CN114076859A - Full-temperature aging test system and method for core components for aerospace - Google Patents
Full-temperature aging test system and method for core components for aerospace Download PDFInfo
- Publication number
- CN114076859A CN114076859A CN202010831342.3A CN202010831342A CN114076859A CN 114076859 A CN114076859 A CN 114076859A CN 202010831342 A CN202010831342 A CN 202010831342A CN 114076859 A CN114076859 A CN 114076859A
- Authority
- CN
- China
- Prior art keywords
- component
- test
- tested
- result
- performance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 292
- 230000032683 aging Effects 0.000 title claims abstract description 19
- 239000008358 core component Substances 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims description 10
- 239000000306 component Substances 0.000 claims abstract description 192
- 238000011056 performance test Methods 0.000 claims abstract description 138
- 238000011990 functional testing Methods 0.000 claims description 10
- 230000003993 interaction Effects 0.000 claims description 6
- 238000010998 test method Methods 0.000 claims description 4
- 230000006872 improvement Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/30—Structural combination of electric measuring instruments with basic electronic circuits, e.g. with amplifier
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention belongs to the technical field of reliability test of aerospace components, and particularly relates to a full-temperature burn-in test system for aerospace core components, which comprises an upper computer, a test burn-in circuit and a customized special high-low temperature box, wherein the upper computer, the test burn-in circuit and the customized special high-low temperature box are connected with one another; the customized special high-low temperature box is used for providing respective high-temperature or low-temperature aging environment for each component to be tested; the test burn-in circuit is used for acquiring performance test data and function test data of each component to be tested, performing performance test and function test on each component to be tested according to the acquired performance test data and function test data to obtain a performance test result and a function test result, and uploading the performance test result and the function test result to the upper computer; and the upper computer is used for judging whether each component to be tested meets the requirement of the space mission or not according to the received performance test result and the function test result and displaying the judgment result.
Description
Technical Field
The invention belongs to the technical field of reliability testing of aerospace components on satellite-borne equipment, and particularly relates to a full-temperature burn-in testing system and method for aerospace core components.
Background
Space navigation components used in special missions of space systems or equipment, working space environments and the like are required to have the characteristics of small volume, light weight, low electric power consumption, high reliability level, strong space radiation resistance and the like. The aerospace components can be selected by users only after strict identification and inspection or even batch-by-batch sampling and assessment.
Under the situation that components are required to be independently ensured at present, a large quantity of independently researched and developed novel components are urgently needed to be applied to the aerospace field. The component test and verification provides reliability verification and guarantee for the application of the novel component in the aerospace product, and is an important premise for the application of the novel component.
At present, the existing testing method adopts a single device to test a circuit board, can only realize simple functional testing, and has long development period, high cost, poor universality and serious influence on task progress. In addition, in the testing process, the existing testing system cannot realize the online measurement of the full temperature range with controllable temperature.
Disclosure of Invention
In order to solve the defects in the prior art, the invention provides a full-temperature burn-in test system for a core component for aerospace, which is of a tool rest structure and comprises an upper computer, a test burn-in circuit and a customized special high-low temperature box, wherein the upper computer, the test burn-in circuit and the customized special high-low temperature box are connected with one another; the upper computer is connected with the test aging circuit through a serial server; (ii) a
A test daughter board is arranged in the customized special high-low temperature box, and a plurality of components to be tested are arranged on the test daughter board; each component to be tested is connected with the test burn-in circuit through the power connector and the signal connector, and provides a respective high-temperature or low-temperature burn-in environment for each component to be tested;
the test burn-in circuit is used for acquiring performance test data and function test data of each component to be tested, performing performance test and function test on each component to be tested according to the acquired performance test data and function test data to obtain a performance test result and a function test result, and uploading the performance test result and the function test result to the upper computer;
and the upper computer is used for judging whether each component to be tested meets the requirement of the space mission or not according to the received performance test result and the function test result and displaying the judgment result.
As an improvement of the above technical solution, the performance test data includes: the power supply voltage, the power supply current and the temperature of the test daughter board where the component to be tested is located; the functional test data includes: and working modes of various components to be tested.
As an improvement of the above technical solution, the test burn-in circuit includes: a DC power supply and a plurality of parallel test sub-circuits;
the direct current power supply is used for providing power for each test sub-circuit;
the test sub-circuit is used for collecting performance test data and function test data of each component to be tested, performing performance test and function test on each component to be tested according to the collected performance test data and function test data to obtain a performance test result and a function test result, and uploading the performance test result and the function test result to the upper computer.
