CN114141926A - Packaging method of light emitting diode - Google Patents
Packaging method of light emitting diode Download PDFInfo
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- CN114141926A CN114141926A CN202010916472.7A CN202010916472A CN114141926A CN 114141926 A CN114141926 A CN 114141926A CN 202010916472 A CN202010916472 A CN 202010916472A CN 114141926 A CN114141926 A CN 114141926A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000000853 adhesive Substances 0.000 claims abstract description 39
- 230000001070 adhesive effect Effects 0.000 claims abstract description 39
- 239000011324 bead Substances 0.000 claims abstract description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 239000000741 silica gel Substances 0.000 claims abstract description 9
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 9
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 239000004332 silver Substances 0.000 claims abstract description 8
- 238000005520 cutting process Methods 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 29
- 239000003292 glue Substances 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000001723 curing Methods 0.000 abstract 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 24
- 239000004800 polyvinyl chloride Substances 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000005431 greenhouse gas Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000009516 primary packaging Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000009517 secondary packaging Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a packaging method of a light emitting diode. The method comprises the steps of fixing an LED chip on an LED support base through a double-sided adhesive PVC film, communicating an electrode of the LED chip with a support through a conductive lead, and finally packaging, curing and cutting through epoxy resin adhesive or silica gel. The invention does not use conductive silver adhesive or insulating adhesive, and because the double-sided adhesive PVC film, the epoxy resin adhesive or the silica gel are insulating, the invention can effectively avoid the occurrence of electric leakage and the influence on the light-emitting efficiency. The method is simple to operate, and the LED lamp bead yield is high.
Description
Technical Field
The invention relates to a packaging method of a light emitting diode, belonging to the technical field of photoelectronics.
Background
The LED is used as a new illumination light source in the 21 st century, and under the same brightness, the power consumption of a semiconductor lamp is only l/10 of that of a common incandescent lamp, but the service life of the semiconductor lamp can be prolonged by 100 times. The LED device is a cold light source, has high light efficiency, low working voltage, low power consumption and small volume, can be packaged in a plane, is easy to develop light and thin products, has firm structure and long service life, does not contain harmful substances such as mercury, lead and the like in the light source, does not have infrared and ultraviolet pollution, and does not generate pollution to the outside in production and use. Therefore, the semiconductor lamp has the characteristics of energy conservation, environmental protection, long service life and the like, and like the transistor replaces the electron tube, the semiconductor lamp replaces the traditional incandescent lamp and the traditional fluorescent lamp, and the trend is also great. From the viewpoint of saving electric energy, reducing greenhouse gas emission and reducing environmental pollution, the LED serving as a novel lighting source has great potential for replacing the traditional lighting source.
CN103236486A provides an LED packaging method, which includes: coating a layer of chip adhesive on the top surface of the bearing plate, and fixing the LED chip to be packaged on the bearing plate through the adhesive; welding gold wires on the LED chips; coating the LED chip and the gold thread on the bearing plate by using first packaging adhesive; after the first packaging adhesive is solidified, separating the first packaging adhesive layer, the LED chip and the gold thread from the bearing plate; and a second packaging adhesive layer is wrapped around the first packaging adhesive layer. Because the light reflection of the bearing plate is avoided, the LED packaging method, the packaging structure and the LED lamp using the packaging structure have the advantage of higher light emitting efficiency. The invention provides only a method for improving the light extraction efficiency. The thickness of the adhesive for bonding the chip to the bearing plate is not easy to operate, and the possibility of electric leakage or influence on light emitting efficiency can be caused. And the packaging method has the disadvantages of difficult primary packaging and separation technology, secondary packaging and complex process.
When the light-emitting diode is packaged into the LED lamp bead, the LED chip is usually fixed by conductive silver adhesive or insulating glue, and the problems of too much glue dispensing amount, electric leakage of the lamp bead or influence on light emitting efficiency and the like are easily caused because the glue dispensing amount is not well controlled in the production process, so that the packaged finished product is not qualified. At present, in order to avoid the phenomenon of electric leakage or low light-emitting rate caused by silver colloid, packaging manufacturers are reluctant to use chips with too thin thicknesses, the requirements of the chips on heat dissipation are higher and higher due to higher and higher brightness of the chips, and the chips are inevitably thinned. How to avoid the phenomenon of chip leakage or low light extraction efficiency under the condition of thinning the chip is an urgent problem to be solved in the current chip industry and is one of the main factors for restricting the technical improvement parameters of the current chip industry.
