CN210005637U - Mother board control device and aging mother board - Google Patents

Mother board control device and aging mother board Download PDF

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Publication number
CN210005637U
CN210005637U CN201920245631.8U CN201920245631U CN210005637U CN 210005637 U CN210005637 U CN 210005637U CN 201920245631 U CN201920245631 U CN 201920245631U CN 210005637 U CN210005637 U CN 210005637U
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motherboard
circuit board
burn
control
aging
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CN201920245631.8U
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刘军
吴扬
邓雅娉
张永强
刘雄剑
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Changsha Nandao Electronic Technology Co Ltd
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Changsha Nandao Electronic Technology Co Ltd
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Abstract

The embodiment of the application discloses motherboard control devices and burn-in motherboards, wherein each motherboard control device comprises a control circuit board which is arranged on the motherboard circuit board and electrically connected with the motherboard circuit board, and a controller which is arranged on the control circuit board and used for sending control information to the corresponding burn-in daughter boards and receiving detection information corresponding to the burn-in daughter boards, or a plurality of burn-in daughter boards arranged on the motherboard circuit board are controlled by the motherboard control device, and the motherboard control device is provided with an independent control circuit board, so that the wiring design on the motherboard circuit board is simplified, the interference of wiring on signal transmission is reduced, and the test requirements that the same burn-in motherboard can provide different temperatures and burn-in different chips at the same time can be met through independent control of the burn-in daughter boards.

Description

Mother board control device and aging mother board
Technical Field
The application relates to a chip aging test, in particular to motherboard control devices and an aging motherboard.
Background
The burn-in test is non-destructive tests which only induce circuits with potential defects and do not cause new failure mechanisms or change failure distribution of the circuits after integral screening, and if the burn-in test is not performed, many semiconductor finished products have many problems in the using process due to defects of devices, manufacturing processes and the like.
In the related technology, a plurality of chips to be tested are placed on the same burn-in board, the burn-in boards are placed in the burn-in oven to be heated in a system , and the burn-in boards are connected with a power supply outside the burn-in oven and a functional circuit through a high-temperature-resistant connector and a high-temperature-resistant wire.
SUMMERY OF THE UTILITY MODEL
In view of this, the embodiment of the present application provides kinds of motherboard control devices and a burn-in motherboard, and aims to implement burn-in test on a burn-in daughter board on the burn-in motherboard and simplify the design of wires on the burn-in motherboard.
The technical scheme of the embodiment of the application is realized as follows:
, the embodiment of the present application provides motherboard control devices for controlling at least burn-in daughter boards disposed on a motherboard circuit board, where the motherboard control device includes a control circuit board configured to be mounted on the motherboard circuit board and electrically connected to the motherboard circuit board, and a controller disposed on the control circuit board and configured to send control information to the corresponding burn-in daughter board and receive detection information corresponding to the burn-in daughter board.
In a second aspect, embodiments of the present application provide aged motherboards, which include a motherboard circuit board, on which the motherboard control device according to the foregoing embodiments is disposed.
In the technical scheme that this application embodiment provided, set up or polylith on the motherboard circuit board and smelt the daughter board always by motherboard controlling means control, and motherboard controlling means has solitary control circuit board to simplify the wiring design on the motherboard circuit board, reduced and walked the interference of line to signal transmission, and can through the independent control to smelting the daughter board always, satisfied with the different test demands that the motherboard of smelting always can provide different temperatures and burn simultaneously and smelt different chips always.
Drawings
Fig. 1 is a schematic structural diagram of a motherboard circuit board according to an embodiment of the present application ;
fig. 2 is a schematic structural diagram of a motherboard control device according to an embodiment of the present application ;
FIG. 3 is a schematic diagram of a burn-in platter of the present application embodiment.
Detailed Description
The present invention is further described in the detailed description with reference to the drawings and the detailed description, it is to be understood that the embodiments are provided solely for the purpose of illustration and not as a definition of the limits of the application.
The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application, the terminology used herein "and/or" includes any and all combinations of or more of the associated listed items.
Referring to fig. 1, in an embodiment , eight second mounting areas 412 and fourth mounting areas 411 are disposed on a motherboard circuit board 41, the eight burn-in daughter boards are correspondingly mounted on the second mounting areas 412, the motherboard control device is mounted on the mounting area 411, and each second mounting area 412 is electrically connected to the mounting area 411 (for example, the eight burn-in daughter boards may be electrically connected through copper wires laid in the motherboard circuit board 41), so that control of burn-in daughter boards is achieved.
In the embodiment of the present application, referring to fig. 2, the motherboard control device 5 includes: a control circuit board 51 for mounting on the motherboard circuit board 41 and electrically connected to the motherboard circuit board 41; and the controller is arranged on the control circuit board 51 and used for sending control information to the aging daughter board and receiving detection information corresponding to the aging daughter board.
The motherboard controlling means 5 of the embodiment of this application, to setting up or polylith burn-in daughter boards on motherboard circuit board 41 and controlling, and motherboard controlling means 5 has solitary control circuit board 51, thereby the wiring design on motherboard circuit board 41 has been simplified, the interference of walking the line to signal transmission has been reduced, and can be through the independent control to burn-in daughter board, satisfied with burn-in motherboard can provide different temperatures and burn-in test demand of different chips simultaneously.
In embodiments, the controller disposed on the control circuit board 51 includes a field programmable array FPGA52, a microprocessor MCU 53. FPGA52 communicatively connected to the motherboard circuit board 41, an MCU 53 communicatively connected to both the FPGA52 and the motherboard circuit board 41, the MCU 53 configured to send control information to the FPGA52, the FPGA52 configured to receive the detection information corresponding to the burn-in daughter board and send the detection information to the MCU 53, and the corresponding burn-in daughter board is controlled to perform a burn-in test according to the control information sent by the MCU 53.
By adopting the working mode of the cooperation of the MCU and the FPGA, the MCU can realize the data configuration of the FPGA, thereby saving a configuration storage circuit of the FPGA, simplifying the circuit and saving the hardware cost.
Referring to fig. 2, a connector 54 is disposed on a control circuit board 51, the control circuit board 51 is detachably and electrically connected to a motherboard circuit board 41 through the connector 54, and is in communication connection with the hardened daughter board through the motherboard circuit board 41, so that the motherboard control device 5 can be separated from the motherboard circuit board 41, both the motherboard control device 5 and the motherboard circuit board 41 adopt a modular design and can be reused, when the motherboard circuit board 41 or the motherboard control device 5 has a fault, only the faulty portion needs to be replaced, and maintenance is facilitated, the connector 54 can be a flat cable or a gold finger connector, and a slot is correspondingly disposed on the motherboard circuit board 41 in an mounting area 411, so as to electrically connect the motherboard control device 5 and the motherboard circuit board 41.
Optionally, the control circuit board 51 is further provided with a power supply circuit 55, the power supply circuit 55 receives a direct current power supply provided by the motherboard circuit board 41 and converts the direct current power supply provided by the motherboard circuit board 41 through the connector 54 to provide power for the controller, in an embodiment , the power supply circuit 55 converts the DC12V power supply provided by the motherboard circuit board 41 through the connector 54 into a DC3V3 working voltage and a DC1V2 working voltage, and the power supply circuit 55 provides the FPGA52 with the DC3V3 working voltage and the DC1V2 working voltage and provides the MCU 53 with the DC3V3 working voltage.
In embodiments, the FPGA52 downloads, develops and debugs an FPGA program through a JTAG (Joint Test Action Group) interface, the FPGA52 may generate a clock signal CLK from the MCU 53, or may generate a clock signal from an external reserved crystal oscillator, so that when the MCU 53 outputs an abnormal clock signal, the FPGA52 may use the clock signal generated by the external reserved crystal oscillator to improve system stability, the FPGA52 may generate a reset signal RST from the MCU 53, or may perform an external manual reset through the external, so as to improve system stability, the FPGA52 is connected to a configuration circuit for pulling up or down pins necessary for normal operation of the FPGA according to an FPGA user manual, the FPGA52 may be connected to a Flash memory, after the FPGA is normally powered on, the MCU 53 transmits a clock signal (CLK) and a Reset Signal (RST) to the FPGA52, the FPGA52 reads out an FPGA configuration file from the Flash through an SPI bus interface, loads the FPGA configuration file into the FPGA, the FPGA52 may reserve a MCU 53 for controlling the FPGA configuration pins of the FPGA configuration pins, thereby simplifying a hardware circuit design, reducing the board, and may implement flexible configuration of the FPGA configuration pins of the FPGA52, so as to implement flexible serial number expansion of an old daughter board corresponding to an old card no 354, so as to selectively implement a serial number corresponding to an old card, and an old card, which is installed on the MCU 53.