As an improvement of the above technical solution, the test sub-circuit includes: the device comprises a power panel, an ADC data acquisition card, an FPGA processor and a test motherboard;
the power panel is connected with the direct-current power supply through the power supply connector and is used for converting the power supply provided by the direct-current power supply into the power supply required by the component to be tested;
the ADC data acquisition card is used for acquiring performance test data of the component to be tested and inputting the performance test data into the FPGA processor through the serial server;
the FPGA processor is configured on the test mother board and used for carrying out information interaction with a device to be tested on the test daughter board, and according to a function test instruction sent by the test mother board, the acquired function test data of the device to be tested is sent to the FPGA processor through the signal connector for function test to obtain a function test result; the performance testing system is also used for carrying out performance testing on each component to be tested according to the collected performance testing data to obtain a performance testing result, and uploading the function testing result and the performance testing result to the testing motherboard;
and the test motherboard is used for sending the performance test result and the function test result obtained by the FPGA processor to the upper computer through the serial server.
As an improvement of the above technical solution, the test motherboard is provided with a plurality of motherboard slots for connecting with each device to be tested on the test daughter board through the signal connector.
As one of the improvements of the above technical solution, the upper computer includes: the performance testing module and the function testing module;
the performance test module is used for judging whether each component to be tested meets the requirement of the space mission according to the received performance test result and displaying the judgment result:
if the performance test result is that the power supply voltage and the power supply current in the performance test data of the component to be tested and the daughter board temperature of the test daughter board where the component to be tested is located are all larger than or equal to the performance standard value of the component required by the space mission, the component to be tested meets the space mission requirement, can normally work, and displays the judgment result;
if the performance test result is that the power supply voltage and the power supply current in the performance test data of the component to be tested or the daughter board temperature of the test daughter board where the component to be tested is located are smaller than the performance standard value of the component required by the space mission, the component to be tested does not accord with the space mission requirement, the component to be tested cannot normally work, and the judgment result is displayed;
the function test module is used for judging whether each component to be tested meets the requirement of the space mission according to the received function test result and displaying the judgment result;
if the function test result is that each working mode in the function test data of the component to be tested is consistent with the working mode recorded on the component manual, the component to be tested meets the requirement of the space mission, can normally work, and displays the judgment result;
and if the function test result is that each working mode in the function test data of the component to be tested is inconsistent with the working mode recorded on the component manual, the component to be tested does not meet the requirement of the space mission and can not work normally, and the judgment result is displayed.
The invention also provides a full-temperature aging test method for the aerospace core component, which comprises the following steps:
the customized special high-low temperature box provides a respective high-temperature or low-temperature aging environment for each component to be tested;
the test aging circuit collects performance test data and function test data of each component to be tested, performs performance test and function test on each component to be tested according to the collected performance test data and function test data to obtain a performance test result and a function test result, and uploads the performance test result and the function test result to the upper computer;
and the upper computer judges whether each component to be tested meets the requirement of the space mission or not according to the received performance test result and the function test result, and displays the judgment result.
As one improvement of the technical scheme, the test burn-in circuit collects performance test data and function test data of each component to be tested, performs performance test and function test on each component to be tested according to the collected performance test data and function test data to obtain a performance test result and a function test result, and uploads the performance test result and the function test result to the upper computer; the method specifically comprises the following steps:
the power panel converts a power supply provided by a direct current power supply into a power supply required by the component to be tested;
the ADC data acquisition card acquires performance test data of each component to be tested and inputs the performance test data to the FPGA processor through the serial server;
the FPGA processor is configured on the test mother board and performs information interaction with each device to be tested on the test daughter board, and according to a function test instruction sent by the test mother board, the acquired function test data of each device to be tested is sent to the FPGA processor through the signal connector for function test to obtain a function test result; meanwhile, collecting performance test data of each component to be tested, performing performance test on the component to be tested to obtain a performance test result, and uploading the function test result and the performance test result of each component to be tested to a test motherboard;
and the test motherboard sends the performance test result and the function test result of each component to be tested, which are obtained by the FPGA processor, to the upper computer through the serial server.
