CN114195929A - 增材制造的用于金属镀覆的热固性聚合物和金属镀覆零件 - Google Patents
增材制造的用于金属镀覆的热固性聚合物和金属镀覆零件 Download PDFInfo
- Publication number
- CN114195929A CN114195929A CN202111103152.0A CN202111103152A CN114195929A CN 114195929 A CN114195929 A CN 114195929A CN 202111103152 A CN202111103152 A CN 202111103152A CN 114195929 A CN114195929 A CN 114195929A
- Authority
- CN
- China
- Prior art keywords
- thermosetting resin
- meth
- acrylate
- vpp
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 117
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 53
- 239000002184 metal Substances 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title abstract description 10
- 238000007747 plating Methods 0.000 title abstract description 9
- 239000000654 additive Substances 0.000 title abstract description 7
- 230000000996 additive effect Effects 0.000 title abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 113
- 239000011347 resin Substances 0.000 claims abstract description 113
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims abstract description 12
- 238000000465 moulding Methods 0.000 claims abstract description 10
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 8
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 8
- 229910000019 calcium carbonate Inorganic materials 0.000 claims abstract description 6
- 229920001577 copolymer Polymers 0.000 claims abstract description 5
- 239000010954 inorganic particle Substances 0.000 claims abstract description 5
- 239000011146 organic particle Substances 0.000 claims abstract description 5
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 42
- 239000000178 monomer Substances 0.000 claims description 41
- 238000000576 coating method Methods 0.000 claims description 37
- 239000011248 coating agent Substances 0.000 claims description 36
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 claims description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- HIYIGPVBMDKPCR-UHFFFAOYSA-N 1,1-bis(ethenoxymethyl)cyclohexane Chemical compound C=COCC1(COC=C)CCCCC1 HIYIGPVBMDKPCR-UHFFFAOYSA-N 0.000 claims description 12
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 claims description 12
- SAMJGBVVQUEMGC-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOC=C SAMJGBVVQUEMGC-UHFFFAOYSA-N 0.000 claims description 12
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 12
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 12
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 11
- 229960000834 vinyl ether Drugs 0.000 claims description 11
