring to fig. 6, the length L of the tip 51 of the metal connecting member 50 is 2mm to 5mm, and the included angle α of the tip 51 is 20 ° to 40 °. It should be noted that the length L of the tip 51 of the metal connecting member 50 is set to be smaller than the height of the mold cavity 31. The metal connecting member 50 may be made of stainless steel, copper, aluminum, or the like.

In a more preferable embodiment, the metal connecting member 50 is a metal sheet structure, the thickness of which is 0.3mm to 1mm, the width of which is 3mm to 5mm, and the length of which can be set according to actual needs.

The device for preparing the interface drawing force test sample of the adhesive can be used for preparing the test sample according to the following steps:

and S1, ultrasonically cleaning the lower clamp 10, the base plate 20, the template 30, the upper clamp 40, the metal connecting piece 50 and the fixed plate 602-3 times by adopting an ethanol solution, and drying for later use.

S2, placing the substrate 20 at the center of the lower jig 10, completely covering the template 30 on the substrate 20, covering the upper jig 40 on the template 30, locking the upper jig 40 and the lower jig 10 by a locking mechanism, so that the substrate 20 and the template 30 are fixedly clamped between the upper and lower jigs, and then placing the assembled manufacturing apparatus on a heating table for preheating.

S3, an appropriate amount of adhesive is injected into the cavity 31 of the mold plate 30 through the first through-hole 41 of the upper jig 40. Care should be taken to avoid spillage of the adhesive as much as possible.

S4, assembling the fixing plate 60 in the first through hole 41, inserting the metal connecting element 50 into the adhesive in the mold cavity 31 through the second through hole 61 in the fixing plate 60, and making the tip 51 of the metal connecting element 50 contact with the substrate 20.

And S5, waiting for the adhesive to be cured (normal temperature curing or heating curing).

And S6, after the adhesive is cured, disassembling the locking mechanism, disassembling the lower clamp 10 and the upper clamp 40, and performing demolding treatment on the template 30, thereby preparing and obtaining an interface drawing force test sample.

Based on the above preparation apparatus and preparation process of the interface drawing force test sample of the adhesive, the interface drawing force test sample of the adhesive is prepared and obtained in the embodiment of the present invention, referring to fig. 7 and 8, the interface drawing force test sample 100 includes a substrate 20, an adhesive pudding die 80 connected to the substrate 20, and a metal connecting member 50 inserted in the adhesive pudding die 80. Referring to the above process steps S3-S5, the adhesive pudding mold 80 is prepared by curing the adhesive to be tested, and the metal connector 50 is inserted into the adhesive pudding mold during the curing process.

The adhesive pudding die 80 has a shape structure identical to the inner space of the die cavity 31, and the bonding interface between the adhesive pudding die 80 and the substrate 20 is an interface to be subjected to a drawing force test; one end of the metal connector 50 is formed as a tip, and the tip of the metal connector 50 is in interference connection with the substrate 20.

The embodiment of the utility model also provides a method for testing the interface drawing force of the adhesive, which comprises the following steps:

s10, preparing the interface pull force test sample (refer to the test samples in fig. 7 and 8) by using the preparation device (refer to the preparation device in fig. 1) according to the above embodiment of the present invention.

And S20, providing a drawing force testing device. Referring to fig. 9, the drawing force testing apparatus includes a sample bonding plate 1, a first jig 2, and a second jig 3. Fixedly connecting the substrate 20 of the interface drawing force test sample 100 to the sample bonding plate 1, clamping the metal connecting piece 50 of the interface drawing force test sample 100 by the first clamp 2, and clamping the sample bonding plate 1 by the second clamp 3.

The sample bonding plate 1 has a T-shaped structure, the substrate 20 of the interfacial drawing force test sample 100 is bonded on the plane of the T-shaped sample bonding plate 1 by another adhesive, and the second clamp 3 clamps the connecting arm of the sample bonding plate 1 in the vertical direction. In selecting the additional adhesive, it is necessary to ensure that the adhesion between the substrate 20 and the sample bonding plate 1 is greater than the adhesion between the substrate 20 and the adhesive pudding die 80.