Disclosure of Invention
Aiming at the defects of the existing LED chip packaging method, the invention provides the LED packaging method with simple and convenient flow.
The technical problems solved by the invention include: the invention solves the problems of electric leakage or low light-emitting rate of the package after the chip is thinned, does not use chip bonding glue, does not have the packaging hidden trouble caused by excessive or insufficient bonding glue amount, has simple and easy realization process and improves the yield of the packaged product.
The invention also provides an LED lamp bead packaged by using the LED packaging method.
Interpretation of terms:
LED: a light emitting diode;
PVC film: a polyvinyl chloride film. PVC is a shorthand for poly vinyl chloride.
Cutting: the support before LED encapsulation is usually 10-30 LED supports which are connected together to form a plate, and after the LED encapsulation, the connected supports are separated by cutting to form independent encapsulated lamp beads.
A method for packaging an LED comprises the following steps:
(1) providing a plate LED support, adhering one surface of a double-sided adhesive PVC film on an LED support substrate, placing an LED chip on the other surface, and fixing the LED chip on the support substrate by using the double-sided adhesive PVC film; at least 1 LED chip is fixed on each support substrate;
(2) communicating the electrode of the LED chip with the LED bracket by using a conductive lead;
(3) coating and packaging the LED chip and the conductive lead by using epoxy resin glue or silica gel;
(4) heating and curing the epoxy resin glue or the silica gel packaged in the step (3); and then cutting the connected bracket to form a single independent LED lamp bead.
In the step (1), 1 to 9 LED chips are preferably fixed on each support substrate. Preferably, 2-4 LED chips are fixed on each support substrate. The number of the fixed LED chips is determined according to the size of the support substrate, the size of the chips and actual needs.
Further, the conductive lead in the step (2) is a gold wire, a silver wire or an alloy wire; further preferably a gold wire of 18 μm to 25 μm or a silver wire or alloy wire of 18 μm to 25 μm. The LED chip is communicated with the LED support, namely the LED chip is communicated with the corresponding electrode of the LED support.
Further, in the step (4), an oven is used for heating and curing, the baking temperature is 120-150 ℃, and the heating and curing time is 60-90 minutes.
In the step (1), the double-sided adhesive PVC film can be selected from insulating temperature-resistant commercial products. The preferred model is double sided adhesive PVC film 225 SRP.
The packaging method is suitable for packaging various LEDs except the LED chip with the vertical structure. The LED packaging structure is particularly suitable for packaging LED chips with thinner thickness, and can highlight the advantages.
An LED lamp bead packaged by the LED packaging method is provided.
The invention has the technical characteristics and beneficial effects that:
the LED lamp bead packaging method has the advantages that the double-sided adhesive PVC film is used for fixing the LED chip on the LED support base, the conductive metal wire is used for connecting the electrode of the LED chip with the corresponding polarity of the support, the conductive silver adhesive or the insulating adhesive is not used for fixing the LED chip, the curing temperature of the used epoxy resin adhesive or silica gel is greatly reduced compared with that of the conductive silver adhesive, the double-sided adhesive PVC film is insulating, and meanwhile, the finally used epoxy resin adhesive or silica gel is also insulating, so that the situations of electric leakage and influence on light emitting efficiency are effectively avoided, the method is simple to operate, no step is added in the packaging process, and the yield of the LED lamp bead is higher under the condition that the production efficiency is not influenced.
Although the technical scheme of the method is simple, the method has an unexpected good effect, and can effectively solve the problem of electric leakage of the adhesive package after the chip is thinned. The high-brightness chip is required to have better heat dissipation, the thinning of the chip is more favorable for heat dissipation, and the improvement of luminous flux is facilitated to ensure that the brightness of the chip is higher, so that the thinning of the chip is the trend of industry development, and the problem of low electric leakage or light-emitting rate caused by encapsulation of silver adhesive after the thinning of the chip can be solved. And a good packaging process foundation is laid for thinning the chip.
