CN114206013A - Manufacturing method of stepped circuit board - Google Patents
Manufacturing method of stepped circuit board Download PDFInfo
- Publication number
- CN114206013A CN114206013A CN202111480607.0A CN202111480607A CN114206013A CN 114206013 A CN114206013 A CN 114206013A CN 202111480607 A CN202111480607 A CN 202111480607A CN 114206013 A CN114206013 A CN 114206013A
- Authority
- CN
- China
- Prior art keywords
- film
- copper
- chemical reaction
- etching
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052802 copper Inorganic materials 0.000 claims abstract description 36
- 239000010949 copper Substances 0.000 claims abstract description 36
- 238000005530 etching Methods 0.000 claims abstract description 22
- 238000003825 pressing Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000010030 laminating Methods 0.000 claims abstract description 9
- 238000005553 drilling Methods 0.000 claims abstract description 8
- 238000004381 surface treatment Methods 0.000 claims abstract description 4
- 239000010408 film Substances 0.000 claims description 40
- 238000006243 chemical reaction Methods 0.000 claims description 24
- 239000002313 adhesive film Substances 0.000 claims description 19
- 230000001681 protective effect Effects 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 10
- 239000013039 cover film Substances 0.000 claims description 6
- 239000003814 drug Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims 2
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000003475 lamination Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Abstract
The invention provides a manufacturing method of a step circuit board, which comprises the steps of 1, drilling, 2, film pasting, 3, exposure, 4, development, 5, etching, 6, film stripping, 7, bottom layer covering film laminating, 8, bottom layer covering film pressing, 9, film pasting, 10, exposure, 11, development, 12, etching, 13, film stripping, 14, top layer covering film laminating, 15, top layer covering film pressing, 16, surface treatment, 17 and characters. The invention has the beneficial effects that the etching copper reduction method is adopted to realize the step forming, the customer requirements are effectively met, the lamination process is smooth, the layering risk of the covering film is improved, and the yield is improved.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a manufacturing method of a stepped circuit board.
Background
At present, the method for producing the step line in the industry is to produce the step line by a layer increasing process.
The step line production process in the industry: cutting material → drilling hole → exposing → developing → selecting and plating pattern → removing film → exposing → developing → etching → cleaning → laminating film → surface processing till the finished product is delivered.
Above traditional process flow is by current density and time completion when the figure selection plates thickening copper, accomplishes that high ladder needs long-time electroplating, is influenced by current density, and the long-time work can appear that pinch point region thickness and the board in the middle of the thickness inhomogeneous leads to that the back process circuit etching is difficult to manage and control, and the pressfitting covers the regional layering of step. Customers have special requirements on copper thickness, line width, line distance resistance and impedance, and need to select individually, and tested products are delivered to the customers, so that the cost of manpower and material resources is increased, and the yield is low.
