CN114126228A

CN114126228A - Board collecting machine, upper PIN needle rubber coating and board collecting integrated production equipment

Info

Publication number: CN114126228A
Application number: CN202111336959.9A
Authority: CN
Inventors: 钟谢安; 许兴祥; 陈兴义; 钟芳虹; 刘运阳; 蓝勇
Original assignee: Dongguan Jihong Hardware Technology Co ltd
Current assignee: Dongguan Jihong Hardware Technology Co ltd
Priority date: 2021-11-12
Filing date: 2021-11-12
Publication date: 2022-03-01
Anticipated expiration: 2041-11-12
Also published as: CN114126228B

Abstract

The invention provides a plate collecting machine, comprising: the machine base, the material taking mechanism, the stacking mechanism and the separable bearing mechanism are arranged on the machine base, a temporary placing platform matched with the material taking mechanism is arranged on the machine base, and the stacking mechanism is arranged between the temporary placing platform and the separable bearing mechanism. Wherein, stacking mechanism includes: the stacking manipulator is arranged on the base, and the movable driving device is arranged on the base; separable bearing mechanism includes: the device comprises a lifting device, a bearing platform and a carrying trolley; the lifting device comprises a lifting frame, the bearing platform is detachably placed on the lifting frame, and the carrying cart is placed below the bearing platform. The board collecting machine can realize automatic collection of the PCB, and the PCB is orderly stacked to prevent the PCB from being scratched.

Description

Board collecting machine, upper PIN needle rubber coating and board collecting integrated production equipment

Technical Field

The invention relates to the technical field of processing equipment, in particular to a plate collecting machine and integrated production equipment for encapsulating and collecting PIN needles of the plate collecting machine.

Background

The current nailing and encapsulating process of the PCB industry generally comprises manual nailing and encapsulating, and the nailing and encapsulating process is used for firmly stacking a plurality of PCBs. After nailing and rubber coating are finished, the whole set of PCB is manually collected and stacked, however, the manual collection and stacking mode has low production efficiency, and meanwhile, the PCB is easily corroded due to the fact that hands sweat and frequently contact the PCB. Further, the structure of the PCB 10 after completing the nailing and taping process is shown in fig. 1, since the PIN 11 protrudes from the surface of the PCB 10 after nailing, if the PCB 10 is simply stacked, the PIN 11 may scratch the PCB 10.

Therefore, how to design a board collecting machine and integrated production equipment for coating the PIN PINs and collecting the PCB, wherein the integrated production equipment comprises the board collecting machine, the automatic collection of the PCB is realized, and the working efficiency is improved; and the PCB boards are orderly stacked, so that the scratch of the PCB boards is prevented, which is a technical problem to be solved by technical personnel in the field.

Disclosure of Invention

The invention aims to overcome the defects in the prior art, provides a board collecting machine and integrated production equipment for coating PIN PINs and collecting boards, wherein the integrated production equipment comprises the board collecting machine, so that the automatic collection of PCB boards is realized, and the working efficiency is improved; and the PCB boards are orderly stacked, so that the PCB boards are prevented from being scratched.

The purpose of the invention is realized by the following technical scheme:

a board receiving machine comprising: the device comprises a machine base, a material taking mechanism, a stacking mechanism and a separable bearing mechanism; the material taking mechanism and the stacking mechanism are arranged on the base, a temporary placing table matched with the material taking mechanism is arranged on the base, and the stacking mechanism is arranged between the temporary placing table and the separable bearing mechanism;

the stacking mechanism includes: the stacking manipulator is arranged on the base, and the movable driving device is arranged on the base;

the detachable bearing mechanism comprises: the device comprises a lifting device, a bearing platform and a carrying trolley; the lifting device comprises a lifting frame, the bearing platform is detachably placed on the lifting frame, and the carrying cart is placed below the bearing platform.

In one embodiment, the movable driving device comprises: the support frame slides and is located on the horizontal sliding rail, the telescopic cylinder is installed on the support frame, and a piston rod of the telescopic cylinder is connected with the rotating cylinder.

In one embodiment, the stacking robot comprises: the clamping device comprises a base, a driving assembly and a clamping jaw; the base is connected with the rotating cylinder, and the clamping jaw is arranged on the base in a sliding mode through the driving assembly; the number of the clamping jaws is two, and the moving directions of the two clamping jaws are opposite.

In one embodiment, the lifting device further comprises: the guide rod is arranged on the guide rod; the slider is installed on the crane, the slider slides and locates on the guide bar, the lead screw subassembly drive the crane rises or descends.