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 claims description 8
- XWUNIDGEMNBBAQ-UHFFFAOYSA-N Bisphenol A ethoxylate diacrylate Chemical compound C=1C=C(OCCOC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCCOC(=O)C=C)C=C1 XWUNIDGEMNBBAQ-UHFFFAOYSA-N 0.000 claims description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- AMFGWXWBFGVCKG-UHFFFAOYSA-N Panavia opaque Chemical compound C1=CC(OCC(O)COC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OCC(O)COC(=O)C(C)=C)C=C1 AMFGWXWBFGVCKG-UHFFFAOYSA-N 0.000 claims description 8
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 8
- 239000011651 chromium Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 claims description 6
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 6
- 229920000570 polyether Polymers 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229920002635 polyurethane Polymers 0.000 claims description 5
- 239000004814 polyurethane Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- -1 acrylate ester Chemical class 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 2
- 229920000180 alkyd Polymers 0.000 claims description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 2
- 239000001095 magnesium carbonate Substances 0.000 claims description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 239000002923 metal particle Substances 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 2
- 229920001195 polyisoprene Polymers 0.000 claims description 2
- 229920006305 unsaturated polyester Polymers 0.000 claims description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 abstract description 4
- 239000011707 mineral Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 24
- 239000000758 substrate Substances 0.000 description 20
- 239000004634 thermosetting polymer Substances 0.000 description 11
- 238000005530 etching Methods 0.000 description 10
- 238000001465 metallisation Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000009699 high-speed sintering Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000000110 selective laser sintering Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F16/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F16/12—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
- C08F16/32—Monomers containing two or more unsaturated aliphatic radicals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/12—Esters of monohydric alcohols or phenols
- C08F20/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F20/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F216/12—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