Disclosure of Invention
The invention provides a method for manufacturing a step circuit board, which comprises the following steps:
step 1, drilling: drilling alignment holes in the copper sheet;
step 2, film pasting: pasting a photosensitive film on the copper sheet, wherein the photosensitive film is equivalent to a camera photosensitive film;
step 3, exposure: positioning and aligning by using an aligning hole, and then carrying out L1 surface grabbing point positioning exposure to obtain a pattern, wherein the L1 surface is the front surface of the product;
and 4, developing: the exposed pattern is subjected to chemical reaction to leave a pattern, and the unexposed area is removed after the chemical reaction to obtain a bare copper surface;
step 5, etching: etching the exposed copper surface to form a circuit through chemical reaction;
step 6, removing the film: dissolving the photosensitive adhesive film pasted in the step 2 by using a liquid medicine to obtain a complete circuit;
step 7, laminating a bottom layer covering film: the protective adhesive film for protecting the copper layer also has the function of insulating solder resist, and is equivalent to green oil of a hard board;
step 8, pressing a bottom covering film: pressing and curing the overlapped protective adhesive film at high temperature and high pressure;
step 9, film pasting: pasting a photosensitive adhesive film;
step 10, exposure: positioning and aligning by using an aligning hole, and then carrying out L2 surface grabbing point positioning to expose a graph, wherein the L2 surface is the back of the product;
step 11, developing: exposing the L2 surface to obtain a pattern, performing chemical reaction on the pattern to obtain a pattern, and removing the unexposed area after the chemical reaction to obtain a bare copper surface;
step 12, etching: etching a circuit on the copper surface exposed out of the L2 surface through a chemical reaction, wherein the speed debugging is twice as fast as that of the L1 surface, half of the circuit is remained due to insufficient reaction, and a formed step (for example, the thickness of the copper surface on the same layer is 40 micrometers, half of the circuit remained after etching is only 20 micrometers, and the copper surface of 20 micrometers is remained);
step 13, removing the film: dissolving the photosensitive film with a liquid medicine;
step 14, laminating a top cover film: the protective adhesive film for protecting the copper layer also has the function of insulating solder resist, and is equivalent to green oil of a hard board;
step 15, pressing a top layer covering film: pressing and curing the overlapped protective adhesive film at high temperature and high pressure;
step 16, surface treatment: cleaning the surface of the product;
step 17, character: printing characters on a product according to the requirements of a client;
as a further improvement of the invention, in the step 1, the copper sheet drilled with the alignment holes is cleaned.
As a further improvement of the present invention, in step 6, the dry film is removed by chemical reaction to obtain a complete circuit, and then the circuit is cleaned.
As a further improvement of the present invention, in the step 8, after the bottom cover film is pressed, cleaning is performed.
In a further improvement of the present invention, in step 13, after the film is removed, cleaning is performed.
As a further improvement of the present invention, the manufacturing method further comprises:
step 18, function testing: performing function test on the stepped circuit board;
step 19, die cutting the shape: and punching a step circuit board to form a specified shape.
The invention has the beneficial effects that: the invention adopts the etching copper-reducing method to realize the step formation, effectively meets the customer requirements, and improves the layering risk of the covering film and the yield by leveling the pressing procedure.
Detailed Description
The invention discloses a manufacturing method of a step circuit board, which realizes the step by adopting an etching copper reduction method.
The manufacturing method of the invention comprises the following steps:
step 1, drilling: drilling alignment holes in the copper sheet;
step 2, film pasting: pasting a photosensitive film on the copper sheet, wherein the photosensitive film is equivalent to a camera photosensitive film;
step 3, exposure: positioning and aligning by using an aligning hole, and then carrying out L1 surface grabbing point positioning exposure to obtain a pattern, wherein the L1 surface is the front surface of the product;
and 4, developing: the exposed pattern is subjected to chemical reaction to leave a pattern, and the unexposed area is removed after the chemical reaction to obtain a bare copper surface;
step 5, etching: etching the exposed copper surface to form a circuit through chemical reaction;
step 6, removing the film: dissolving the photosensitive adhesive film pasted in the step 2 by using a liquid medicine to obtain a complete circuit;
step 7, laminating a bottom layer covering film: the protective adhesive film for protecting the copper layer also has the function of insulating solder resist, and is equivalent to green oil of a hard board;
step 8, pressing a bottom covering film: pressing and curing the overlapped protective adhesive film at high temperature and high pressure;
step 9, film pasting: pasting a photosensitive adhesive film;
step 10, exposure: positioning and aligning by using an aligning hole, and then carrying out L2 surface grabbing point positioning to expose a graph, wherein the L2 surface is the back of the product;
step 11, developing: exposing the L2 surface to obtain a pattern, performing chemical reaction on the pattern to obtain a pattern, and removing the unexposed area after the chemical reaction to obtain a bare copper surface;
step 12, etching: etching a circuit on the copper surface exposed out of the L2 surface through a chemical reaction, wherein the speed debugging is twice as fast as that of the L1 surface, half of the circuit is remained due to insufficient reaction, and a formed step (for example, the thickness of the copper surface on the same layer is 40 micrometers, half of the circuit remained after etching is only 20 micrometers, and the copper surface of 20 micrometers is remained);
step 13, removing the film: dissolving the photosensitive film with a liquid medicine;
step 14, laminating a top cover film: the protective adhesive film for protecting the copper layer also has the function of insulating solder resist, and is equivalent to green oil of a hard board;
step 15, pressing a top layer covering film: pressing and curing the overlapped protective adhesive film at high temperature and high pressure;
step 16, surface treatment: cleaning the surface of the product;
step 17, character: and printing characters on the product according to the requirements of customers.
