CN115753273A - Method for preparing sample by gluing ultrathin metal sheet - Google Patents
Method for preparing sample by gluing ultrathin metal sheet Download PDFInfo
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- CN115753273A CN115753273A CN202211336503.7A CN202211336503A CN115753273A CN 115753273 A CN115753273 A CN 115753273A CN 202211336503 A CN202211336503 A CN 202211336503A CN 115753273 A CN115753273 A CN 115753273A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
Abstract
The invention provides a method for preparing a sample by gluing an ultrathin metal plate, which comprises the following steps: step S1, processing two ultrathin metal plates into a size of a sticky sample, and wiping the surfaces of the two ultrathin metal plates by using an organic solvent; s2, selecting and processing the bottom plates, and fixing the two ultrathin metal plates on the two bottom plates to obtain two plates serving as an upper plate and a lower plate; s3, wiping the surface of the ultrathin metal plate by using an organic solvent; s4, scribing a line on the surface of the ultra-thin metal plate of the lower plate to determine a gluing area and a gluing area; step S5, covering the gluing area except the gluing area by using a non-stick glue film, and extending to two side surfaces of the covering bottom plate; s6, injecting an adhesive into the adhesive coating area under the assistance of the non-adhesive film on the upper layer; s7, coating uniform adhesive, and removing the non-adhesive film on the upper layer; s8, assembling the ultrathin metal plates of the upper plate and the lower plate into an adhesive joint in an adhesive area in a butt joint mode and fixing the adhesive joint by using a chuck; and S9, cleaning the overflowing adhesive, and then curing to finish sample preparation.
Description
Technical Field
The invention relates to the field of scientific research test methods, in particular to a method for preparing a sample by gluing an ultrathin metal plate.
Background
The hydrogen fuel cell is a novel energy conversion device, is clean and pollution-free, meets the requirement of double carbon and has wide application prospect. The ultrathin bipolar plate is used as a core component in a hydrogen fuel cell stack, the sealing performance of the ultrathin bipolar plate is critical to the energy conversion and the service life of the cell, and the existing polar plate sealing mainly adopts an adhesive process. The existing products and the developed metal bipolar plate materials relate to multi-metal alloys such as stainless steel, titanium, aluminum, nickel and the like, the mechanical strength and the sealing performance of different adhesives are different, and in order to research the adhesive sealing performance of the fuel cell bipolar plate, the adhesive performance test of the ultrathin metal plate needs to be widely carried out.
The thin plate has low mechanical properties due to its extremely thin thickness, resulting in poor sample preparation and test operability. When the performance tests such as shearing, stretching, compressing and the like are carried out, the problems that the plate is easy to damage, the plate is difficult to clamp, the plate is easy to bend and the like exist. Therefore, a special method is required for the thin plate test, and the existing patents also relate to the thin plate test method.
In patent CN110039461A, xu pine et al have designed a portable metal sheet clamping device for solving the problem of fixing the metal sheet during processing; in patent CN103163019A, chenw et al designs a special fixture for a tensile test of a metal sheet or a metal foil, and solves the problem that the existing fixture is not adapted in the tensile test of an ultra-thin metal sheet aiming at a sheet material with a thickness of less than 1 mm; patent CN 216433724U designs a clamp for small-sized composite sheet shear test. The problem that the existing small-size composite sheet cannot be clamped when a shearing experiment is carried out is solved; a normal loading thin plate micro-tensile test device and method are designed in a patent CN114323949A, and the technical problem that the existing normal loading thin plate micro-tensile mechanical property is blank is solved; patent CN113959847A discloses a method for testing sheet metal compression and a method for judging effectiveness of sample installation, which solves the problems of judging conditions and methods for effectiveness of sheet metal compression test.
The above patents mainly aim at the clamping problem when the metal sheet is subjected to material processing and mechanical property testing, and the thickness limitation of each patent to the metal sheet is different and not uniform.