- C08F216/125—Monomers containing two or more unsaturated aliphatic radicals, e.g. trimethylolpropane triallyl ether or pentaerythritol triallyl ether
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
- C08F22/10—Esters
- C08F22/1006—Esters of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
- C08F222/1025—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2013—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by mechanical pretreatment, e.g. grinding, sanding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
- B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/20—Post-treatment, e.g. curing, coating or polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
本公开提供了“增材制造的用于金属镀覆的热固性聚合物和金属镀覆零件”。一种用于形成待金属镀覆的零件的热固性树脂,包括光聚合固化成型(VPP)热固性树脂和安置在所述VPP热固性树脂中的可蚀刻相。所述可蚀刻相从由所述VPP热固性树脂形成的零件的表面进行蚀刻,使得在所述零件的所述表面上形成多个微机械锁定部位。所述可蚀刻相是以下项中的至少一者:有机颗粒、有机树脂、无机颗粒、和所述VPP热固性树脂的共聚物。例如,所述可蚀刻相可能是聚丁二烯相和/或诸如碳酸钙等矿物。
Description
技术领域
本公开涉及热固性聚合物,并且特别地,涉及用于金属镀覆的热固性聚合物。
背景技术
本部分中的陈述仅提供了与本公开有关的背景信息,并且可能不构成现有技术。
诸如丙烯腈丁二烯苯乙烯(ABS)等热塑性聚合物用于形成随后被金属镀覆的注塑成型零件。而且,由此类聚合物形成的注塑成型零件通常具有“光滑”表面,所述“光滑”表面在蚀刻之后允许在表面上形成具有期望的表面外观的金属镀覆涂层。然而,此类热塑性聚合物不能用于经由光聚合固化成型(VPP)增材制造(AM)技术形成零件,并且其他AM技术中的热塑性用途存在美学限制。例如,ABS已经用于使用熔融细丝制作(FFF)来形成零件,然而FFF在形成的零件的表面上产生可见的层线,从而限制了可在此类零件的表面上产生的图形的平滑度、清新度和/或分辨率。
本公开解决了经由VPP零件由热固性聚合物进行增材制造的这些挑战,以及与热固性聚合物有关的其他问题。
发明内容
在本公开的一种形式中,一种用于形成待金属镀覆的零件的热固性树脂包括光聚合固化成型(VPP)热固性树脂和安置在所述VPP热固性树脂中的可蚀刻相。所述可蚀刻相被配置成从由所述VPP热固性树脂形成的零件的表面进行蚀刻,使得在所述零件的所述表面上形成多个微机械锁定部位。
在一些变型中,VPP热固性树脂是至少一种单体、至少一种低聚物和至少一种光引发剂的混合物。在至少一个变型中,所述VPP热固性树脂包括选自由(甲基)丙烯酸酯单体和乙烯基醚组成的组的至少一种单体。在此类变型中,(甲基)丙烯酸酯单体可能是单官能单体、双官能单体和多官能单体中的至少一种。例如,在一些变型中,(甲基)丙烯酸酯单体是以下项中的至少一者:丙烯酸2-乙基己酯(EHA)、丙烯酸正丁酯(BA)、1,4-丁二醇二丙烯酸酯(BDDA)和二乙二醇二丙烯酸酯(DEGDA)。而且,在一些变型中,乙烯基醚是以下项中的至少一者:二乙二醇二乙烯基醚(DEGDE)、环已烷二甲醇二乙烯基醚(CHDMDE)和三乙二醇二乙烯基醚(TEGDE)。
在至少一个变型中,所述VPP热固性树脂包含至少一种(甲基)丙烯酸酯化低聚物。并且,在一些变型中,VPP热固性树脂包括选自由聚氨酯、聚醚、聚酯和环氧树脂组成的组的至少一种低聚物。
在至少一个变型中,可蚀刻相选自由有机颗粒、有机树脂、无机颗粒、和VPP热固性树脂的共聚物组成的组。在此类变型中,可蚀刻相是聚丁二烯相和/或碳酸钙。
在一些变型中,一种部件由其中安置有可蚀刻相的VPP热固性树脂形成,并且所述部件具有经蚀刻的表面和安置在经蚀刻的表面上的金属涂层。在至少一个变型中,金属涂层是铬涂层。并且,在一些变型中,金属涂层是镍层、铜层和铬层。
在本公开的另一种形式中,一种金属镀覆聚合物零件包括:VPP热固性基板,所述VPP热固性基板由至少一种单体、至少一种低聚物、至少一种光引发剂和可蚀刻相的混合物形成;以及金属涂层,所述金属涂层在VPP热固性基板的表面上。而且,所述表面是具有多个微机械锁定部位的经蚀刻表面,并且所述金属涂层在所述多个微机械锁定部位处粘合到所述表面。
在一些变型中,VPP热固性基板由具有至少一种单体的VPP热固性树脂形成,所述至少一种单体是(甲基)丙烯酸酯单体和/或乙烯基醚。在此类变型中,(甲基)丙烯酸酯单体是以下项中的至少一者:丙烯酸2-乙基己酯(EHA)、丙烯酸正丁酯(BA)、1,4-丁二醇二丙烯酸酯(BDDA)和二乙二醇二丙烯酸酯(DEGDA),并且乙烯基醚是以下项中的至少一者:二乙二醇二乙烯基醚(DEGDE)、环已烷二甲醇二乙烯基醚(CHDMDE)和三乙二醇二乙烯基醚(TEGDE)。
在至少一个变型中,VPP热固性树脂包括至少一种(甲基)丙烯酸酯化低聚物,诸如聚氨酯、聚醚、聚酯和环氧树脂等。
在一些变型中,可蚀刻相是聚丁二烯相和矿物相中的至少一个。
