CN114086024B - 一种用于5g终端设备接口用铜合金箔材及其制备方法 - Google Patents
一种用于5g终端设备接口用铜合金箔材及其制备方法 Download PDFInfo
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- 239000011888 foil Substances 0.000 title claims abstract description 33
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 238000005096 rolling process Methods 0.000 claims abstract description 74
- 238000004140 cleaning Methods 0.000 claims abstract description 44
- 239000000956 alloy Substances 0.000 claims abstract description 23
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 21
- 238000000227 grinding Methods 0.000 claims abstract description 17
- 238000005098 hot rolling Methods 0.000 claims abstract description 16
- 238000003801 milling Methods 0.000 claims abstract description 16
- 230000032683 aging Effects 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 239000010949 copper Substances 0.000 claims abstract description 11
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 8
- 238000009849 vacuum degassing Methods 0.000 claims abstract description 7
- 238000009749 continuous casting Methods 0.000 claims abstract description 5
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 5
- 238000003723 Smelting Methods 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 238000005266 casting Methods 0.000 claims description 33
- 238000000137 annealing Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 13
- 238000004321 preservation Methods 0.000 claims description 5
- 238000010008 shearing Methods 0.000 claims description 5
- 239000013067 intermediate product Substances 0.000 claims description 4
- 239000010936 titanium Substances 0.000 abstract description 8
- 239000011777 magnesium Substances 0.000 abstract description 5
- 238000005406 washing Methods 0.000 abstract description 5
- 238000005238 degreasing Methods 0.000 abstract description 4
- 229910052684 Cerium Inorganic materials 0.000 abstract description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052749 magnesium Inorganic materials 0.000 abstract description 3