The existing method for preparing the sample by gluing the metal plate is poor in applicability to the metal sheet, particularly to the metal ultrathin sheet with the thickness of less than 0.2mm. In the existing method for preparing the sample by gluing the metal plate, the gluing area of the gluing joint is arranged at the end part of the plate and is not suitable for the gluing test of the ultra-thin metal plate: the strength of the metal ultrathin plate is low, the corresponding adhesive area is small, if the end part is still coated with adhesive, the joint is not easy to fix, the adhesive coating operation is difficult, and the adhesive area error is large; on the other hand, when the metal plate is thin (especially the metal foil with the thickness of less than 0.2 mm), the adhesive sample joint is easy to cause irreversible damage to the metal thin plate when being manufactured, for example, the fixed chuck generates indentation on the plate material and even directly destroys the metal ultrathin plate; in addition, the glue layer thickness control and the glue flow limitation of the metal ultrathin plate joint have the particularity; the problem of curling and deforming of the ultra-thin metal sheet also exists when the adhesive joint is subjected to curing operation; when the joint is subjected to tensile test, the stress state of the joint glue layer can be changed into the condition of shearing and stripping coupling due to the clamping problem of the ultrathin metal plate, so that accurate adhesion performance cannot be obtained. These problems limit the extensive testing of the adhesion properties of the ultra-thin metal sheets, and the existing experimental methods and patents do not propose an effective adhesion testing method to solve the adhesion problem of the ultra-thin metal sheets.
Disclosure of Invention
The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for preparing a sample by adhering an ultrathin metal sheet.
The invention provides a method for preparing a sample by gluing an ultrathin metal plate, which is characterized by comprising the following steps of: step S1, processing two ultrathin metal plates into a size of an adhesive sample, and wiping the surfaces of the ultrathin metal plates by using an organic solvent;
s2, selecting a bottom plate meeting the thickness requirement, processing the bottom plate into the same size of the ultrathin metal plates, fixing the two ultrathin metal plates on the two bottom plates respectively, and obtaining two plate materials after fixing to be used as an upper plate and a lower plate respectively;
s3, wiping the surface of the ultrathin metal plate by using an organic solvent;
s4, marking lines on the surface of the ultra-thin metal plate of the lower plate to determine a gluing area and a gluing area, wherein the gluing area is positioned in the gluing area;
s5, using two non-adhesive films to cling to adhesive areas outside the covering and gluing areas and extend to two side surfaces of the covering bottom plate;
step S6, covering an upper non-adhesive film on the two non-adhesive films, and injecting an adhesive into the adhesive coating area under the assistance of the upper non-adhesive film;
s7, after the adhesive is uniformly coated, removing the non-adhesive film on the upper layer;
s8, assembling the ultrathin metal sheets of the upper plate and the lower plate into an adhesive joint in a butt joint mode in an adhesive area and fixing the adhesive joint by using a chuck;
and S9, after the overflowed adhesive is cleaned, curing the adhesive to finish sample preparation.
The method for preparing the sample by gluing the ultrathin metal plate, provided by the invention, can also have the following characteristics: wherein, the thickness of the metal ultrathin plate is less than 0.2mm.
The method for preparing the sample by gluing the ultrathin metal plate, provided by the invention, can also have the following characteristics: wherein the size of the adhesive sample was 100mm × 25mm.
The method for preparing the sample by gluing the ultrathin metal plate, provided by the invention, can also have the following characteristics: wherein, the bottom plate and the non-adhesive film are made of acid-base resistant and high-temperature resistant materials.
The method for preparing the sample by gluing the ultrathin metal plate, provided by the invention, can also have the following characteristics: wherein, the thickness requirement of the bottom plate in the step S2 is obtained by limiting the bending rigidity of the bottom plate, and the method comprises the following substeps:
step S2-1, taking the thickness delta 0 =1mm flexural rigidity of test sheet as comparison flexural rigidity K 0 ，K 0 ＝E 0 I 0 ，E 0 To test the Young's modulus of the panels, I 0 In order to test the moment of inertia of the slab,
step S2-2, bending rigidity K of bottom plate x The flexural rigidity K of the steel sheet is higher than that of the reference 0 According to K x ≥K 0 To obtain the thickness delta of the base plate x The calculation formula of (c) is as follows:
in the formula (1), E 0 For testing the Young modulus of the plate, the unit is MPa, E x Young's modulus of the base plate in MPa.
The method for preparing the sample by gluing the ultrathin metal plate, provided by the invention, can also have the following characteristics: in step S3, after the surface of the ultrathin metal sheet is wiped with an organic solvent, the ultrathin metal sheet is subjected to surface treatment or not according to the use requirement.