In a preferred embodiment, the drawing force testing device is further equipped with an oven, and the testing conditions of the drawing force test can be set to be high temperature.

And S30, starting the drawing force testing device, controlling the first clamp 2 and the second clamp 3 to draw along the opposite direction, and recording the drawing force value on the drawing force testing device when the adhesive pudding die 80 is peeled from the substrate 20 to obtain the drawing force parameter.

Specifically, the first clamp 2 is controlled to pull the metal connecting member 50 at a certain pulling rate speed, the pulling force F is gradually increased, and the first clamp 2 automatically stops pulling when the adhesive pudding die 80 is peeled from the base plate 20.

The preparation device for the interface drawing force test sample, the corresponding interface drawing force test sample and the test method provided by the embodiment of the utility model have the following advantages: on one hand, the adhesive pudding die and the substrate only have one connecting interface, so that the bonding strength between the adhesive and the substrate can be more accurately reflected, and the test result is more accurate; on the other hand, the adhesive pudding mold is cured and formed in the mold cavity of the preparation device, is not only suitable for soft adhesives with low fluidity, but also suitable for adhesives which need high-temperature curing and have high fluidity before curing, and the dosage of the adhesives is easy to control, thereby being beneficial to improving the stability of test results; in addition, when the test is carried out, the substrate of the test sample is adhered to the sample adhesion plate with a larger area through the adhesive with larger adhesive force, so that the substrate of the test sample can be selected from hard materials such as copper, a PCB (printed Circuit Board), aluminum, stainless steel and the like, and can also be selected from brittle materials such as silicon, silicon nitride, gallium arsenide and the like, and the test flexibility is improved.

Furthermore, in the embodiment of the utility model, one end of the metal connecting piece is formed into a tip, and is inserted into the adhesive pudding die and is in contact connection with the substrate, so that the metal connecting piece has the following beneficial effects during testing: when a sample is stretched, the metal connecting piece is tightly combined with the pudding mould colloid, the pudding mould colloid is pulled by the metal connecting piece, so that the pudding mould colloid is separated from the substrate, and after the metal connecting piece is prepared into a tip, because the contact area of the tip and the colloid is small, the tensile force borne by the metal connecting piece is mainly behind the contact part (non-tip part) of the metal connecting piece and the colloid, so that the stretching is more stable; if the metal connecting element is not provided with the tip, the head part (corresponding to the tip part) of the metal connecting element is subjected to a large force at the beginning, so that the head part is easily disconnected from the colloid in the stretching process, and the drawing failure is caused.

Example 1

Providing a test sample preparation device as described above in embodiments of the present invention, with reference to fig. 1, 2 and 3, wherein: the lower clamp 10 is a stainless steel plate with the thickness of 4 mm; the upper clamp 40 is a stainless steel plate with the thickness of 4mm, and a circular through hole with the diameter of 10mm is formed in the center; the template 30 is a Teflon plate with the thickness of 6mm and the side length of 20mm, and a die cavity 31 in the template 30 is a round table reverse die (the size is that the diameter of the top is 3mm, the diameter of the bottom is 4mm, and the height is 6 mm); the substrate 20 is a 0.5mm thick silicon nitride substrate with sides of 15mm by 15 mm.

The metal connecting piece 50 is a 304 stainless steel plate with the length of 60mm, the width of 3mm and the thickness of 0.3mm, the height of the tip is 3mm, and the included angle of the tip is 30 degrees.

The fixed plate 60 is a circular stainless steel plate with a diameter of 9mm and a thickness of 4mm, and has a rectangular opening with a length of 4mm and a width of 0.4mm in the center.

Test samples were prepared as follows:

(1) and ultrasonically cleaning the lower clamp 10, the base plate 20, the template 30, the upper clamp 40, the metal connecting piece 50 and the fixed plate 60 by adopting an ethanol solution, and drying for later use.