- 229910052719 titanium Inorganic materials 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 abstract description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 abstract description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 abstract description 2
- 239000011574 phosphorus Substances 0.000 abstract description 2
- 239000006104 solid solution Substances 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 16
- 229910000831 Steel Inorganic materials 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 229910017945 Cu—Ti Inorganic materials 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 230000002431 foraging effect Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
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- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/46—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling metal immediately subsequent to continuous casting
- B21B1/463—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling metal immediately subsequent to continuous casting in a continuous process, i.e. the cast not being cut before rolling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/001—Continuous casting of metals, i.e. casting in indefinite lengths of specific alloys
- B22D11/004—Copper alloys
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- C21—METALLURGY OF IRON
- C21C—PROCESSING OF PIG-IRON, e.g. REFINING, MANUFACTURE OF WROUGHT-IRON OR STEEL; TREATMENT IN MOLTEN STATE OF FERROUS ALLOYS
- C21C7/00—Treating molten ferrous alloys, e.g. steel, not covered by groups C21C1/00 - C21C5/00
- C21C7/10—Handling in a vacuum
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- C—CHEMISTRY; METALLURGY
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- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/26—Methods of annealing
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
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- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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Abstract
本发明涉及一种用于5G终端设备接口用铜合金箔材及其制备方法,属于合金技术领域。本发明提供的一种用于5G终端设备接口用铜合金箔材,由按质量百分比计的如下组分组成Ti 2.50%~3.50%,P≤0.10%,Ce 0.05%~0.15%,Mg 0.08%~0.20%,Zr 0.05%~0.15%,余量为Cu。铜合金箔材采用特定含量的铜、钛、镁、铈、锆和磷元素为坯料,坯料经真空脱气熔炼、半连续铸造、步进炉加热、热轧、四面铣、粗轧开坯、粗切边、气垫炉在线固溶、厚洗线研磨、中轧、精轧(20辊轧制)、脱脂清洗、钟罩炉时效、脱脂清洗,经成品分剪得到铜合金箔材,所得箔材抗拉强度能达到≥1010MPa、屈服强度≥950MPa、导电率≥20.1%,相比C19900合金强度得到保证,导电率也得到了一定提升。
Description
技术领域
本发明属于合金技术领域,具体涉及一种用于5G终端设备接口用铜合金箔材及其制备方法。
背景技术
5G多样化的应用场景需求,5G的关键性能指标更加多元化,要求趋向设备小型化、高速通讯、快速充电、快速导热,对铜合金材料在高强及超薄,性能精细化方面有着更高的要求。
5G终端用手机板对板连接器主要使用钛铜、超级磷青铜、铜镍材料等。经过研究及终端应用发现,0.1SH/C5240(Sn:10%~12%)抗拉强度可达850Mpa,但其抗疲劳性能明显低于Cu-Ti系列合金,Cu-Ti系合金是时效强化型合金,损伤容限大、寿命长、具有最佳抗弯折性能、高屈服强度、良好加工性能和伸长率,冲击时不产生火花,现有的铜钛合金C19900导电率还是偏低,导电率(IACS%)仅有12%左右。基于此,急需研发一种抗疲劳性能优良,抗拉强度可达1000Mpa,导电率(IACS%)可达20%的超薄新型合金材料。
发明内容
基于此,针对现有技术的不足之处,本发明的目的在于提供了一种用于5G终端设备接口用铜合金箔材及其制备方法,以解决现有技术中的Cu-Ti系列合金导电率普遍偏低的技术问题。
为了解决本发明提出的技术问题,本发明提供一种用于5G终端设备接口用铜合金箔材,由按质量百分比计的如下组分组成:
Ti 2.50%~3.50%;
P ≤0.10%;
Ce 0.05%~0.15%;
Mg 0.08%~0.20%;
Zr 0.05%~0.15%;
余量为Cu。
本发明还提供上述一种用于5G终端设备接口用铜合金箔材的制备方法,包括以下步骤:
S1:将坯料Cu、Ti、P、Ce、Mg和Zr进行真空脱气熔炼,采用半连续铸造工艺制得铸坯;
S2:所述铸坯依次进行加热、热轧和粗轧开坯得到合金片材;
S3:所述片材经退火清洗后进行中轧和精轧至最终厚度;
S4:经清洗、时效处理和清洗后进行分剪即得所述铜合金箔材。
进一步地,S1所述铸坯由按质量百分比计的如下组分组成:Ti 2.50%~3.50%,P≤0.10%,Ce 0.05%~0.15%,Mg 0.08%~0.20%,Zr 0.05%~0.15%,余量为Cu。
进一步地,S1所述铸造温度为1250℃~1350℃,采用拉-停工艺,拉铸速度30m/min~60m/min,结晶器振动频率:0~90次/分,结晶器振幅:0~8㎜,铸造铸坯尺寸:(150~250)*(200~400)*(3000~5000)铸坯。
进一步地,S2所述加热为在步进加热炉加热至900℃~1000℃并保温3h~6h;
优选地,S2所述热轧为在热轧机中轧至16mm。
进一步地,S2还包括于所述热轧之后和所述粗轧之前对铸坯进行铣面,上下各铣面0.5mm~1.0mm,两侧面各铣1mm~2mm;
优选地,S2所述粗轧开坯为将铣面后的铸坯进行粗轧使其厚度由14.5mm轧至1mm,所述粗轧中间品的厚度依次为12.2mm、10.1mm、8.0mm、6mm、4.5mm、3mm和1.8mm,轧制速度100m/min~150m/min,前后张力控制为20KN~30KN。
进一步地,S3所述退火为将所述片材转气垫炉进行在线固溶退火,所述退火温度为830℃~880℃,退火速度5m/min~15m/min,研磨刷电流0.8A~1.2A;
优选地,S3所述清洗为厚洗研磨清洗,所述清洗速度为20m/min~30m/min,研磨刷电流0.8A~1.2A。
进一步地,S3所述中轧为将合金片材厚度由1mm轧至0.5mm,所述中轧中间品厚度分别为0.8mm和0.63mm,轧制速度150m/min~200m/min,前后张力控制在30KN~50KN;
优选地,S3所述精轧为在二十辊精轧机对中轧后的合金片材厚度由0.5mm轧至0.08mm~0.12mm;
和/或S4所述时效处理为在钟罩炉中进行,时效处理的工艺为:时效温度380℃~430℃,升温时间2h~4h,保温时间2h~4h。
进一步地,所述5G终端设备接口为5G终端用手机板对板连接器。
进一步地,所述铜合金箔材的厚度为0.08mm~0.12mm,抗拉强度≥1000MPa,导电率≥20%。
与现有技术相比,本发明的技术方案具有的有益效果是:
