CN114054385B - Full-automatic double-head wafer tester - Google Patents
Full-automatic double-head wafer tester Download PDFInfo
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- CN114054385B CN114054385B CN202111329999.0A CN202111329999A CN114054385B CN 114054385 B CN114054385 B CN 114054385B CN 202111329999 A CN202111329999 A CN 202111329999A CN 114054385 B CN114054385 B CN 114054385B
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- 238000012360 testing method Methods 0.000 claims abstract description 175
- 235000012431 wafers Nutrition 0.000 claims abstract description 77
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- 238000004140 cleaning Methods 0.000 claims description 25
- 230000000712 assembly Effects 0.000 claims description 9
- 238000000429 assembly Methods 0.000 claims description 9
- 230000007246 mechanism Effects 0.000 claims description 7
- 239000013013 elastic material Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 description 14
- 230000006978 adaptation Effects 0.000 description 7
- 238000007689 inspection Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- B08B1/20—
-
- B08B1/30—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention provides a full-automatic double-head wafer testing machine which comprises a testing platform and an electric turntable arranged at the upper end of the testing platform, wherein the rotating end of the electric turntable is fixedly connected with a testing disc, a plurality of equidistant mounting grooves are formed in the edge of the upper end of the testing disc, a receiving plate matched with a wafer is connected in a sliding manner in the mounting grooves, a plurality of groups of conducting components positioned at one side of the mounting grooves are fixedly connected at the upper end of the testing disc, each conducting component comprises two metal contacts with gaps, an electric feeding sliding rail positioned at the first side of the testing disc is arranged at the upper end of the testing platform, and three groups of testing devices are sequentially distributed at the upper end of the testing platform around the testing disc. The invention solves the technical problem of automatic detection of wafers.
Description
Technical Field
The invention relates to the technical field of wafer testing, in particular to a full-automatic double-head wafer testing machine.
Background
The wafer is a light-emitting component of the LED lamp, is one of the most important parts in the interior, is made of semiconductor materials, is mostly made of arsenic, aluminum, gallium and the like, and can emit light with different colors by changing the internal structure and material composition of the wafer.
One end surface of the wafer is smooth in packaging surface, two conductive metal bumps are welded on the other end surface of the wafer, a metal oxide layer or other stains are adhered to the surface of the metal bumps in the processing process, the conductive performance of the metal bumps is affected, conductive tests are required to be carried out on the surface of the metal bumps, but the conventional wafer detection device cannot accurately and effectively detect and classify wafers in different conductive states, and the degree of automation is required to be improved, so that a full-automatic double-end wafer tester is required.
Disclosure of Invention
In view of the above problems, the present invention provides a full-automatic double-ended wafer tester, which solves the technical problems if wafers are automatically inspected.
In order to solve the problems, the invention adopts the following technical scheme:
the utility model provides a full-automatic double-end wafer testing machine, includes test platform and installs in the electric turntable of test platform upper end, electric turntable rotation end fixedly connected with test dish, test dish upper end edge opens there is a plurality of equidistance distribution's mounting groove, sliding connection has the board of accepting with the wafer adaptation in the mounting groove, test dish upper end fixedly connected with multiunit is located the conduction subassembly of mounting groove one side, the conduction subassembly includes the metal contact that has the clearance between two, electric feeding slide rail that is located test dish first side is installed to test platform upper end, test platform upper end has distributed three group's testing arrangement in proper order around the test dish, testing arrangement includes test board, first testing component and second testing component, every group testing component includes the test brush that has the clearance between two, follow electric feeding slide rail begins along the equal fixedly connected with first testing component of first two testing board lower extreme of electric turntable rotation direction, three testing board lower extreme all fixedly connected with second testing component, first testing component and wafer adaptation, the second testing component is equipped with the second testing component and the drive arrangement that the wafer adaptation is equipped with in turn on the board, wherein can carry out the drive arrangement through the drive arrangement that the wafer adaptation is equipped with the drive arrangement.