Step 18, function testing: performing function test on the stepped circuit board;
step 19, die cutting the shape: and punching a step circuit board to form a specified shape.
In the step 1, the copper sheet with the alignment holes drilled is cleaned.
In the step 6, the dry film is removed through chemical reaction to obtain a complete circuit, and then the circuit is cleaned.
In step 8, after the bottom cover film is pressed, cleaning is performed.
In step 13, after the film is removed, cleaning is performed.
The invention adopts the etching copper-reducing method to realize the step formation, effectively meets the customer requirements, and improves the layering risk of the covering film and the yield by leveling the pressing procedure.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (6)
1. A manufacturing method of a step circuit board is characterized by comprising the following steps:
step 1, drilling: drilling alignment holes in the copper sheet;
step 2, film pasting: pasting a photosensitive adhesive film on the copper sheet;
step 3, exposure: positioning and aligning by using an aligning hole, and then carrying out L1 surface grabbing point positioning exposure to obtain a pattern, wherein the L1 surface is the front surface of the product;
and 4, developing: the exposed pattern is subjected to chemical reaction to leave a pattern, and the unexposed area is removed after the chemical reaction to obtain a bare copper surface;
step 5, etching: etching the exposed copper surface to form a circuit through chemical reaction;
step 6, removing the film: dissolving the photosensitive adhesive film pasted in the step 2 by using a liquid medicine to obtain a complete circuit;
step 7, laminating a bottom layer covering film: the protective adhesive film for protecting the copper layer also has an insulating resistance welding function;
step 8, pressing a bottom covering film: pressing and curing the overlapped protective adhesive film at high temperature and high pressure;
step 9, film pasting: pasting a photosensitive adhesive film;
step 10, exposure: positioning and aligning by using an aligning hole, and then carrying out L2 surface grabbing point positioning to expose a graph, wherein the L2 surface is the back of the product;
step 11, developing: exposing the L2 surface to obtain a pattern, performing chemical reaction on the pattern to obtain a pattern, and removing the unexposed area after the chemical reaction to obtain a bare copper surface;
step 12, etching: etching a circuit on the copper surface exposed out of the L2 surface through chemical reaction, wherein the speed debugging is twice as fast as that of the L1 surface, and half of the copper surface is remained after insufficient reaction to form a step;
step 13, removing the film: dissolving the photosensitive film with a liquid medicine;
step 14, laminating a top cover film: the protective adhesive film for protecting the copper layer also has an insulating resistance welding function;
step 15, pressing a top layer covering film: pressing and curing the overlapped protective adhesive film at high temperature and high pressure;
step 16, surface treatment: cleaning the surface of the product;
step 17, character: and printing characters on the product according to the requirements of customers.
2. The manufacturing method according to claim 1, wherein in the step 1, the copper sheet with the alignment holes drilled therein is cleaned.
3. The method of claim 1, wherein in step 6, the dry film is removed by chemical reaction to obtain a complete circuit, and then cleaned.