The method for preparing the sample by gluing the ultrathin metal plate, provided by the invention, can also have the following characteristics: wherein, step S4 includes the following substeps:
s4-1, when scribing is carried out on the surface of the ultrathin metal sheet of the lower plate, the gluing area is positioned at one side end of the surface of the ultrathin metal sheet, and the distance between the starting line of the gluing area and the end part of the ultrathin metal sheet is 10mm;
s4-2, determining the size of the gluing area to be 25mm multiplied by 25mm, determining the length of the gluing area to be 25mm, determining the width of the gluing area through a single-drawing experiment of the ultrathin metal sheet, and obtaining the tensile strength sigma of the ultrathin metal sheet through a tensile test x Then according to the normal temperature shearing strength sigma of the adhesive Glue According to F x ≥F Glue To obtain the theoretical maximum adhesive width d max The calculation formula of (a) is as follows:
in the formula (2), δ Measuring The actual thickness of the metal ultrathin plate is taken as the unit mm, and the actual gluing width d is taken 0 <d max Finally determining the width d of the glue application area 0 。
The method for preparing the sample by gluing the ultrathin metal plate, provided by the invention, can also have the following characteristics: wherein, the thickness of the non-stick film is the same as that of the glue layer in the glue coating area.
The method for preparing the sample by gluing the ultrathin metal plate, provided by the invention, can also have the following characteristics: in step S6, the upper layer of non-stick film is provided with a strip-shaped through opening corresponding to the glue coating area, and during glue coating, the strip-shaped through opening is correspondingly arranged above the glue coating area, and an adhesive is injected into the glue coating area through the strip-shaped through opening.
Action and effects of the invention
According to the method for preparing the adhesive sample of the ultrathin metal plate, the ultrathin metal plate with the thickness dimension smaller than 0.2mm is fixed on the bottom plate with a certain thickness, so that certain rigidity and strength are provided for the sample, the operability of adhesive sample preparation is ensured, the damage to a metal material in the operation process is avoided, and the correct stress of the sample in the subsequent shearing test process is ensured; in addition, the material used by the bottom plate and the material used by the film are better material attribute selection considering the possible surface treatment before the metal ultrathin plate is adhered and the curing environment of the adhesive; in addition, the gluing area is determined by marking at a position 10mm away from the end part, so that the method is more suitable for gluing the ultrathin metal sheet with a narrower gluing area; meanwhile, the invention uses the non-adhesive film to limit the adhesive area and replace the commonly used glass beads to control the thickness of the adhesive layer, thereby being more suitable for the adhesive test sample preparation of the metal ultrathin plate. Therefore, the method for preparing the ultra-thin metal sheet adhesive sample solves the problems of the ultra-thin metal sheet adhesive test that the operation of the ultra-thin metal sheet adhesive is difficult, the thickness of an adhesive layer is difficult to control, a metal substrate is easy to damage, the curing process is easy to curl and the like, ensures the smooth operation of the ultra-thin metal sheet adhesive sample preparation and the subsequent test, and provides the sample preparation method with strong applicability and good operability for the test of the ultra-thin metal sheet adhesive property.
Drawings
FIG. 1 is a schematic flow chart of a method for preparing a sample by gluing an ultra-thin metal plate according to an embodiment of the present invention;
FIG. 2 is a schematic view of the structure of the lower plate in the embodiment of the present invention;
FIG. 3 is a schematic representation of bond line thickness before compression when the upper and lower plates are adhesively bonded together in an embodiment of the invention;
FIG. 4 is a schematic illustration of bond line thickness after compression when the upper and lower plates are adhesively bonded together in an embodiment of the invention;
FIG. 5 is a schematic illustration of an embodiment of the present invention in which an upper non-stick film is used to assist in applying glue;
fig. 6 is a schematic view of the upper and lower plates after completion of the adhesive joint and curing in an embodiment of the present invention.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the following embodiments are specifically explained in the following with the attached drawings.
< example >
In this embodiment, the thickness δ Metal And (3) gluing the metal Ti ultrathin plate with the thickness of 0.1mm to prepare a sample, wherein the adhesive is high-temperature curing adhesive DB392.
FIG. 1 is a schematic flow chart of a method for preparing a sample by gluing an ultrathin metal plate in an embodiment of the invention.
As shown in fig. 1, the method for preparing a sample by gluing an ultra-thin metal plate of the embodiment includes the following steps:
step S1, processing two metal Ti ultrathin plates into a size of a sticky sample, and wiping the surfaces of the metal Ti ultrathin plates by alcohol.