Preferably, in order to realize the ejection of the wafer, the driving device comprises a mounting shaft rotationally connected with the inner wall of the mounting groove, two first gears are fixedly connected on the mounting shaft, a first toothed plate meshed with the first gears is fixedly connected at the lower end of the bearing plate, a second toothed plate meshed with the second first gears is slidingly connected at the inner bottom of the mounting groove, the second toothed plate is elastically connected with the inner wall of the mounting groove through a first spring, a power supply is arranged in the testing plate, two metal contacts are electrically connected with two ends of the first spring, a non-closed loop is formed by the second testing assembly and the power supply in an electric connection mode, and the first testing assembly is connected in series in the corresponding non-closed loop.
Preferably, in order to adjust the height of the test board, and then carry out adaptation detection to wafers with different thicknesses, the test device further comprises a guide rod fixed at the upper end of the test platform, the guide rod penetrates through the test board and is in sliding connection with the test board, an adjusting rod is connected with the side wall of the guide rod in a threaded manner, and a first cam located below the test board is fixedly connected with the tail end of the adjusting rod.
Preferably, in order to enable the test brush to be in close contact with the metal contact and the wafer, a baffle plate is fixedly connected to the upper end of the guide rod, and a second spring positioned between the baffle plate and the test plate is sleeved outside the guide rod.
Preferably, in order to be able to transport the wafers after inspection, two conveyor belts are mounted on the upper end of the test platform, and the two conveyor belts are respectively located on one side of the two second test assemblies.
Preferably, in order to clean the surface of the wafer, the upper end of the test platform is fixedly connected with a mounting seat, a strip-shaped opening is formed in the side wall of the mounting seat, a cleaning plate penetrating through the strip-shaped opening and in sliding connection with the strip-shaped opening is arranged on one side of the mounting seat, a cleaning pad made of elastic materials is fixedly connected to the lower end of the cleaning plate, and a cleaning mechanism for driving the cleaning plate to reciprocate is arranged at the upper end of the test platform.
Preferably, in order to strengthen the cleaning effect to the wafer cleaning mechanism include with test platform upper end rotate the second gear of being connected, electric turntable's rotation end outer wall fixedly connected with and second gear engagement's external tooth ring, second gear upper end fixedly connected with second cam, cleaning plate lower extreme fixedly connected with and second cam matched with actuating lever, be connected with the third spring between cleaning plate terminal and the mount pad.
The beneficial effects of the invention are as follows:
1. the metal bumps on the surface of the wafer are subjected to contact test through the test brush, the first springs can be in a conducting state instantly under the condition that the metal bumps are normally conducted, the carrying plate is driven to move through the driving device in the process of shrinkage of the first springs, and then the wafer after detection is ejected.
2. The cleaning plate can clean the oxide layer and the dirt on the surface of the wafer in the process of reciprocating movement, so that the metal bumps on the surface of the wafer can be in a conducting state.
3. The three groups of testing devices are arranged, so that wafers with different surface conduction conditions can be placed in a classified mode, the whole process is automatically carried out, and the detection accuracy and the automation degree are improved.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is a schematic cross-sectional view of the line A-A of FIG. 2 in accordance with the present invention;
FIG. 4 is a schematic side view of the present invention;
FIG. 5 is an enlarged schematic view of the structure of the present invention at B;
FIG. 6 is an enlarged schematic view of the structure of the present invention at C;
FIG. 7 is an enlarged schematic view of the structure of the present invention at D;
FIG. 8 is an enlarged schematic view of the structure of the invention at E;
FIG. 9 is an enlarged schematic view of the structure of the invention at F;
fig. 10 is a schematic diagram of a wafer structure in the prior art.