4. The method according to claim 1, wherein in step 8, after the base cover film is pressed, cleaning is performed.
5. The method of claim 1, wherein in step 13, after the film is removed, cleaning is performed.
6. The manufacturing method according to any one of claims 1 to 5, further comprising:
step 18, function testing: performing function test on the stepped circuit board;
step 19, die cutting the shape: and punching a step circuit board to form a specified shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111480607.0A CN114206013A (en) | 2021-12-06 | 2021-12-06 | Manufacturing method of stepped circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111480607.0A CN114206013A (en) | 2021-12-06 | 2021-12-06 | Manufacturing method of stepped circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114206013A true CN114206013A (en) | 2022-03-18 |
Family
ID=80650771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111480607.0A Pending CN114206013A (en) | 2021-12-06 | 2021-12-06 | Manufacturing method of stepped circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114206013A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1197809A (en) * | 1997-09-19 | 1999-04-09 | Fujitsu General Ltd | Microwave circuit board |
| CN1359256A (en) * | 2000-07-27 | 2002-07-17 | 索尼化学株式会社 | Flexible wire distribution board and making method |
| CN102361542A (en) * | 2011-09-30 | 2012-02-22 | 东莞市五株电子科技有限公司 | Manufacturing process of printed circuit board with steps |
| CN102523701A (en) * | 2011-12-26 | 2012-06-27 | 深圳市星河电路有限公司 | Method for manufacturing stair boss video interface processor (VIP) hole resin plugging plate |
| CN103002660A (en) * | 2011-09-13 | 2013-03-27 | 深南电路有限公司 | Circuit board and processing method thereof |
| CN105992463A (en) * | 2015-03-06 | 2016-10-05 | 深南电路股份有限公司 | Method for manufacturing step circuit board and step circuit board |
| CN106879171A (en) * | 2017-03-07 | 2017-06-20 | 深南电路股份有限公司 | A kind of step conductive flexible circuit board and its processing method |
| CN110366322A (en) * | 2019-07-16 | 2019-10-22 | 深圳市星河电路股份有限公司 | A kind of processing method that copper base processes figure |
| CN111295056A (en) * | 2020-03-16 | 2020-06-16 | 深圳市实锐泰科技有限公司 | Manufacturing method of flexible plate of step circuit |
| CN113692124A (en) * | 2021-07-21 | 2021-11-23 | 苏州浪潮智能科技有限公司 | PCB (printed circuit board), manufacturing method thereof and electronic equipment |
-
2021
- 2021-12-06 CN CN202111480607.0A patent/CN114206013A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1197809A (en) * | 1997-09-19 | 1999-04-09 | Fujitsu General Ltd | Microwave circuit board |
| CN1359256A (en) * | 2000-07-27 | 2002-07-17 | 索尼化学株式会社 | Flexible wire distribution board and making method |
| CN103002660A (en) * | 2011-09-13 | 2013-03-27 | 深南电路有限公司 | Circuit board and processing method thereof |
| CN102361542A (en) * | 2011-09-30 | 2012-02-22 | 东莞市五株电子科技有限公司 | Manufacturing process of printed circuit board with steps |
| CN102523701A (en) * | 2011-12-26 | 2012-06-27 | 深圳市星河电路有限公司 | Method for manufacturing stair boss video interface processor (VIP) hole resin plugging plate |
| CN105992463A (en) * | 2015-03-06 | 2016-10-05 | 深南电路股份有限公司 | Method for manufacturing step circuit board and step circuit board |
| CN106879171A (en) * | 2017-03-07 | 2017-06-20 | 深南电路股份有限公司 | A kind of step conductive flexible circuit board and its processing method |
| CN110366322A (en) * | 2019-07-16 | 2019-10-22 | 深圳市星河电路股份有限公司 | A kind of processing method that copper base processes figure |
| CN111295056A (en) * | 2020-03-16 | 2020-06-16 | 深圳市实锐泰科技有限公司 | Manufacturing method of flexible plate of step circuit |
| CN113692124A (en) * | 2021-07-21 | 2021-11-23 | 苏州浪潮智能科技有限公司 | PCB (printed circuit board), manufacturing method thereof and electronic equipment |
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