In this embodiment, the cleaning of the surface of the ultra-thin metal Ti plate with alcohol or other organic solvent is performed to ensure the fixing strength between the ultra-thin metal plate and the bottom plate, so as to prevent the ultra-thin metal plate from being debonded from the bottom plate in the subsequent operation.
The size of the glued sample is 100mm by 25mm.
And S2, selecting a bottom plate meeting the thickness requirement, processing the bottom plate into the same size of the ultrathin metal plates, fixing the two ultrathin metal plates on the two bottom plates respectively, and obtaining two plates after fixing to be used as an upper plate and a lower plate respectively.
The material of the bottom plate needs to be selected by considering the curing condition of the adhesive and the operation environment related to the subsequent test, and the material with heat resistance and acid and alkali resistance is selected; in addition, the non-metallic material is selected to reduce the influence of electrochemical corrosion. In this embodiment, teflon is selected as the material of the bottom plate.
In step S2, the thickness of the base plate is required to be obtained by limiting the bending stiffness of the base plate, and the method comprises the following substeps:
step S2-1, taking the thickness delta 0 =1mm flexural rigidity of test sheet as comparison flexural rigidity K 0 ，K 0 ＝E 0 I 0 ，E 0 To test the Young's modulus of the panels, I 0 In order to test the moment of inertia of the slab,
step S2-2, flexural rigidity K of base plate x The flexural rigidity K is required to be higher than the contrast 0 According to K x ≥K 0 To obtain the thickness delta of the base plate x The calculation formula of (c) is as follows:
in the formula (1), E 0 To test the Young's modulus of the plate, units MPa, E x Young's modulus of the base plate in MPa.
In this embodiment, the Young's moduli of the metal Ti ultrathin plate and the polytetrafluoroethylene-made base plate are respectively E Ti ＝1.08×10 5 MPa、E PTFE ＝0.5×10 3 MPa；
Calculating according to a calculation formula of the thickness of the bottom plate:
to obtain delta PTFE Not less than 5.99mm, therefore, the thickness delta of the bottom plate is selected in the embodiment PTFE A polytetrafluoroethylene sheet of =8mm as a bottom sheet to provideCertain rigidity and strength, and good corrosion resistance and high temperature resistance are ensured.
The fixed connection mode of the metal ultrathin plate and the bottom plate is adhesive or mechanical connection.
In this embodiment, the double-sided adhesive is selected for fixing, and when the double-sided adhesive is selected, it is also required to consider that the working temperature of the double-sided adhesive is higher than the curing temperature of the used adhesive and the thermal influence temperature brought by the ultra-thin metal plate during surface treatment, so as to avoid the ultra-thin metal plate and the bottom plate from being debonded due to the subsequent steps (surface treatment and adhesive curing). Therefore, the working temperature of the polyimide high-temperature double-sided tape selected by the embodiment is higher than the curing temperature of the adhesive high-temperature curing adhesive DB392.
And step S3, wiping the surface of the ultrathin metal plate by using alcohol.
In step S3, after the surface of the ultrathin metal sheet is wiped with an organic solvent, the ultrathin metal sheet is subjected to surface treatment or not according to the use requirement. The surface treatment includes laser, plasma, and the like, and the surface treatment is not performed in this embodiment.
In step S1 and step S3, the ultra-thin metal plate may be wiped with one or more organic solvents such as alcohol.
And S4, scribing lines on the surface of the ultra-thin metal plate of the lower plate to determine a gluing area and a gluing area, wherein the gluing area is positioned in the gluing area.
The step S4 comprises the following substeps:
step S4-1, as shown in FIG. 2, when scribing is performed on the surface of the ultra-thin metal plate of the lower plate, the gluing area is located at one side end of the surface of the ultra-thin metal plate, and the distance from the starting line of the gluing area to the end of the ultra-thin metal plate is 10mm;
and S4-2, determining the size of the gluing area to be 25mm multiplied by 25mm, determining the length of the gluing area to be 25mm, and determining the width of the gluing area through a single-drawing experiment of the ultrathin metal sheet.
In this example, the tensile strength σ of the ultra-thin metal sheet was obtained by performing a tensile test x =365MPa, shear strength σ according to DB392 Glue =10MPa to 12MPa, according to the theoretical maximum adhesive width d max Is calculated by the calculation formula of (c):
to obtain d max Less than or equal to 3.04mm, and taking the actual adhesive width d 0 <d max Finally determining the width d of the glue application area 0 =3mm, the dimensions of the glue application area are determined to be 3mm x 25mm.
