CN114188202B - Substrate holding device and ion implantation device - Google Patents
Substrate holding device and ion implantation device Download PDFInfo
- Publication number
- CN114188202B CN114188202B CN202110715711.7A CN202110715711A CN114188202B CN 114188202 B CN114188202 B CN 114188202B CN 202110715711 A CN202110715711 A CN 202110715711A CN 114188202 B CN114188202 B CN 114188202B
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- substrate
- bracket
- support
- shaft
- shaft member
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- 239000000758 substrate Substances 0.000 title claims abstract description 256
- 238000005468 ion implantation Methods 0.000 title claims abstract description 29
- 238000010884 ion-beam technique Methods 0.000 claims description 14
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 description 12
- 230000007246 mechanism Effects 0.000 description 6
- 230000000630 rising effect Effects 0.000 description 6
- 230000003014 reinforcing effect Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 230000000284 resting effect Effects 0.000 description 4
- 238000005304 joining Methods 0.000 description 3
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a substrate holding device and an ion implantation device, which can restrain the deformation of a bracket for holding a substrate. The substrate holding device is provided with: a holder for holding the substrate; a shaft member engaged with the bracket and defining a rotation axis of the bracket; and a stand support member that supports the shaft member, the stand support member being movable between a reclined position and an upright position by rotating the stand about a predetermined rotation axis, the stand comprising: a plurality of substrate supporting members disposed on the rotation shaft so as to be separated from each other; and a first connecting member connecting one end portions of the plurality of substrate supporting members, wherein the shaft member is joined to each substrate supporting member along the rotation shaft.
Description
Technical Field
The present invention relates to a substrate holding device and an ion implantation apparatus including the same.
Background
As a substrate processing apparatus that performs various processes such as ion implantation on a substrate, a substrate processing apparatus disclosed in patent document 1 is known. The substrate processing apparatus of patent document 1 is an apparatus used in a process for manufacturing a flat panel display, and a substrate holding apparatus for holding a substrate is disposed in a processing chamber while a predetermined process is being performed on the substrate. The substrate holding device further includes: a holder holding a substrate; a support frame supporting the support; and a rotation mechanism that rotates the support to move the support between the lodging position and the standing position.
The bracket is formed into a comb-like shape as a whole by connecting four elongated plates at one end, and a pair of rotation shafts are engaged with the plates at both ends. The rotation mechanism is configured to rotate the bracket by applying a rotational force to only one of the pair of rotation shafts.
In the substrate processing apparatus disclosed in patent document 1, when the holder is rotated, a rotational force is applied to only one side of the rotation shaft, and deformation due to torsion is generated in the holder.
Therefore, the plate material located on the opposite side to the side to which the rotational force is applied among the four elongated plate materials constituting the bracket is greatly deformed as compared with the other plate materials. In addition, the two inner plates are deformed by their own weight so as to warp. Further, if the support frame that supports the rotation shaft of the bracket is deformed so as to open in the direction of the rotation shaft, the rotation shaft follows the deformation of the support frame. As a result, the bracket is deformed such that the plates at both ends of the bracket, which are engaged with the rotation shaft, are opened. That is, the deformation direction and amount of the four elongated plates are different, and the deformation of each plate of the bracket is deviated. In particular, when the size of the holder is increased with the increase in the size of the substrate, the difference in the deformation amount of each plate material is increased, and it is difficult to hold the substrate at a predetermined position or posture.
In addition, when the substrate is not held by the holder at a predetermined position or posture, the predetermined process may not be properly performed on the substrate.
Patent document 1: japanese patent laid-open publication No. 2016-63166
Disclosure of Invention
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate holding apparatus and an ion implantation apparatus capable of suppressing deformation of a holder holding a substrate.
The substrate processing apparatus of the present invention comprises: a holder holding a substrate; a shaft member coupled to the bracket and defining a rotation axis of the bracket; and a stand support member having a pair of support plates that rotatably support the shaft member at positions outside both ends of the stand in the rotation axis direction and restrict movement of the shaft member in the rotation axis direction, the stand being movable between a reclined position and a raised position by a rotation operation about the rotation axis, the stand including: a plurality of substrate supporting members disposed on the rotation shaft so as to be separated from each other, for supporting the substrate; and a first connecting member that is joined to an end portion of each of the substrate supporting members on a lower side or an upper side of the raised position, and connects the plurality of substrate supporting members, wherein the shaft member is joined to each of the substrate supporting members along the rotation shaft.