(2) Placing the silicon nitride substrate 20 at the center of the lower fixture 10, completely covering the template 30 on the substrate 20, covering the upper fixture 40 on the template 30, locking the upper fixture 40 and the lower fixture 10 through a locking mechanism, fixedly clamping the substrate 20 and the template 30 between the upper fixture and the lower fixture, and then placing the assembled preparation device on a heating table for preheating, specifically on a 120 ℃ heating table for heating for 30 min.

(3) And an adhesive to be tested is injected into the mold cavity 31 through the first through hole 41 of the upper jig 40.

(4) The fixing plate 60 is assembled in the first through hole 41, and then the metal connecting piece 50 is inserted into the adhesive in the mold cavity 31 through the second through hole 61 in the fixing plate 60, so that the tip 51 of the metal connecting piece 50 is in interference connection with the substrate 20.

(5) And waiting for the adhesive to be cured, wherein in the embodiment, the adhesive is placed in an oven for heating and curing, the set temperature is 160 ℃, and the time is 120 min.

(6) And after the adhesive is cured, disassembling the locking mechanism, disassembling the lower clamp 10 and the upper clamp 40, and performing demolding treatment on the template 30, thereby preparing and obtaining an interface drawing force test sample.

Based on the above process flow, the interface drawing force test sample a prepared and obtained in this embodiment includes the silicon nitride substrate 20, the adhesive pudding die 80 connected to the silicon nitride substrate 20, and the metal connecting member 50 inserted in the adhesive pudding die 80. The adhesive pudding die 80 is in a circular truncated cone shape, the diameter of the top of the adhesive pudding die is 3mm, the diameter of the bottom of the adhesive pudding die is 4mm, and the height of the adhesive pudding die is 6 mm.

Example 2

This example differs from example 1 in that: in the test sample preparation apparatus, the cavity 31 in the die plate 30 was a square frustum reverse mold (dimensions: top side 3mm, bottom side 4mm, height 6 mm).

The remaining structural features of the device for preparing a test sample in this embodiment are the same as those of embodiment 1, and the process for preparing a test sample is also the same as those of embodiment 1, and therefore, the description thereof is omitted.

An interfacial drawing force test sample B prepared in this embodiment includes a silicon nitride substrate 20, an adhesive pudding die 80 connected to the silicon nitride substrate 20, and a metal connecting member 50 inserted in the adhesive pudding die 80. The adhesive pudding die 80 is in a quadrangular frustum shape, the top side length of the adhesive pudding die is 3mm, the bottom side length of the adhesive pudding die is 4mm, and the height of the adhesive pudding die is 6 mm.

Example 3

This example was conducted for the interfacial drawing force test samples obtained in examples 1 and 2.

Based on the method for testing the interfacial drawing force of the adhesive provided by the embodiment of the utility model, the following three groups of samples are respectively tested by referring to the steps S10 to S30:

(1) a group of test samples a prepared in example 1 was subjected to a drawing force test;

(2) a group of test samples B prepared in example 2 were subjected to a drawing force test;

(3) based on the group of test samples a obtained in example 1, the samples were heated to 80 ℃ in an oven of a drawing force testing apparatus and then kept at the temperature for 5min, and then the drawing force test was performed. This set of samples was designated test sample C.

When the drawing force is tested, the first clamp is controlled to draw the metal connecting piece of the test sample at the speed of 0.5mm/min, the drawing force is gradually increased, and when the adhesive pudding die of the test sample is peeled off from the substrate, the corresponding drawing force value is recorded.

The results of the pull force tests on the above test samples are shown in table 1 below (5 samples were tested for each sample).

Table 1:

sample (I)	Mean value (N)	Mean square error (N)
			Test sample A	62.6	1.5
Test sample B	48.5	1.2
			Test sample C	21.3	0.7

Based on the peel interface of the pullout force test procedure and the test data in table 1, it can be seen that: according to the preparation device of the test sample and the test sample prepared by the preparation device, the peeling interface between the adhesive layer and the substrate is clean and flat, the fracture path is a bonding interface, the mean square error of the test result is small, the data stability is good, and the accuracy is high.