Fig. 2 is a schematic view of the structure of the lower plate in the embodiment of the present invention.
As shown in fig. 2, in this embodiment, the size of the base plate 1 and the size of the ultra-thin metal plate 2 are both 100mm × 25mm, the base plate 1 and the ultra-thin metal plate 2 are fixedly connected by the connection layer 3 formed by the double-sided tape, the upper surface of the ultra-thin metal plate 2 is divided into the gluing area 21 (25 mm) in the length direction, the gluing area 21 includes the gluing area 22, the middle section 23 (50 mm) and the stretching and holding section 24 (25 mm), and the starting line of the gluing area is 10mm away from the end of the ultra-thin metal plate.
And S5, tightly adhering the two non-adhesive films to the adhesive area outside the covering adhesive area and extending to the two side surfaces of the covering bottom plate.
The non-stick film is made of a heat-resistant, acid-base resistant non-stick material. In this embodiment, the non-adhesive film is made of polytetrafluoroethylene, has heat resistance, acid resistance and alkali resistance, and can effectively prevent the adhesive from contacting the non-adhesive region. Meanwhile, the thickness of the non-adhesive film is 0.05mm, and is consistent with the thickness of the required adhesive layer in the adhesive coating area.
The thickness of the non-stick film is the same as that of the glue layer in the glue coating area, and the thickness of the glue layer in the glue coating area can be controlled according to the thickness of the used non-stick film, and the principle is as follows:
fig. 3 is a schematic view showing the thickness of a bond line before pressing when the upper and lower plates are adhesively bonded to each other in the embodiment of the present invention, and fig. 4 is a schematic view showing the thickness of a bond line after pressing when the upper and lower plates are adhesively bonded to each other in the embodiment of the present invention.
As shown in fig. 3 and 4, the clamping force F is applied when the upper and lower plates are adhesively bonded Clamping of The stability of the joint structure before the glue layer is cured is ensured; non-stick film 4 and clamping force F Clamping of Similar to the seal and sealing force: at a clamping force F Clamping of Under the action, after the joint structure is pressed, the compression amount of the non-adhesive film 4 is delta l, a sealing interface is formed between the ultra-thin metal plate 2 and the non-adhesive film 4, and the situation that the adhesive cannot overflow out of a marking area and only can overflow from two sides of the joint and be cleaned up is ensured; in addition, the bond line thickness δ after compression of the joint Glue The thickness of the non-stick adhesive film is consistent with the thickness (l-delta l) of the non-stick adhesive film after being pressed, and the thickness control of the adhesive layer is realized.
The selection process of the thickness of the non-adhesive film is as follows: determining the thickness requirement delta of the glue layer Glue And clamping force F for fixing the joint Clamping of And according to the requirement that the thickness of the deformed film is equal to the thickness of the glue layer and the compression deformation mechanical equation of the film:
δ glue ＝l-Δl (3)
E Film ε Film ＝σ (4)
In formulas (3) to (5), a = a × (b) Glue joint -d 0 ) Force area of the non-stick film, E Film The Young modulus of the non-adhesive film is in unit MPa;
the relation between the initial thickness of the non-adhesive film and the thickness of the adhesive layer is obtained as follows:
analysis was performed due to the clamping force F Clamping of ＜＜E Film A, the following formula is obtained:
l≈δ glue (7)
In summary, the non-adhesive film with the same adhesive layer thickness requirement is selected, i.e., l ≈ δ Glue And the thickness of the adhesive layer is controlled and the overflow is limited.
And S6, covering an upper non-adhesive film on the two non-adhesive films, and injecting an adhesive into the adhesive coating area under the assistance of the upper non-adhesive film.
Fig. 5 is a schematic diagram of the application of an upper layer of non-stick film to assist in applying adhesive in an embodiment of the present invention.
As shown in fig. 5, during the glue spreading in step S6, the upper layer of non-adhesive film 5 is placed above the two non-adhesive films 4 to assist in glue spreading, the upper layer of non-adhesive film 5 is provided with strip-shaped through holes corresponding to the glue spreading region, during the glue spreading, the strip-shaped through holes are correspondingly placed above the glue spreading region, and the adhesive is injected into the glue spreading region through the strip-shaped through holes, so as to achieve the function of controlling the overflow of the glue. The upper layer non-stick film 5 is only used in the gluing operation process and can be reused, so that the situation that glue overflows between the non-stick film 4 and a lower plate to influence the thickness control of the glue layer because the glue is coated on the upper surface of the non-stick film 4 during manual gluing is prevented.