Drawings
Fig. 1 is a schematic view of one side of a double-sided adhesive PVC film being adhered to an LED support substrate;
FIG. 2 is a schematic view of an LED chip placed on the surface of a double-sided adhesive PVC film;
FIG. 3 is a schematic diagram of an electrode of an LED chip in communication with an LED support using a conductive lead;
in the figure, 1, an LED support substrate; 2. double-sided adhesive PVC film; 3. a stent electrode; 4. an LED chip; 5. and a conductive lead.
Detailed Description
The present invention will be described in further detail with reference to the drawings and embodiments, but is not limited thereto. All raw materials in the examples are commercially available products. The model of the double-sided adhesive PVC film is 225SRP, and the double-sided adhesive PVC film can resist the temperature of over 160 ℃.
The support before the LED packaging in the embodiment is formed by connecting 20 support substrates into a plate.
Example 1: chip thickness 100-
(1) A board LED support is provided, one side of a double-sided adhesive PVC film 2 is adhered to an LED support substrate 1 (as shown in fig. 1), and the other side of the PVC film is upward. On each support substrate, 1 LED chip 4 is placed on the upper surface of the double-sided adhesive PVC film, and the LED chip is fixed on the support substrate by the double-sided adhesive PVC film, as shown in fig. 2;
(2) the electrode of the LED chip is communicated with the electrode 3 of the LED bracket by using a gold wire conductive lead 5 with the diameter of 22 mu m; as shown in fig. 3;
(3) 6101AB epoxy resin glue is used for coating and packaging the LED chip and the conductive lead; heating and curing in an oven at 90 deg.C for 60 min.
(4) And cutting the packaged and cured support to form a single independent LED lamp bead, wherein each LED lamp bead contains 1 LED chip.
The luminous flux of the LED chip packaged by the method of the embodiment can be improved by about 5 percent compared with the LED chip packaged by glue dispensing.
Example 2: chip thickness 140-
(1) Providing a plate of LED support, adhering one surface of a double-sided adhesive PVC film on an LED support substrate, enabling the other surface of the PVC film to face upwards, placing 2 LED chips on the upper surface of the double-sided adhesive PVC film on each support substrate, and fixing the LED chips on the support substrates by using the double-sided adhesive PVC film;
(2) communicating the electrode of the LED chip with the electrode of the LED bracket by using a 20-micron silver wire;
(3) encapsulating and packaging the LED chip and the conductive lead by using silica gel; heating and curing in an oven at the temperature of 140-150 ℃ for 60 minutes.
(4) And cutting the packaged and cured support to form a single independent LED lamp bead, wherein each LED lamp bead contains 2 LED chips.
The luminous flux of the LED chip packaged by the method can be improved by about 3 percent compared with the LED chip packaged by dispensing and fixing the LED chip.
Comparative example 1: the conventional current packaging method for fixing the LED chip by dispensing is adopted, and the thickness of the LED chip is the same as that of the LED chip in the embodiment 1.
(1) Providing a plate LED support, uniformly dispensing an insulating glue binder on LED support substrates by using a glue dispenser, placing LED chips on the insulating glue sites one by one, placing 2 chips on each support substrate, placing the chips in an oven for baking, and fixing the chips on the support substrates;
steps (2) to (4) were the same as in example 1.
Comparative example 2: the current conventional packaging method of dispensing and fixing the LED chip is used, and the thickness of the LED chip is the same as that of the LED chip in the embodiment 2.
(1) Providing a plate LED support, uniformly dispensing an insulating glue binder on LED support substrates by using a glue dispenser, placing LED chips on the insulating glue sites one by one, placing 2 chips on each support substrate, placing the chips in an oven for baking, and fixing the chips on the support substrates; steps (2) to (4) were the same as in example 2.
Experimental example: use double faced adhesive tape PVC membrane and use point gum machine binder fixed LED chip's encapsulation lamp pearl yields contrast
The LED packaging experiments are respectively carried out according to the methods of the embodiments 1 and 2 and the comparative examples 1 and 2, 2 chips are placed on each support substrate, four LED supports are provided for each experimental example, 80 support substrates (one support substrate is 20), each experimental example is packaged and cut together to form 80 LED lamp beads, the photoelectric parameters of each LED lamp bead are tested, and the LED lamp beads with the luminous flux lower than the average value of 80% are defective products. The yield was counted and shown in Table 1.