In summary, the preparation apparatus for the interfacial drawing force test sample and the corresponding interfacial drawing force test sample provided by the embodiments of the present invention: on one hand, the adhesive pudding die and the substrate only have one connecting interface, so that the bonding strength between the adhesive and the substrate can be more accurately reflected, and the test result is more accurate; on the other hand, the adhesive pudding mold is cured and formed in the mold cavity of the preparation device, is not only suitable for soft adhesives with low fluidity, but also suitable for adhesives which need high-temperature curing and have high fluidity before curing, and the dosage of the adhesives is easy to control, thereby being beneficial to improving the stability of test results.

The foregoing is directed to embodiments of the present application and it is noted that numerous modifications and adaptations may be made by those skilled in the art without departing from the principles of the present application and are intended to be within the scope of the present application.

Claims

1. The preparation device of the interface drawing force test sample of the adhesive is characterized by comprising a lower clamp, a base plate, a template and an upper clamp which are sequentially arranged from bottom to top, wherein a locking mechanism is connected between the lower clamp and the upper clamp; a mold cavity used for containing an adhesive to form a test sample is arranged in the template, one end of the mold cavity is communicated to the substrate so that the formed test sample is bonded to the substrate, the other end of the mold cavity is communicated to the upper clamp, the upper clamp is provided with a first through hole at a corresponding position, and the first through hole is used for injecting the adhesive; the manufacturing device is further provided with a metal connecting piece, one end of the metal connecting piece is formed into a tip, the metal connecting piece is inserted into the die cavity through the first through hole, and the tip is connected with the substrate in an abutting mode.

2. The manufacturing apparatus as set forth in claim 1, wherein a fixing plate member is fitted in said first through hole, said fixing plate member having a size fitting said first through hole, said fixing plate member having a second through hole provided therein, said second through hole having a size fitting said metal connecting member, said metal connecting member being inserted into said mold cavity through said second through hole.

3. The manufacturing apparatus according to claim 1, wherein the top width of the cavity is 3mm to 6mm, the bottom width of the cavity is 4mm to 8mm, and the height of the cavity is 4mm to 6 mm; wherein the top width of the mold cavity refers to a width between two points farthest away in the top of the mold cavity, and the bottom width of the mold cavity refers to a width between two points farthest away in the bottom of the mold cavity.

4. The manufacturing apparatus according to claim 3, wherein the inner space of the cavity of the die plate has a shape of a circular truncated cone or a quadrangular frustum.

5. A manufacturing apparatus as set forth in any one of claims 1-4 wherein the tip of said metal connecting member has a length of 2mm to 5mm and an included angle of 20 ° to 40 ° with respect to the tip.

6. The manufacturing apparatus as set forth in claim 5, wherein the metal connecting member is a metal sheet structure having a thickness of 0.3mm to 1mm and a width of 3mm to 5 mm.

7. An interface drawing force test sample of an adhesive is characterized by comprising a substrate, an adhesive pudding die connected to the substrate and a metal connecting piece inserted in the adhesive pudding die; the adhesive pudding die is an adhesive pudding die formed by an adhesive to be tested through a curing process, the metal connecting piece is inserted into the adhesive pudding die in the curing process, and a bonding interface of the adhesive pudding die and the substrate is an interface to be subjected to a drawing force test; one end of the metal connecting piece is formed into a tip, and the tip of the metal connecting piece is connected with the substrate in an abutting mode.

8. The interfacial drawing force test specimen according to claim 7, wherein the width of the top of the adhesive pudding die is 3mm to 6mm, the width of the bottom of the adhesive pudding die is 4mm to 8mm, and the height of the adhesive pudding die is 4mm to 6 mm; the width of the top of the adhesive pudding die is the width between two points which are farthest away in the top of the adhesive pudding die, and the width of the bottom of the adhesive pudding die is the width between two points which are farthest away in the bottom of the adhesive pudding die.

9. The interfacial drawing force test specimen according to claim 7 or 8, wherein the length of the tip of the metal connecting member is 2mm to 5mm, and the included angle of the tip is 20 ° to 40 °.

10. The interfacial drawing force test specimen according to claim 9, wherein the metal connecting member is a metal sheet structure having a thickness of 0.3mm to 1mm and a width of 3mm to 5 mm.