In this embodiment, the amount of the adhesive needs to be controlled to ensure that a small amount of the adhesive overflows after the joint is clamped.
And S7, uniformly coating the adhesive, and removing the non-adhesive film on the upper layer.
And S8, assembling the ultrathin metal sheets of the upper plate and the ultrathin metal sheets of the lower plate in a butt joint mode in a gluing area to form a glue joint, and fixing the glue joint with a chuck or a special clamp.
And S9, after cleaning the overflowing adhesive, curing the adhesive to complete sample preparation.
The method for preparing the adhesive sample of the metal ultrathin plate successfully completes the adhesive sample preparation of the metal Ti ultrathin plate, solves the problem of difficult sample preparation operation in the test of the adhesive property of the metal Ti ultrathin plate with the thickness of 0.1mm, and is also suitable for samples which need to be subjected to laser treatment or plasma surface treatment before adhesion.
Fig. 6 is a schematic view of the upper and lower plates after completion of the adhesive joint and curing in an embodiment of the present invention.
As shown in fig. 6, the upper plate and the lower plate complete the adhesive joint in the adhesive area, the thickness of the adhesive layer in the adhesive area 22 can be controlled by the non-adhesive film 4, the non-adhesive film 4 is tightly attached to the side surfaces of the ultra-thin metal plate 2 and the bottom plate 1 to cover, and after the joint is clamped tightly, a sealing interface is formed between the ultra-thin metal plate 2 and the non-adhesive film 4, so that the adhesive can be ensured not to overflow out of the marking area, and only can overflow from the two sides of the joint and be cleaned up. Meanwhile, the bottom plate 1 provides certain rigidity and strength, damage to the ultrathin metal plate 2 in the operation process is avoided, and smooth proceeding of gluing and sample preparation of the ultrathin metal plate is guaranteed.
Effects and effects of the embodiments
According to the method for preparing the adhesive sample of the ultrathin metal plate, the ultrathin metal plate with the thickness of less than 0.2mm is fixed on the bottom plate with a certain thickness, so that certain rigidity and strength are provided for the sample, the operability of the adhesive sample preparation is ensured, the damage to the metal material in the operation process is avoided, and the correct stress of the sample in the subsequent shearing test process is ensured; in addition, the material used for the bottom plate and the material used for the film in the embodiment are both selected with better material properties in consideration of possible surface treatment and curing environment of the adhesive before the metal ultrathin plate is adhered; in addition, the gluing area of the embodiment is determined by marking lines at a position 10mm away from the end part, and the method is more suitable for gluing the ultrathin metal plate with a narrow gluing area; meanwhile, the non-adhesive film is used for limiting the adhesive area in the embodiment, the thickness of the adhesive layer is controlled by replacing the commonly used glass beads, and the method is more suitable for preparing an adhesive test sample of the ultrathin metal sheet. Therefore, the method for preparing the ultra-thin metal sheet adhesive sample solves the problems of the ultra-thin metal sheet adhesive test that the operation of the ultra-thin metal sheet adhesive is difficult, the thickness of an adhesive layer is difficult to control, a metal substrate is easy to damage, the curing process is easy to curl and the like, ensures the smooth operation of the ultra-thin metal sheet adhesive sample preparation and the subsequent test, and provides a sample preparation method with strong applicability and good operability for the test of the ultra-thin metal sheet adhesive property.
The above embodiments are preferred examples of the present invention, and are not intended to limit the scope of the present invention.
Claims (9)
1. An ultrathin metal sheet gluing sample preparation method is characterized by comprising the following steps:
step S1, processing two ultrathin metal plates into a size of an adhesive sample, and wiping the surfaces of the ultrathin metal plates by using an organic solvent;
s2, selecting a bottom plate meeting the thickness requirement, processing the bottom plate into the same size of the ultrathin metal plates, fixing the two ultrathin metal plates on the two bottom plates respectively, and obtaining two plate materials after fixing to be used as an upper plate and a lower plate respectively;
s3, wiping the surface of the ultrathin metal plate by using an organic solvent;
s4, scribing lines on the surface of the ultrathin metal sheet of the lower plate to determine a gluing area and a gluing area, wherein the gluing area is positioned in the gluing area;
s5, using two non-adhesive films to cling to and cover the adhesive area outside the adhesive coating area and extend to cover two side surfaces of the bottom plate;
step S6, covering an upper non-adhesive film on the two non-adhesive films, and injecting an adhesive into the adhesive coating area under the assistance of the upper non-adhesive film;
s7, uniformly coating the adhesive, and removing the non-adhesive film on the upper layer;
s8, assembling the ultrathin metal sheets of the upper plate and the lower plate into an adhesive joint in a butt joint mode in the adhesive area and fixing the adhesive joint by using a chuck;
and S9, after the overflowed adhesive is cleaned, curing the adhesive to finish sample preparation.