本发明提供的铜合金箔材采用特定含量的铜、钛、镁、铈、锆和磷元素为坯料,坯料经真空脱气熔炼、半连续铸造、步进炉加热、热轧、四面铣、粗轧开坯、切边气垫炉在线固溶厚洗线研磨、中轧、精轧(20辊轧制)、脱脂清洗、钟罩炉时效、脱脂清洗,经成品分剪得到铜合金箔材,所得箔材抗拉强度能达到≥1010MPa、屈服强度≥950MPa、导电率≥20.1%,相比C19900合金强度得到保证,导电率也得到了一定提升。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚,下面将对本发明实施例中的技术方案进行清楚、完整地描述。实施例中未注明具体条件者,按照常规条件或制造商建议的条件进行,本发明中涉及的浓度未注明条条件时,均为质量浓度。所用试剂或仪器未注明生产厂商者,均为可以通过市售购买获得的常规产品。
以下结合实施例对本发明的特征和性能作进一步的详细描述。
实施例1
本实施例提供一种用于5G终端设备接口用铜合金箔材,其制备方法为:
a、真空脱气熔炉时将合金成分严格控制在Ti:2.50%,P:0.08%,Ce:0.05%,Mg:0.10%,Zr:0.05%,余量为Cu。铸造温度:1260℃,采用拉-停工艺,拉铸速度50m/min,结晶器振动频率:60次/分,结晶器振幅:2㎜,铸造铸坯尺寸(厚度*宽度*长度;单位为mm):180*400*3500铸坯;
b、铸坯进行步进加热炉加热至950℃,保温6小时,出炉经过热轧机轧至16mm;
c、热轧后铸坯进行铣面,上下各铣面0.75mm,两侧面各铣1.5mm;
d、铣面后转粗轧由14.5mm轧至1mm,轧制工艺为14.5-12.2-10.1-8-6-4.5-3-1.8-1共轧制9道次,轧制速度100m/min~150m/min,前后张力控制在20KN~30KN;
e、轧制1mm后再转气垫炉在线固溶退火,退火温度850℃,退火速度12m/min,研磨刷电流0.8A~1.2A;
f、1.0mm在经过厚洗研磨清洗,清洗速度:20m/min~30m/min,研磨刷电流0.8A~1.2A;
h.清洗后转中轧轧至0.5mm,轧制工艺:1.0-0.8-0.63-0.5,轧制速度150m/min~200m/min,前后张力控制在30KN~50KN;
i.轧至0.5mm后,转入二十辊精轧机由0.5mm轧至0.1mm成品,轧制工艺为:0.5-0.41-0.33-0.27-0.23-0.19-0.16-0.145-0.122-0.1,轧制速度为200m/min~300m/min,前后张力控制在5KN~10KN;
j、轧制0.1mm后,转入清洗线进行清洗,清洗后转钟罩炉进行时效处理,时效温度400℃,升温时间3h,保温时间3.5h;
k、0.1mm成品时效后,转入清洗线清洗;
h、清洗后转成品剪切,包装入库。
对所制备的铜合金箔材进行性能检测,各项性能检测结果见表1
表1:铜合金箔材性能检测结果
实施例2
本实施例提供一种用于5G终端设备接口用铜合金箔材,其制备方法为:
a、真空脱气熔炉时将合金成分严格控制在Ti:2.9%,P:0.08%,Ce:0.08%,Mg:0.08%,Zr:0.09%,余量为Cu。铸造温度1280℃,采用拉-停工艺,拉铸速度48m/min,结晶器振动频率:60次/分,结晶器振幅:2㎜,铸造铸坯尺寸(厚度*宽度*长度;单位为mm):180*400*3500铸坯;
b、铸坯进行步进加热炉加热至950℃,保温6小时,出炉经过热轧机轧至16mm;
c、热轧后铸坯进行铣面,上下各铣面0.75mm,两侧面各铣1.5mm;
d、铣面后转粗轧由14.5mm轧至1mm,轧制工艺为14.5-12.2-10.1-8-6-4.5-3-1.8-1共轧制9道次,轧制速度100m/min~150m/min,前后张力控制在20KN~30KN;
e、轧制1mm后再转气垫炉在线固溶退火,退火温度850℃,退火速度11m/min,研磨刷电流0.8A~1.2A;
f、1.0mm在经过厚洗研磨清洗,清洗速度:20m/min~30m/min,研磨刷电流0.8A~1.2A;
h.清洗后转中轧轧至0.5mm,轧制工艺:1.0-0.8-0.63-0.5,轧制速度150m/min~200m/min,前后张力控制在30KN~50KN;
i.轧至0.5mm后,转入二十辊精轧机由0.5mm轧至0.08mm成品,轧制工艺为:0.5-0.42-0.34-0.29-0.25-0.22-0.19-0.165-0.14-0.115-0.08,轧制速度100m/min~200m/min,前后张力控制在5KN~10KN;
j、轧制0.08mm后,转入清洗线进行清洗,清洗后转钟罩炉进行时效处理,时效温度390℃,升温时间3h,保温时间3h;
k、0.08mm成品时效后,转入清洗线清洗;
h、清洗后转成品剪切,包装入库。
对所制备的铜合金箔材进行性能检测,各项性能检测结果见表2
表2:铜合金箔材性能检测结果
实施例3
本实施例提供一种用于5G终端设备接口用铜合金箔材,其制备方法为:
a、真空脱气熔炉时将合金成分严格控制在Ti:3.50%,P:0.1%,Ce:0.15%,Mg:0.2%,Zr:0.15%,余量为Cu。铸造温度为1300℃,采用拉-停工艺,拉铸速度45mm/min,结晶器振动频率:60次/分,结晶器振幅:2㎜,铸造铸坯尺寸(厚度*宽度*长度;单位为mm):180*400*3500铸坯;
b、铸坯进行步进加热炉加热至950℃,保温6小时,出炉经过热轧机轧至16mm;
c、热轧后铸坯进行铣面,上下各铣面0.75mm,两侧面各铣1.5mm;
d、铣面后转粗轧由14.5mm轧至1mm,轧制工艺为14.5-12.2-10.1-8-6-4.5-3-1.8-1共轧制9道次,轧制速度100m/min~150m/min,前后张力控制在20KN~30KN;
e、轧制1mm后再转气垫炉在线固溶退火,退火温度850℃,退火速度10m/min,研磨刷电流0.8A~1.2A;
f、1.0mm在经过厚洗研磨清洗,清洗速度:20m/min~30m/min,研磨刷电流0.8A~1.2A;
h.清洗后转中轧轧至0.5mm,轧制工艺:1.0-0.8-0.63-0.5,轧制速度150m/min~200m/min,前后张力控制在30KN~50KN;
i.轧至0.5mm后,转入二十辊精轧机由0.5mm轧至0.12mm成品,轧制工艺为:0.5-0.41-0.33-0.27-0.23-0.19-0.16-0.145-0.12,轧制速度200m/min~300m/min,前后张力控制在5KN~10KN;
j、轧制0.12mm后,转入清洗线进行清洗,清洗后转钟罩炉进行时效处理,时效温度410℃,升温时间3.5h,保温时间4h;
k、0.12mm成品时效后,转入清洗线清洗;
h、清洗后转成品剪切,包装入库。
对所制备的铜合金箔材进行性能检测,各项性能检测结果见表3
表3:铜合金箔材性能检测结果
最后,还需要注意的是,以上列举的仅是本发明的若干个具体实施例。显然,本发明不限于以上实施例,还可以有许多变形。本领域的普通技术人员能从本发明公开的内容直接导出或联想到的所有变形,均应认为是本发明的保护范围。
Claims (5)
1.一种用于5G终端设备接口用铜合金箔材的制备方法,其特征在于,铜合金箔材由按质量百分比计的如下组分组成:
Ti 2.50%~3.50%;
P 0.08%~0.10%;
Ce 0.05%~0.15%;
Mg 0.08%~0.20%;
Zr 0.05%~0.15%;
余量为Cu;
其制备方法,包括以下步骤:
S1:将坯料Cu、Ti、P、Ce、Mg和Zr进行真空脱气熔炼,采用半连续铸造工艺制得铸坯;
S2:所述铸坯依次进行加热、热轧和粗轧开坯得到合金片材;
S3:所述片材经退火清洗后进行中轧和精轧至最终厚度;
S4:经清洗、时效处理和清洗后进行分剪即得所述铜合金箔材;
所述铜合金箔材的厚度为0.08mm~0.12mm;
S1铸坯厚度为180mm;
S2所述加热为在步进加热炉加热至900℃~1000℃并保温3h~6h;S2所述热轧为在热轧机中轧至16mm;S2还包括于所述热轧之后和所述粗轧之前对铸坯进行铣面,上下各铣面0.5mm~1.0mm, 两侧面各铣1mm~2mm;S2所述粗轧开坯为将铣面后的铸坯进行粗轧使其厚度由14.5mm轧至1mm,所述粗轧中间品的厚度依次为12.2mm、10.1mm、8.0mm、6mm、4.5mm、3mm和1.8mm,轧制速度100m/min~150m/min,前后张力控制为20KN~30KN;
S3所述退火为将所述片材转气垫炉进行在线固溶退火,所述退火温度为830℃~880℃,退火速度5m/min~15m/min,研磨刷电流0.8A~1.2A;S3所述中轧为将合金片材厚度由1mm轧至0.5mm,所述中轧中间品厚度分别为0.8mm和0.63mm,轧制速度150m/min~200m/min,前后张力控制在30KN~50KN;
S3所述精轧为在二十辊精轧机对中轧后的合金片材厚度由0.5mm轧至0.08mm~0.12mm;
S4所述时效处理为在钟罩炉中进行,时效处理的工艺为:时效温度380℃~430℃,升温时间2h~4h,保温时间2h~4h。
2.根据权利要求1所述用于5G终端设备接口用铜合金箔材的制备方法,其特征在于,S1所述半连续铸造温度为1250℃~1350℃,采用拉-停工艺,拉铸速度30m/min~60m/min,结晶器振动频率:0~90次/分,结晶器振幅:0~8㎜,铸造铸坯尺寸:(150~250)*(200~400)*(3000~5000)铸坯。
3.根据权利要求1所述用于5G终端设备接口用铜合金箔材的制备方法,其特征在于,S3所述清洗为厚洗研磨清洗,所述清洗速度为20m/min~30m/min,研磨刷电流0.8A~1.2A。
4.根据权利要求1~3任一项所述用于5G终端设备接口用铜合金箔材的制备方法,其特征在于,所述5G终端设备接口为5G终端用手机板对板连接器。
5.根据权利要求1~3任一项所述用于5G终端设备接口用铜合金箔材的制备方法,其特征在于,所述铜合金箔材的厚度为0.08mm~0.12mm,抗拉强度≥1000MPa,导电率≥20%。
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