The FPGA52 communicates with 8 aging daughter boards through 32 pairs of high-speed differential signals (CLK P/N <0:7>, CS P/N <0:7>, DI P/N <0:7>, DOP/N <0:7>) and acquires detection information corresponding to each aging daughter board, wherein the detection information comprises or more of information such as daughter board numbers, whether daughter boards exist, chip shell temperature, whether chips work normally, chip working voltage, ambient temperature around an aging base and the like, the FPGA52 communicates with the 8 aging daughter boards through 32 pairs of high-speed differential signals and controls the aging daughter boards to perform aging tests according to control information sent by the MCU 53, and the control information comprises or more of information such as heating devices of start-stop aging bases, heat dissipation devices of start-stop aging bases, single chip shell temperature offset (base temperature), whole cabinet chip shell temperature offset (offset temperature) and the like.
The FPGA52 communicates with the MCU 53 through the SPI bus interface, transmits the acquired detection information corresponding to the 8 aging daughter boards to the MCU 53, and receives the control information sent by the MCU.
In , the motherboard control device 5 further includes an indicator light 521 , an indicator light 521 connected to the FPGA52 for indicating the operating status of the FPGA52, specifically, when the FPGA program is loaded, the DONE pin outputs a high level, and the program loading indicator light is turned on.
In embodiments, the power supply circuit 55 provides the MCU 53 with a DC3V3 working power supply, the MCU 53 generates a clock from an internal crystal oscillator, an external crystal oscillator is reserved, the MCU 53 supports an external manual reset and a dog software reset, the MCU 53 downloads and updates an MCU program through a serial port (UART) to meet the control requirements of different burn-in tests, optionally, the MCU 53 may control the FPGA52 configuration pin, the MCU 53 is provided with a download configuration port, a jumper pin on the board is shorted through a jumper cap, the boot0 is connected to the 3V3, the program download is completed, and the jumper cap is pulled down, thereby realizing the program download.
The MCU 53 is in communication connection with the motherboard circuit board 41 through a communication line RX/TX, the MCU 53 can receive external control information and issue the control information to the FPGA52, and can also send detection information corresponding to the aging daughter board sent by the FPGA52 to external control equipment through the motherboard circuit board 41. in the embodiment, the motherboard circuit board 41 is provided with a communication interface, the MCU 53 is connected with the communication interface and can receive the control information issued by the aging control equipment and send the detection information corresponding to each aging daughter board to the aging control equipment, so that the centralized control of each aging daughter board by the aging control equipment is realized, and the aging control equipment can obtain the detection information corresponding to each aging daughter board.
In , the motherboard control device 5 further includes a second indicator light 531, the second indicator light 531 is connected to the MCU 53 for indicating the operating status of the MCU 53. for example, if the MCU is working normally, the LED _ WORK outputs a low level, the indicator light is on, so that the operating status of the MCU 53 can be observed in real time, which facilitates quick troubleshooting.
In , the motherboard control device 5 further includes a display device 56, where the display device 56 is connected to the controller and is used to display the detection information corresponding to the burn-in board, in , the display device 56 is an LED display, the power supply circuit 55 provides DC3V3 working power to the LED display, the LED display receives the detection information corresponding to the burn-in board acquired by the MCU 53 via the SPI bus, and can switch and display 8 pieces of information of the burn-in board at set time intervals, for example, the display content of the LED display is, for example, the number of the row 1 daughter board and the number of the row 2 daughter board are normally operated, the temperature of the row 3, and in other embodiments, the display device 56 may also be a nixie tube.
In , the control circuit board 51 has a plurality of fixing holes 511, for example, a plurality of fixing holes 511 are formed on the periphery of the control circuit board, and the control circuit board 51 is fixed on the mounting region 411 of the motherboard circuit board 41 through the fixing holes 511.
The embodiment of the present application further provides types of aging motherboards, please refer to fig. 3, where the aging motherboard 4 includes a motherboard circuit board 41, and the motherboard circuit board 41 is provided with the motherboard control device 5 of any of the aforementioned embodiments, in embodiment, the motherboard circuit board is provided with a plurality of mounting portions for electrically connecting with the aging motherboard and second mounting portions for electrically connecting with the motherboard control device, as shown in fig. 1, eight second mounting areas 412 and mounting areas 411 are provided on the motherboard circuit board 41, eight aging motherboards 1 are correspondingly mounted in the second mounting areas 412, the motherboard control device 5 is mounted in the mounting area 411, and each second mounting area 412 is electrically connected with the mounting area 411 (for example, the eight aging motherboards can be electrically connected through copper wires laid in the motherboard circuit board 41), so as to realize the control of the motherboard control devices 5 on the eight aging motherboards 1.
The motherboard circuit board 41 is provided with a power supply circuit 42, and the power supply circuit 42 supplies power to the motherboard control device 5 and the burn-in board 1. The power circuit 42 can adopt 8M 8 copper studs to be connected with a 1-circuit direct current 12V high-power switching power supply, 4 of the 8 copper studs are connected with a positive power supply, and 4 of the 8 copper studs are connected with a negative power supply, so that a DC12V power supply is respectively provided for the aging daughter board 1 and the motherboard control device 5.
In embodiments, a communication interface 43 is further disposed on the motherboard circuit board 41, and is connected to the motherboard control device 5, so that the motherboard control device 5 is in communication connection with an external control device, where the communication interface 43 may be a wired or wireless communication interface, the motherboard control device 5 provides a DC3V3 power supply to the communication interface 43, the motherboard control device 5 is in communication connection with the communication interface 43 through a communication line RX/TX, and may receive external control information, such as control information issued by the burn-in control device, where the control information includes or more of a heating device for starting and stopping the burn-in socket, a heat dissipation device for starting and stopping the burn-in socket, a single chip socket temperature offset (base temperature), a whole cabinet chip socket temperature offset (offset temperature), etc., the burn-in control device 5 may further transmit detection information transmitted from each burn-in daughter board 1 to the burn-in control device through the communication interface 43, and the burn-in control device may obtain detection information corresponding to each burn-in daughter board (CS/N0, CS/N < 7, N < N > and/N < 7> when the burn-in-out control device may detect whether there is a burn-in-out switch (RST < N > and/N <0, N < N > and/N < 7, N < N > and a communication signal, and a communication signal corresponding to detect whether a normal operation state, a normal operation, a communication signal, a signal corresponding to.
In , the motherboard circuit board 41 has a plurality of fixing holes 411, for example, a plurality of fixing holes 411 are opened on the periphery of the motherboard circuit board, and the motherboard circuit board 41 is fixed in the chassis through the fixing holes 411, so as to realize a centralized aging test of a plurality of aging motherboards in the chassis.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (9)