根据本文中提供的描述,另外的适用领域将变得显而易见。应理解,描述和具体示例仅意图用于说明目的,并且不意图限制本公开的范围。
附图说明
为了可很好地理解本公开,现在将参考附图通过举例的方式描述本公开的各种形式,在附图中:
图1示出了根据本公开的教示的用于增材制造热固性树脂的立体光刻系统;
图2是根据本公开的教示的经由热固性树脂的光聚合固化成型形成的金属镀覆零件的侧视图;
图3是根据现有技术经由光聚合固化成型由树脂形成的基板在蚀刻基板之前和之后的横截面视图;
图4是根据本公开的一种形式的经由光聚合固化成型形成的基板在蚀刻基板之前和之后的横截面视图;
图5是根据本公开的另一种形式的使用树脂经由光聚合固化成型形成的基板在蚀刻基板之前和之后的横截面视图;
图6是根据本公开的另一种形式的使用树脂经由光聚合固化成型形成的基板在蚀刻基板之前和之后的横截面视图;
图7是图4至图6中根据本公开的教示的基板在蚀刻基板之前和之后以及在对经蚀刻的基板进行金属镀覆之后的横截面视图;并且
图8是根据本公开的教示的形成金属镀覆零件的方法30的流程图。
本文中描述的附图仅用于说明目的,而不意在以任何方式限制本公开的范围。
具体实施方式
以下描述在性质上仅是示例性的,并且不意在限制本公开、应用或用途。应理解,贯穿附图,对应的附图标记指示相同或对应的零件和特征。
本公开提供了一种用于经由光聚合固化成型(VPP)形成零件的热固性树脂,并且所述VPP形成的零件可使用标准或常规的金属镀覆技术和装备进行金属镀覆。热固性树脂包括VPP热固性树脂和安置在VPP热固性树脂中的可蚀刻相。热固性树脂特别适合于使用立体光刻(SLA)增材制造(AM)、数字光处理(DLP)AM和连续液体界面生产(CLIP)AM来形成零件。对VPP形成的零件进行蚀刻,并且然后使用标准或常规的金属镀覆技术和装备进行金属镀覆。如本文所使用的,术语“光聚合”是指在通过可聚合系统吸收光(例如,紫外光)时发起和传播的链式反应来合成聚合物,光仅用作不干扰链式过程的传播或阶段和终止阶段的发起工具。
参看图1,示出了立体光刻(SLA)系统10。SLA系统10包括:槽100;平台110;升降机120,所述升降机被配置成使平台110向上(+z方向)和向下(-z方向)移动;以及光扫描系统130。VPP热固性树脂140(在本文中也简称为“热固性树脂”)安置在槽100内。光扫描系统130包括:光源132(例如,紫外激光器);光束整形光学器件134;以及x-y扫描仪136(例如,镜子),所述x-y扫描仪被配置成沿着安置在槽100中的热固性树脂140的表面141上的预定义图案引导光束138。平台110可包括支撑件111,零件140p的AM逐层形成在所述支撑件上。例如,通过以下方式形成固化的热固性树脂140c(图3)的第一层‘1’:将平台110和/或支撑件111定位在热固性树脂140的表面141正下方(-z方向),使得预定厚度(z方向)的热固性树脂140的层安置在平台和/或支撑件111上。然后,光扫描系统130沿着预定义图案引导光束138,以形成固化的热固性树脂140c的第一层‘1’。并且,在形成固化的热固性树脂140c的第一层1之后,升降机120使平台110向下(-z方向)移动预定义距离,使得热固性树脂140的第二层′2′流动并安置在固化的热固性树脂140c的第一层1上方。然后,光扫描系统130沿着另一预定义图案引导光束138以形成固化的热固性树脂140c的第二层2,所述另一预定义图案可与先前的预定义图案相同或不同。该循环继续,直到逐层完全形成AM零件140p为止。使用上述AM技术形成的此种AM零件140p的示例在图2中示出。
虽然图1提供了一种类型的AM系统和/或技术的示例,但是应理解,其他AM技术(诸如但不限于DLP AM和CLIP AM)可用于用根据本公开的教示的热固性树脂形成AM零件。
参看图3,示出了使用本领域已知的VPP热固性树脂140形成经蚀刻的AM零件140e的方法20。特别地,在步骤200处,VPP热固性树脂140用于逐层形成AM零件140p,并且在步骤210处蚀刻AM零件140p以形成经蚀刻的AM零件140e。AM零件140p由如上所讨论的固化的热固性树脂140c的连续层形成,并且具有表面142,所述表面在步骤210处暴露于蚀刻剂使得提供经蚀刻表面142e。用于蚀刻表面142的蚀刻剂的非限制性示例包括氧化酸溶液,诸如MnO2-H2SO4蚀刻剂、MnO2-H3PO4-H2SO4蚀刻剂、铬酸蚀刻剂等。
如图3中所示,经蚀刻的表面142e不存在或不具有用于将金属涂层(未示出)粘合到经蚀刻表面142e的微机械粘合部位。也就是说,VPP热固性树脂140不具有适合于经由蚀刻移除的任何相或颗粒。因此,应理解,经蚀刻表面142e本身有助于金属镀覆,因为经蚀刻表面142e上缺少微机械粘合部位会抑制沉积到经蚀刻表面142e上的金属涂层的粘合。
现在参看图4,示出了根据本公开的教示的使用热固性树脂150形成经蚀刻的AM零件150e的方法22。特别地,图1中的热固性树脂140被替换为热固性树脂150。而且,热固性树脂150包括VPP热固性树脂140和安置在VPP热固性树脂140中的可蚀刻相112。在图4中示出的示例中,可蚀刻相112呈可用已知的蚀刻剂(诸如上面列出的那些)蚀刻的树脂相的形式。此类树脂相的非限制性示例包括:聚丁二烯(甲基)丙烯酸酯;聚异戊二烯(甲基)丙烯酸酯;聚氯丁二烯(甲基)丙烯酸酯;不饱和聚酯(甲基)丙烯酸酯;醇酸(甲基)丙烯酸酯;酚醛(甲基)丙烯酸酯;以及其他类型的(甲基)丙烯酸酯化聚合物,它们在其主链或侧链上包含不饱和双键官能团(-CH2=CH2-)。