As one improvement of the technical scheme, the upper computer judges whether each component to be tested meets the requirement of the space mission according to the received performance test result and the function test result, and displays the judgment result; the method specifically comprises the following steps:
the performance test module judges whether each component to be tested meets the requirement of the space mission according to the received performance test result, and displays the judgment result:
if the performance test result is that the power supply voltage and the power supply current in the performance test data of the component to be tested and the daughter board temperature of the test daughter board where the component to be tested is located are all larger than or equal to the performance standard value of the component required by the space mission, the component to be tested meets the space mission requirement, can normally work, and displays the judgment result;
if the performance test result is that the power supply voltage and the power supply current in the performance test data of the component to be tested or the daughter board temperature of the test daughter board where the component to be tested is located are smaller than the performance standard value of the component required by the space mission, the component to be tested does not accord with the space mission requirement, the component to be tested cannot normally work, and the judgment result is displayed;
the function test module judges whether each component to be tested meets the requirements of a device manual or not according to the received function test result, and displays the judgment result;
if the function test result is that each working mode in the function test data of the component to be tested is consistent with the working mode recorded on the component manual, the component to be tested meets the requirement of the space mission, can normally work, and displays the judgment result;
and if the function test result is that each working mode in the function test data of the component to be tested is inconsistent with the working mode recorded on the component manual, the component to be tested does not meet the requirement of the space mission and can not work normally, and the judgment result is displayed.
Compared with the prior art, the invention has the beneficial effects that:
the system can simultaneously test the functions and the performances of a plurality of components by only using one FPGA processor, has short development period, greatly reduces the cost, has high universality, greatly accelerates the task progress and improves the working efficiency. In addition, in the testing process, the testing system can realize the temperature-controllable full-temperature-range online measurement of each component.
Drawings
Fig. 1 is a schematic structural diagram of an all-temperature burn-in test system for aerospace core components according to the present invention.
Detailed Description
The invention will now be further described with reference to the accompanying drawings.
As shown in fig. 1, the invention provides a full-temperature burn-in test system for aerospace core components, which is of a tool rest structure and comprises an upper computer, a test burn-in circuit and a customized special high-low temperature box, wherein the upper computer, the test burn-in circuit and the customized special high-low temperature box are connected with one another;
the upper computer is connected with the test aging circuit through a serial port server, and the customized special high-low temperature box is connected with the test aging circuit through an adapter plate; a test daughter board is arranged in the customized special high-low temperature box, and a plurality of components to be tested are arranged on the test daughter board; each element to be tested is connected with the test aging circuit through the power connector and the signal connector;
the customized special high-low temperature box is used for providing respective high-temperature or low-temperature aging environment for each component to be tested;
the test burn-in circuit is used for acquiring performance test data and function test data of each component to be tested, performing performance test and function test on each component to be tested according to the acquired performance test data and function test data to obtain a performance test result and a function test result, and uploading the performance test result and the function test result to the upper computer;
and the upper computer is used for judging whether each component to be tested meets the requirement of the space mission or not according to the received performance test result and the function test result and displaying the judgment result.
The performance test data includes: the power supply voltage, the power supply current and the temperature of the test daughter board where the component to be tested is located; the functional test data includes: and working modes of various components to be tested.
In this embodiment, each test motherboard measures and monitors 8 devices to be tested, that is, 8 paths of power supply voltage and power supply current, and can draw a corresponding power supply voltage-to-practice change curve, a power supply current-to-time change curve, and a temperature-to-time change curve, or perform a list to store data.
The functional test is to check each working mode according to a plurality of working modes recorded on the component manual, for example, when the functional test is carried out, a specific character string is written into a register, then a register instruction is read, then the character string written into the register is collected, and finally the written specific character string and the collected character string are compared; if the two are consistent, determining that the function test is normal, and outputting a test result as successful test; if the two are not consistent, determining that the function test is abnormal, and outputting a test result as the test abnormality.
The test burn-in circuit comprises: a DC power supply and a plurality of parallel test sub-circuits; the test sub-circuit comprises: the test system comprises a test motherboard, an FPGA processor, an ADC data acquisition card and a power panel;
the dc power supply is configured to provide power for each test sub-circuit, and specifically, in this embodiment, the dc power supply provides power for the test motherboard and the power board in each test sub-circuit;
the test sub-circuit is used for collecting performance test data and function test data of each component to be tested, performing performance test and function test on each component to be tested according to the collected performance test data and function test data to obtain a performance test result and a function test result, and uploading the performance test result and the function test result to the upper computer.
Wherein the test sub-circuit comprises: the test system comprises a test motherboard, an FPGA processor, an ADC data acquisition card and a power panel;
the power panel is used for converting a power supply provided by a direct-current power supply into a power supply required by the component to be tested;
the ADC data acquisition card is used for acquiring performance test data of the component to be tested and inputting the performance test data into the FPGA processor through the serial server;
the FPGA processor is configured on the test mother board and used for carrying out information interaction with a device to be tested on the test daughter board, and according to a function test instruction sent by the test mother board, the acquired function test data of the device to be tested is sent to the FPGA processor through the signal connector for function test to obtain a function test result; the performance testing system is also used for carrying out performance testing on each component to be tested according to the collected performance testing data to obtain a performance testing result, and uploading the function testing result and the performance testing result to the testing motherboard;
and the test motherboard is used for sending the performance test result and the function test result obtained by the FPGA processor to the upper computer through the serial server.
And a plurality of motherboard slots are arranged on the test motherboard and are used for being connected with each component to be tested on the test daughter board through a signal connector.
Wherein, the host computer includes: the performance testing module and the function testing module;
the performance test module is used for judging whether each component to be tested meets the requirement of the space mission according to the received performance test result and displaying the judgment result:
if the performance test result is that the power supply voltage and the power supply current in the performance test data of the component to be tested and the daughter board temperature of the test daughter board where the component to be tested is located are all larger than or equal to the performance standard value of the component required by the space mission, the component to be tested meets the space mission requirement, can normally work, and displays the judgment result;
if the performance test result is that the power supply voltage and the power supply current in the performance test data of the component to be tested or the daughter board temperature of the test daughter board where the component to be tested is located are smaller than the performance standard value of the component required by the space mission, the component to be tested does not accord with the space mission requirement, the component to be tested cannot normally work, and the judgment result is displayed;
the function test module is used for judging whether each component to be tested meets the requirement of the space mission according to the received function test result and displaying the judgment result;
if the function test result is that each working mode in the function test data of the component to be tested is consistent with the working mode recorded on the component manual, the component to be tested meets the requirement of the space mission, can normally work, and displays the judgment result;
and if the function test result is that each working mode in the function test data of the component to be tested is inconsistent with the working mode recorded on the component manual, the component to be tested does not meet the requirement of the space mission and can not work normally, and the judgment result is displayed.
The invention also provides a full-temperature aging test method for the aerospace core component, which comprises the following steps:
the customized special high-low temperature box provides a respective high-temperature or low-temperature aging environment for each component to be tested;
the test aging circuit collects performance test data and function test data of each component to be tested, performs performance test and function test on each component to be tested according to the collected performance test data and function test data to obtain a performance test result and a function test result, and uploads the performance test result and the function test result to the upper computer;
in particular, the amount of the solvent to be used,
the power panel converts a power supply provided by a direct current power supply into a power supply required by the component to be tested; the direct current power supply supplies power to the test motherboard;
the ADC data acquisition card acquires performance test data of each component to be tested and inputs the performance test data to the FPGA processor through the serial server;
the FPGA processor is configured on the test mother board and performs information interaction with each device to be tested on the test daughter board, and according to a function test instruction sent by the test mother board, the acquired function test data of each device to be tested is sent to the FPGA processor through the signal connector for function test to obtain a function test result; meanwhile, collecting performance test data of each component to be tested, performing performance test on the component to be tested to obtain a performance test result, and uploading the function test result and the performance test result of each component to be tested to a test motherboard;
and the test motherboard sends the performance test result and the function test result of each component to be tested, which are obtained by the FPGA processor, to the upper computer through the serial server.
And the upper computer judges whether each component to be tested meets the requirement of the space mission or not according to the received performance test result and the function test result, and displays the judgment result.
Specifically, the performance test module judges whether each component to be tested meets the requirement of the space mission according to the received performance test result, and displays the judgment result:
if the performance test result is that the power supply voltage and the power supply current in the performance test data of the component to be tested and the daughter board temperature of the test daughter board where the component to be tested is located are all larger than or equal to the performance standard value of the component required by the space mission, the component to be tested meets the space mission requirement, can normally work, and displays the judgment result;
if the performance test result is that the power supply voltage and the power supply current in the performance test data of the component to be tested or the daughter board temperature of the test daughter board where the component to be tested is located are smaller than the performance standard value of the component required by the space mission, the component to be tested does not accord with the space mission requirement, the component to be tested cannot normally work, and the judgment result is displayed;
the function test module judges whether each component to be tested meets the requirements of a device manual or not according to the received function test result, and displays the judgment result;
if the function test result is that each working mode in the function test data of the component to be tested is consistent with the working mode recorded on the component manual, the component to be tested meets the requirement of the space mission, can normally work, and displays the judgment result;
and if the function test result is that each working mode in the function test data of the component to be tested is inconsistent with the working mode recorded on the component manual, the component to be tested does not meet the requirement of the space mission and can not work normally, and the judgment result is displayed.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and are not limited. Although the present invention has been described in detail with reference to the embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. A full temperature burn-in test system for core components for aerospace is characterized in that the test burn-in system is of a tool rest structure and comprises an upper computer, a test burn-in circuit and a customized special high-low temperature box which are connected with each other; the upper computer is connected with the test aging circuit through a serial server; a test daughter board is arranged in the customized special high-low temperature box, and a plurality of components to be tested are arranged on the test daughter board; each element to be tested is connected with the test aging circuit through the power connector and the signal connector; providing a respective high-temperature or low-temperature aging environment for each component to be tested;
the test burn-in circuit is used for acquiring performance test data and function test data of each component to be tested, performing performance test and function test on each component to be tested according to the acquired performance test data and function test data to obtain a performance test result and a function test result, and uploading the performance test result and the function test result to the upper computer;
and the upper computer is used for judging whether each component to be tested meets the requirement of the space mission or not according to the received performance test result and the function test result and displaying the judgment result.
2. The system of claim 1, wherein the performance test data comprises: the power supply voltage, the power supply current and the temperature of the test daughter board where the component to be tested is located; the functional test data includes: and working modes of various components to be tested.
3. The system of claim 1, wherein the burn-in test circuit comprises: a DC power supply and a plurality of parallel test sub-circuits;
the direct current power supply is used for providing power for each test sub-circuit;
the test sub-circuit is used for collecting performance test data and function test data of each component to be tested, performing performance test and function test on each component to be tested according to the collected performance test data and function test data to obtain a performance test result and a function test result, and uploading the performance test result and the function test result to the upper computer.
4. The system of claim 3, wherein the test sub-circuit comprises: the device comprises a power panel, an ADC data acquisition card, an FPGA processor and a test motherboard;
the power panel is connected with the direct-current power supply through the power supply connector and is used for converting the power supply provided by the direct-current power supply into the power supply required by the component to be tested;
the ADC data acquisition card is used for acquiring performance test data of the component to be tested and inputting the performance test data into the FPGA processor through the serial server;
the FPGA processor is configured on the test mother board and used for carrying out information interaction with a device to be tested on the test daughter board, and according to a function test instruction sent by the test mother board, the acquired function test data of the device to be tested is sent to the FPGA processor through the signal connector for function test to obtain a function test result; the performance testing system is also used for carrying out performance testing on each component to be tested according to the collected performance testing data to obtain a performance testing result, and uploading the function testing result and the performance testing result to the testing motherboard;
and the test motherboard is used for sending the performance test result and the function test result obtained by the FPGA processor to the upper computer through the serial server.
5. The system of claim 4, wherein the test motherboard comprises a plurality of motherboard slots for connecting to each device under test on the test daughter board via signal connectors.
6. The full-temperature burn-in test system for aerospace core components according to claim 2, wherein the upper computer comprises: the performance testing module and the function testing module;
the performance test module is used for judging whether each component to be tested meets the requirement of the space mission according to the received performance test result and displaying the judgment result:
if the performance test result is that the power supply voltage and the power supply current in the performance test data of the component to be tested and the daughter board temperature of the test daughter board where the component to be tested is located are all larger than or equal to the performance standard value of the component required by the space mission, the component to be tested meets the space mission requirement, can normally work, and displays the judgment result;
if the performance test result is that the power supply voltage and the power supply current in the performance test data of the component to be tested or the daughter board temperature of the test daughter board where the component to be tested is located are smaller than the performance standard value of the component required by the space mission, the component to be tested does not accord with the space mission requirement, the component to be tested cannot normally work, and the judgment result is displayed;
the function test module is used for judging whether each component to be tested meets the requirement of the space mission according to the received function test result and displaying the judgment result;
if the function test result is that each working mode in the function test data of the component to be tested is consistent with the working mode recorded on the component manual, the component to be tested meets the requirement of the space mission, can normally work, and displays the judgment result;
and if the function test result is that each working mode in the function test data of the component to be tested is inconsistent with the working mode recorded on the component manual, the component to be tested does not meet the requirement of the space mission and can not work normally, and the judgment result is displayed.
7. A full-temperature burn-in test method for a core component for aerospace is characterized by comprising the following steps:
the customized special high-low temperature box provides a respective high-temperature or low-temperature aging environment for each component to be tested;
the test aging circuit collects performance test data and function test data of each component to be tested, performs performance test and function test on each component to be tested according to the collected performance test data and function test data to obtain a performance test result and a function test result, and uploads the performance test result and the function test result to the upper computer;
and the upper computer judges whether each component to be tested meets the requirement of the space mission or not according to the received performance test result and the function test result, and displays the judgment result.
8. The method for testing the all-temperature burn-in of an aerospace core component as claimed in claim 7, wherein the test burn-in circuit collects performance test data and functional test data of each component to be tested, and performs performance test and functional test on each component to be tested according to the collected performance test data and functional test data to obtain a performance test result and a functional test result, and uploads the performance test result and the functional test result to the upper computer; the method specifically comprises the following steps:
the power panel converts a power supply provided by a direct current power supply into a power supply required by the component to be tested;
the ADC data acquisition card acquires performance test data of each component to be tested and inputs the performance test data to the FPGA processor through the serial server;
the FPGA processor is configured on the test mother board and performs information interaction with each device to be tested on the test daughter board, and according to a function test instruction sent by the test mother board, the acquired function test data of each device to be tested is sent to the FPGA processor through the signal connector for function test to obtain a function test result; meanwhile, collecting performance test data of each component to be tested, performing performance test on the component to be tested to obtain a performance test result, and uploading the function test result and the performance test result of each component to be tested to a test motherboard;
and the test motherboard sends the performance test result and the function test result of each component to be tested, which are obtained by the FPGA processor, to the upper computer through the serial server.
9. The full-temperature burn-in test method for aerospace core components according to claim 7, wherein the upper computer judges whether each component to be tested meets the space mission requirement according to the received performance test result and function test result, and displays the judgment result; the method specifically comprises the following steps:
the performance test module judges whether each component to be tested meets the requirement of the space mission according to the received performance test result, and displays the judgment result:
if the performance test result is that the power supply voltage and the power supply current in the performance test data of the component to be tested and the daughter board temperature of the test daughter board where the component to be tested is located are all larger than or equal to the performance standard value of the component required by the space mission, the component to be tested meets the space mission requirement, can normally work, and displays the judgment result;
if the performance test result is that the power supply voltage and the power supply current in the performance test data of the component to be tested or the daughter board temperature of the test daughter board where the component to be tested is located are smaller than the performance standard value of the component required by the space mission, the component to be tested does not accord with the space mission requirement, the component to be tested cannot normally work, and the judgment result is displayed;
the function test module judges whether each component to be tested meets the requirements of a device manual or not according to the received function test result, and displays the judgment result;
if the function test result is that each working mode in the function test data of the component to be tested is consistent with the working mode recorded on the component manual, the component to be tested meets the requirement of the space mission, can normally work, and displays the judgment result;
and if the function test result is that each working mode in the function test data of the component to be tested is inconsistent with the working mode recorded on the component manual, the component to be tested does not meet the requirement of the space mission and can not work normally, and the judgment result is displayed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010831342.3A CN114076859A (en) | 2020-08-18 | 2020-08-18 | Full-temperature aging test system and method for core components for aerospace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010831342.3A CN114076859A (en) | 2020-08-18 | 2020-08-18 | Full-temperature aging test system and method for core components for aerospace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114076859A true CN114076859A (en) | 2022-02-22 |
Family
ID=80281340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010831342.3A Pending CN114076859A (en) | 2020-08-18 | 2020-08-18 | Full-temperature aging test system and method for core components for aerospace |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114076859A (en) |
Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63274885A (en) * | 1987-04-24 | 1988-11-11 | スカンテスト システムズ アクチ−セルスカブ | Method of testing semiconductor integrated circuit during burn-in and circuit substrate |
| US5414370A (en) * | 1991-07-19 | 1995-05-09 | Sumitomo Electric Industries, Ltd. | Burn-in apparatus and method which individually controls the temperature of a plurality of semiconductor devices |
| CN2470954Y (en) * | 2001-02-28 | 2002-01-09 | 赵俊芳 | Dynamic testing apparatus for large-medium scale digital circuit |
| CN102129020A (en) * | 2010-01-19 | 2011-07-20 | 中芯国际集成电路制造(上海)有限公司 | Aging test device |
| CN201927782U (en) * | 2010-08-02 | 2011-08-10 | 曹金学 | Socket for ageing test of 64-wire 0.5-ptch ceramic quad flat packaged components |
| CN102520280A (en) * | 2011-12-08 | 2012-06-27 | 台晶(宁波)电子有限公司 | Multi-temperature-point synchronous dynamic high-temperature aging acceleration test device |
| CN102540056A (en) * | 2011-12-29 | 2012-07-04 | 北京控制工程研究所 | Method for testing and screening APS chips |
| CN203398437U (en) * | 2013-08-16 | 2014-01-15 | 浙江长兴电子厂有限公司 | Aging test socket for components with insulated frame package |
| CN203396794U (en) * | 2013-08-16 | 2014-01-15 | 浙江长兴电子厂有限公司 | Aging test socket for metallic-packaging large-power circuit components |
| CN103713265A (en) * | 2013-12-26 | 2014-04-09 | 北京航天测控技术有限公司 | Burn-in detection system |
| CN106569124A (en) * | 2016-11-09 | 2017-04-19 | 中国空间技术研究院 | Universal dynamic aging system for Virtex-5 FPGAs (field programmable gate arrays) |
| CN106571166A (en) * | 2016-11-09 | 2017-04-19 | 中国空间技术研究院 | MT29F series NAND FLASH test aging system with customizable process |
| CN106771987A (en) * | 2017-03-08 | 2017-05-31 | 上海鑫匀源科技有限公司 | A kind of IC chip ageing tester and method of testing based on mother baby plate |
| CN107094018A (en) * | 2017-05-26 | 2017-08-25 | 浙江杭可科技股份有限公司 | D and D/A converter ageing testboard |
| CN208076687U (en) * | 2018-03-27 | 2018-11-09 | 陕西省电子技术研究所 | A kind of aged test tooling for power module |
| CN109283449A (en) * | 2018-10-24 | 2019-01-29 | 武汉精鸿电子技术有限公司 | A kind of device for supporting semiconductor devices high temperature ageing to test |
| CN109884940A (en) * | 2019-02-26 | 2019-06-14 | 长沙南道电子科技有限公司 | Ageing system |
| CN110058146A (en) * | 2019-05-22 | 2019-07-26 | 西安太乙电子有限公司 | It is a kind of to change the mold general aging test device and its operating method |
| CN210005638U (en) * | 2019-02-26 | 2020-01-31 | 长沙南道电子科技有限公司 | Daughter board control device and burn-in daughter board |
| CN210005637U (en) * | 2019-02-26 | 2020-01-31 | 长沙南道电子科技有限公司 | Mother board control device and aging mother board |
-
2020
- 2020-08-18 CN CN202010831342.3A patent/CN114076859A/en active Pending
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63274885A (en) * | 1987-04-24 | 1988-11-11 | スカンテスト システムズ アクチ−セルスカブ | Method of testing semiconductor integrated circuit during burn-in and circuit substrate |
| US5414370A (en) * | 1991-07-19 | 1995-05-09 | Sumitomo Electric Industries, Ltd. | Burn-in apparatus and method which individually controls the temperature of a plurality of semiconductor devices |
| CN2470954Y (en) * | 2001-02-28 | 2002-01-09 | 赵俊芳 | Dynamic testing apparatus for large-medium scale digital circuit |
| CN102129020A (en) * | 2010-01-19 | 2011-07-20 | 中芯国际集成电路制造(上海)有限公司 | Aging test device |
| CN201927782U (en) * | 2010-08-02 | 2011-08-10 | 曹金学 | Socket for ageing test of 64-wire 0.5-ptch ceramic quad flat packaged components |
| CN102520280A (en) * | 2011-12-08 | 2012-06-27 | 台晶(宁波)电子有限公司 | Multi-temperature-point synchronous dynamic high-temperature aging acceleration test device |
| CN102540056A (en) * | 2011-12-29 | 2012-07-04 | 北京控制工程研究所 | Method for testing and screening APS chips |
| CN203398437U (en) * | 2013-08-16 | 2014-01-15 | 浙江长兴电子厂有限公司 | Aging test socket for components with insulated frame package |
| CN203396794U (en) * | 2013-08-16 | 2014-01-15 | 浙江长兴电子厂有限公司 | Aging test socket for metallic-packaging large-power circuit components |
| CN103713265A (en) * | 2013-12-26 | 2014-04-09 | 北京航天测控技术有限公司 | Burn-in detection system |
| CN106569124A (en) * | 2016-11-09 | 2017-04-19 | 中国空间技术研究院 | Universal dynamic aging system for Virtex-5 FPGAs (field programmable gate arrays) |
| CN106571166A (en) * | 2016-11-09 | 2017-04-19 | 中国空间技术研究院 | MT29F series NAND FLASH test aging system with customizable process |
| CN106771987A (en) * | 2017-03-08 | 2017-05-31 | 上海鑫匀源科技有限公司 | A kind of IC chip ageing tester and method of testing based on mother baby plate |
| CN107094018A (en) * | 2017-05-26 | 2017-08-25 | 浙江杭可科技股份有限公司 | D and D/A converter ageing testboard |
| CN208076687U (en) * | 2018-03-27 | 2018-11-09 | 陕西省电子技术研究所 | A kind of aged test tooling for power module |
| CN109283449A (en) * | 2018-10-24 | 2019-01-29 | 武汉精鸿电子技术有限公司 | A kind of device for supporting semiconductor devices high temperature ageing to test |
| CN109884940A (en) * | 2019-02-26 | 2019-06-14 | 长沙南道电子科技有限公司 | Ageing system |
| CN210005638U (en) * | 2019-02-26 | 2020-01-31 | 长沙南道电子科技有限公司 | Daughter board control device and burn-in daughter board |
| CN210005637U (en) * | 2019-02-26 | 2020-01-31 | 长沙南道电子科技有限公司 | Mother board control device and aging mother board |
| CN110058146A (en) * | 2019-05-22 | 2019-07-26 | 西安太乙电子有限公司 | It is a kind of to change the mold general aging test device and its operating method |
Non-Patent Citations (1)
| Title |
|---|
| 宁永成 等: "基于板方式器件级测试老炼的可行性研究", 《电子产品可靠性与环境试验》 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109143033B (en) | Automatic testing system for whole satellite interface | |
| US20080262759A1 (en) | System and method for testing information handling system components | |
| TW201500264A (en) | Apparatus and method for testing aircraft message trigger logics | |
| CN101442448B (en) | Test system and method for knife blade server | |
| CN103457804A (en) | Consistency testing platform of train network communication products | |
| CN105335264A (en) | Computer PCIE (Peripheral Component Interconnect Express) adapter card function testing method based on UEFI (Unified Extensible Firmware Interface) | |
| CN111026588B (en) | Computer system and method for testing a computer system | |
| CN113391965A (en) | Universal test device and test method for aviation bus | |
| CN111402771A (en) | Detection equipment for display driving chip and display module | |
| US20090164931A1 (en) | Method and Apparatus for Managing Test Result Data Generated by a Semiconductor Test System | |
| CN114076859A (en) | Full-temperature aging test system and method for core components for aerospace | |
| US8598900B2 (en) | System and method for testing electronic device | |
| CN201532421U (en) | Audio control panel test device for airliners in civil aviation | |
| US8723539B2 (en) | Test card for motherboards | |
| CN207424123U (en) | Unmanned aerial vehicle onboard Aerial Electronic Equipment tests system | |
| CN110018934A (en) | A kind of system and method based on server master board quick diagnosis power-on error | |
| CN113405583B (en) | Automatic test equipment and control method for aviation board sensor | |
| CN111538318A (en) | Digital regulator single module detecting system | |
| CN104346982B (en) | Reliability test instructional device | |
| CN106597169A (en) | Measuring apparatus for electronic equipment | |
| CN106649001B (en) | CPCI bus backboard test system | |
| CN112067983A (en) | Micro-breaking testing device and system for aerospace equipment | |
| CN115493801B (en) | Steady-state pressure and dynamic data phase synchronization parallel acquisition and preprocessing system | |
| CN220820500U (en) | Testing device for millimeter wave control board | |
| CN213658949U (en) | Automatic tester for keyboard interface of notebook computer mainboard |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220222 |