CN114101665B - 一种银包铜导电粉的制备方法 - Google Patents
一种银包铜导电粉的制备方法 Download PDFInfo
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- CN114101665B CN114101665B CN202111350535.8A CN202111350535A CN114101665B CN 114101665 B CN114101665 B CN 114101665B CN 202111350535 A CN202111350535 A CN 202111350535A CN 114101665 B CN114101665 B CN 114101665B
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- Prior art keywords
- silver
- copper powder
- coated copper
- powder
- acid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
Description
电阻率(mΩ·cm) | 方阻(Ω/□) | |
实施例1 | 0.294 | 0.150 |
实施例2 | 0.321 | 0.164 |
对比例3 | 1.13 | 0.580 |
Claims (8)
Priority Applications (1)
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CN202111350535.8A CN114101665B (zh) | 2021-11-15 | 2021-11-15 | 一种银包铜导电粉的制备方法 |
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CN202111350535.8A CN114101665B (zh) | 2021-11-15 | 2021-11-15 | 一种银包铜导电粉的制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN114101665A CN114101665A (zh) | 2022-03-01 |
CN114101665B true CN114101665B (zh) | 2023-08-29 |
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CN202111350535.8A Active CN114101665B (zh) | 2021-11-15 | 2021-11-15 | 一种银包铜导电粉的制备方法 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115376722A (zh) * | 2022-08-01 | 2022-11-22 | 隆基绿能科技股份有限公司 | 含有包覆层的铜铝颗粒粉末、制备方法及其应用 |
CN115805310B (zh) * | 2023-01-17 | 2023-05-26 | 苏州星翰新材料科技有限公司 | 银包铜粉、制备方法、在银包铜浆料中的应用及检测银包铜粉中银包覆层致密性的方法 |
Citations (10)
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CN202180203U (zh) * | 2011-06-20 | 2012-04-04 | 宁波广博纳米新材料股份有限公司 | 用于制备电子浆料用银包铜粉的反应釜 |
CN102950282A (zh) * | 2012-10-15 | 2013-03-06 | 宁波广博纳米新材料股份有限公司 | 银铜包覆粉的制备方法 |
CN104419922A (zh) * | 2013-08-26 | 2015-03-18 | 比亚迪股份有限公司 | 一种化学置换镀银液和化学置换镀银方法 |
JP2015092017A (ja) * | 2013-10-01 | 2015-05-14 | Dowaエレクトロニクス株式会社 | 銀被覆銅粉及びその製造方法、並びに導電性ペースト |
JP2016108649A (ja) * | 2014-11-26 | 2016-06-20 | 住友金属鉱山株式会社 | 銀コート銅粉及びその製造方法 |
CN207126515U (zh) * | 2017-06-14 | 2018-03-23 | 上海昊誉化工有限公司 | 一种生产高粘度胶黏剂的反应釜 |
CN108817377A (zh) * | 2018-06-22 | 2018-11-16 | 深圳市绚图新材科技有限公司 | 一种导电片状银包铜粉的制备方法 |
CN108941539A (zh) * | 2018-06-22 | 2018-12-07 | 深圳市绚图新材科技有限公司 | 一种低废液排放的银包铜粉的制备方法及设备 |
WO2021109728A1 (zh) * | 2019-12-06 | 2021-06-10 | 苏州太湖电工新材料股份有限公司 | 一种分散反应器 |
WO2021180029A1 (zh) * | 2020-03-10 | 2021-09-16 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 银包铜粉及其制备方法、电子浆料 |
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2021
- 2021-11-15 CN CN202111350535.8A patent/CN114101665B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
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CN202180203U (zh) * | 2011-06-20 | 2012-04-04 | 宁波广博纳米新材料股份有限公司 | 用于制备电子浆料用银包铜粉的反应釜 |
CN102950282A (zh) * | 2012-10-15 | 2013-03-06 | 宁波广博纳米新材料股份有限公司 | 银铜包覆粉的制备方法 |
CN104419922A (zh) * | 2013-08-26 | 2015-03-18 | 比亚迪股份有限公司 | 一种化学置换镀银液和化学置换镀银方法 |
JP2015092017A (ja) * | 2013-10-01 | 2015-05-14 | Dowaエレクトロニクス株式会社 | 銀被覆銅粉及びその製造方法、並びに導電性ペースト |
JP2016108649A (ja) * | 2014-11-26 | 2016-06-20 | 住友金属鉱山株式会社 | 銀コート銅粉及びその製造方法 |
CN207126515U (zh) * | 2017-06-14 | 2018-03-23 | 上海昊誉化工有限公司 | 一种生产高粘度胶黏剂的反应釜 |
CN108817377A (zh) * | 2018-06-22 | 2018-11-16 | 深圳市绚图新材科技有限公司 | 一种导电片状银包铜粉的制备方法 |
CN108941539A (zh) * | 2018-06-22 | 2018-12-07 | 深圳市绚图新材科技有限公司 | 一种低废液排放的银包铜粉的制备方法及设备 |
WO2021109728A1 (zh) * | 2019-12-06 | 2021-06-10 | 苏州太湖电工新材料股份有限公司 | 一种分散反应器 |
WO2021180029A1 (zh) * | 2020-03-10 | 2021-09-16 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 银包铜粉及其制备方法、电子浆料 |
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