CN114076840A - 检测探针的制造方法及制造装置 - Google Patents
检测探针的制造方法及制造装置 Download PDFInfo
- Publication number
- CN114076840A CN114076840A CN202110895382.9A CN202110895382A CN114076840A CN 114076840 A CN114076840 A CN 114076840A CN 202110895382 A CN202110895382 A CN 202110895382A CN 114076840 A CN114076840 A CN 114076840A
- Authority
- CN
- China
- Prior art keywords
- terminal
- cylinder
- manufacturing
- detection probe
- barrel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 238000001514 detection method Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title abstract description 22
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000003780 insertion Methods 0.000 claims description 51
- 230000037431 insertion Effects 0.000 claims description 51
- 238000010586 diagram Methods 0.000 description 22
- 239000000758 substrate Substances 0.000 description 13
- 229920002120 photoresistant polymer Polymers 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000004020 conductor Substances 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 238000005096 rolling process Methods 0.000 description 5
- 230000005489 elastic deformation Effects 0.000 description 4
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Treatment Of Fiber Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020200100206A KR102456469B1 (ko) | 2020-08-11 | 2020-08-11 | 검사 프로브의 제조 방법 및 장치 |
KR10-2020-0100206 | 2020-08-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114076840A true CN114076840A (zh) | 2022-02-22 |
Family
ID=80283158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110895382.9A Pending CN114076840A (zh) | 2020-08-11 | 2021-08-05 | 检测探针的制造方法及制造装置 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR102456469B1 (ko) |
CN (1) | CN114076840A (ko) |
TW (1) | TWI792422B (ko) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01287484A (ja) * | 1988-05-16 | 1989-11-20 | Hitachi Ltd | プローブヘッド及びその製造方法とそれを用いた半導体lsi検査装置 |
KR101904265B1 (ko) * | 2018-04-13 | 2018-10-05 | (주)에이치엠티 | 플랫 핀바디를 구비한 핀블록용 프로브핀 |
KR20180111219A (ko) * | 2017-03-31 | 2018-10-11 | 주식회사 오킨스전자 | 레이저 용접을 이용하여 조립되는 프로브 핀, 그 프로브 핀의 조립 방법 및 여기에 사용되는 프로브 핀의 전기-광학 용접 시스템 |
TW201918712A (zh) * | 2017-11-07 | 2019-05-16 | 南韓商李諾工業股份有限公司 | 測試探針模組、測試插座及製造測試探針模組的方法 |
TW201940887A (zh) * | 2018-03-20 | 2019-10-16 | 日商日本電產理德股份有限公司 | 接觸端子、具備接觸端子的檢查治具、以及接觸端子的製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050112213A (ko) * | 2004-05-25 | 2005-11-30 | 서인교 | 버티컬 핸들러의 반도체 소자 소켓 설치 구조 |
KR20170105030A (ko) * | 2014-12-30 | 2017-09-18 | 테크노프로브 에스.피.에이. | 복수의 테스트 헤드용 접촉 프로브를 포함하는 반제품 및 이의 제조 방법 |
KR20170000572A (ko) * | 2015-06-24 | 2017-01-03 | 주식회사 메가터치 | 전자 디바이스 테스트용 탐침 장치 |
US10168357B2 (en) * | 2015-12-21 | 2019-01-01 | Intel Corporation | Coated probe tips for plunger pins of an integrated circuit package test system |
TWI671529B (zh) * | 2017-12-22 | 2019-09-11 | 馬來西亞商宇騰精密探針集團 | 具有壓縮性彈簧組件的接觸探針 |
-
2020
- 2020-08-11 KR KR1020200100206A patent/KR102456469B1/ko active IP Right Grant
-
2021
- 2021-07-16 TW TW110126161A patent/TWI792422B/zh active
- 2021-08-05 CN CN202110895382.9A patent/CN114076840A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01287484A (ja) * | 1988-05-16 | 1989-11-20 | Hitachi Ltd | プローブヘッド及びその製造方法とそれを用いた半導体lsi検査装置 |
KR20180111219A (ko) * | 2017-03-31 | 2018-10-11 | 주식회사 오킨스전자 | 레이저 용접을 이용하여 조립되는 프로브 핀, 그 프로브 핀의 조립 방법 및 여기에 사용되는 프로브 핀의 전기-광학 용접 시스템 |
TW201918712A (zh) * | 2017-11-07 | 2019-05-16 | 南韓商李諾工業股份有限公司 | 測試探針模組、測試插座及製造測試探針模組的方法 |
TW201940887A (zh) * | 2018-03-20 | 2019-10-16 | 日商日本電產理德股份有限公司 | 接觸端子、具備接觸端子的檢查治具、以及接觸端子的製造方法 |
KR101904265B1 (ko) * | 2018-04-13 | 2018-10-05 | (주)에이치엠티 | 플랫 핀바디를 구비한 핀블록용 프로브핀 |
Also Published As
Publication number | Publication date |
---|---|
KR20220019918A (ko) | 2022-02-18 |
KR102456469B1 (ko) | 2022-10-21 |
TWI792422B (zh) | 2023-02-11 |
TW202206821A (zh) | 2022-02-16 |
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