在一些变型中,VPP热固性树脂140是至少一种单体、至少一种低聚物和至少一种光引发剂的混合物。所述至少一种单体的非限制性示例包括(甲基)丙烯酸酯单体、乙烯基醚等。而且,(甲基)丙烯酸酯单体可能是以下项中的至少一者:单官能单体、双官能单体和多官能单体。例如,在一些变型中,(甲基)丙烯酸酯单体是以下项中的至少一者:丙烯酸2-乙基己酯(EHA)、丙烯酸正丁酯(BA)、1,4-丁二醇二丙烯酸酯(BDDA)以及二乙二醇二丙烯酸酯(DEGDA)、双酚A-甲基丙烯酸缩水甘油酯(Bis-GMA)、双酚A乙氧基化物二丙烯酸酯(Bis-EDA)、三羟甲基丙烷三丙烯酸酯(TTA)和三乙二醇二甲基丙烯酸酯(TEGDMA)等。而且,乙烯基醚可能是以下项中的至少一者:二乙二醇二乙烯基醚(DEGDE)、环已烷二甲醇二乙烯基醚(CHDMDE)和三乙二醇二乙烯基醚(TEGDE)等。
在至少一个变型中,本公开的VPP热固性树脂包括至少一种丙烯酸酯化低聚物。并且,在一些变型中,所述至少一种低聚物是聚氨酯(甲基)丙烯酸酯、聚醚(甲基)丙烯酸酯、聚酯(甲基)丙烯酸酯、环氧(甲基)丙烯酸酯、氨基(甲基)丙烯酸酯和硅氧烷(甲基)丙烯酸酯等。
与图3中形成AM零件140p相似,在步骤200处使用热固性树脂150逐层形成AM零件150p,并且在步骤210处蚀刻AM零件150p以形成经蚀刻的AM零件150e。然而,并且与由热固性树脂140形成的AM零件140p相比,蚀刻剂从在表面152处的热固性树脂150移除或溶解可蚀刻相112,使得在经蚀刻的表面152e上形成多个微机械粘合部位113。应理解,微机械粘合部位113增强了沉积在经蚀刻表面152e上的金属涂层的粘合,如下面参考图7所示出和讨论的。
现在参看图5,示出了根据本公开的教示的使用热固性树脂160形成经蚀刻的AM零件160e的方法24。特别地,图1中的热固性树脂140被替换为热固性树脂160。而且,热固性树脂160包括VPP热固性树脂140和安置在VPP热固性树脂140中的另一可蚀刻相114。在图5中示出的示例中,可蚀刻相114呈可用已知的蚀刻剂(诸如上面列出的那些)蚀刻的颗粒(在本文中也称为“可蚀刻颗粒114”)的形式。此类颗粒的非限制性示例包括以下颗粒:包括铁(Fe)和铝(Al)的金属颗粒;包括氧化铝(Al2O3)、氧化镁(MgO)和氧化锌(ZnO)的金属氧化物颗粒;以及包括碳酸钙(CaCO3)、碳酸钡(BaCO3)、碳酸镁(MgCO3)的金属碳酸盐颗粒等。
与图3中形成AM零件140p相似,在步骤200处使用热固性树脂160逐层形成AM零件160p,并且在步骤210处蚀刻AM零件160p以形成经蚀刻的AM零件160e。AM零件160p由固化的热固性树脂160c的连续层形成,并且具有表面162,所述表面在步骤210处暴露于蚀刻剂使得提供经蚀刻表面162e。然而,并且与由热固性树脂140形成的AM零件140p相比,蚀刻剂移除或溶解在经蚀刻表面162e处的可蚀刻颗粒114,使得在经蚀刻的表面162e上形成多个微机械粘合部位113。应理解,微机械粘合部位113增强了沉积在经蚀刻表面162e上的金属涂层的粘合,如下面参考图7所讨论的。
参看图6,示出了根据本公开的教示的使用热固性树脂170形成经蚀刻的AM零件170e的方法26。特别地,图1中的热固性树脂140被替换为热固性树脂170。而且,热固性树脂170包括VPP热固性树脂140、可蚀刻相112和安置在VPP热固性树脂140中的可蚀刻颗粒114。
与图3中形成AM零件140p相似,在步骤200处使用热固性树脂170逐层形成AM零件170p,并且在步骤210处蚀刻AM零件170p以形成经蚀刻的AM零件170e。零件170p由固化的热固性树脂170c的连续层形成,并且具有表面172,所述表面在步骤210处暴露于蚀刻剂使得提供经蚀刻表面172e。然而,并且与由热固性树脂140形成的AM零件140p相比,蚀刻剂移除或溶解在经蚀刻表面172e处的可蚀刻相112和可蚀刻颗粒114,使得在经蚀刻的表面172e上形成多个微机械粘合部位113。应理解,微机械粘合部位113增强了沉积在经蚀刻表面172e上的金属涂层的粘合,如下面所讨论的。
现在参看图7,示出经蚀刻的AM零件150e、160e、170e具有施加并粘合到经蚀刻表面152e、162e、172e的金属涂层180,使得提供金属涂覆的AM零件190。微机械粘合部位113提供边缘113a和底切区域113b,所述边缘和底切区域增强了金属涂层180与经蚀刻的AM零件150e、160e、170e的粘合(例如,机械粘合)。另外,微机械粘合部位113提供空隙空间的容积,金属182在金属涂层180的沉积期间沉积在所述空隙空间内,使得金属涂层180的至少一部分被封装在经蚀刻的AM零件150e、160e、170e的经蚀刻表面152e、162e、172e内。另外,微机械粘合部位113提供由热固性树脂使用标准或常规金属镀覆技术和装备形成的AM零件的金属镀覆。此类标准或常规金属镀覆技术的非限制性示例包括电镀、无电镀、物理气相沉积(PVD)、真空金属化和喷涂金属涂覆等。并且,标准或常规金属镀覆装备的非限制性示例包括支架、浸渍槽、金属化腔室和等离子弧枪等。而且,金属涂层180的非限制性示例包括铬或铬合金涂层、镍或镍合金涂层、铜或铜合金涂层、铝或铝合金涂层以及它们的组合等。
现在参看图8,示出了形成金属镀覆零件的方法30的流程图。方法30包括在300处经由VPP由具有可蚀刻相的热固性树脂形成基板,以及在310处蚀刻基板的表面。表面的蚀刻移除了可蚀刻相的接近基板的表面的至少一部分,并且在310处在表面处形成多个微机械锁定部位。然后,在320处,例如使用标准或常规的金属镀覆技术和装备在经蚀刻的表面上沉积或形成金属涂层,并且在多个微机械锁定部位处将金属涂层附接到经蚀刻的表面。
根据本公开的教示应理解,提供了用于经由VPP形成零件的热固性树脂。热固性树脂提供具有期望的表面或表面光洁度的VPP零件,所述表面或表面光洁度可被蚀刻并随后进行金属镀覆。例如,VPP零件的表面质量不存在通过施加到VPP零件的金属涂层示出的不期望的表面伪影。如本文所使用的,短语“不期望的表面伪影”是指由形成零件的AM过程产生的表面瑕疵、线条和/或孔隙率。此类AM过程包括但不限于:挤出印刷工艺,诸如熔融细丝成形(FFF)和熔融沉积成型(FDM);以及粉末床熔融过程,诸如粉末床熔融(PBF)、多射流熔融(MJF)、高速烧结(HSS)和选择性激光烧结(SLS)。