According to this configuration, the substrate support members disposed separately from each other are coupled by the shaft member along the rotation axis in addition to the first coupling member. Therefore, each substrate supporting member is supported by the shaft member in addition to the first coupling member, so that deformation due to its own weight is suppressed. In addition, the variation in the deformation amount of each substrate supporting member is suppressed, and the variation in the deformation of each substrate supporting member is suppressed. In addition, even when a rotational force is applied to the rotation shaft, deformation of each substrate supporting member due to torsion can be suppressed.
In addition, even when the pair of support plates are to be deformed, the pair of support plates and the substrate support members are supported by each other via the shaft member, so that the deformation of the pair of support plates and the substrate support members can be suppressed, and as a result, the deformation of the bracket can be suppressed.
Therefore, according to the substrate holding device of the present invention, deformation of the holder holding the substrate can be suppressed. Further, the variation in the deformation amount of each substrate supporting member can be suppressed, and the substrate can be held in a predetermined position and posture.
In the substrate processing apparatus according to the present invention, at least one of the plurality of substrate supporting members may be formed of an elongated plate material having a supporting surface for supporting one side of the substrate, and a thickness dimension from the supporting surface may be gradually reduced from the side of the joining position toward the side of the end portion in a region of at least a part between the joining position with the shaft member and the end portion on the upper side or the lower side of the standing position.
According to this configuration, in the region of at least a part of the substrate support member between the engagement position with the shaft member and the upper or lower end of the raised position, the thickness dimension from the support surface gradually decreases from the engagement position with the shaft member toward the upper end of the raised position, so that the rigidity of the substrate support member can be ensured and the substrate support member can be reduced in weight.
In the substrate processing apparatus according to the present invention, the support may further include a second coupling member that couples an end portion of the substrate support member on a lower side or an upper side of the standing position to an end portion of the substrate support member on a side different from the side coupled by the first coupling member.
According to this configuration, since the end portion of each substrate support member on the side different from the side connected to the first connecting member is connected in addition to the end portion of each substrate support member on the side connected to the first connecting member, the deformation amounts of the upper and lower end portions of each substrate support member are less likely to vary, and the occurrence of variation in deformation of the bracket can be further suppressed.
In the substrate processing apparatus according to the present invention, the substrate holding device may further include a driving device that drives the rotation operation of the holder, and the driving device may be configured to apply a rotational force to both of the shaft members outside the both ends of the holder, the rotational force rotating the shaft members in the same direction.
According to this configuration, since the rotational force is applied to the opposite sides of the support of the contrast shaft member, the support is less likely to twist, and deformation of the support can be suppressed.
The ion implantation device of the present invention comprises: a processing chamber for performing ion implantation processing on a substrate; and a substrate holding device disposed in the processing chamber,
The substrate holding device is provided with: a holder holding a substrate; a shaft member coupled to the bracket and defining a rotation axis of the bracket; and a stand support member having a pair of support plates that rotatably support the shaft member at positions outside both ends of the stand in the rotation axis direction and restrict movement of the shaft member in the rotation axis direction, the stand being movable between a reclined position and a raised position by a rotation operation about the rotation axis, the stand including: a plurality of substrate supporting members disposed on the rotation shaft so as to be separated from each other, for supporting the substrate; and a first connecting member that is joined to an end portion of each of the substrate supporting members on a lower side or an upper side of the raised position, and that connects the plurality of substrate supporting members, wherein the shaft member is joined to the plurality of substrate supporting members along the rotation shaft.
According to this configuration, the substrate support members disposed separately from each other are coupled by the shaft member along the rotation axis in addition to the first coupling member. Therefore, each substrate support member is supported by the shaft member in addition to the first coupling member, and therefore, deformation due to its own weight can be suppressed. In addition, the variation in the deformation amount of each substrate supporting member can be suppressed, and the variation in the deformation of each substrate supporting member can be suppressed. In addition, even when a rotational force is applied to the rotation shaft, deformation of each substrate supporting member due to torsion can be suppressed.
In addition, even when the pair of support plates are to be deformed, the pair of support plates and the substrate support members are supported by each other via the shaft member, so that the deformation of the pair of support plates and the substrate support members can be suppressed, and as a result, the deformation of the bracket can be suppressed.
Therefore, according to the substrate holding device of the present invention, deformation of the holder holding the substrate can be suppressed. Further, the variation in the deformation amount of each substrate supporting member can be suppressed, and the substrate can be held in a predetermined position and posture. As a result, ion implantation processing can be appropriately performed on the substrate.
According to the substrate holding device of the present invention, deformation of the holder holding the substrate can be suppressed. Further, the variation in the deformation amount of each substrate supporting member can be suppressed, and the substrate can be held in a predetermined position and posture.
Drawings
Fig. 1 is a plan view showing an ion implantation apparatus according to an embodiment of the present invention.
Fig. 2 is a front view showing a substrate holding apparatus according to the same embodiment.
Fig. 3 is a schematic side view showing the substrate holding apparatus with the stand of the embodiment in the lodged position.
Fig. 4 is a schematic side view showing the substrate holding apparatus in the standing position with the stand according to the embodiment.
Fig. 5 is a perspective view showing a stent according to the same embodiment.
Fig. 6 is a side view showing a substrate supporting member according to the same embodiment.
Fig. 7 is a front view showing a shaft member according to the same embodiment.
Fig. 8 is a front view showing an upper connecting member according to the same embodiment.
Reference numerals illustrate:
S: a substrate; IB: an ion beam; a: a rotation shaft; d: one direction; p1: a lodging position; p2: a standing position; 100: an ion implantation device; 101: a processing chamber; 102: a transport chamber; 103: a load lock chamber; 104: a conveying device; 105: a transfer device; 10: a substrate holding device; 20: a bracket; 21a to 21f: a substrate supporting member; 23: a lower connecting member; 25a to 25f: an upper tapered region; 26a to 26f: a lower tapered region; 28: an upper connecting member; 30: a shaft member; 31. 31: a shaft; 40: a bracket supporting member; 41. 41: a support plate; 50: a driving device.
Detailed Description
A substrate holding apparatus 10 and an ion implantation apparatus 100 using the substrate holding apparatus 10 according to an embodiment of the present invention will be described. The substrate holding device of the present invention is not limited to use in an ion implantation apparatus.
The ion implantation apparatus 100 of the present embodiment shown in fig. 1 is used in a process for manufacturing a flat panel display such as a liquid crystal display and an organic EL display, and is an apparatus for performing ion implantation processing on a substrate S, and the substrate S of the present embodiment is a rectangular glass substrate.
As shown in fig. 1, the ion implantation apparatus 100 is in a high vacuum state, and includes a process chamber 101 into which an ion beam IB is introduced, a transfer chamber 102 connected to the process chamber 101, and two load lock chambers 103 and 103 connected to the transfer chamber 102. The transfer chamber 102 is provided with a transfer device 104 for transferring the substrate S between the transfer chamber 102 and the load lock chambers 103 and the processing chamber 101. The conveyor 104 includes an arm 104a that conveys the substrate S in a state where the substrate S is placed thereon. The arm 104a includes a plurality of elongated fingers 104b, and the plurality of fingers 104b are positioned apart from each other in a state of being parallel to each other in the longitudinal direction. In the present embodiment, the arm 104a includes five fingers 104b, but the number of the fingers 104b is not limited to this, and may be appropriately changed according to the size of the target substrate S or the like.
In addition, a substrate holding device 10 and a transfer device 105 connected to the substrate holding device 10 are disposed inside the processing chamber 101. The transfer device 105 is configured to reciprocate the substrate holding device 10 in one direction D so that the substrate holding device 10 holding the substrate S traverses the ion beam IB introduced into the processing chamber 101.
As shown in fig. 1 and 2, the substrate holding apparatus 10 of the present embodiment includes: a holder 20 for holding the substrate S; a shaft member 30 engaged with the bracket 20; and a bracket support member 40 rotatably supporting the shaft member 30. As shown in fig. 2, the substrate holding apparatus 10 includes a driving device 50, and the driving device 50 applies a rotational force to the shaft member 30 to rotate the holder 20.
As shown in fig. 2, the rack support member 40 is coupled to the transfer device 105 disposed below the rack support member 40. The transfer device 105 includes: a slider 106 fixed to the bracket support member 40; and a guide rail 107 laid in one direction D in the processing chamber 101. The substrate holding apparatus 10 is moved in one direction D in the processing chamber 101 by the movement of the slider 106 on the guide rail 107.
The bracket 20 includes: six substrate supporting members 21a to 21f for supporting the substrate S; the lower connecting member 23 is a first connecting member connected to the substrate supporting members 21a to 21 f; and a plurality of clamps 27 for clamping the end edges of the substrate S between the substrate supporting members 21a to 21f and the lower connecting member 23. In the present embodiment, the clips 27 are arranged at four locations, but the number and arrangement positions of the clips 27 may be appropriately changed according to the size of the substrate S and the like. The clamp 27 is configured to clamp or unclamp the substrate S in conjunction with the rotation of the holder 20 by a mechanical structure not shown. In addition, the clamping member 27 is not shown in fig. 5.
As shown in fig. 7, the shaft member 30 includes: a pair of shafts 31, 31 formed at both ends in the longitudinal direction; and a joint surface 32 formed between the pair of shafts 31, 31 and joined to the substrate support members 21a to 21 f. The shaft member 30 is rotatably supported by the holder support member 40, and defines a rotation axis a of the holder 20 shown in fig. 2. More specifically, the pair of shafts 31, 31 are disposed on the rotation axis a in a straight line, and are supported by the bracket support member 40 so as to be rotatable about the rotation axis a.
As shown in fig. 2, the bracket support member 40 includes a pair of support plates 41, 41 and a bottom plate 42, and the bottom plate 42 is joined to the lower ends of the pair of support plates 41, 41. The pair of support plates 41, 41 and the bottom plate 42 are connected to each other so as to be コ -shaped (U-shaped) with an upward opening in front view, and the slider 106 of the transfer device 105 is connected to the bottom plate 42. A power source 51 of a driving device 50 described later is disposed on the base plate 42. The holder support member 40 further includes a protection plate 43, and the protection plate 43 protects the driving device 50 and a part of the link mechanism 52 connected to the driving device 50 from the ion beam IB.
The pair of support plates 41, 41 support the pair of shafts 31, 31 of the support shaft member 30 to be rotatable at positions outside both ends of the bracket 20 in the rotation axis a direction, and are fixed in a state in which movement of the shaft member 30 in the rotation axis a direction is regulated.
The driving device 50 includes a power source 51 such as a motor, and a pair of link mechanisms 52, and the pair of link mechanisms 52, 52 transmits power from the power source 51 to the shafts 31, 31 to rotate the shafts 31, 31. That is, the driving device 50 is configured to transmit the rotational motion of the power source 51 to both of the shafts 31 and 31 via the link mechanisms 52 and 52.
The holder 20 according to the present embodiment is configured to move between a resting position P1 and a standing position P2, which will be described later, by applying a rotational force from the driving device 50 to the shaft member 30 and performing a rotational operation about the rotational axis a. Fig. 3 and 4 show the reclined position P1 and the raised position P2 of the stand 20, respectively. Fig. 3 and 4 schematically show the substrate holding apparatus 10, and only a part of the holder 20 and the holder support member 40 is shown.
As shown in fig. 3, the resting position P1 of the holder 20 of the present embodiment is a position where the substrate S is placed on a horizontal plane. The lodging position P1 is a position of the support 20 used when the substrate S is transferred between the processing chamber 101 and the transfer chamber 102.
As shown in fig. 4, the stand position P2 of the stand 20 of the present embodiment is a position where the substrate S is placed on a vertical surface. The standing position P2 is a position of the holder 20 used when ion beam irradiation and ion implantation are performed on the substrate S.
The lodging position P1 and the rising position P2 are merely relative positional relationships indicating the rotational operation of the stand 20, and the above-described positions are examples, and are not limited to the lodging position P1 and the rising position P2.
As shown in fig. 2 and 5, the bracket 20 includes: six substrate support members 21a to 21f arranged in the direction of the rotation axis a so as to be separated from each other; and a lower connecting member 23 connecting the substrate supporting members 21a to 21 f. The substrate support members 21a to 21f are each formed of a long plate material having the same length and dimension, and each have support surfaces 22a to 22f as a surface for supporting one side of the substrate S. The lower connecting member 23 is also formed of a plate material, and has a support surface 23a as a surface for supporting one side of the substrate S.
The lower connecting member 23 is joined to the substrate supporting members 21a to 21f by being joined to the lower end portions of the rising positions P2 of the substrate supporting members 21a to 21 f. More specifically, the substrate support members 21a to 21f are arranged in parallel in the longitudinal direction and separated from each other in the rotation axis a direction. The support surfaces 22a to 22f of the substrate support members 21a to 21f and the support surface 23a of the lower connecting member 23 are located on the same plane. Therefore, the holder 20 can support the substrate S by the support surfaces 22a to 22f of the substrate support members 21a to 21f and the support surface 23a of the lower connecting member 23, and can release heat generated by performing a predetermined process on the substrate S from the gap formed between the substrate support members 21a to 21 f.
In the present embodiment, pins (not shown) for supporting the substrate S are disposed on the support surfaces 22a to 22f of the substrate support members 21a to 21f and on the support surface 23a of the lower connecting member 23, and the substrate support members 21a to 21f and the lower connecting member 23 support the substrate S by the pins (not shown).
As shown in fig. 2 and 5, the shaft member 30 is coupled to the bracket 20 using a bolt, not shown. More specifically, the substrate support members 21a to 21f are joined to the shaft member 30 in a region between the pair of shafts 31, 31 of the shaft member 30. In the present embodiment, the substrate support members 21a to 21f and the shaft member 30 are joined by bolts (not shown), but the joining method is not limited thereto, and may be joined by welding, for example.
As shown in fig. 7, the shaft member 30 has a joint surface 32, and the joint surface 32 is located between the pair of shafts 31, 31 and is a surface on the joint side with the respective substrate support members 21a to 21 f. The joint surface 32 includes a plurality of wall portions 33, and the plurality of wall portions 33 are positioned so as to sandwich the substrate support members 21a to 21f on both sides in the rotation axis a direction in a state where the substrate support members 21a to 21f are joined to the joint surface 32. When the substrate support members 21a to 21f are joined to the shaft member 30, the wall portion 33 is used for positioning the substrate support members 21a to 21f with respect to the shaft member 30. After the substrate support members 21a to 21f are joined to the shaft member 30, the wall portion 33 restricts deformation of the substrate support members 21a to 21f in the direction of the rotation axis a. In addition, the wall portion 33 is not necessarily constituted.
As shown in fig. 5, each of the substrate support members 21a to 21f has upper tapered regions 25a to 25f in a partial region between the engagement position with the shaft member 30 and the upper end of the standing position P2. The upper tapered regions 25a to 25f have a shape in which the thickness dimension from the support surfaces 22a to 22f of the substrate support members 21a to 21f gradually decreases from the side of the joint position with the shaft member 30 toward the upper end of the standing position P2. The substrate support members 21a to 21f have the upper tapered regions 25a to 25f, whereby rigidity can be ensured, and the substrate support members 21a to 21f can be reduced in weight.
Similarly, each of the substrate support members 21a to 21f has lower tapered regions 26a to 26f in a partial region between the engagement position with the shaft member 30 and the lower end of the standing position P2. The lower tapered regions 26a to 26f have a shape in which the thickness dimension from the support surfaces 22a to 22f of the substrate support members 21a to 21f gradually decreases from the side of the joint position with the shaft member 30 toward the lower end of the standing position P2.
The substrate support members 21a to 21f have the lower tapered regions 26a to 26f, so that rigidity can be ensured, and the substrate support members 21a to 21f can be reduced in weight. In the present embodiment, the substrate support members 21a to 21f have the same shape in side view, and the upper tapered regions 25a to 25f and the lower tapered regions 26a to 26f are formed in the entire substrate support members 21a to 21f, respectively, but the present invention is not limited thereto. For example, the substrate support members 21a to 21f may have only one of the upper tapered regions 25a to 25f and the lower tapered regions 26a to 26f, and the presence or absence of formation of the upper tapered regions 25a to 25f and the lower tapered regions 26a to 26f may be changed for each of the substrate support members 21a to 21 f.
Fig. 6 shows a side surface of the substrate support member 21 a. As described above, the substrate support member 21a includes the upper tapered region 25a and the lower tapered region 26a formed so that the thickness dimension from the support surface 23a decreases from the side of the joint position with the shaft member 30 toward the both end portions.
As shown by diagonal lines in fig. 6, a reinforcing member 29 made of Carbon Fiber Reinforced Plastic (CFRP) is embedded in the substrate support member 24a, so that the rigidity of the substrate support member 21a is ensured and the weight is reduced. The reinforcing member 29 is embedded in the other substrate supporting members 21b to 21f in the same manner. In addition, the reinforcing member 29 is not necessary. The reinforcing member 29 may be embedded in only a part of the substrate support members 21b to 21f, and whether or not to use the reinforcing member 29 may be determined according to the rigidity and weight of each of the substrate support members 21b to 21 f.
As shown in fig. 2 and 5, the stand 20 of the present embodiment further includes an upper connecting member 28, and the upper connecting member 28 is a second connecting member that connects the upper end portions of the standing positions P2 of the substrate support members 21a to 21 f. The upper connecting member 28 is joined to the substrate supporting members 21a to 21f by bolts (not shown) on the surfaces of the substrate supporting members 21a to 21f opposite to the supporting surfaces 22a to 22 f.
As shown in fig. 8, the upper connecting member 28 is formed by bending an elongated plate material, and includes joint regions 28a joined to the substrate support members 21a to 21f and connecting regions 28b formed between the joint regions 28 a. The upper connecting member 28 is configured to avoid interference with the finger 104b for mounting the substrate S, as will be described later, in a state where the bracket is located at the resting position P1, and the connecting region 28b is located below the joint region 28 a.
In the present embodiment, the first connecting member is the lower connecting member 23, and the second connecting member is the upper connecting member 28, but the following may be used instead: the first connecting member connects the upper end portions of the rising positions P2 of the substrate supporting members 21a to 21f, and the second connecting member connects the lower end portions of the rising positions P2 of the substrate supporting members 21a to 21 f.
In the substrate holding apparatus 10 of the present embodiment, the substrate support members 21a to 21f constituting the holder 20 and disposed separately from each other are coupled along the rotation axis a by the shaft member 30 in addition to the lower coupling member 23. Therefore, the deformation of each of the substrate supporting members 21a to 21f due to its own weight can be suppressed. In addition, the deformation amounts of the substrate support members 21a to 21f are less likely to vary, and the deformation of the substrate support members 21a to 21f can be suppressed from varying.
In addition, even when a rotational force is applied to the rotation axis a, deformation of the substrate support members 21a to 21f due to torsion can be suppressed. Even when the pair of support plates 41, 41 of the support bracket 20 are to be deformed, the shaft member 30 is coupled to the substrate support members 21a to 21f, and therefore the shaft member 30 and the pair of support plates 41, 41 support each other, whereby the deformation of the pair of support plates 41, 41 and the substrate support members 21a to 21f can be suppressed. Therefore, the substrate holding device 10 according to the present embodiment can suppress deformation of the holder 20, and can suppress variation in deformation of the substrate support members 21a to 21 f.
More specifically, as shown in fig. 2, the bracket 20 and the pair of support plates 41, 41 are supported by both ends of the bottom plate 42 in the direction of the rotation axis a. Therefore, assuming that stress concentrates on both end portions of the bottom plate 42, the bottom plate 42 is deformed such that both end portions warp downward. In this way, if the bottom plate 42 is warped, the pair of support plates 41, 41 deform so as to open to each other to the outside in the rotation axis a direction along with the deformation of the bottom plate 42. Further, if the pair of support plates 41, 41 are deformed as described above, stress is transmitted to the substrate support members 21a, 21f, particularly the substrate support members 21a, 21f located on the outer sides, via the shafts 31, and the substrate support members 21a, 21f are also deformed so as to open to each other on the outer sides in the rotation axis a direction.
In contrast, in the holder 20 of the present embodiment, the shaft member 30 is supported in a state of being coupled to the substrate support members 21a to 21f with the movement in the rotation axis a direction being restricted by the pair of support plates 41, and therefore the pair of support plates 41, 41 and the substrate support members 21a to 21f are mutually supported via the shaft member 30, and deformation of the holder 20 and the pair of support plates 41, 41 of the holder support member 40 and the bottom plate 42 can be suppressed.
Further, since the substrate support members 21a to 21f are connected by the upper connecting member 28, the deformation amount of the upper end portion of the rising position P2 of each of the substrate support members 21a to 21f becomes less likely to vary, and the deformation amount of each of the substrate support members 21a to 21f can be suppressed from varying.
In the substrate holding device 10 of the present embodiment, the driving device 50 applies a rotational force to the pair of shafts 31, that is, to both sides outside both ends of the bracket 20 about the rotation axis a, to rotate the shaft member 30 in the same direction. Therefore, torsion is less likely to occur in the stent 20, and deformation of the stent 20 can be further suppressed.
Further, it is assumed that if a large torsion is generated in the bracket 20, the pair of shafts 31, 31 is slightly deviated from the rotation axis a. In this case, since the shaft member 30 becomes difficult to rotate, a load is applied to the power source 51. In contrast, in the present embodiment, by applying a rotational force to both of the pair of shafts 31 and 31, deformation of the bracket 20 and the shaft member 30 due to torsion can be suppressed, and load applied to the power source 51 can also be suppressed.
The substrate support members 21a to 21f constituting the holder 20 of the substrate holding device 10 are provided with the upper tapered regions 25a to 25f and 26a to 26f, respectively, so that the substrate support members 21a to 21f can ensure rigidity and can be made lightweight. That is, the bracket 20 is lightweight, and deformation of the bracket 20 is suppressed.
As described above, in the holder 20 of the present embodiment, the substrate support members 21a to 21f constituting the holder 20 are coupled by the shaft member 30 and the upper coupling member 28 in addition to the lower coupling member 23, so that the occurrence of variation in the deformation amounts of the substrate support members 21a to 21f can be suppressed. The shaft member 30 is coupled to the substrate support members 21a to 21f along the rotation axis a, and is supported in a state in which the movement in the rotation axis a direction is restricted by the pair of support plates 41, 41 of the bracket support member 40. Accordingly, the pair of support plates 41, 41 and the shaft member 30 are in a mutually supported state, and as a result, the pair of support plates 41, 41 and the substrate support members 21a to 21f are in a mutually supported state by the shaft member 30, whereby deformation of the bracket 20 is suppressed. That is, in the substrate holding device 10 of the present embodiment, deformation of the holder 20 holding the substrate S is suppressed. Further, the deformation amount of each of the substrate support members 21a to 21f can be suppressed from being varied, and the substrate S can be held in a predetermined position and posture. As a result, the substrate S can be held at a predetermined position and posture, and predetermined processing such as ion implantation can be appropriately performed on the substrate S.
Next, an operation of the ion implantation apparatus 100 according to the present embodiment will be described with reference to fig. 1.
In the ion implantation apparatus 100, a substrate S is first carried into a load lock chamber 103, which is placed in one of the chambers at atmospheric pressure, from the outside. Then, the interior of the load lock chamber 103 is evacuated, and the substrate S is carried into the processing chamber 101 through the transfer chamber 102 by the transfer device 104. In the process chamber 101, the substrate S is held on the holder 20 of the substrate holding device 10. At this time, the holder 20 is positioned at the lodging position P1, and the substrate S is placed on the holder 20 in a state in which the surface Sa to be processed of the substrate S to be irradiated with the ion beam IB is directed upward. More specifically, the substrate S is carried into the processing chamber 101 by the drive arm 104a in a state of being placed on the finger 104 b.
Thereafter, the fingers 104b on which the substrates S are mounted are gradually lowered from above the holder 20, and the substrates S are mounted on the support surfaces 22a to 22f of the substrate support members 21a to 21f by operating such that the fingers 104b are positioned in the gaps between the substrate support members 21a to 21 f.
Then, the stand 20 is rotated by the rotational force applied from the driving device 50, and is moved to the standing position P2. At the standing position P2, the surface to be processed Sa of the substrate S is oriented toward the ion beam IB introduced into the processing chamber 101.
Then, in a state where the holder 20 is positioned at the standing position P2, that is, in a state where the substrate holding device 10 faces the processed surface Sa of the substrate S toward the ion beam IB, the substrate holding device 10 is driven by the transfer device 105 to move in one direction D so as to traverse the ion beam IB. During this period, the surface to be processed Sa of the substrate S traverses the ion beam IB, and ion implantation is performed on the substrate S. In the ion implantation apparatus 100 of the present embodiment, the substrate S held by the substrate holding apparatus 10 is ion-implanted while traversing the ion beam IB at a time, but the substrate holding apparatus 10 may be configured to reciprocate along one direction D to traverse the ion beam IB a plurality of times.
After the ion implantation process is performed on the substrate S, the support 20 performs a return rotation operation, and moves from the standing position P2 to the resting position P1. Thereafter, the wafer is carried out to the outside through the transfer chamber 102 and the load lock chamber 103 by the transfer device 104 or the like.
Since the ion implantation apparatus 100 of the present embodiment includes the substrate holding apparatus 10, the ion beam IB can be irradiated onto the substrate S while the substrate S is held by the holder 20 in a predetermined position and posture, and the ion implantation process can be appropriately performed on the substrate S.
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.
Claims (4)
1. A substrate holding apparatus for an ion implantation apparatus, characterized in that,
The substrate holding device is provided with:
a holder holding a substrate;
A shaft member coupled to the bracket and defining a rotation axis of the bracket; and
A bracket support member having a pair of support plates that support the shaft member rotatably at positions outside both ends of the bracket in the rotation axis direction and restrict movement of the shaft member in the rotation axis direction,
The support is movable between a lodging position and a standing position by a rotation action taking the rotation shaft as a center, the standing position irradiates the substrate held by the support with ion beams,
The stent has:
a plurality of substrate supporting members disposed on the rotation shaft so as to be separated from each other, for supporting the substrate; and
A first connecting member that is joined to an end portion of each of the substrate supporting members on a lower side or an upper side of the standing position and connects the plurality of substrate supporting members,
The shaft member is engaged with each of the substrate supporting members along the rotation shaft,
The substrate holding device further has a driving device that drives the rotational motion of the holder,
The driving device is configured to apply a rotational force to both of the shaft members outside the both ends of the bracket, the rotational force rotating the shaft members in the same direction.
2. The substrate holding apparatus according to claim 1, wherein,
At least one of the plurality of substrate supporting members is constituted by an elongated plate material having a supporting surface for supporting one side of the substrate,
In a region of at least a part between an engagement position with the shaft member and an end portion on an upper side or a lower side of the raised position, a thickness dimension from the support surface becomes gradually smaller from the engagement position side toward the end portion side.
3. The substrate holding apparatus according to claim 1 or 2, wherein,
The bracket further includes a second coupling member that couples one of the lower or upper ends of the standing positions of the substrate support members to the end of the side different from the side coupled by the first coupling member.
4. An ion implantation apparatus, characterized in that,
The ion implantation apparatus includes: a processing chamber for performing ion implantation processing on a substrate; and a substrate holding device disposed in the processing chamber,
The substrate holding device is provided with:
a holder holding a substrate;
A shaft member coupled to the bracket and defining a rotation axis of the bracket; and
A bracket support member having a pair of support plates that support the shaft member rotatably at positions outside both ends of the bracket in the rotation axis direction and restrict movement of the shaft member in the rotation axis direction,
The support is movable between a lodging position and an erect position by a rotational motion about the rotational axis,
The stent has:
a plurality of substrate supporting members disposed on the rotation shaft so as to be separated from each other, for supporting the substrate; and
A first connecting member that is joined to an end portion of each of the substrate supporting members on a lower side or an upper side of the standing position and connects the plurality of substrate supporting members,
The shaft member is engaged with the plurality of substrate supporting members along the rotation shaft,
The substrate holding device further has a driving device that drives the rotational motion of the holder,
The driving device is configured to apply a rotational force to both of the shaft members outside the both ends of the bracket, the rotational force rotating the shaft members in the same direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020154970A JP7163944B2 (en) | 2020-09-15 | 2020-09-15 | Substrate holder and ion implanter |
| JP2020-154970 | 2020-09-15 |
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| Publication Number | Publication Date |
|---|---|
| CN114188202A CN114188202A (en) | 2022-03-15 |
| CN114188202B true CN114188202B (en) | 2024-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110715711.7A Active CN114188202B (en) | 2020-09-15 | 2021-06-25 | Substrate holding device and ion implantation device |
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| CN (1) | CN114188202B (en) |
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Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100528810B1 (en) * | 2004-05-19 | 2005-11-15 | 주식회사 디엠에스 | Apparatus for transferring works |
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| JP2002083854A (en) * | 1999-07-09 | 2002-03-22 | Tokyo Electron Ltd | Substrate carrying apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN114188202A (en) | 2022-03-15 |
| JP2022048909A (en) | 2022-03-28 |
| JP7163944B2 (en) | 2022-11-01 |
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