In one embodiment, the material taking mechanism comprises a translation device and a material taking mechanical arm, the translation device is mounted on the base, and the material taking mechanical arm is slidably arranged on the translation device.

In one embodiment, the reclaimer robot comprises: the movable main frame, the arm support, the lifting claw and the clamping claw; the movable main frame is arranged on the translation device in a sliding mode, the arm support is arranged on the movable main frame in a lifting mode, the lifting claw is fixedly arranged on the arm support, and the clamping claw is arranged on the arm support in a rotating mode and matched with the lifting claw.

In one embodiment, two article placing vertical plates are arranged on the temporary placing table, an avoiding groove is formed between the two article placing vertical plates, and the lifting claw of the material taking mechanical arm can enter or be separated from the avoiding groove.

In one embodiment, the trigger collecting machine comprises the trigger collecting machine as claimed in any one of the claims 1 to 7, and further comprises an upper PIN glue wrapping machine matched with the trigger collecting machine for use.

In conclusion, the board collecting machine provided by the invention realizes automatic collection of the PCB, and the PCB is orderly stacked, so that the PCB is prevented from being scratched. Moreover, the integrated production equipment for encapsulating and collecting the PIN PINs realizes automatic nailing, encapsulating and stacking of the multilayer PCB, thereby improving the production efficiency.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic structural diagram of a PCB board for completing nailing and encapsulating processes according to the present invention;

FIG. 2 is a schematic structural diagram of a plate receiving machine according to the present invention;

FIG. 3 is an exploded view of the plate receiving machine shown in FIG. 2;

FIG. 4 is a schematic structural view of the stacking mechanism shown in FIG. 3;

FIG. 5 is a schematic structural view of the detachable carrying mechanism shown in FIG. 1;

FIG. 6 is a schematic view of the take-off mechanism of FIG. 3;

FIG. 7 is a schematic view showing the state of the PCB after cross stacking by the board collecting machine;

FIG. 8 is a schematic structural diagram of an upper PIN glue-wrapping machine of the present invention;

FIG. 9 is an exploded view of the upper PIN glue applicator shown in FIG. 8;

fig. 10 is an internal structural schematic view (one) of the encapsulating mechanism shown in fig. 9;

fig. 11 is an internal structural schematic view (ii) of the encapsulation mechanism shown in fig. 9;

FIG. 12 is a schematic view of a partial structure of a encapsulation mechanism;

FIG. 13 is a schematic view of a partial structure of a taping mechanism during tape recycling;

figure 14 is a partial cross-sectional elevation view of the encapsulation mechanism;

figure 15 is a partial cross-sectional side view of the encapsulation mechanism.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 2, the present invention discloses a board receiving machine 20, which includes: a frame 100, a material taking mechanism 200, a stacking mechanism 300 (shown in fig. 3), and a detachable carrying mechanism 400. The material taking mechanism 200 and the stacking mechanism 300 (shown in fig. 3) are mounted on the base 100, a temporary placing table 500 matched with the material taking mechanism 200 is arranged on the base 100, and the stacking mechanism 300 is arranged between the temporary placing table 500 and the detachable carrying mechanism 400.

In operation, the material taking mechanism 200 cooperates with a set of PCB boards 10 which have been nailed and encapsulated in the previous process, and then the PCB boards 10 are sent to the temporary placing table 500; then, the stacking mechanism 300 transfers the PCB 10 on the temporary placing table 500 to the separable carrying mechanism 400, and when the PCB is placed, the stacking mechanism 300 places the PCB 10 at a crossed angle to prevent the PIN 11 on the PCB 10 from scratching the board surface, and the specific working process will be described in detail below.

The following describes a specific structure of the board receiving machine 20 according to the present invention with reference to the present embodiment:

specifically, as shown in fig. 3, the stacking mechanism 300 includes: the stacking machine comprises a movable driving device 310, a rotating cylinder 320 and a stacking manipulator 330, wherein the movable driving device 310 is installed on the base 100, and the rotating cylinder 320 is connected with the movable driving device 310 and the stacking manipulator 330.

As shown in fig. 4, in the present embodiment, the movable driving device 310 includes: the support frame 311 is slidably disposed on the horizontal slide rail 312, the telescopic cylinder 313 is mounted on the support frame 311, and a piston rod (not shown) of the telescopic cylinder 311 is connected to the rotating cylinder 320. When the stacking manipulator moves, the horizontal sliding rail 312 enables the supporting frame 311 to move horizontally, and the telescopic cylinder 311 enables the rotating cylinder 320 and the stacking manipulator 330 to move up and down, so that the stacking manipulator 330 can move in the horizontal axial direction and the vertical direction under the matching of the horizontal sliding rail 312 and the telescopic cylinder 311; further, the stacking robot 330 may also rotate in a horizontal direction by a certain angle by the driving of the rotation cylinder 320.

Preferably, as shown in fig. 4, the stacking robot 330 includes: a base 331, a drive assembly 332, and a jaw 333. The base 331 is connected to the rotating cylinder 320, and the clamping jaw 333 is slidably disposed on the base 331 through the driving assembly 332. The number of the clamping jaws 333 is two, and the moving directions of the two clamping jaws 333 are opposite. During work, if the driving assembly 332 drives the two clamping jaws 333 to move oppositely, the distance between the two clamping jaws 333 is shortened, and clamping is realized; if the driving unit 332 drives the two jaws 333 to move back and forth, the distance between the two jaws 333 is increased, and the stacking robot 330 puts down the gripped PCB panel 10.

Specifically, as shown in fig. 3, the separable carrying mechanism 400 includes: a lifting device 410, a load-bearing platform 420, and a carrying cart 430. The lifting device 410 includes a lifting frame 411 (as shown in fig. 5), the carrying platform 420 is detachably placed on the lifting frame 411, and the carrying cart 430 is placed under the carrying platform 420. In operation, the loading platform 420 can be lifted or lowered together with the crane 411, and when the crane 411 is lowered to a height lower than the height of the loading cart 430, the loading platform 420 is supported by the loading cart 430, will be separated from the crane 411, and then the loading platform 420 is placed on the loading cart 430.

In this embodiment, as shown in fig. 5, the lifting device 410 further includes: a slider 412, a guide rod 413, and a lead screw assembly 414. The sliding block 412 is installed on the lifting frame 411, the sliding block 412 is slidably arranged on the guide rod 413, and the lead screw component 414 drives the lifting frame 411 to ascend or descend. The lead screw assembly 414 functions to drive the crane 411 to move, and the structure thereof is well known in the art, and thus the structure thereof will not be described herein.

As shown in fig. 3, the material taking mechanism 200 includes a translation device 210 and a material taking robot 220, wherein the translation device 210 is mounted on the machine base 100, and the material taking robot 220 is slidably disposed on the translation device 210. Preferably, as shown in fig. 6, the reclaimer robot arm 220 includes: a movable main frame 221, an arm support 222, a lifting claw 223 and a clamping claw 224. The movable main frame 221 is slidably disposed on the translation device 210, the arm support 222 is disposed on the movable main frame 221 in a liftable manner, the lifting claw 223 is fixedly mounted on the arm support 222, and the clamping claw 224 is rotatably disposed on the arm support 222 and is matched with the lifting claw 223, i.e., the clamping claw 224 can be pressed on the lifting claw 223 to realize the clamping action.

Further, as shown in fig. 4 and 6, two vertical placement boards 510 are disposed on the temporary placement platform 500, an avoiding groove 520 is formed between the two vertical placement boards 510, and the lifting claw 223 of the material taking arm 220 can enter or leave the avoiding groove 520. In operation, the material taking mechanical arm 220 places the clamped PCB board 10 on the temporary placing table 500. Specifically, the material taking mechanical arm 220 moves to the upper side of the avoiding groove 520, then descends to the lifting claw 223 to enter the avoiding groove 520, and then the clamping claw 224 is released, so that the placing vertical plate 510 lifts up the PCB 10, and after the releasing is completed, the lifting claw 223 is pulled out from the avoiding groove 520.

It is noted that the material extracting mechanism 200 and the stacking mechanism 300 of the present invention further include other power source assemblies for driving the corresponding mechanism to move, such as: driving the material taking robot arm 220 to move on the translation device 210; driving the arm bracket 222 to move up and down on the movable main frame 221; the driving support frame 311 slides on the horizontal slide rail 312, and the like. The power source component adopts the prior art known by the person skilled in the art, such as a motor or a cylinder, and the structure of the power source component is not described in detail herein, and an appropriate scheme can be selected as required during implementation.

So far, the detailed structure of the board collecting machine 20 of the present invention is described.

The operation of the plate receiving machine 20 of the present invention will be explained with reference to the above structure, and refer to fig. 3 to 6:

first, the material taking mechanism 200 is engaged with the set of PCB boards 10 taken from the previous process after nailing and taping. Specifically, the material taking mechanical arm 220 is driven by the translation device 210 to move, and the PCB board 10 completing the nailing and encapsulating process is clamped and taken by the lifting claw 223 and the clamping claw 224 cooperatively. Subsequently, the translation device 210 drives the material taking robot 220 to move back until the material taking robot 220 moves above the temporary placement table 500;

then, the material taking robot arm 220 places the PCB board 10 on the temporary placing table 500. Specifically, the material taking mechanical arm 220 moves to the upper side of the avoiding groove 520, then descends until the lifting claw 223 enters the avoiding groove 520, then the clamping claw 224 is released, the placing vertical plate 510 lifts the PCB 10, after the lifting claw 223 is pulled out from the avoiding groove 520, the PCB 10 is separated, and then the PCB 10 is placed on the temporary placing table 500;

next, the stacking mechanism 300 transfers the PCB boards 10 on the temporary placement table 500 to the separable carrying mechanism 400 and crossly stacks them (as shown in fig. 7). Specifically, the supporting frame 311 moves above the temporary placement platform 500 along the horizontal sliding rail 312, then the telescopic cylinder 311 drives the rotating cylinder 320 and the stacking manipulator 330 to descend, and the driving assembly 332 causes the two clamping jaws 333 to approach each other, so as to clamp the PCB 10 on the temporary placement platform 500. Next, the stacking robot 330 moves above the loading platform 420 by the movable driving device 310, the driving assembly 332 drives the two clamping jaws 333 away from each other, and the PCB 10 is separated from the stacking robot 330 and falls onto the loading platform 420. Then, the stacking robot 330 repeats the above steps, and continuously picks up new PCB boards 10 to be placed on the supporting platform 420, so as to stack the PCB boards 10. In the process, when the stacking robot 330 is about to put down the second set of PCB boards 10, the rotating cylinder 320 drives the stacking robot 330 to rotate 90 degrees (of course, the rotating angle can be selected according to actual needs), so that the first set of PCB boards 10 and the second set of PCB boards 10 are stacked in a crossed manner, and thus the PIN PINs 11 between the PCB boards 10 are staggered. Similarly, when the stacking manipulator 330 puts down the third set of PCB boards 10, the rotating cylinder 320 still drives the stacking manipulator 330 to rotate 90 degrees, i.e. except for the first time, the rotating cylinder 320 drives the stacking manipulator 330 to rotate in the subsequent cycle;

in the process of stacking the PCB boards 10, the supporting platform 420 and the lifting frame 411 are driven by the lead screw assembly 414 to slowly descend, and after the PCB boards 10 are stacked to a certain thickness, the lifting frame 411 also descends to a height lower than the height of the carrying cart 430. At this time, the loading platform 420 is disengaged from the crane 411 and pressed against the carrying cart 430. Subsequently, the worker pushes the cart 430 and the PCB panel 10 stacked thereon, the crane 411 is lifted and reset by the lead screw assembly 414, the worker places the platform 420 on the crane 411 again, and places a new cart 430 under the platform 420, thereby starting a new work cycle.

It is emphasized that, as shown in fig. 7, the board receiving machine 20 of the present invention adopts a cross stacking manner when stacking the PCB boards 10, and specifically, in addition to the first placement, the rotating cylinder 320 drives the stacking robot 330 to rotate each time of stacking, so that the current PCB board 10 and the previous PCB board 10 are crossed with each other, and thus the PIN PINs 11 between the PCB boards 10 are staggered with each other, and the PIN PINs 11 are prevented from scratching the PCB boards 10.

It is further noted that the collecting and stacking of the PCB panels 10 by the board collecting machine 20 of the present invention does not require the operator to touch the PCB panels 10. During collection, the PCB 10 is clamped by the material taking mechanical arm 220 and then placed on the temporary placing table 500; then the PCB board 10 is transferred to the bearing platform 420 by the stacking manipulator 330, and the cross stacking is realized; then, the lifting frame 411 takes the carrying platform 420 to descend until the carrying platform 420 is pressed on the carrying cart 430; finally, the worker pushes the carrying cart 430 and the PCB 10 stacked thereon. In the whole process, the worker does not need to contact the PCB 10, and the worker only needs to replace the new carrying platform 420 and the new carrying cart 430 to complete the transportation operation when the stacked PCB 10 is finally transported.

The invention also provides upper PIN needle encapsulation and board collection integrated production equipment, which comprises the board collecting machine 20 and an upper PIN needle encapsulation machine 30 (shown in fig. 8) matched with the board collecting machine 20. In operation, the upper PIN taping machine 30 nails and glues the multi-layered PCB 10 into a set, and then the set of PCB 10 is removed by the board collecting machine 20 and cross-stacked. Thus, the upper PIN needle encapsulation machine 30 is matched with the plate receiving machine 20

Specifically, as shown in fig. 8 and 9, the upper PIN encapsulation machine 30 includes: the equipment base 600, the nailing mechanism 700 and the encapsulation mechanism 800. Wherein, the equipment base 600 is provided with a guide rail platform 610, and the nailing mechanism 700 and the rubber coating mechanism 800 are both arranged on the guide rail platform 610. The equipment base 600 is further provided with a bearing support 620, the nailing mechanisms 700 are symmetrically distributed by taking the bearing support 620 as a center, and the rubber coating mechanisms 800 are distributed around the bearing support 620. During operation, place on bearing support 620 after stacking the multilayer PCB board, the edge of multilayer PCB board erects on nailing mechanism 700 and rubber coating mechanism 800, and afterwards, nailing mechanism 700 drills and goes up the PIN needle to the PCB board, and rubber coating mechanism 800 carries out the rubber coating to the edge of multilayer PCB board. Since the nailing mechanism 700 and the encapsulation mechanism 800 are disposed on the rail platform 610, the positions of the nailing mechanism 700 and the encapsulation mechanism 800 can be changed according to the size of the PCB 10, so as to meet the requirements of practical operation.

The main structure of the upper PIN encapsulation machine 30 of the present invention is specifically described below with reference to the present embodiment:

in the present embodiment, as shown in fig. 9, the nailing mechanism 700 includes: pay-off vibration dish 710, telescopic cylinder 720, PIN needle material loading 730 and drilling machine 740, be equipped with PIN dish 741 on the drilling machine 740, telescopic cylinder 720 drive PIN needle material loading 730 makes elevating movement. In operation, the edge of the PCB 10 is placed on the upper PIN disc 741, the drilling machine 740 drills holes in the PCB 10, the feeding vibration disc 710 sends the PIN to the PIN feeding member 730, and then the telescopic cylinder 720 drives the PIN feeding member 730 to insert the PIN on the PCB 10.

In this embodiment, as shown in fig. 9 and 10, the encapsulating mechanism 800 includes: the base 810, send gluey subassembly 820 and spacing cutting assembly 830 to locate on the base 810. A rotatable adhesive tape disc 811 is arranged on the base 810, the adhesive tape disc 811 is wound with an adhesive tape 801, and the adhesive tape 801 passes through the adhesive feeding assembly 820 to the position limiting cutting assembly 830.

Preferably, as shown in fig. 10, the glue feeding assembly 820 includes: a guide vane 821, a main runner 822, and a sub-runner 823. The guide shutter 821 is mounted on the base 810, the main runner 822 and the sub-runner 823 are rotatably pressed on the guide shutter 821, and the sub-runner 823 rotates in synchronization with the main runner 822 during feeding. The main runner 822 has a slot 824, the guide plate 821 has a guide rib 825 engaged with the slot 824, and guide grooves (not shown) are formed on two sides of the guide rib 824. The primary and

secondary wheels

822 and 823 are rotatably mounted to the base 810 by a synchronizing wheel 826. Wherein, a reverse buffer structure 840 (as shown in fig. 14) is arranged between the secondary turning wheel 823 and the synchronizing wheel 826.

It should be noted that, as shown in fig. 10, the main rotating wheel 822 cooperates with the guiding baffle 821 to sandwich the adhesive tape 801, one side of the adhesive tape 801 having viscosity faces the main rotating wheel 822 and the auxiliary rotating wheel 823, the wheel surface of the main rotating wheel 822 has a plurality of pointed teeth, the top ends of the pointed teeth are abutted against the adhesive tape 801, and the adhesive tape 801 is not easily adhered to the wheel surface of the main rotating wheel 822 due to the small contact area between the two.

In this embodiment, as shown in fig. 10, the spacing and cutting assembly 830 includes an elastic clamping arm 831 and a driving cylinder 832, and the elastic clamping arm 831 is slidably disposed on the fixing frame 810 through the driving cylinder 832. The elastic clamping arm 831 has a movable clamping jaw 833 and a fixed clamping jaw 834, the movable clamping jaw 833 is rotatably disposed on the fixed clamping jaw 834 through an elastic member (not shown), the movable clamping jaw 833 and the fixed clamping jaw 834 are both provided with a flattening roller 835, and the fixed clamping jaw 834 is further provided with a cutting knife 836 (as shown in fig. 11). Preferably, the elastic member may be a torsion spring (not shown) for providing the movable jaw 833 with a tendency to swing toward the fixed jaw 834, so that the pressing roller 835 of the movable jaw 833 can press against the PCB 10 during operation, and the structure of the elastic member is well known in the art and therefore will not be described herein.

So far, the main structure of the upper PIN encapsulation machine 30 of the invention is completely described.

The working principle of the integrated production equipment for encapsulating and collecting PIN needles according to the present invention is described below with reference to the board collecting machine 20 and the PIN encapsulating machine 30:

initially, the multilayer PCB 10 is placed on the carrying bracket 620, and then the upper PIN encapsulating machine 30 starts to work, and the encapsulating mechanism 800 encapsulates the multilayer PCB 10;

the specific encapsulation process is as follows: the adhesive tape feeding assembly 820 moves first, the adhesive tape reel 811 is unwound, the main rotating wheel 822 and the auxiliary rotating wheel 823 rotate clockwise as shown in fig. 10, and since the main rotating wheel 822 presses the adhesive tape 801 against the guide baffle 821, the main rotating wheel 822 rotates to push the adhesive tape 801 upward, so that the free end of the adhesive tape 801 extends upward. Then the spacing and cutting assembly 830 moves, the driving cylinder 832 pushes the elastic clamping arm 831 to slide towards the PCB 10, and the pressing roller 835 on the movable clamping jaw 833 will roll over and press the PCB 10 to compact it because the movable clamping jaw 833 has an elastic tendency. In the process, the elastic clipping arms 831 push the adhesive tape 801 to wrap and stick on the PCB 10; until the elastic clamping arm 831 moves to a proper position, the main rotating wheel 822 does not rotate any more, the adhesive tape 801 between the main rotating wheel 822 and the fixed clamping jaw 834 is stretched straightly, so that the cutting knife 836 can smoothly cut the stretched adhesive tape 801, and then the cut adhesive tape 801 is flattened by the flattening roller 835;

the nailing process is also carried out at the same time as the encapsulation process. Since the elastic clipping arms 831 have already firmly clipped the multi-layer PCB 10 during encapsulation, the nailing mechanism 700 can directly perform nailing operation. Specifically, a drilling machine 740 drills holes in the edge of the PCB 10, a feeding vibration disc 710 sends the PIN PINs to a PIN PIN feeding part 730, then a telescopic cylinder 720 drives the PIN PIN feeding part 730 to insert the PIN PINs on the PCB 10, and the multilayer PCB is fixed together;

after the above-mentioned encapsulating and nailing are completed, the encapsulating mechanism 800 and the nailing mechanism 700 are both reset, the elastic clamping arms 831 no longer clamp the multi-layer PCB 10, and at this time, the board collecting machine 20 starts to work. Firstly, the material taking mechanical arm 220 clamps a set of PCB boards 10, and then the translation device 210 drives the material taking mechanical arm 220 to move back until the material taking mechanical arm 220 moves above the temporary placement platform 500; then, the material taking mechanical arm 220 places the PCB board 10 on the temporary placing table 500; next, the stacking mechanism 300 transfers the PCB 10 on the temporary placing table 500 to the separable carrying mechanism 400, and performs cross stacking, wherein the specific process refers to the working principle of the board receiving machine 20 above;

therefore, according to the integrated production equipment for encapsulating and collecting the upper PIN needles, nailing and encapsulating are firstly carried out on the multilayer PCB 10 through the upper PIN needle encapsulating machine 30, and then the whole set of PCB 10 is stacked in a crossed mode through the plate collecting machine 20, so that integrated processing is realized.

It is noted that during the encapsulation process, the main wheel 822 cooperates with the guide block 821 to push the adhesive tape 801 upward, so that the adhesive tape 801 rises to the middle position between the movable clamping jaw 833 and the fixed clamping jaw 834, thereby preparing for encapsulation. In this process, the adhesive tape 801 must always be kept vertically upward, i.e. the adhesive tape 801 must always "stand" and cannot "hang" so as to ensure the encapsulation to be performed smoothly. In order to keep the adhesive tape 801 in a vertical upward state, the main rotating wheel 822 and the guide baffle 821 of the present invention are specially designed:

as shown in fig. 11, the main rotor 822 has a slot 824, the guide plate 821 has a guide rib 825 engaged with the slot 824, and guide grooves (not shown) are formed on two sides of the guide rib 825. When the tape 801 is between the main runner 822 and the guide rail 821, the main runner 822 presses the tape 801 against the guide rail 821. Since the guiding ribs 825 are provided on the guiding plate 821, the middle of the adhesive tape 801 is pushed up by the guiding ribs 825, and the edge of the adhesive tape 801 is pressed into the guiding groove, so that the adhesive tape 801 is longitudinally bent (as shown in fig. 12). The bent adhesive tape 801 has better bending resistance, and can always keep vertically upward under the condition of no external force, so that the smooth proceeding of the encapsulation process is ensured.

It is emphasized that, during the encapsulation process, after the cutting blade 836 shears the adhesive tape 801, the adhesive tape 801 between the primary pulley 822 and the fixed jaw 834 is bent by the moving fixed jaw 834, so that the bent adhesive tape 801 is not suitable for the subsequent encapsulation, and therefore the adhesive feeding assembly 820 needs to be specially designed:

as shown in fig. 13, the guide plate 821 further has a bias inclined surface 827, and an escape gap 828 is formed between the bias inclined surface 827, the main roller 822 and the sub roller 823. Moreover, the main rotating wheel 822 and the auxiliary rotating wheel 823 are rotatably mounted on the base 810 through a synchronizing wheel 826, the synchronizing wheel 826 drives the main rotating wheel 822 and the auxiliary rotating wheel 823 to rotate respectively under the driving of a belt, wherein a reverse buffer structure 840 is arranged between the auxiliary rotating wheel 823 and the synchronizing wheel 826;

when the tape 801 is cut, the synchronizing wheel 826 rotates the primary wheel 822 in a reverse direction by an angle, and keeps the secondary wheel 823 from rotating under the action of the reverse buffer structure 860. The main wheel 822 reverses the direction of the tape 801 cut between the main wheel 822 and the fixed jaw 834, and the auxiliary wheel 823 does not rotate, so that the tape 801 is folded in the escape gap 828 (see fig. 13) after being recovered. After the encapsulation is completed, the elastic clamping arms 831 are reset, the main rotating wheel 822 rotates forward again, and the folded adhesive tape 801 is pushed out again. Since the pushed-out adhesive tape 801 passes the guide rib 825 again, the adhesive tape 801 is still bent in the longitudinal direction, so that the adhesive tape 801 is kept in a vertically upward state. It is to be noted. Because the guiding baffle 821 is further provided with the offset inclined surface 827, the recovered adhesive tape 801 can be folded only towards the main rotating wheel 822 under the abutting of the offset inclined surface 827 and is positioned in the avoiding gap 828, so that the adhesive tape 801 can be folded according to the design when recovered, and the self-adhesion condition when the adhesive tape 801 is recovered is avoided.

Further, when the recovered floor tape 801 is pushed out again, the main reel 822 needs to be rotated forward first, and after the folded tape 801 is straightened, the sub reel 823 needs to be rotated forward. For this purpose, a reverse buffer structure 840 is provided between the secondary runner 823 and its synchronizing wheel 826.

Specifically, as shown in fig. 14 and 15, the reverse buffer structure 840 includes: a stop block 841 arranged on the auxiliary rotating wheel 823, a wheel shaft 842 arranged on the synchronizing wheel 826 and a shaft key 843 arranged on the wheel shaft 842, wherein the shaft key 843 presses or separates from the stop block 841, and a bearing is arranged between the auxiliary rotating wheel 823 and the synchronizing wheel 826. The working principle of the reverse buffer structure 840 is as follows:

during normal transmission, the synchronizing wheel 826 rotates in a forward direction (clockwise as viewed in FIG. 14), the primary wheel 822 is fixedly connected to and rotates with the synchronizing wheel 826, and the secondary wheel 823 rotates by virtue of the reverse buffer structure 840. Specifically, the synchronizing wheel 826 and the wheel shaft 842 thereon rotate, so that the shaft key 843 rotates, and after the shaft key 843 contacts and presses the blocking block 841, the synchronizing wheel 826 can drive the secondary rotating wheel 823 to rotate;

however, when the tape 801 is cut, the synchronizing wheel 826 is driven by the belt to rotate in a reverse direction by an angle, and at this time, the primary pulley 822 rotates in a reverse direction by an angle with the synchronizing wheel 826, and the secondary pulley 823 does not rotate in a reverse direction due to the reverse buffer structure 840. Specifically, when the synchronizing wheel 826 and the wheel axle 842 thereon rotate in opposite directions, the axle key 843 also rotates in opposite directions by an angle, so that the axle key 843 is disengaged from the blocking block 841, the synchronizing wheel 826 can not drive the secondary rotating wheel 823 any more, and the driven secondary rotating wheel 823 is kept still by the pressing of the guide baffle 821. Thus, the main rotating wheel 822 is reversed and the auxiliary rotating wheel 823 does not rotate, so that the adhesive tape 801 is folded after being recovered;

then, after encapsulation is complete, the sync wheel 826 is rotated forward. At this time, the main reel 822 pushes out the folded tape 801 again with the normal rotation, and the sub reel 823 delays the normal rotation. Specifically, the synchronizing wheel 826 and the wheel axle 842 thereof rotate forward, and the axle key 843 needs to rotate forward by a certain angle to contact the pressing and holding block 841 again. During this period, although the synchronous wheel 826 rotates forward, the secondary rotating wheel 823 will remain stationary and rotate after the shaft key 843 presses the blocking block 841, so that the primary rotating wheel 822 rotates first to straighten the folded adhesive tape 801.

The working principle of the integrated production equipment for encapsulating the PIN needles and collecting the plates is explained.

Further, as the apparatus is operated, the tape 801 is continuously consumed, and there may be a case where the tape 801 is absent, and for this reason, it is necessary to detect whether there is a tape at the time of encapsulation. Preferably, the glue feeding assembly 820 further comprises a detection alarm assembly 850 (shown in fig. 11), the detection alarm assembly 850 comprises a laser probe 851 (shown in fig. 12) and a detection system (not shown), the laser probe 851 is electrically connected with the detection system, wherein one end of the laser probe 851 is located in the wheel groove 824 of the main wheel 822. During operation, the tail end of the laser probe 851 detects whether the adhesive tape 801 exists or not through laser, and if the adhesive tape 801 is used up, the laser probe 851 generates an electric signal to the detection system, so that the detection system gives an alarm to remind a worker of installing a new adhesive tape 801.

In summary, the board collecting machine 20 of the present invention realizes the automatic collection of the PCBs, and the PCBs are stacked in order to prevent the PCBs from being scratched. Moreover, the integrated production equipment for encapsulating and collecting the PIN PINs realizes automatic nailing, encapsulating and stacking of the multilayer PCB, thereby improving the production efficiency.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A board receiving machine, characterized by comprising: the device comprises a machine base, a material taking mechanism, a stacking mechanism and a separable bearing mechanism; the material taking mechanism and the stacking mechanism are arranged on the base, a temporary placing table matched with the material taking mechanism is arranged on the base, and the stacking mechanism is arranged between the temporary placing table and the separable bearing mechanism;

2. A board receiving machine according to claim 1, characterised in that the movable driving means comprise: the support frame slides and is located on the horizontal sliding rail, the telescopic cylinder is installed on the support frame, and a piston rod of the telescopic cylinder is connected with the rotating cylinder.

3. The board receiving machine of claim 1, wherein the stacking robot comprises: the clamping device comprises a base, a driving assembly and a clamping jaw; the base is connected with the rotating cylinder, and the clamping jaw is arranged on the base in a sliding mode through the driving assembly; the number of the clamping jaws is two, and the moving directions of the two clamping jaws are opposite.

4. A board receiving machine according to claim 1, characterised in that the lifting device further comprises: the guide rod is arranged on the guide rod; the slider is installed on the crane, the slider slides and locates on the guide bar, the lead screw subassembly drive the crane rises or descends.

5. A board receiving machine according to claim 1, wherein the material taking mechanism comprises a translation device and a material taking mechanical arm, the translation device is mounted on the machine base, and the material taking mechanical arm is slidably arranged on the translation device.

6. The board receiving machine of claim 5, wherein the material extracting robot arm comprises: the movable main frame, the arm support, the lifting claw and the clamping claw; the movable main frame is arranged on the translation device in a sliding mode, the arm support is arranged on the movable main frame in a lifting mode, the lifting claw is fixedly arranged on the arm support, and the clamping claw is arranged on the arm support in a rotating mode and matched with the lifting claw.

7. The board collecting machine as claimed in claim 6, wherein the temporary placing table is provided with two vertical placing boards, an avoiding groove is formed between the two vertical placing boards, and the lifting claw of the material taking mechanical arm can enter or leave the avoiding groove.

8. An upper PIN needle encapsulation and board collection integrated production device, which comprises the board collecting machine of any one of claims 1 to 7, and further comprises an upper PIN needle encapsulation machine matched with the board collecting machine.