在一些变型中,热固性树脂是单体、低聚物、光引发剂和可蚀刻相的混合物,并且在至少一种变型中,可蚀刻相是以下项中的至少一者:有机颗粒、有机树脂、无机颗粒、VPP热固性聚合物的共聚物以及它们的组合等。在一些变型中,可蚀刻相是聚丁二烯相。在其他变型中,可蚀刻相是矿物相,例如碳酸钙。
在一些变型中,使用无电沉积将金属涂层施加到经蚀刻表面上。例如,可在经蚀刻表面上施加或沉积无电镍涂层。在此类变型中,可跨无电沉积的镍施加或沉积铜的电解沉积。而且,可在电解沉积的镍上施加或沉积铬的电解沉积。
如本文所使用,短语A、B和C中的至少一个应被解释为表示使用非排他性逻辑或的逻辑(A或B或C),并且不应被解释为表示“A中的至少一个、B中的至少一个以及C中的至少一个”。
除非另外明确指示,否则在描述本公开的范围时,指示机械/热性能、组成百分比、尺寸和/或公差或其他特性的所有数值都应理解为由词语“大约”或“近似”修饰。由于各种原因,包括工业实践、制造技术和测试能力,期望进行这种修饰。
本文使用的术语仅是出于描述特定示例形式的目的,而不意在进行限制。除非上下文另外明确指示,否则单数形式“一”、“一个”和“所述”也可意在包括复数形式。术语“包括”、和“具有”都是包括性的并且因此指定所陈述特征、整数、步骤、操作、要素和/或部件的存在,但不排除存在或添加一种或多种其他特征、整数、步骤、操作、要素、部件和/或它们的群组。本文所描述的方法、步骤、过程和操作不应被解释为必须以所讨论或说明的特定顺序执行,除非具体地识别为执行的顺序。还应理解,可采用额外的或替代的步骤。
本公开的描述在本质上仅仅是示例性的,并且因此,不背离本公开的实质的变型意图处于本公开的范围内。不应将此类变型视为脱离本公开的精神和范围。
根据本发明,提供了一种用于形成待金属镀覆的零件的热固性树脂,具有:光聚合固化成型(VPP)热固性树脂;以及可蚀刻相,所述可蚀刻相安置在所述VPP热固性树脂中,其中所述可蚀刻相被配置成从由所述VPP热固性树脂形成的零件的表面进行蚀刻,使得在所述零件的所述表面上形成多个微机械锁定部位。
根据实施例,VPP热固性树脂包括至少一种单体、至少一种低聚物和至少一种光引发剂的混合物。
根据实施例,所述VPP热固性树脂包括选自由(甲基)丙烯酸酯单体和乙烯基醚组成的组的至少一种单体。
根据实施例,(甲基)丙烯酸酯单体是以下项中的至少一者:单官能单体、双官能单体和多官能单体。
根据实施例,(甲基)丙烯酸酯单体是以下项中的至少一者:丙烯酸2-乙基己酯(EHA)、丙烯酸正丁酯(BA)、1,4-丁二醇二丙烯酸酯(BDDA)以及二乙二醇二丙烯酸酯(DEGDA)、双酚A-甲基丙烯酸缩水甘油酯(Bis-GMA)、双酚A乙氧基化物二丙烯酸酯(Bis-EDA)、三羟甲基丙烷三丙烯酸酯(TTA)和三乙二醇二甲基丙烯酸酯(TEGDMA)。
根据实施例,乙烯基醚是以下项中的至少一者:二乙二醇二乙烯基醚(DEGDE)、环已烷二甲醇二乙烯基醚(CHDMDE)和三乙二醇二乙烯基醚(TEGDE)。
根据实施例,所述VPP热固性树脂包括至少一种(甲基)丙烯酸酯化低聚物。
根据实施例,VPP热固性树脂包括至少一种低聚物,所述至少一种低聚物选自由聚氨酯、(甲基)丙烯酸酯、聚醚(甲基)丙烯酸酯、聚酯(甲基)丙烯酸酯、环氧(甲基)丙烯酸酯、氨基(甲基)丙烯酸酯或硅氧烷(甲基)丙烯酸酯组成的组。
根据实施例,可蚀刻相选自由有机颗粒、有机树脂、无机颗粒、和VPP热固性树脂的共聚物组成的组。
根据实施例,可蚀刻相是聚丁二烯相。
根据实施例,可蚀刻相是碳酸钙。
根据实施例,本发明的特征还在于由其中安置有所述可蚀刻相的所述VPP热固性树脂形成的部件。
根据实施例,所述部件具有经蚀刻的表面和安置在经蚀刻表面上的金属涂层。
根据实施例,金属涂层是铬涂层。
根据实施例,金属涂层是镍层、铜层和铬层。
根据本发明,提供了一种金属镀覆的聚合物零件,具有:光聚合固化成型(VPP)热固性基板,所述热固性基板由至少一种单体、至少一种低聚物、至少一种光引发剂和可蚀刻相的混合物形成;以及金属涂层,所述金属涂层在VPP热固性基板的表面上,其中所述表面是具有多个微机械锁定部位的经蚀刻表面,并且所述金属涂层在所述多个微机械锁定部位处粘合到所述表面。
根据实施例,所述VPP热固性基板由VPP热固性树脂形成,所述VPP热固性树脂包括选自由(甲基)丙烯酸酯单体和乙烯基醚组成的组的至少一种单体。
根据实施例,丙烯酸酯单体是以下项中的至少一者:丙烯酸2-乙基己酯(EHA)、丙烯酸正丁酯(BA)、1,4-丁二醇二丙烯酸酯(BDDA)以及二乙二醇二丙烯酸酯(DEGDA)以及双酚A-甲基丙烯酸缩水甘油酯(Bis-GMA)、双酚A乙氧基化物二丙烯酸酯(Bis-EDA)、三羟甲基丙烷三丙烯酸酯(TTA)和三乙二醇二甲基丙烯酸酯(TEGDMA),并且乙烯基醚是以下项中的至少一者:二乙二醇二乙烯基醚(DEGDE)、环已烷二甲醇二乙烯基醚(CHDMDE)和三乙二醇二乙烯基醚(TEGDE)。
根据实施例,VPP热固性树脂包括选自由聚氨酯、聚醚、聚酯和环氧树脂组成的组的至少一种低聚物。
根据实施例,可蚀刻相选自由聚丁二烯相和矿物相组成的组。
Claims (15)
1.一种用于形成待金属镀覆的零件的热固性树脂,所述热固性树脂包括:
光聚合固化成型(VPP)热固性树脂;以及
可蚀刻相,所述可蚀刻相安置在所述VPP热固性树脂中,其中所述可蚀刻相被配置成从由所述VPP热固性树脂形成的零件的表面进行蚀刻,使得在所述零件的所述表面上形成多个微机械锁定部位。
2.根据权利要求1所述的热固性树脂,其中所述VPP热固性树脂包括至少一种单体、至少一种低聚物和至少一种光引发剂的混合物。
3.根据权利要求1所述的热固性树脂,其中所述VPP热固性树脂包括选自由(甲基)丙烯酸酯单体和乙烯基醚组成的组的至少一种单体。
4.根据权利要求3所述的热固性树脂,其中所述(甲基)丙烯酸酯单体是以下项中的至少一者:单官能单体、双官能单体和多官能单体。