TABLE 1 packaging yields
| Packaging process | Number of packages (granule) | Poor lamp pearl (particle) | Yield of good products |
| Example 1 (thin) | 80 | 0 | 100％ |
| Example 2 (Thick) | 80 | 0 | 100％ |
| COMPARATIVE EXAMPLE 1 (THIN) | 80 | 7 | 91.3％ |
| COMPARATIVE EXAMPLE 2 (THICKNESS) | 80 | 4 | 95％ |
Claims (8)
1. A method for packaging an LED comprises the following steps:
(1) providing a plate LED support, adhering one surface of a double-sided adhesive PVC film on an LED support substrate, placing an LED chip on the other surface, and fixing the LED chip on the support substrate by using the double-sided adhesive PVC film; at least 1 LED chip is fixed on each support substrate;
(2) communicating the electrode of the LED chip with the LED bracket by using a conductive lead;
(3) coating and packaging the LED chip and the conductive lead by using epoxy resin glue or silica gel;
(4) heating and curing the epoxy resin glue or the silica gel packaged in the step (3); and then cutting the connected bracket to form a single independent LED lamp bead.
2. The method for encapsulating an LED according to claim 1, wherein the type of the double-sided adhesive PVC film in the step (1) is 225 SRP.
3. The method for encapsulating LED according to claim 1, wherein in the step (1), the number of LED chips fixed on each support substrate is 1-9; preferably, 2-4 LED chips are fixed on each support substrate.
4. The method according to claim 1, wherein the conductive leads in step (2) are gold wires, silver wires or alloy wires.
5. The method for encapsulating an LED according to claim 1, wherein the conductive leads in step (2) are gold wires of 18 μm to 25 μm or silver wires or alloy wires of 18 μm to 25 μm.
6. The method for encapsulating LED as claimed in claim 1, wherein in the step (4), the LED is cured by heating in an oven at a temperature of 120 ℃ and 150 ℃ for 60-90 minutes.
7. The method for packaging an LED according to any one of claims 1 to 6, wherein the method is used for packaging an LED chip with a relatively thin thickness.
8. The LED lamp bead packaged by the LED packaging method according to any one of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010916472.7A CN114141926A (en) | 2020-09-03 | 2020-09-03 | Packaging method of light emitting diode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010916472.7A CN114141926A (en) | 2020-09-03 | 2020-09-03 | Packaging method of light emitting diode |
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| CN114141926A true CN114141926A (en) | 2022-03-04 |
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| CN202010916472.7A Pending CN114141926A (en) | 2020-09-03 | 2020-09-03 | Packaging method of light emitting diode |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102832294A (en) * | 2011-06-13 | 2012-12-19 | 中山市世耀光电科技有限公司 | Method for packaging LED light source and LED light source |
| CN108417673A (en) * | 2018-02-06 | 2018-08-17 | 珠海市圣大光电有限公司 | A kind of packaging technology of low light attenuation LED light |
| CN110034221A (en) * | 2018-11-16 | 2019-07-19 | 吴裕朝 | Light emitting device package processing procedure |
| CN111370550A (en) * | 2018-12-25 | 2020-07-03 | 山东浪潮华光光电子股份有限公司 | Packaging method of red light LED chip |
-
2020
- 2020-09-03 CN CN202010916472.7A patent/CN114141926A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102832294A (en) * | 2011-06-13 | 2012-12-19 | 中山市世耀光电科技有限公司 | Method for packaging LED light source and LED light source |
| CN108417673A (en) * | 2018-02-06 | 2018-08-17 | 珠海市圣大光电有限公司 | A kind of packaging technology of low light attenuation LED light |
| CN110034221A (en) * | 2018-11-16 | 2019-07-19 | 吴裕朝 | Light emitting device package processing procedure |
| CN111370550A (en) * | 2018-12-25 | 2020-07-03 | 山东浪潮华光光电子股份有限公司 | Packaging method of red light LED chip |
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