1, kinds of motherboard controlling means for control at least smelting daughter boards that burn in on the motherboard circuit board set up, its characterized in that, motherboard controlling means includes:
the control circuit board is used for being installed on the motherboard circuit board and electrically connected with the motherboard circuit board;
and the controller is arranged on the control circuit board and used for sending control information to the corresponding aging daughter board and receiving detection information corresponding to the aging daughter board.
2. The motherboard control apparatus of claim 1, wherein said controller comprises:
the field programmable array FPGA is in communication connection with the motherboard circuit board;
the microprocessor MCU is in communication connection with the FPGA and the motherboard circuit board;
the MCU is used for sending control information to the FPGA, the FPGA is used for receiving the detection information corresponding to the aging daughter board and sending the detection information to the MCU, and the aging daughter board corresponding to the control information sent by the MCU is controlled to perform aging test.
3. The motherboard control apparatus as recited in claim 1, wherein said motherboard control apparatus further comprises:
and the display device is connected with the controller and used for displaying the detection information corresponding to the aging daughter board.
4. The motherboard control apparatus as recited in claim 2, wherein said motherboard control apparatus further comprises:
indicator light connected with the FPGA for indicating the working state of the FPGA and/or,
and the second indicator light is connected with the MCU and used for indicating the working state of the MCU.
5. The motherboard control apparatus as recited in claim 1, wherein said motherboard control apparatus further comprises:
the connector is arranged on the control circuit board and used for being electrically connected with the motherboard circuit board in a detachable mode and being in communication connection with the aging daughter board through the motherboard circuit board.
A burn-in motherboard of the type 6, , comprising a motherboard circuit board on which motherboard control means as claimed in any of claims 1 to 5 to are provided.
7. The burn-in motherboard of claim 6, wherein said motherboard circuit board is provided with a plurality of th mounting sections for electrical connection with the burn-in board and second mounting sections for electrical connection with said motherboard control device.
8. The burn-in motherboard of claim 7, wherein said motherboard circuit board has power circuitry disposed thereon, said power circuitry providing power to said motherboard control means and said burn-in board.
9. The aging master according to claim 6, further comprising:
and the communication interface is connected with the motherboard control device and is used for connecting the motherboard control device with external control equipment in a communication way.
CN201920245631.8U 2019-02-26 2019-02-26 Mother board control device and aging mother board Active CN210005637U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920245631.8U CN210005637U (en) 2019-02-26 2019-02-26 Mother board control device and aging mother board

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Application Number Priority Date Filing Date Title
CN201920245631.8U CN210005637U (en) 2019-02-26 2019-02-26 Mother board control device and aging mother board

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CN210005637U true CN210005637U (en) 2020-01-31

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114076859A (en) * 2020-08-18 2022-02-22 中国科学院国家空间科学中心 Full-temperature aging test system and method for core components for aerospace
CN114637247A (en) * 2022-05-17 2022-06-17 中海油田服务股份有限公司 Control device and water bird

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114076859A (en) * 2020-08-18 2022-02-22 中国科学院国家空间科学中心 Full-temperature aging test system and method for core components for aerospace
CN114637247A (en) * 2022-05-17 2022-06-17 中海油田服务股份有限公司 Control device and water bird

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