2. The method for preparing the ultra-thin metal plate sample by gluing as claimed in claim 1, wherein:
wherein, the thickness of the metal ultrathin plate is less than 0.2mm.
3. The method for preparing the ultra-thin metal plate sample by gluing as claimed in claim 1, wherein:
wherein the size of the adhesive sample is 100mm × 25mm.
4. The method for preparing the ultra-thin metal plate sample by gluing as claimed in claim 1, wherein:
the base plate and the non-adhesive film are both made of acid-base-resistant and high-temperature-resistant materials.
5. The method for preparing the ultra-thin metal plate sample by gluing as claimed in claim 1, wherein:
wherein the thickness requirement of the base plate in step S2 is obtained by limiting the bending stiffness of the base plate, and the method comprises the following substeps:
step S2-1, taking the thickness delta 0 Bending stiffness of test panel of =1mm as control bending stiffness K 0 ，K 0 ＝E 0 I 0 ，E 0 For the Young's modulus, I, of the test panels 0 In order to test the moment of inertia of the slab,
step S2-2, bending rigidity K of the bottom plate x Needs to be greater than the reference bending stiffness K 0 According to K x ≥K 0 To obtain the thickness delta of the base plate x The calculation formula of (c) is as follows:
in the formula (1), E 0 For testing the Young modulus of the plate, the unit is MPa, E x Is the young's modulus of the base plate in units MPa.
6. The method for preparing the ultra-thin metal plate sample by gluing as claimed in claim 1, wherein:
in step S3, after the surface of the ultra-thin metal plate is wiped with an organic solvent, the ultra-thin metal plate may be subjected to surface treatment or not according to the use requirement.
7. The method for preparing a sample by gluing an ultrathin metal plate as claimed in claim 1, wherein the method comprises the following steps:
wherein, step S4 includes the following substeps:
s4-1, when the surface of the ultrathin metal sheet of the lower plate is scribed, the adhesive area is positioned at one side end of the surface of the ultrathin metal sheet, and the distance between the starting line of the adhesive area and the end part of the ultrathin metal sheet is 10mm;
s4-2, determining the size of the gluing area to be 25mm multiplied by 25mm, determining the length of the gluing area to be 25mm through a single-drawing experiment of the ultrathin metal sheet, and obtaining the tensile strength sigma of the ultrathin metal sheet through a tensile test x Then according to the normal temperature shearing strength sigma of the adhesive Glue According to F x ≥F Glue To obtain the theoretical maximum adhesive width d max The calculation formula of (c) is as follows:
in the formula (2), δ Measuring Taking the actual gluing width d as the actual thickness of the ultrathin metal sheet in mm 0 <d max Finally determining the width d of the glue application area 0 。
8. The method for preparing a sample by gluing an ultrathin metal plate as claimed in claim 1, wherein the method comprises the following steps:
and the thickness of the non-adhesive film is the same as that of the adhesive layer of the adhesive coating area.
9. The method for preparing a sample by gluing an ultrathin metal plate as claimed in claim 1, wherein the method comprises the following steps:
in step S6, the upper non-stick film is provided with a strip-shaped through opening corresponding to the gluing area, and during gluing, the strip-shaped through opening is correspondingly arranged above the gluing area, and the adhesive is injected into the gluing area through the strip-shaped through opening.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117030410A (en) * | 2023-10-10 | 2023-11-10 | 北京科技大学 | Preparation method of ultrathin metal material metallographic sample |
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| CN117030410A (en) * | 2023-10-10 | 2023-11-10 | 北京科技大学 | Preparation method of ultrathin metal material metallographic sample |
| CN117030410B (en) * | 2023-10-10 | 2023-12-15 | 北京科技大学 | Preparation method of ultrathin metal material metallographic sample |
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