5.根据权利要求3所述的热固性树脂,其中所述(甲基)丙烯酸酯单体是以下项中的至少一者:丙烯酸2-乙基己酯(EHA)、丙烯酸正丁酯(BA)、1,4-丁二醇二丙烯酸酯(BDDA)、二乙二醇二丙烯酸酯(DEGDA)、双酚A-甲基丙烯酸缩水甘油酯(Bis-GMA)、双酚A乙氧基化物二丙烯酸酯(Bis-EDA)、三羟甲基丙烷三丙烯酸酯(TTA)和三乙二醇二甲基丙烯酸酯(TEGDMA)。
6.根据权利要求3所述的热固性树脂,其中所述乙烯基醚是以下项中的至少一者:二乙二醇二乙烯基醚(DEGDE)、环已烷二甲醇二乙烯基醚(CHDMDE)和三乙二醇二乙烯基醚(TEGDE)。
7.根据权利要求1所述的热固性树脂,其中所述VPP热固性树脂包括至少一个(甲基)丙烯酸酯低聚物。
8.根据权利要求1所述的热固性树脂,其中所述VPP热固性树脂包括至少一种低聚物,所述至少一种低聚物选自由聚氨酯、(甲基)丙烯酸酯、聚醚(甲基)丙烯酸酯、聚酯(甲基)丙烯酸酯、环氧(甲基)丙烯酸酯、酚醛(甲基)丙烯酸酯、氨基(甲基)丙烯酸酯或硅氧烷(甲基)丙烯酸酯组成的组。
9.根据权利要求1所述的热固性树脂,其中所述可蚀刻相选自由有机颗粒、有机树脂、无机颗粒、和VPP热固性树脂的共聚物组成的组。
10.根据权利要求1所述的热固性树脂,其中所述可蚀刻相是(甲基)丙烯酸酯中的至少一种,所述(甲基)丙烯酸酯选自由以下组成的组:聚丁二烯(甲基)丙烯酸酯、聚异戊二烯(甲基)丙烯酸酯、聚氯丁二烯(甲基)丙烯酸酯、不饱和聚酯(甲基)丙烯酸酯和醇酸(甲基)丙烯酸酯;以及(甲基)丙烯酸酯化聚合物,其主链或侧链上具有不饱和双键官能团(-CH2=CH2-)。
11.根据权利要求1所述的热固性树脂,其中所述可蚀刻相是以下项中的至少一者:选自由铁(Fe)和铝(A1)组成的组的金属颗粒;选自由氧化铝(Al2O3)、氧化镁(MgO)和氧化锌(ZnO)组成的组的金属氧化物颗粒;以及选自由碳酸钙(CaCO3)、碳酸钡(BaCO3)和碳酸镁(MgCO3)组成的组的金属碳酸盐颗粒。
12.根据权利要求1所述的热固性树脂,其还包括由其中安置有所述可蚀刻相的所述VPP热固性树脂形成的部件。
13.根据权利要求1至12中任一项所述的热固性树脂,其中所述部件具有经蚀刻的表面和安置在所述经蚀刻表面上的金属涂层。
14.根据权利要求13所述的热固性树脂,其中所述金属涂层是铬涂层。
15.根据权利要求13所述的热固性树脂,其中所述金属涂层是镍层、铜层和铬层。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/025,397 US11692049B2 (en) | 2020-09-18 | 2020-09-18 | Additively manufactured thermoset polymers for metal plating and metal plated parts formed therefrom |
US17/025,397 | 2020-09-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114195929A true CN114195929A (zh) | 2022-03-18 |
Family
ID=80473612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111103152.0A Pending CN114195929A (zh) | 2020-09-18 | 2021-09-18 | 增材制造的用于金属镀覆的热固性聚合物和金属镀覆零件 |
Country Status (3)
Country | Link |
---|---|
US (2) | US11692049B2 (zh) |
CN (1) | CN114195929A (zh) |
DE (1) | DE102021124281A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11692049B2 (en) * | 2020-09-18 | 2023-07-04 | Ford Global Technologies, Llc | Additively manufactured thermoset polymers for metal plating and metal plated parts formed therefrom |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5302494A (en) * | 1985-06-10 | 1994-04-12 | The Foxboro Company | Multilayer circuit board having microporous layers and process for making same |
MY120077A (en) | 1998-06-26 | 2005-08-30 | Ibiden Co Ltd | Multilayer printed wiring board having a roughened inner conductor layer and production method thereof |
MY128333A (en) | 1998-09-14 | 2007-01-31 | Ibiden Co Ltd | Printed wiring board and its manufacturing method |
EP2731783A4 (en) | 2011-07-13 | 2016-03-09 | Nuvotronics Llc | METHOD FOR PRODUCING ELECTRONIC AND MECHANICAL STRUCTURES |
US10239255B2 (en) * | 2017-04-11 | 2019-03-26 | Molecule Corp | Fabrication of solid materials or films from a polymerizable liquid |
US10676572B1 (en) * | 2018-02-23 | 2020-06-09 | Hrl Laboratories, Llc | Water-decomposable thermoset resin formulations, and water-decomposable thermoset polymers made therefrom |
US11331854B2 (en) * | 2018-03-26 | 2022-05-17 | Arevo, Inc. | System and method for dispensing composite filaments for additive manufacturing |
CN114258342A (zh) * | 2019-06-26 | 2022-03-29 | 维纳米技术公司 | 改进的热机械复合材料的增材制造 |
US11692049B2 (en) * | 2020-09-18 | 2023-07-04 | Ford Global Technologies, Llc | Additively manufactured thermoset polymers for metal plating and metal plated parts formed therefrom |
-
2020
- 2020-09-18 US US17/025,397 patent/US11692049B2/en active Active
-
2021
- 2021-09-18 CN CN202111103152.0A patent/CN114195929A/zh active Pending
- 2021-09-20 DE DE102021124281.9A patent/DE102021124281A1/de active Pending
-
2023
- 2023-05-18 US US18/319,746 patent/US11965045B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US11965045B2 (en) | 2024-04-23 |
DE102021124281A1 (de) | 2022-03-24 |
US11692049B2 (en) | 2023-07-04 |
US20230287161A1 (en) | 2023-09-14 |
US20220089799A1 (en) | 2022-03-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5971312B2 (ja) | 多層3次元構造を製造するための方法 | |
US10245770B2 (en) | Housings for electronic devices | |
US11965045B2 (en) | Method of forming an etched part and a method of forming a metal plated part | |
CA1262778A (en) | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby | |
US20180319108A1 (en) | Methods of fabricating electronic and mechanical structures | |
US20180043618A1 (en) | Embedding apparatus and method utilizing additive manufacturing | |
CN1159863A (zh) | 用于生产数据存储光盘模具的方法 | |
CN1527793A (zh) | 在一基体上形成微电子弹簧结构的方法 | |
JP5149069B2 (ja) | 金型組立体及び射出成形方法 | |
KR102129908B1 (ko) | 다층박막의 제조방법, 다층박막이 형성된 부재, 및 이를 포함하는 전자제품. | |
US11803121B2 (en) | Method for manufacturing a horology component | |
CN1939756A (zh) | 塑胶表面具金属质感的立体图案效果的处理方法 | |
CN1217958A (zh) | 铸造型芯新工艺 | |
JP2007015337A (ja) | 筐体、電子機器および複合成形方法 | |
CN1940125A (zh) | 真空镀emi金属膜层与塑胶底材附着性的方法 | |
CN1688504A (zh) | 有选择地覆盖微机加工表面的方法 | |
JP2006523769A (ja) | ラピッドプロトタイピングプロセス | |
JP5247233B2 (ja) | 金型組立体及び射出成形方法 | |
JP5627177B2 (ja) | 金属デザインモックアップの作成方法および金属デザインモックアップ | |
JP2003127143A (ja) | 微細金型の製造方法 | |
JP3231681B2 (ja) | マグネシウム成形品 | |
JP7326427B2 (ja) | 車両照明用のリフレクタ | |
JPH0359913A (ja) | 金属溶射による回路体の製造方法 | |
CN1506500A (zh) | 以预成型金属为基材的微电铸铸模及其制造方法 | |
KR101962336B1 (ko) | 희생 금속 산화막을 이용한 코팅층, 이의 제조 방법 및 이를 이용한 스퍼터링 휠 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |