CN114158189A - Manufacturing method for improving oil dropping of PAD edge of tin plate - Google Patents
Manufacturing method for improving oil dropping of PAD edge of tin plate Download PDFInfo
- Publication number
- CN114158189A CN114158189A CN202111264095.4A CN202111264095A CN114158189A CN 114158189 A CN114158189 A CN 114158189A CN 202111264095 A CN202111264095 A CN 202111264095A CN 114158189 A CN114158189 A CN 114158189A
- Authority
- CN
- China
- Prior art keywords
- plate
- super
- controlled
- improving
- washing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 239000005028 tinplate Substances 0.000 title claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 36
- 238000007788 roughening Methods 0.000 claims abstract description 34
- 239000003814 drug Substances 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 23
- 229910000679 solder Inorganic materials 0.000 claims abstract description 16
- 238000005406 washing Methods 0.000 claims description 38
- 239000010949 copper Substances 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 238000007654 immersion Methods 0.000 claims description 13
- 238000000227 grinding Methods 0.000 claims description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 6
- 230000001680 brushing effect Effects 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 27
- 230000007547 defect Effects 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000861 blow drying Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a manufacturing method for improving oil dropping of a PAD edge of a tin plate, which is characterized in that a board is subjected to super-roughening treatment before a solder mask is manufactured on a production board, and a super-roughening cylinder in the super-roughening treatment is internally added with 1.3 +/-0.3L of liquid medicine every time a production board with the size of 400 square inches is produced, so that Cu in the liquid medicine in the super-roughening cylinder2+The content is controlled to be 10-35 g/L. The method optimizes the technological process parameters, and improves the oil dropping problem of the PAD edge of the tin plate by optimizing the activity of the super-coarsening liquid medicine and the proportion of the liquid medicine.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method for improving oil dropping of a PAD edge of a tin plate.
Background
The tin deposition is one of PCB surface treatment processes, and aims to deposit a metal tin coating on the surface of a bonding pad in a chemical mode, protect the bonding pad from being oxidized and ensure good solderability. The tin deposition process flow is as follows:
upper plate → degreasing → first-stage washing → second-stage washing → third-stage washing → microetching → first-stage washing → second-stage washing → third-stage washing → pre-immersion tin → post-immersion tin → thiourea washing → LONIXSF washing → second-stage hot washing → third-stage hot washing → lower plate.
The problem of PAD edge oil drop (solder resist ink peeling) often occurs due to the attack of the liquid medicine on the solder resist ink in the tin immersion process, and the solder resist ink with tin immersion resistance is generally used at presentThe novel super-roughening liquid medicine is used for treating the PCB, so that the binding force between the ink and the copper surface is improved, the two methods are high in production cost and cannot thoroughly solve the problem of solder resistance and oil dropping of the PAD edge, and the production quality and the delivery period are seriously influenced; factors affecting the super-roughening effect: concentration of liquid medicine, Cu2+Content, micro-etching amount, pressure of a liquid medicine tank and a water washing tank, temperature of the liquid medicine tank, plate grinding speed, drying temperature and the like.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a manufacturing method for improving the oil dropping of the PAD edge of the tin plate, which optimizes the technological process parameters and improves the oil dropping problem of the PAD edge of the tin plate by optimizing the activity and the liquid medicine proportion of the super-coarsening liquid medicine.
In order to solve the technical problem, the invention provides a manufacturing method for improving oil dropping of a PAD edge of a tin plate, wherein a plate is subjected to super-roughening treatment before a solder mask is manufactured on a production plate, and a super-roughening cylinder in the super-roughening treatment is internally added with 1.3 +/-0.3L of liquid medicine every time a production plate with the size of 400 square inches is produced, so that Cu in the liquid medicine in the super-roughening cylinder2+The content is controlled to be 10-35 g/L.
Further, the microetching during the super-roughening treatment was controlled to 1.0 to 1.5. mu.m.
Further, the temperature of the super-coarsening cylinder is controlled to be 24 +/-4 ℃, and the pressure is controlled to be 1.5 +/-0.5 kg/cm2(ii) a And the rotating speed of the super-roughening cylinder is controlled to be 2200 +/-200 rpm.
Further, the liquid medicine is ultra-coarse cylinder opening liquid with the model number of BTH-2085A.
Further, the super-roughening treatment sequentially comprises the following steps: brushing, oil removal, overflow washing, super coarsening, overflow washing, ultrasonic washing, hydrochloric acid washing, overflow washing, ultrasonic washing, pressurized washing, water absorption sponge, strong wind drying and hot wind drying.
Furthermore, the width of the grinding trace is controlled to be 1.0-1.6cm during grinding and brushing.
Further, sulfuric acid with the concentration of 3-5% is adopted during oil removal, the temperature of an oil removal cylinder is controlled to be 28 +/-2 ℃, and the pressure is controlled to be 1.5 +/-0.5 kg/cm2。
Further, in the above-mentioned case,the pressure of overflow water washing is 1.0-3.0kg/cm2The pressure during ultrasonic water washing is 1.0-2.0kg/cm2。
Further, the wind speed is 120m/s when the strong wind blows dry; the temperature of hot air is controlled to be 85 +/-5 ℃.
Furthermore, the thick copper plate is a multilayer plate formed by pressing an inner core plate and an outer copper foil into a whole through a prepreg, and the multilayer plate is subjected to the working procedures of drilling, copper deposition, full-plate electroplating and outer circuit manufacturing in sequence.
Compared with the prior art, the invention has the following beneficial effects:
the method optimizes the technological process parameters, so that 1.3 +/-0.3L of liquid medicine is added into the super-coarsening cylinder when each 400 square inch of production plate is produced, and the Cu of the liquid medicine in the super-coarsening cylinder is ensured2+The content is controlled to be 10-35g/L, so that the coarsening of the board is kept stable all the time, and a uniform coarsening layer is generated on the board surface, so that the binding force of the printing ink and the board surface is enhanced, the stability of the production quality is improved, the yield and the delivery period are ensured, the rework cost is avoided, the production efficiency is improved, and the problem of oil falling of the PAD edge of the tin plate is solved by optimizing the activity of the super-coarsening liquid medicine and the proportion of the liquid medicine; in addition, the micro-etching amount during the super-roughening is increased from the original 0.7 mu m to 1.0-1.5 mu m, the plate surface is further roughened, and the bonding force between the later stage and the solder resist ink is improved.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The method for manufacturing the circuit board shown in this embodiment can improve the problem of oil dropping at the PAD edge of the tin plate, and sequentially comprises the following processing steps:
(1) cutting: the core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 0.5mm, and the thickness of the copper layers on the two surfaces of the core board is 0.5 oz.
(2) Inner layer circuit manufacturing (negative film process): transferring the inner layer pattern, coating a photosensitive film with a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 μm, completing the exposure of the inner layer circuit by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers), and forming the inner layer circuit pattern after development; etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And (3) laminating: and (3) brown-oxidizing at the speed of brown-oxidizing according to the thickness of the bottom copper, sequentially laminating the core plate, the prepreg and the outer copper foil according to requirements, and then pressing the laminated plate by selecting proper lamination conditions according to the Tg of the plate to form the production plate.
(4) Drilling: according to the existing drilling technology, drilling processing is carried out on the production plate according to design requirements.
(5) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(6) Electroplating the whole plate: and performing full-plate electroplating for 120min at the current density of 18ASF to increase the thickness of the hole copper and the plate surface copper layer.
(7) Manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, then respectively plating copper and tin on the production plate, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board, wherein the copper thickness of the outer layer circuit is more than or equal to 70 mu m; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(8) And super-roughening treatment: the method sequentially comprises the following steps: the method comprises the following steps of grinding and brushing → oil removal → overflow water washing (1, 2) → super-coarsening → overflow water washing (3) → ultrasonic water washing (1) → hydrochloric acid washing → overflow water washing (4) → ultrasonic water washing (2) → pressurized water washing → absorbent sponge → strong wind drying → hot wind drying.
In the method, the width of the grinding mark is controlled to be 1.0-1.6cm during grinding and brushing, and the binding force between the later plate surface and the solder resist ink can be effectively improved by improving the sufficiently wide grinding mark; the oil removal is carried out by using 3-5% sulfuric acid, controlling the temperature of oil removal cylinder at 28 + -2 deg.C and the pressure at 1.5 + -0.5 kg/cm2So as to sequentially remove the grease on the board surface and oxidize through scrubbing and degreasing; the pressure of overflow water washing is 1.0-3.0kg/cm2The pressure during ultrasonic water washing is 1.0-2.0kg/cm2(ii) a The concentration of HCL in the pickling cylinder during pickling with hydrochloric acid is 8-12%, CU2+The content is less than 2g/L, the temperature of the pickling cylinder is controlled at 24 +/-4 ℃, and the pressure is controlled at 1.0-2.0kg/cm2(ii) a The cooperation of the parameters is improved, so that the coarsening quality of the board surface and the quality of the board can be effectively improved, and the binding force between the board surface and the solder resist ink in the later period is improved.
In addition, the super-roughening cylinder in super-roughening adds 1.3 +/-0.3L of liquid medicine into the cylinder when producing a production plate with the thickness of 400 square inches, so that Cu of the liquid medicine in the super-roughening cylinder2+The content is controlled at 10-35g/L, the micro-erosion amount during super-roughening is controlled at 1.0-1.5 μm, the temperature of the super-roughening cylinder is controlled at 24 + -4 deg.C, and the pressure is controlled at 1.5 + -0.5 kg/cm2And the rotating speed of the super-roughening cylinder is controlled to be 2200 +/-200 rpm.
Furthermore, the liquid medicine in the super-coarsening cylinder adopts super-coarsening cylinder opening liquid with the model number of BTH-2085A.
When strong wind blows, 3 pairs of air knives are adopted, the wind speed is 120m/s, and the air knives are used for blowing out water in holes in the plate so as to prevent the plate surface from forming new oxidation points in a hot wind blowing section; the temperature during hot air blow-drying is controlled at 85 +/-5 ℃, and the aim is to dry water vapor on the PCB surface and in the holes so as to avoid water marks on the PCB surface.
A liquid medicine adding groove is formed in one side of the super-roughening cylinder, the super-roughening cylinder is communicated with the liquid medicine adding groove through a pipeline, and an air outlet is formed in the pipeline; in the prior art, an adding pipeline from a liquid medicine adding groove to a super-roughening cylinder is not provided with an exhaust port, so that a siphoning phenomenon can occur in the liquid medicine adding process, namely, a solution in the liquid medicine adding groove can be pumped to the super-roughening cylinder without an automatic adding instruction, so that the liquid medicine is disordered due to the overlarge adding amount of the liquid medicine adding liquid, and the micro-roughening effect is poor; through set up the gas vent on the pipeline in this embodiment in order to avoid leading to liquid medicine to add excessive problem because of the siphon, improve production quality stability.
(9) Solder resist and silk screen printing of characters: after the solder resist ink is printed on the surface of the production board in a silk-screen manner, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, the TOP surface solder resist ink is added with a UL mark on the TOP surface character, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need welding, and the protective layer plays a role in beautifying the appearance.
(10) Surface treatment (tin deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a tin layer with certain required thickness is uniformly deposited, and the thickness of the tin layer is as follows: 3-5 μm.
(11) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(12) And forming: according to the prior art and according to the design requirement, routing the shape, and obtaining the circuit board with the external tolerance of +/-0.05 mm.
(13) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the circuit board is inspected, if a defect exists, the circuit board is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(14) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.
(15) And packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. The manufacturing method for improving oil dropping of the PAD edge of the tin plate is characterized in that the plate is subjected to super-roughening treatment before a solder mask is manufactured on a production plate, and a super-roughening cylinder in the super-roughening treatment is internally added with 1.3 +/-0.3L of liquid medicine every time a production plate with the size of 400 square inches is produced, so that Cu in the liquid medicine in the super-roughening cylinder2+The content is controlled to be 10-35 g/L.
2. The method as claimed in claim 1, wherein the micro-etching amount during the super-roughening treatment is controlled to be 1.0-1.5 μm.
3. The method for improving the edge oil dropping of the PAD of the tin immersion plate as claimed in claim 1, wherein the temperature of the super-roughening cylinder is controlled to 24 ± 4 ℃ and the pressure is controlled to 1.5 ± 0.5kg/cm2(ii) a And the rotating speed of the super-roughening cylinder is controlled to be 2200 +/-200 rpm.
4. The manufacturing method for improving the edge oil dropping of the tin immersion plate PAD as claimed in claim 1, wherein the liquid medicine is an ultra-coarse cylinder opening liquid with a model number of BTH-2085A.
5. The method for improving the oil dropping of the PAD edge of the tin plate as claimed in claim 1, wherein the super-roughening treatment comprises the following steps in sequence: brushing, oil removal, overflow washing, super coarsening, overflow washing, ultrasonic washing, hydrochloric acid washing, overflow washing, ultrasonic washing, pressurized washing, water absorption sponge, strong wind drying and hot wind drying.
6. The manufacturing method for improving the oil dropping of the PAD edge of the tin immersion plate as claimed in claim 5, wherein the width of a grinding mark is controlled to be 1.0-1.6cm during grinding.
7.The method for improving the edge oil shedding of the PAD of the tin immersion plate as claimed in claim 5, wherein sulfuric acid with a concentration of 3-5% is used for oil shedding, the temperature of the oil removing cylinder is controlled at 28 ± 2 ℃, and the pressure is controlled at 1.5 ± 0.5kg/cm2。
8. The method for improving the edge oil dropping of the PAD of the tin immersion plate as claimed in claim 1, wherein the pressure of the overflow washing is 1.0-3.0kg/cm2The pressure during ultrasonic water washing is 1.0-2.0kg/cm2。
9. The manufacturing method for improving the oil dropping of the PAD edge of the tin immersion plate as claimed in claim 1, wherein the wind speed when the tin immersion plate is dried by strong wind is 120 m/s; the temperature of hot air is controlled to be 85 +/-5 ℃.
10. The manufacturing method for improving the oil dropping of the PAD edge of the tin immersion plate as claimed in claim 1, wherein the thick copper plate is a multi-layer plate formed by laminating an inner core plate and an outer copper foil into a whole through a prepreg, and the multi-layer plate is subjected to the processes of drilling, copper immersion, full-plate electroplating and outer circuit manufacturing in sequence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111264095.4A CN114158189A (en) | 2021-10-27 | 2021-10-27 | Manufacturing method for improving oil dropping of PAD edge of tin plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111264095.4A CN114158189A (en) | 2021-10-27 | 2021-10-27 | Manufacturing method for improving oil dropping of PAD edge of tin plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114158189A true CN114158189A (en) | 2022-03-08 |
Family
ID=80459183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111264095.4A Pending CN114158189A (en) | 2021-10-27 | 2021-10-27 | Manufacturing method for improving oil dropping of PAD edge of tin plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114158189A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013089863A (en) * | 2011-10-20 | 2013-05-13 | Hitachi Chemical Co Ltd | Manufacturing method of printed wiring board |
| CN104737629A (en) * | 2013-07-15 | 2015-06-24 | 深圳崇达多层线路板有限公司 | Resistance welding pretreatment process and preparation process of high-frequency PCB |
| CN104918417A (en) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | Method for producing organic solderability preservative on surface of circuit board |
| CN105376958A (en) * | 2015-11-13 | 2016-03-02 | 广州兴森快捷电路科技有限公司 | Circuit board surface treatment method |
| CN110987773A (en) * | 2019-11-18 | 2020-04-10 | 大连崇达电子有限公司 | Micro-etching testing method of circuit board |
| CN112133640A (en) * | 2020-11-24 | 2020-12-25 | 宁波康强电子股份有限公司 | Preparation method of lead frame with rough side wall |
-
2021
- 2021-10-27 CN CN202111264095.4A patent/CN114158189A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013089863A (en) * | 2011-10-20 | 2013-05-13 | Hitachi Chemical Co Ltd | Manufacturing method of printed wiring board |
| CN104737629A (en) * | 2013-07-15 | 2015-06-24 | 深圳崇达多层线路板有限公司 | Resistance welding pretreatment process and preparation process of high-frequency PCB |
| CN104918417A (en) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | Method for producing organic solderability preservative on surface of circuit board |
| CN105376958A (en) * | 2015-11-13 | 2016-03-02 | 广州兴森快捷电路科技有限公司 | Circuit board surface treatment method |
| CN110987773A (en) * | 2019-11-18 | 2020-04-10 | 大连崇达电子有限公司 | Micro-etching testing method of circuit board |
| CN112133640A (en) * | 2020-11-24 | 2020-12-25 | 宁波康强电子股份有限公司 | Preparation method of lead frame with rough side wall |
Non-Patent Citations (1)
| Title |
|---|
| 天津大学等院校合编: "化工仪表及自动化", 31 July 1961, 中国工业出版社, pages: 319 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111642071B (en) | Circuit board and method for improving board explosion and copper sheet foaming of circuit board | |
| CN110802963B (en) | Character processing method for PCB (printed circuit board) super-thick copper plate | |
| CN114158195B (en) | Method for manufacturing precise circuit with assistance of laser | |
| CN110839319A (en) | Method for manufacturing high-precision impedance circuit | |
| CN111182738B (en) | Method for manufacturing characters on large copper surface of PCB | |
| CN111867266A (en) | Circuit design method for preventing short circuit of isolated circuit of PCB | |
| CN111107715A (en) | Manufacturing method of HDI plate back drilling hole | |
| CN110602890A (en) | Manufacturing method of negative film circuit board with step circuit | |
| CN112954903A (en) | Ultrathin high-density printed board and manufacturing method thereof | |
| CN111741615B (en) | Method for pressing and filling glue of blind hole with high thickness-diameter ratio | |
| CN111601461A (en) | Improvement method for no copper of circuit board hole | |
| CN110785013A (en) | Manufacturing method for improving foaming and explosion of circuit board | |
| CN114040598A (en) | Method for removing flash of metalized half hole of electric gold plate | |
| CN114126260A (en) | Manufacturing method of ultra-thick copper PCB with 6oz inner layer and 12oz outer layer | |
| CN113660794A (en) | Manufacturing method of high-reliability printed circuit board | |
| CN101534608A (en) | Manufacturing method of flexible circuit board | |
| CN114158189A (en) | Manufacturing method for improving oil dropping of PAD edge of tin plate | |
| CN107371334A (en) | A kind of method for preventing from forming film print on solder mask | |
| CN115003039A (en) | Thick copper HDI circuit board and manufacturing method of fine circuit thereof | |
| CN113973440A (en) | Circuit board insulating layer treatment process | |
| CN111315141B (en) | Method for manufacturing explosion-proof plate of thick plate and thick copper plate, thick plate and thick copper plate | |
| CN111465202A (en) | Drilling machining method for improving precision of gong platform | |
| CN112969287A (en) | Method for improving roughness of pore wall of PTFE (polytetrafluoroethylene) material | |
| CN105282989A (en) | Manufacturing method of windowed rigid-flex PCB | |
| CN111757603B (en) | Processing method for improving oxidation of small PCS (process control System) plate metal surface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |