CN114051334A - Automatic PCB board glue line - Google Patents

Automatic PCB board glue line Download PDF

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Publication number
CN114051334A
CN114051334A CN202111251973.9A CN202111251973A CN114051334A CN 114051334 A CN114051334 A CN 114051334A CN 202111251973 A CN202111251973 A CN 202111251973A CN 114051334 A CN114051334 A CN 114051334A
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CN
China
Prior art keywords
conveying
positioning
rubber coating
pcb
rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202111251973.9A
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Chinese (zh)
Other versions
CN114051334B (en
Inventor
何茂水
杨健
楚雄
黄小强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Chengtai Automation Technology Co ltd
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Huizhou Chengtai Automation Technology Co Ltd
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Priority to CN202111251973.9A priority Critical patent/CN114051334B/en
Publication of CN114051334A publication Critical patent/CN114051334A/en
Application granted granted Critical
Publication of CN114051334B publication Critical patent/CN114051334B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

The invention relates to a full-automatic PCB rubber-coated wire, which belongs to the field of PCB processing equipment and comprises a rack, wherein a positioning PIN printing mechanism, a plate stacking mechanism, a rubber coating mechanism, a marking mechanism and a blanking mechanism are sequentially arranged on the rack; the machine frame is also provided with a conveying line which sequentially passes through the positioning PIN loading mechanism, the plate stacking mechanism, the rubber coating mechanism, the marking mechanism and the blanking mechanism and is used for conveying the PCB; rubber coating mechanism includes first rubber coating device and the second rubber coating device that sets gradually along the direction of delivery of transfer chain, and first rubber coating device is including setting up respectively in two first rubber coating machine groups of the both sides of transfer chain, and first rubber coating machine group is including the two rubber coating machines that set up side by side, and second rubber coating device is including setting up respectively in two second rubber coating machine groups of the both sides of transfer chain, and second rubber coating machine group is including the two rubber coating machines that set up side by side, is provided with jacking rotary device between two first rubber coating machine groups, and jacking rotary device sets up in the frame. The invention can effectively improve the encapsulation efficiency of the PCB.

Description

Full-automatic PCB board rubber coating line
Technical Field
The invention relates to the field of PCB processing equipment, in particular to a full-automatic PCB rubber-coated wire.
Background
Before the multi-layer PCB is subjected to laminating operation, single-layer PCBs need to be laminated together, and then the single-layer PCBs laminated together are fixed together by using PIN needles and adhesive tapes, wherein the four side edges of the PCBs need to be subjected to encapsulation treatment, and because the PCBs need to be conveyed by using a conveying belt, the two side edges of the PCBs can be pressed on the conveying belt, so that the two opposite side edges of the PCBs, which are not pressed on the conveying belt, can be encapsulated only by one encapsulation operation of the existing encapsulation equipment, if the other two sides need to be encapsulated, the PCBs need to be rotated by 90 degrees, then the conveying belt is used for conveying the PCBs to encapsulation stations of the encapsulation equipment for encapsulation, the encapsulation operation of the four side edges of the PCBs can be completed, and the encapsulation efficiency of the PCBs is low.
Disclosure of Invention
Based on the above, a full-automatic PCB encapsulation line is needed to be provided, which comprises a rack, wherein a positioning PIN printing mechanism, a plate stacking mechanism, an encapsulation mechanism, a marking mechanism and a blanking mechanism are sequentially arranged on the rack; the machine frame is also provided with a conveying line which sequentially passes through the positioning PIN feeding mechanism, the board stacking mechanism, the rubber coating mechanism, the marking mechanism and the blanking mechanism and is used for conveying the PCB; rubber coating mechanism includes first rubber coating device and the second rubber coating device that sets gradually along the direction of delivery of transfer chain, first rubber coating device including set up respectively in two first rubber coating machine groups of the both sides of transfer chain, first rubber coating machine group is including two rubber coating machines that set up side by side, second rubber coating device including set up respectively in two second rubber coating machine groups of the both sides of transfer chain, second rubber coating machine group is including two rubber coating machines that set up side by side, be provided with jacking rotary device between two first rubber coating machine groups, jacking rotary device set up in the frame.
Wherein, the conveying line is used for conveying the PCB boards which are overlapped together, and the PCB boards which are conveyed by the conveying line sequentially pass through the positioning and PIN printing mechanism, the board overlapping mechanism, the encapsulation mechanism, the marking mechanism and the blanking mechanism, wherein the plate stacking mechanism is used for transferring the base plate to the conveying line, the base plate is positioned at the PIN feeding mechanism, the positioning PIN punching device is used for stacking the PCB plate on the base plate and inserting the PIN needles into the stacked PCB plate and base plate, the laminated PCB and the base plate are fixed, and meanwhile, the laminating mechanism is also used for fixing the laminated PCB and the base plate after the PIN printing of the PCB is finished, an aluminum sheet is laminated on the PCB, the rubber coating mechanism is used for attaching the adhesive tape to the edge of the PCB fixed by the PIN needle, the PCB is further fixed, the marking mechanism is used for marking the PCB and the base plate which are overlapped together, and the blanking mechanism is used for removing the PCB from the conveying line.
According to the invention, two first rubber coating machine groups of a first rubber coating device are used for carrying out rubber coating operation on two opposite short edges of a PCB, wherein the distance between the two rubber coating machines in the first rubber coating machine group is set according to the width of the PCB, so that when the PCB passes through the first rubber coating device, the two rubber coating machines in the first rubber coating machine group can be aligned to the edges of the two ends of the side edge of the PCB, and thus the two rubber coating machines in the first rubber coating machine group can simultaneously carry out rubber coating treatment on the edges of the two ends of the short edge of the PCB, and further the two ends of the short edge of the PCB which is subjected to rubber coating can be effectively prevented from tilting relatively; two second rubber coating machine groups of the second rubber coating device are used for performing rubber coating operation on two opposite long edges of the PCB, wherein the distance between the two rubber coating machines in the second rubber coating machine group is set according to the length of the PCB, so that when the PCB passes through the second rubber coating device, the two rubber coating machines in the second rubber coating machine group can be aligned to the edges of the two ends of the long edges of the PCB, the two rubber coating machines in the second rubber coating machine group can simultaneously perform rubber coating treatment on the edges of the two ends of the side edges of the PCB, and further the two ends of the long edges of the PCB which are subjected to rubber coating can be effectively prevented from being relatively tilted; therefore, the invention can effectively improve the encapsulation quality of the PCB.
Simultaneously, after first rubber coating device accomplished the rubber coating operation, jacking rotary device can carry out the jacking to the PCB board between two first rubber coating machine groups, rotatory operation, through rotating the PCB board 90, can make the PCB board when the second rubber coating device is passed through under the transport of transfer chain, two second rubber coating machine groups towards second rubber coating device respectively on its two long limits, at this moment, second rubber coating machine group can advance the rubber coating operation to the both ends on the long limit of PCB board. Therefore, in the one-time conveying process of the PCB, the short edge and the long edge of the PCB can be encapsulated, and the encapsulating efficiency of the PCB can be effectively improved.
Furthermore, the conveyer belt includes the rubber coating transport section that corresponds rubber coating mechanism sets up, rubber coating transport section corresponds the window has been seted up to jacking rotary device.
The rubber-coated conveying belt can be two conveying belts which are parallel to each other, the window is formed between the two conveying belts, and the jacking rotating device is used for completing jacking and rotating of the PCB between the two conveying belts so that the PCB can rotate on the conveying belts by 90 degrees.
Furthermore, the conveying line comprises a positioning conveying section which is arranged corresponding to the positioning PIN printing mechanism, the positioning conveying section comprises a plurality of conveying rollers which are arranged along the vertical direction of the conveying line and are rotatably arranged on the rack, and a first transfer device which is arranged above the conveying rollers; the positioning and PIN printing mechanism comprises a centering device and a positioning and PIN printing device which are sequentially arranged along the conveying direction of the positioning and conveying section; the centering device is including setting up in both sides installation pole of the below of conveying roller, the installation pole along the direction of delivery of location conveying section sets up, just the installation pole along the direction of delivery's of location conveying section the vertical direction movably set up in the frame, the fixed a plurality of push rods that are provided with on the installation pole, the push rod upwards extends and passes through clearance between the conveying roller extends to the top of conveying roller.
Wherein, the positioning and conveying section is used for conveying the PCB, the centering device can push the PCB on the positioning and conveying section to the middle through the opposite movement of the two mounting rods on the centering device, thereby, the positioning of the PCB can be completed, so that the PCB can be conveyed on a conveying line in a predetermined path, so that the first transfer device can accurately grab the PCB on the positioning and conveying section, thereby accurately laminating the PCB on the backing plate placed on the conveying line by the laminating mechanism, accurately aligning the fixing holes on the PCB with the PIN punching station of the PIN punching machine to facilitate the PIN punching operation of the PIN punching machine, wherein, the first transfer device is preferably a transfer device capable of fixing a moving path, such as a robot, to ensure that the position of the PCB board transferred to the transfer line by the first transfer device is fixed, thereby ensuring that the fixing holes on the PCB transferred to the conveying line by the first transfer device can be aligned with the PIN printing station of the PIN printing machine.
Further, the positioning and PIN printing device comprises a PIN printing device and a positioning device, and the positioning device is positioned between the PIN printing device and the centering device; the PIN punching device comprises PIN punching machines arranged on two sides of the positioning and conveying section, each PIN punching machine comprises a first support arranged on the rack, a fixed table and a lifting table are arranged on the first support, a placing hole used for placing a PIN needle is formed in the fixed table, the lifting table is arranged above the fixed table in a vertically movable mode, and a thimble is fixedly arranged at the lower end of the lifting table corresponding to the placing hole; the positioning device comprises positioning machines arranged on two sides of the positioning conveying section, the positioning machines comprise positioning tables movably arranged on the rack through XY moving modules, CCD cameras are fixedly arranged above the positioning tables, positioning needles are vertically arranged on the surfaces of the positioning tables, and the positioning needles are telescopically arranged on the positioning tables.
Wherein, the CCD camera on the positioning device is used for detecting the position of the fixing hole on the PCB placed on the conveying line by the first transfer device, thereby the positioning PIN on the positioning table can be aligned with the fixing hole on the PCB, at the moment, the positioning PIN on the positioning table extends upwards out of the positioning table and can be inserted into the fixing hole on the PCB, then the positioning table is moved to the preset position, thereby the position deviation of the PCB in the transfer process by the first transfer device can be corrected, the fixing hole of the PCB transferred to the backing plate by the first transfer device can be ensured to be strictly aligned with the PIN punching station of the PIN punching machine, namely the thimble of the PIN punching machine, further the PIN punching machine can be ensured to smoothly insert the PIN into the fixing hole, the PCB is fixed, wherein, the placing hole of the PIN punching machine is used for placing the PIN needle, the lifting platform is used for pushing the thimble to move downwards, and further the thimble is pushed into the positioning hole, and fixing the PCB.
Further, the plate stacking mechanism comprises an accommodating space arranged on the rack, the accommodating space is positioned between the PIN punching mechanism and the encapsulation mechanism, and the accommodating space comprises a first accommodating position and a second accommodating position which are used for accommodating a transport trolley; the plate stacking mechanism further comprises a transfer module, the transfer module comprises a second transfer device and a third transfer device, the second transfer device and the third transfer device are arranged on the rack and respectively correspond to the first containing position and the second containing position.
The first containing position is used for placing the transport trolley loaded with the base plate, the second containing position is used for placing the transport trolley loaded with the aluminum sheet, the second transferring device is used for moving the wood base plate on the transport trolley to the conveying line before the PIN hitting mechanism carries out PIN hitting operation, the third transferring device is used for completing PIN hitting operation by the PIN hitting mechanism, and the aluminum sheet on the transport trolley is stacked on the PCB.
Furthermore, locking devices for fixing the transport trolley in the accommodating space are further arranged at the first accommodating position and the second accommodating position in the accommodating space.
The locking device at the first containing position and the second containing position is used for fixing the position of the transport trolley in the first containing position and the second containing position, and further fixing the positions of the base plate and the aluminum plate on the transport trolley, so that the position accuracy of the base plate and the aluminum plate is improved when the base plate and the aluminum plate are transferred by the second transfer device and the third transfer device.
Further, fold board mechanism still including set up in drilling mechanism in the frame, drilling mechanism including set up in the drilling machine of the both sides of transfer chain, the drilling machine including set up in second support in the frame, be provided with backup pad and mounting panel on the second support, the mounting panel is located the top of backup pad, just the mounting panel can set up with reciprocating in the second support, the vertical drill bit that is provided with on the mounting panel, the drill bit pass through driving motor set up in the mounting panel, the backup pad corresponds the drill bit is provided with the via hole that supplies the drill bit to pass.
The second transfer device is preferably a transfer device capable of fixing a moving path, such as a manipulator, so as to ensure that the position of the base plate transferred to the conveying line by the second transfer device is fixed, thereby ensuring that the position of the through hole transferred to the base plate on the conveying line by the second transfer device is fixed, and further ensuring that the through hole of the base plate transferred to the conveying line by the second transfer device can be aligned with the ejector PIN of the PIN printing machine.
Wherein, the backup pad supports the PCB board, and the drill bit moves down under the drive of mounting panel can carry out drilling operation to the backing plate.
Further, the transfer chain is including corresponding marking transport section that marking mechanism set up, marking mechanism including set up in turning device in the frame and set up in the laser marking machine of turning device top.
The turnover device is used for turning over the PCB so that the aluminum plate in the PCB is positioned below the turnover device, namely, the part of the PIN needle extending out of the PCB faces upwards, so that the blanking mechanism can stack the fixed multiple layers of PCBs; the laser marking machine is used for carrying out laser marking operation on the backing plate positioned above after the PCB is turned over.
Furthermore, the turnover device comprises two turnover clamping hands which are respectively arranged at two sides of the marking conveying section, each turnover clamping hand comprises a third support, a turntable is vertically arranged on each third support, the turntable is rotatably arranged on the rack, a first clamping plate and a second clamping plate are arranged on the turntable, the first clamping plate is fixedly arranged on the turntable, the second clamping plate is arranged below the first clamping plate, and the second clamping plate can be vertically and vertically arranged on the turntable; the marking conveying section comprises a conveying table corresponding to the turnover device, and the moving table can be arranged on the rack along the conveying direction of the conveying line.
Wherein, the second splint are used for passing through it at the PCB board, compress tightly the PCB board on first splint to realize its fixed to the PCB board, and then accomplish the upset of PCB board under the rotation of carousel. After the turnover device fixes the PCB, the transfer table for moving the PCB moves backwards, so that the turnover device can smoothly turn over the PCB.
Further, the rubber coating machine comprises a fourth support arranged on the machine frame, a winding disc for winding a rubber belt and a conveying device for conveying the rubber belt are arranged on the fourth support, the conveying device comprises a guide plate vertically arranged on the fourth support, a conveying wheel is arranged on one side of the guide plate, the conveying wheel is rotatably arranged on the machine frame, a plurality of convex strips are arranged on the side surface of the conveying wheel along the axial direction of the conveying wheel, and the thickness of the convex strips is gradually reduced along the direction far away from the conveying wheel; the rubber cutting device is further arranged on the rack and comprises a rubber cutting head capable of moving towards the rubber coating conveying section in a reciprocating mode, an upper push plate and a lower push plate which are parallel to each other are arranged on the rubber cutting head, the upper push plate and the lower push plate are arranged up and down, a cutter is arranged at one end, facing towards the rubber coating conveying section, of the upper push plate, and the distance from one end, facing towards the rubber coating conveying section, of the lower push plate to the rubber coating conveying section is smaller than the distance from one end, facing towards the rubber coating conveying section, of the upper push plate to the rubber coating conveying section.
Wherein, the winding disc is used for winding the adhesive tape, the conveying wheel is used for pressing the adhesive tape led out from the winding disc on the guide plate, the adhesive tape can move downwards along the guide plate by the rotation of the conveying wheel, wherein, the conveying wheel is contacted with one side of the adhesive tape with viscosity, the convex strip on the conveying wheel is used for preventing the adhesive tape from adhering on the conveying wheel, the adhesive tape cutting head is used for pushing the adhesive tape moving downwards along the guide plate to the edge of the PCB plate, the lower push plate is used for pushing the adhesive tape to the PCB plate and adhering the adhesive tape to the lower surface of the PCB plate, the upper push plate is used for pushing the adhesive tape to the PCB plate and adhering the adhesive tape to the upper surface of the PCB plate, meanwhile, the lower push plate has smaller distance from the PCB plate, after the lower push plate pushes the adhesive tape to adhere to the lower surface of the PCB plate, the cutter on the upper push plate can contact the adhesive tape and cut off the adhesive tape, and simultaneously, the upper push plate can adhere the cut off the adhesive tape to the upper surface of the PCB plate, wherein, because need exert certain thrust just can make the cutter cut off the sticky tape on the sticky tape, consequently can be through the rotation control sticky tape of control cam when being cut off the position that the sticky tape was located to guarantee that the sticky tape can be adhered to the upper surface of PCB board by the push-up board smoothly.
The principle and effect of the present invention will be further explained by combining the above technical scheme and the accompanying drawings:
1. according to the invention, two first rubber coating machine groups of a first rubber coating device are used for carrying out rubber coating operation on two opposite short edges of a PCB, wherein the distance between the two rubber coating machines in the first rubber coating machine group is set according to the width of the PCB, so that when the PCB passes through the first rubber coating device, the two rubber coating machines in the first rubber coating machine group can be aligned to the edges of the two ends of the side edge of the PCB, and thus the two rubber coating machines in the first rubber coating machine group can simultaneously carry out rubber coating treatment on the edges of the two ends of the short edge of the PCB, and further the two ends of the short edge of the PCB which is subjected to rubber coating can be effectively prevented from tilting relatively; two second rubber coating machine groups of the second rubber coating device are used for performing rubber coating operation on two opposite long edges of the PCB, wherein the distance between the two rubber coating machines in the second rubber coating machine group is set according to the length of the PCB, so that when the PCB passes through the second rubber coating device, the two rubber coating machines in the second rubber coating machine group can be aligned to the edges of the two ends of the long edges of the PCB, the two rubber coating machines in the second rubber coating machine group can simultaneously perform rubber coating treatment on the edges of the two ends of the side edges of the PCB, and further the two ends of the long edges of the PCB which are subjected to rubber coating can be effectively prevented from being relatively tilted; therefore, the invention can effectively improve the encapsulation quality of the PCB.
2. According to the invention, after the first rubber coating device finishes rubber coating operation, the jacking and rotating device can jack and rotate the PCB between the two first rubber coating device groups, and the two long edges of the PCB can respectively face the two second rubber coating device groups of the second rubber coating device when the PCB is conveyed by the conveying line and passes through the second rubber coating device by rotating the PCB by 90 degrees, so that the two ends of the long edges of the PCB can be subjected to rubber coating operation by the second rubber coating device groups. Therefore, in the one-time conveying process of the PCB, the short edge and the long edge of the PCB can be encapsulated, and the encapsulating efficiency of the PCB can be effectively improved.
Drawings
Fig. 1 is a first schematic structural diagram of a full-automatic PCB board glue-wrapping line according to an embodiment of the present invention;
FIG. 2 is an enlarged view of a portion A of FIG. 1;
FIG. 3 is a partial enlarged view of a portion a of FIG. 2;
FIG. 4 is a partial enlarged view of portion b of FIG. 2;
FIG. 5 is a partial enlarged view of portion B of FIG. 1;
FIG. 6 is a partial enlarged view of portion c of FIG. 5;
FIG. 7 is a partial enlarged view of portion d of FIG. 5;
FIG. 8 is a second schematic structural diagram of a full-automatic PCB glue-wrapping line according to an embodiment of the present invention;
fig. 9 is a partially enlarged view of a portion C in fig. 8.
Description of reference numerals:
1-a positioning PIN-coating mechanism, 11-a first transfer device, 121-a positioning machine, 131-a PIN-coating machine, 141-a push rod, 2-a plate stacking mechanism, 21-an accommodating space, 211-a first accommodating position, 212-a second accommodating position, 22-a transfer module, 221-a second transfer device, 23-a drilling machine, 24-a transport trolley, 231-a second support, 232-an installing plate, 233-a supporting plate, 234-a driving motor, 235-a drill bit, 3-a rubber-coating mechanism, 301-a rubber-coating machine, 3011-a fourth support, 3012-a winding disc, 3013-a guide plate, 3014-a conveying wheel, 3015-a rubber-cutting head, 31-a first rubber-coating machine set, 32-a second rubber-coating machine set, 33-a jacking rotating device and 4-a marking mechanism, 41-overturning clamping hands, 411-a third support, 412-a rotating disc, 413-a first clamping plate, 414-a second clamping plate, 42-a laser marking machine, 5-a blanking mechanism, 61-a positioning conveying section, 611-a conveying roller and 62-a transfer table.
Detailed Description
For the convenience of understanding of those skilled in the art, the present invention will be described in further detail below with reference to the accompanying drawings and examples:
as shown in fig. 1-2, a full-automatic PCB board encapsulation line comprises a frame, wherein a positioning PIN punching mechanism 131, a plate stacking mechanism 2, an encapsulation mechanism 301, a marking mechanism 4 and a blanking mechanism 5 are sequentially arranged on the frame; the frame is also provided with a conveying line which sequentially passes through the positioning PIN feeding mechanism, the plate stacking mechanism 2, the rubber coating mechanism 3013, the marking mechanism 4 and the blanking mechanism 5 and is used for conveying the PCB; glue package machine 301 constructs 3 and includes first glue-wrapping device and second glue-wrapping device that set gradually along the direction of delivery of transfer chain, first glue-wrapping device including set up respectively in two first glue-wrapping machine group 31 of the both sides of transfer chain, first glue-wrapping machine group 31 is including two glue-wrapping machines 301 that set up side by side, second glue-wrapping device including set up respectively in two second glue-wrapping machine group 32 of the both sides of transfer chain, second glue-wrapping machine group 32 is including two glue-wrapping machines 301 that set up side by side, be provided with jacking rotary device 33 between two first glue-wrapping machine group 31, jacking rotary device 33 set up in the frame.
Wherein, the conveying line is used for conveying the stacked PCB boards, and the PCB boards conveyed by the conveying line sequentially pass through the positioning PIN printing mechanism 131, the stacking mechanism 2, the encapsulation mechanism 301, the marking mechanism 4 and the blanking mechanism 5, wherein the plate stacking mechanism 2 is used for transferring the base plate to the conveying line, the base plate is positioned at the PIN loading mechanism, the positioning PIN hitting device is used for stacking the PCB plate on the base plate and inserting the PIN needle into the PCB plate and the base plate which are stacked together, the laminated PCB and the base plate are fixed, and meanwhile, the laminating mechanism 2 is also used for fixing the base plate and the PCB after PIN printing of the PCB is completed, an aluminum sheet is laminated on the PCB, the rubber coating mechanism 301 is used for attaching the adhesive tape to the edge of the PCB fixed by the PIN needle, the PCB is further fixed, the marking mechanism 4 is used for marking the laminated PCB and the backing plate, and the blanking mechanism 5 is used for removing the PCB from the conveying line.
In the invention, two first rubber coating machine groups 31 of a first rubber coating device are used for carrying out rubber coating operation on two opposite short sides of a PCB, wherein the distance between two rubber coating machines 301 in the first rubber coating machine group 31 is set according to the width of the PCB, so that when the PCB passes through the first rubber coating device, the two rubber coating machines 301 in the first rubber coating machine groups 31 can be aligned to the edges of two ends of the side edge of the PCB, thus the two rubber coating machines 301 in the first rubber coating machine groups 31 can simultaneously carry out rubber coating treatment on the edges of two ends of the short side of the PCB, and further the two ends of the short side of the PCB which is subjected to rubber coating can be effectively prevented from tilting relatively; the two second rubber coating machines 32 of the second rubber coating machine set 32 are used for performing rubber coating operation on two opposite long edges of the PCB, wherein the distance between the two rubber coating machines 301 in the second rubber coating machine set 32 is set according to the length of the PCB, so that when the PCB passes through the second rubber coating machine set, the two rubber coating machines 301 in the second rubber coating machines 32 can be aligned to the edges of the two ends of the long edges of the PCB, the two rubber coating machines 301 in the second rubber coating machines 32 can perform rubber coating treatment on the edges of the two ends of the side edges of the PCB at the same time, and further the two ends of the long edges of the PCB which are coated with rubber can be prevented from tilting relatively; therefore, the invention can effectively improve the encapsulation quality of the PCB.
Simultaneously, first rubber coating device accomplishes the rubber coating operation after, jacking rotary device 33 can carry out the jacking to the PCB board between two first rubber coating machine group 31, rotatory operation, through rotating 90 with the PCB board, can make the PCB board when the second rubber coating device is passed through under the transport of transfer chain, two second rubber coating machine group 32 towards second rubber coating machine respectively on its two long limits, and at this moment, second rubber coating machine group 32 can advance the rubber coating operation to the both ends on the long limit of PCB board. Therefore, in the one-time conveying process of the PCB, the short edge and the long edge of the PCB can be encapsulated, and the encapsulating efficiency of the PCB can be effectively improved.
In one embodiment, the conveying belt comprises a rubber coating conveying section corresponding to the rubber coating machine 301 and arranged in the mechanism 3, and the rubber coating conveying section corresponds to the jacking rotating device 33 and is provided with a window.
In this embodiment, the encapsulation conveyor belt may be two conveyor belts parallel to each other, a window is formed between the two conveyor belts, and the jacking and rotating device 33 is used to complete jacking and rotating of the PCB between the two conveyor belts, so that the PCB rotates by 90 ° on the conveyor belt.
In one embodiment, the conveying line includes a positioning conveying section 61 disposed corresponding to the positioning PIN printing mechanism 131, the positioning conveying section 61 includes a plurality of conveying rollers 611 disposed along a direction perpendicular to a conveying direction of the conveying line and rotatably disposed on the rack, and a first transfer device 11 disposed above the conveying rollers 611; the positioning and PIN printing mechanism 131 comprises a centering device and a positioning and PIN printing device which are sequentially arranged along the conveying direction of the positioning and conveying section 61; the centering device comprises two side mounting rods arranged below the conveying rollers 611, the mounting rods are arranged along the conveying direction of the positioning conveying section 61 and movably arranged on the rack along the vertical direction of the conveying direction of the positioning conveying section 61, a plurality of push rods 141 are fixedly arranged on the mounting rods, and the push rods 141 extend upwards and extend to the upper side of the conveying rollers 611 through gaps between the conveying rollers 611.
In this embodiment, the positioning and conveying section 61 is used for conveying the PCB, the centering device can push the PCB on the positioning and conveying section 61 toward the middle by moving the two mounting rods on the centering device in opposite directions, so as to position the PCB, so that the PCB can be conveyed on the conveying line in a predetermined path, and further the first transfer device 11 can accurately grasp the PCB on the positioning and conveying section 61, so as to accurately stack the PCB onto the backing plate placed on the conveying line by the stacking mechanism 2, and accurately align the fixing holes on the PCB with the PIN printing stations of the PIN printing machine 131, so as to facilitate the PIN printing operation of the PIN printing machine 131, wherein the first transfer device 11 preferably includes a transfer device, such as a manipulator, capable of fixing the moving path, so as to ensure that the position of the PCB transferred to the conveying line by the first transfer device 11 is fixed, so as to ensure that the fixing holes on the PCB transferred to the PIN printing device 11 can be aligned with the PIN printing stations of the PIN printing machine 131 And (6) a station.
In one embodiment, the positioning and PIN printing device comprises a PIN printing device and a positioning device, and the positioning device is located between the PIN printing device and the centering device; the PIN punching device comprises PIN punching machines 131 arranged on two sides of the positioning and conveying section 61, each PIN punching machine 131 comprises a first support arranged on the rack, a fixing table and a lifting table are arranged on the first support, a placing hole for placing a PIN needle is formed in the fixing table, the lifting table is arranged above the fixing table in a vertically movable mode, and a thimble is fixedly arranged at the lower end of the lifting table corresponding to the placing hole; the positioning device comprises positioning machines 121 arranged on two sides of the positioning conveying section 61, each positioning machine 121 comprises a positioning table movably arranged on the rack through an XY moving module, a CCD camera is fixedly arranged above the positioning table, a positioning needle is vertically arranged on the surface of the positioning table, and the positioning needle is telescopically arranged on the positioning table.
In this embodiment, the CCD camera on the positioning device is used to detect the position of the fixing hole on the PCB placed on the conveying line by the first transfer device 11, so that the positioning PIN on the positioning table can be aligned with the fixing hole on the PCB, at this time, the positioning PIN on the positioning table extends upward out of the positioning table and can be inserted into the fixing hole on the PCB, then the positioning table is moved to the preset position, so that the position deviation of the PCB during the transfer process by the first transfer device 11 can be corrected, so as to ensure that the fixing hole of the PCB transferred to the pad by the first transfer device 11 can be strictly aligned with the PIN punching station of the PIN punching machine 131, i.e. the PIN of the PIN punching machine 131 is strictly aligned, and further ensure that the PIN punching machine 131 can smoothly insert the PIN into the fixing hole to fix the PCB, wherein the placing hole of the PIN punching machine is used to place the PIN, and the lifting table is used to push the PIN down, and then make the thimble push the locating hole with PIN needle in, realize the fixed of PCB board.
In one embodiment, the plate stacking mechanism 2 includes an accommodating space 21 disposed on the rack, the accommodating space 21 is located between the PIN printing mechanism 131 and the glue coating machine 301, and the accommodating space 21 includes a first accommodating position 211 and a second accommodating position 212 for accommodating a transport cart 24; the plate stacking mechanism 2 further comprises a transfer module 22, wherein the transfer module 22 comprises a second transfer device 221 and a third transfer device which are arranged on the rack, and the second transfer device 221 and the third transfer device are respectively arranged corresponding to the first accommodating position 211 and the second accommodating position 212.
In this embodiment, the first receiving position 211 is used for placing the transport cart 24 loaded with the tie plate, the second receiving position 212 is used for placing the transport cart 24 loaded with the aluminum sheet, the second transfer device 221 is used for moving the wood tie plate on the transport cart 24 to the conveying line before the PIN printing operation of the PIN printing mechanism 131 is performed, and the third transfer device is used for stacking the aluminum sheet on the transport cart 24 onto the PCB after the PIN printing operation of the PIN printing mechanism 131 is completed.
In one embodiment, locking devices for fixing the transportation cart 24 in the accommodating space 21 are further disposed at the first accommodating position 211 and the second accommodating position 212 in the accommodating space 21.
In this embodiment, the locking devices at the first receiving position 211 and the second receiving position 212 are used to fix the positions of the transport cart 24 therein, and further fix the positions of the backing plates and the aluminum plates on the transport cart 24, so as to improve the position accuracy of the backing plates and the aluminum plates when the second transfer device 221 and the third transfer device transfer the backing plates and the aluminum plates.
One of them embodiment, the lamination mechanism 2 still including set up in drilling machine 23 in the frame constructs, drilling machine 23 constructs including set up in the drilling machine 23 of the both sides of transfer chain, drilling machine 23 including set up in second support 231 in the frame, be provided with backup pad 233 and mounting panel 232 on the second support 231, mounting panel 232 is located the top of backup pad 233, just mounting panel 232 can set up with reciprocating in second support 231, the vertical drill bit 235 that is provided with on mounting panel 232, drill bit 235 through driving motor 234 set up in mounting panel 232, backup pad 233 corresponds drill bit 235 is provided with the via hole that supplies drill bit 235 to pass.
In this embodiment, the second transfer device 221 may also transfer the tie plate to the drilling machine 23 before transferring the tie plate to the PIN printing machine 131 to drill a through hole on the tie plate corresponding to the fixing hole on the PCB for passing the PIN, and the second transfer device 221 may preferably be a transfer device capable of fixing a moving path, such as a robot, to ensure that the position of the tie plate transferred to the transport line by the second transfer device 221 is fixed, to ensure that the position of the through hole on the tie plate transferred to the transport line by the second transfer device 221 is fixed, and to ensure that the through hole of the tie plate transferred to the transport line by the second transfer device is aligned with the PIN of the PIN printing machine 131.
Wherein, the supporting plate 233 supports the PCB, and the drill bit 235 is driven by the mounting plate 232 to move downwards to perform a drilling operation on the pad plate.
In one embodiment, the conveying line includes a marking conveying section corresponding to the marking mechanism 4, and the marking mechanism 4 includes a turnover device arranged on the rack and a laser marking machine 42 arranged above the turnover device.
In this embodiment, the turnover device is used for turning over the PCB to enable the aluminum plate therein to be located below, that is, to enable the part of the PIN extending out of the PCB to be upward, so that the blanking mechanism 5 stacks the fixed multiple layers of PCBs; the laser marking machine 42 is used for performing a laser marking operation on the backing plate located above after the PCB is turned over.
In one embodiment, the turning device includes two turning grippers 41 respectively disposed at two sides of the marking conveying section, the turning gripper 41 includes a third support 411, a turntable 412 is vertically disposed on the third support 411, the turntable 412 is rotatably disposed on the rack, a first clamping plate 413 and a second clamping plate 414 are disposed on the turntable 412, the first clamping plate 413 is fixedly disposed on the turntable 412, the second clamping plate 414 is disposed below the first clamping plate 413, and the second clamping plate 414 is disposed on the turntable 412 in a vertically movable manner; the marking conveying section comprises a transfer table 62 arranged corresponding to the turnover device, and the transfer table can be arranged on the rack along the conveying direction of the conveying line.
In this embodiment, the second clamping plate 414 is used for pressing the PCB plate against the first clamping plate 413 when the PCB plate passes through it, so as to fix the PCB plate, and then complete the turnover of the PCB plate under the rotation of the turntable 412. Wherein, after the turnover device fixes the PCB, the transfer table 62 for moving the PCB moves backward so that the turnover device can smoothly turn the PCB.
In one embodiment, the glue coating machine 301 includes a fourth support 3011 arranged on the rack, a winding disc 3012 for winding the adhesive tape and a conveying device for conveying the adhesive tape are arranged on the fourth support 3011, the conveying device includes a guide plate 3013 vertically arranged on the fourth support 3011, a conveying wheel 3014 is arranged on one side of the guide plate 3013, the conveying wheel 3014 is rotatably arranged on the rack, and a plurality of raised lines are arranged on the side surface of the conveying wheel 3014 along the axial direction of the conveying wheel 3014, and the thickness of the raised lines is gradually reduced along the direction away from the conveying wheel 3014; the rubber cutting device is further arranged on the rack and comprises a rubber cutting head 3015 capable of moving towards the rubber coating conveying section in a reciprocating mode, an upper push plate and a lower push plate which are parallel to each other are arranged on the rubber cutting head 3015, the upper push plate and the lower push plate are arranged up and down, a cutter is arranged at one end, facing towards the rubber coating conveying section, of the upper push plate, and the distance from one end, facing towards the rubber coating conveying section, of the lower push plate to the rubber coating conveying section is smaller than the distance from one end, facing towards the rubber coating conveying section, of the upper push plate to the rubber coating conveying section.
In this embodiment, the winding disc 3012 is used to wind the tape, the conveying wheel 3014 is used to press the tape led out from the winding disc 3012 against the guide plate 3013, and the tape can be moved down along the guide plate 3013 by the rotation of the conveying wheel 3014, wherein the conveying wheel 3014 is in contact with the side of the tape having viscosity, the protruding strip on the conveying wheel 3014 is used to prevent the tape from adhering to the conveying wheel 3014, the tape cutting head 3015 is used to push the tape moving down along the guide plate 3013 to the edge of the PCB, the lower pushing plate is used to push the tape to the PCB and make the tape adhere to the lower surface of the PCB, the upper pushing plate is used to push the tape to the PCB and make the tape adhere to the upper surface of the PCB, and at the same time, since the lower pushing plate is at a smaller distance from the PCB, the cutter on the upper pushing plate will contact with the tape and can cut the tape, at the same time, the push-up plate can be attached to the upper surface of the PCB board by the cut-off adhesive tape, wherein the cutter can cut off the adhesive tape only by applying a certain thrust on the adhesive tape, so that the position of the adhesive tape can be controlled by the rotation of the control cam when the adhesive tape is cut off, and the adhesive tape can be smoothly adhered to the upper surface of the PCB board by the push-up plate.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1.一种全自动PCB板包胶线，其特征在于，包括机架，所述机架上依次设置有定位打PIN机构、叠板机构、包胶机构、打标机构以及下料机构；所述机架上还设置有依次经过所述定位上PIN机构、叠板机构、包胶机构、打标机构以及下料机构的，用于输送PCB板的输送线；所述包胶机构包括沿着输送线的输送方向依次设置的第一包胶装置和第二包胶装置，所述第一包胶装置包括分别设置于所述输送线的两侧的两第一包胶机组，所述第一包胶机组包括并列设置的两包胶机，所述第二包胶装置包括分别设置于所述输送线的两侧的两第二包胶机组，所述第二包胶机组包括并列设置的两包胶机，所述两第一包胶机组之间设置有顶升旋转装置，所述顶升旋转装置设置于所述机架。1. a fully automatic PCB board glue line, it is characterized in that, comprise the rack, on the described rack, be provided with the positioning and playing PIN mechanism, the stacking mechanism, the rubber coating mechanism, the marking mechanism and the blanking mechanism successively; The frame is also provided with a conveyor line for conveying the PCB board that passes through the positioning PIN mechanism, the plate stacking mechanism, the rubber coating mechanism, the marking mechanism and the unloading mechanism in sequence; The first and second rubber encapsulation devices are arranged in sequence along the conveying direction of the conveying line. The rubber bagging unit includes two rubber bagging units arranged side by side, and the second rubber bagging device includes two second rubber bagging units arranged on both sides of the conveying line respectively, and the second rubber bagging unit includes two parallel rubber bagging units. In the rubber lagging machine, a lifting and rotating device is arranged between the two first rubber lagging units, and the lifting and rotating device is arranged on the frame. 2.根据权利要求1所述的全自动PCB板包胶线，其特征在于，所述输送带包括对应所述包胶机构设置的包胶输送段，所述包胶输送段对应所述顶升旋转装置开设有开窗。2 . The fully automatic PCB board glue-covering line according to claim 1 , wherein the conveyor belt comprises a rubber-covering conveying section corresponding to the rubber-covering mechanism, and the rubber-covering conveying section corresponds to the jacking up. 3 . The rotating device is provided with an opening window. 3.根据权利要求1所述的全自动PCB板包胶线，其特征在于，所述输送线包括对应所述定位打PIN机构设置的定位输送段，所述定位输送段包括若干沿着所述输送线的输送方向的垂直方向设置，且可转动地设置于所述机架上的输送辊，以及设置于所述输送辊上方的第一移送装置；所述定位打PIN机构包括沿着所述定位输送段的输送方向依次设置的居中装置和定位打PIN装置；所述居中装置包括设置于所述输送辊的下方的两侧安装杆，所述安装杆沿着所述定位输送段的输送方向设置，且所述安装杆沿着所述定位输送段的输送方向的垂直方向可移动地设置于所述机架，所述安装杆上固定设置有若干推杆，所述推杆向上延伸并经过所述输送辊之间的间隙延伸至所述输送辊的上方。3. The fully automatic PCB board glue-covering line according to claim 1, wherein the conveying line comprises a positioning and conveying section set corresponding to the positioning and PIN-playing mechanism, and the positioning and conveying section includes a plurality of sections along the a conveying roller arranged in the vertical direction of the conveying direction of the conveying line and rotatably arranged on the frame, and a first conveying device arranged above the conveying roller; The centering device and the positioning PIN device are sequentially arranged in the conveying direction of the positioning and conveying section; the centering device includes two side mounting rods arranged below the conveying rollers, and the mounting rods are along the conveying direction of the positioning and conveying section. and the installation rod is movably arranged on the frame along the vertical direction of the conveying direction of the positioning and conveying section, and a plurality of push rods are fixedly arranged on the installation rod, and the push rods extend upward and pass through The gap between the conveying rollers extends above the conveying rollers. 4.根据权利要求3所述的全自动PCB板包胶线，其特征在于，所述定位打PIN装置包括打PIN装置和定位装置，所述定位装置位于所述打PIN装置与所述居中装置之间；所述打PIN装置包括设置于所述定位输送段的两侧的打PIN机，所述打PIN机包括设置于所述机架上的第一支架，所述第一支架上设置有固定台和升降台，所述固定台上开设有用于放置PIN针的放置孔，所述升降台可上下移动地设置于所述固定台的上方，且所述升降台的下端对应所述放置孔固定设置有顶针；所述定位装置包括设置于所述定位输送段的两侧的定位机，所述定位机包括通过XY移动模组可移动地设置于所述机架上的定位台，所述定位台的上方固定设置有CCD相机，且所述定位台的表面还竖直设置有定位针，所述定位针可伸缩地设置于所述定位台。4. The fully automatic PCB board glue-covering line according to claim 3, wherein the positioning and PIN-playing device comprises a PIN-playing device and a positioning device, and the positioning device is located between the PIN-playing device and the centering device. between; the PIN device includes a PIN machine arranged on both sides of the positioning and conveying section, the PIN machine includes a first bracket arranged on the frame, and the first bracket is provided with A fixed table and a lifting table, the fixed table is provided with a placement hole for placing the PIN needle, the lifting table can be moved up and down above the fixed table, and the lower end of the lifting table corresponds to the placement hole A thimble is fixedly arranged; the positioning device includes a positioning machine arranged on both sides of the positioning conveying section, and the positioning machine includes a positioning table movably arranged on the frame through an XY moving module, the A CCD camera is fixedly arranged above the positioning table, and a positioning pin is also vertically arranged on the surface of the positioning table, and the positioning pin is telescopically arranged on the positioning table. 5.根据权利要求4所述的全自动PCB板包胶线，其特征在于，所述叠板机构包括设置于所述机架上容纳空间，所述容纳空间位于所述打PIN机构和所述包胶机构之间，且所述容纳空间包括用于容纳运输小车的第一容纳位和第二容纳位；所述叠板机构还包括移送模组，所述移送模组包括设置于所述机架上的第一移送装置、第二移送装置和第三移送装置，所述第二移送装置和第三移送装置分别对应所述第一容纳位置和第二容纳位设置。5. The fully automatic PCB board glue-covering line according to claim 4, wherein the stacking mechanism comprises an accommodating space provided on the rack, and the accommodating space is located between the PIN-making mechanism and the accommodating space. between the lagging mechanisms, and the accommodating space includes a first accommodating position and a second accommodating position for accommodating the transport trolley; the stacking mechanism further includes a transfer module, and the transfer module includes a A first transfer device, a second transfer device and a third transfer device on the shelf, the second transfer device and the third transfer device are respectively arranged corresponding to the first accommodating position and the second accommodating position. 6.根据权利要求5所述的全自动PCB板包胶线，其特征在于，所述容纳空间内的第一容纳位和第二容纳位处还设置有用于将所述运输小车固定在所述容纳空间内的锁止装置。6 . The fully automatic PCB board glue line according to claim 5 , wherein the first accommodating position and the second accommodating position in the accommodating space are further provided with a device for fixing the transport trolley on the Locking device in the accommodating space. 7.根据权利要求5所述的全自动PCB板包胶线，其特征在于，所述叠板机构还包括设置于所述机架上的钻孔机构，所述钻孔机构包括设置于所述输送线的两侧的钻孔机，所述钻孔机包括设置于所述机架上的第二支架，所述第二支架上设置有支撑板和安装板，所述安装板位于所述支撑板的上方，且所述安装板可上下移动地设置于所述第二支架，所述安装板上竖直设置有钻头，所述钻头通过驱动电机设置于所述安装板，所述支撑板对应所述钻头设置有供钻头穿过的过孔。7 . The fully automatic PCB board glue line according to claim 5 , wherein the stacking mechanism further comprises a drilling mechanism arranged on the frame, and the drilling mechanism includes a drilling mechanism arranged on the Drilling machines on both sides of the conveying line, the drilling machine includes a second bracket arranged on the frame, a support plate and an installation plate are arranged on the second bracket, and the installation plate is located on the support Above the plate, and the mounting plate can be moved up and down on the second bracket, the mounting plate is vertically arranged with a drill bit, the drill bit is arranged on the mounting plate through a driving motor, and the support plate corresponds to The drill bit is provided with a via hole for the drill bit to pass through. 8.根据权利要求1所述的全自动PCB板包胶线，其特征在于，所述输送线包括对应所述打标机构设置的打标输送段，所述打标机构包括设置于所述机架上的翻转装置以及设置于所述翻转装置上方的激光打标机。8. The fully automatic PCB board coating line according to claim 1, wherein the conveying line comprises a marking conveying section corresponding to the marking mechanism, and the marking mechanism comprises a A flipping device on the shelf and a laser marking machine arranged above the flipping device. 9.根据权利要求8所述的全自动PCB板包胶线，其特征在于，所述翻转装置包括分别设置于所述打标输送段的两侧的两翻转夹手，所述翻转夹手包括第三支架，所述第三支架上竖直设置有转盘，所述转盘可转动地设置于所述机架，所述转盘上设置有第一夹板和第二夹板，所述第一夹板固定设置于所述转盘，所述第二夹板设置于所述第一夹板的下方，且所述第二夹板可上下移动地设置于所述转盘；所述打标输送段包括对应翻转装置设置的移送台，所述移动台沿着所述输送线的输送方向可以地设置于所述机架。9 . The fully automatic PCB board glue-covering line according to claim 8 , wherein the turning device comprises two turning grippers respectively disposed on both sides of the marking conveying section, and the turning gripping hands include: 10 . A third bracket, a turntable is vertically arranged on the third bracket, the turntable is rotatably arranged on the frame, a first splint and a second splint are arranged on the turntable, and the first splint is fixedly arranged In the turntable, the second clamping plate is arranged below the first clamping plate, and the second clamping plate is arranged on the turntable so as to be movable up and down; the marking conveying section includes a transfer table corresponding to the turning device , the mobile platform can be arranged on the frame along the conveying direction of the conveying line. 10.根据权利要求1所述的全自动PCB板包胶线，其特征在于，所述包胶机包括设置于所述机架上的第四支架，所述第四支架上设置有用于卷绕胶带的卷绕盘和用于输送胶带的输送装置，所述输送装置包括竖直设置于所述第四支架的导向板，所述导向板的一侧设置有输送轮，所述输送轮可转动地设置于所述机架，且所述输送轮的侧面沿着所述输送轮的轴向方向设置有若干凸条，所述凸条沿着远离所述输送轮的方向其厚度逐渐减小；所述机架上还设置有切胶装置，所述切胶装置包括可朝向所述包胶输送段往复移动的切胶头，所述切胶头上设置有相互平行的上推板和下推板，所述上推板和下推板上下设置，且所述上推板朝向所述包胶输送段的一端设置有切刀，所述下推板朝向所述包胶输送段的一端距包胶输送段的距离小于所述上推板朝向所述包胶输送段的一端距包胶输送段的距离。10. The fully automatic PCB board gluing line according to claim 1, wherein the gluing machine comprises a fourth bracket arranged on the frame, and the fourth bracket is provided with a device for winding A tape winding disc and a conveying device for conveying the tape, the conveying device includes a guide plate vertically arranged on the fourth bracket, and a conveying wheel is provided on one side of the guiding plate, and the conveying wheel is rotatable is arranged on the frame, and the side surface of the conveying wheel is provided with a plurality of protruding strips along the axial direction of the conveying wheel, and the thickness of the protruding strips gradually decreases along the direction away from the conveying wheel; The frame is also provided with a glue cutting device, the glue cutting device includes a glue cutting head that can move back and forth toward the rubber-coated conveying section, and the glue cutting head is provided with an upward push plate and a downward push plate that are parallel to each other. The upper push plate and the lower push plate are arranged up and down, and the end of the upper push plate facing the rubber encapsulation conveying section is provided with a cutter, and the end of the lower push plate facing the rubber encapsulation conveying section is separated from the bag The distance of the rubber conveying section is smaller than the distance between the end of the upper push plate facing the rubber lagging transport section and the rubber lagging transport section.
CN202111251973.9A 2021-10-27 2021-10-27 Fully automatic PCB board gluing line Active CN114051334B (en)

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CN116924059A (en) * 2022-03-31 2023-10-24 苏州维嘉科技股份有限公司 Rubber coating device and plate processing equipment with same
CN117682327A (en) * 2024-02-02 2024-03-12 昆山惠裕威电子科技有限公司 PIN rubber coating machine in full-automatic intelligence

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CN211720834U (en) * 2019-12-18 2020-10-20 惠州市成泰自动化科技有限公司 Automatic rubber coating mechanism of PCB
CN112437540A (en) * 2020-10-30 2021-03-02 惠州市成泰自动化科技有限公司 Soft board PCB rubber coating machine

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CN108513440A (en) * 2018-04-20 2018-09-07 深圳市动力飞扬自动化设备有限公司 A kind of encapsulated equipment of upper PIN for pcb board
CN208490040U (en) * 2018-04-20 2019-02-12 深圳市动力飞扬自动化设备有限公司 A kind of encapsulated equipment of upper PIN for pcb board
CN108838673A (en) * 2018-07-24 2018-11-20 山东爱通工业机器人科技有限公司 Pcb board automatically beats the encapsulated production line of pin
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CN112437540A (en) * 2020-10-30 2021-03-02 惠州市成泰自动化科技有限公司 Soft board PCB rubber coating machine

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CN116924059A (en) * 2022-03-31 2023-10-24 苏州维嘉科技股份有限公司 Rubber coating device and plate processing equipment with same
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CN117682327B (en) * 2024-02-02 2024-04-16 昆山惠裕威电子科技有限公司 PIN rubber coating machine in full-automatic intelligence

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