In the figure: the test device comprises a test platform 1, a conveyor belt 2, a guide rod 3, a test board 4, an electric turntable 5, a test disc 6, an electric feeding sliding rail 7, an outer toothed ring 8, a bearing plate 9, a metal contact 10, a mounting groove 11, a first cam 12, a second spring 13, a mounting seat 14, a first toothed plate 15, a mounting shaft 16, a second toothed plate 17, a first spring 18, a first gear 19, a test brush 20, a cleaning plate 21, a second cam 22 and a second gear 23.
Detailed Description
The invention will be further described with reference to the drawings and examples.
Referring to fig. 1-10, the full-automatic double-end wafer testing machine comprises a testing platform 1 and an electric turntable 5 arranged at the upper end of the testing platform 1, wherein the rotating end of the electric turntable 5 is fixedly connected with a testing disc 6, a plurality of equally distributed mounting grooves 11 are formed in the edge of the upper end of the testing disc 6, a carrying plate 9 matched with a wafer is slidably connected in the mounting grooves 11, a groove is formed in the surface of the carrying plate 9, one side of the carrying plate is opened, the size of the carrying plate is matched with the wafer, the wafer can be limited in the carrying plate to be detected, and different carrying plates 9 can be replaced according to the size of the wafer to detect different wafers.
The upper end of the test disc 6 is fixedly connected with a plurality of groups of conduction assemblies positioned on one side of the mounting groove 11, each conduction assembly comprises two metal contacts 10 with gaps, an electric feeding sliding rail 7 positioned on the first side of the test disc 6 is arranged at the upper end of the test platform 1, wafers are conveyed in the electric feeding sliding rail 7 and finally enter the bearing plate 9 to be placed, the conveying process of the electric feeding sliding rail 7 and the rotating process of the test disc 6 are controlled by a controller, and wafers on the electric feeding sliding rail 7 are conveyed to the corresponding bearing plate 9 in the rotating process of the test disc 6, so that automatic conveying of the wafers is completed.
The test platform 1 upper end has distributed three group's testing arrangement in proper order around test dish 6, testing arrangement includes test board 4, first test subassembly and second test subassembly, every group test subassembly includes the test brush 20 that has the clearance between two, from the first test subassembly of two test boards 4 lower extreme equal fixedly connected with of electric turntable 5 direction of rotation of electric turntable 7, be located electric turntable 7 clockwise direction of rotation's first two in fig. 2 in the middle of the picture, test dish 6 pivoted direction is clockwise also, the equal fixedly connected with second test subassembly of three test board 4 lower extreme, first test subassembly and wafer looks adaptation, second test subassembly and conduction subassembly looks adaptation are equipped with drive arrangement in the mounting groove 11, wherein drive arrangement can carry out the popping up of wafer through the position of control socket plate 9, can detect the wafer through corresponding test subassembly, accomplish the testing process of wafer after the wafer pops up.
The driving device comprises a mounting shaft 16 rotationally connected with the inner wall of the mounting groove 11, two first gears 19 are fixedly connected on the mounting shaft 16, a first toothed plate 15 meshed with the first gears 19 is fixedly connected at the lower end of the bearing plate 9, a second toothed plate 17 meshed with the second first gears 19 is slidingly connected at the inner bottom of the mounting groove 11, the second toothed plate 17 is elastically connected with the inner wall of the mounting groove 11 through a first spring 18, a power supply is arranged in the test plate 4, two metal contacts 10 are electrically connected with two ends of the first spring 18, a second test assembly is electrically connected with the power supply to form an unclosed loop, the first test assembly is connected in series in the corresponding unclosed loop, during the rotation of the test disc 6, wafers positioned in the bearing plate 9 sequentially pass through the three test plates 4 and the first two test plates 4, the metal bumps on the surface of the wafer are contacted with the corresponding test brushes 20 to realize conduction, the metal contacts 10 are contacted with the corresponding test brushes 20 to conduct, a closed loop is formed, the first springs 18 are in a conduction state at the moment, the first springs 18 are instantly contracted in conduction, the second toothed plate 17 is pulled to drive the mounting shaft 16 to rotate, the carrying plate 9 is outwards popped out, the wafer on the carrying plate 9 is popped out, the detection process is completed, when the oxide layer on the surface of the wafer is not smooth in conduction, the first springs 18 are not conducted, the carrying plate 9 cannot conduct, the rotation is continued, the next detection process is received, when the wafer rotates to the last test plate 4, the lower end of the test plate 4 at the position is not provided with a first test component, at the moment, as long as the test brushes 20 are contacted with the metal contacts 10, the first springs 18 are in a conduction state at the moment, the first springs 18 are contracted, the wafer is popped out, the sorting of the wafers is then effected during the inspection of the wafers.
The testing device further comprises a guide rod 3 fixed at the upper end of the testing platform 1, the guide rod 3 penetrates through the testing plate 4 and is in sliding connection with the testing plate, an adjusting rod is connected to the side wall of the guide rod 3 in a threaded mode, a first cam 12 located below the testing plate 4 is fixedly connected to the tail end of the adjusting rod, a baffle is fixedly connected to the upper end of the guide rod 3, a second spring 13 located between the baffle and the testing plate 4 is sleeved outside the guide rod 3, the position of the side wall of the first cam 12 propped against the testing plate 4 can be changed by rotating the first cam 12, the height of the testing plate 4 can be linearly adjusted under the action of the second spring 13, and then a testing electric brush 20 on the surface of the testing electric brush can be tightly propped against a wafer and a metal contact 10, and the conducting state of a circuit is guaranteed.
Two conveyer belts 2 are installed to test platform 1 upper end, and two conveyer belts 2 are located two second test assembly one sides respectively, and conveyer belt 2 can carry the wafer after detecting qualified, can set up the collection box in last test board 4 department, realizes the collection to the wafer.
The upper end fixedly connected with mount pad 14 of test platform 1, the bar mouth is opened to the mount pad 14 lateral wall, mount pad 14 one side is equipped with runs through the bar mouth and with its sliding connection's clean board 21, clean board 21 lower extreme fixedly connected with is made by elastic material's clean pad, test platform 1 upper end is equipped with the clean mechanism of drive clean board 21 reciprocating motion, clean pad can offset with the wafer surface, can realize the cleanness to its surface in the middle of the wafer removes the in-process, set up it between first test board 4 and second test board 4, can let second test board 4 detect once more the clean wafer, realize the tertiary classification to the wafer.
The cleaning mechanism comprises a second gear 23 rotationally connected with the upper end of the test platform 1, an outer gear ring 8 meshed with the second gear 23 is fixedly connected to the outer wall of the rotating end of the electric turntable 5, a second cam 22 is fixedly connected to the upper end of the second gear 23, a driving rod matched with the second cam 22 is fixedly connected to the lower end of the cleaning plate 21, a third spring is connected between the tail end of the cleaning plate 21 and the mounting seat 14, and the cleaning plate 21 can reciprocate in the rotating process of the test disk 6 under the action of the mechanisms such as the second cam 22 and the third spring, so that the cleaning capability on wafers is enhanced.
The working principle of the invention is as follows: the wafer that needs to detect is carried through electronic pay-off slide rail 7 and is entered into on accepting board 9 in proper order to electronic carousel 5 can drive test dish 6 rotate and pass through three test board 4 in proper order, and the test brush 20 of first test board 4 lower extreme contacts with wafer and metal contact 10, and when the metal bump on wafer surface was in normal conductive state, corresponding first spring 18 switched on this moment, and first spring 18 is the shrink in the moment of switching on, and second pinion rack 17 drives installation axle 16 and rotates this moment, and installation axle 16 drives first gear 19 and rotates and finally lets accepting board 9 pop out, and the accepting board 9 that pops out drops on conveyer belt 2 and obtains the transportation.
When there is an erasable impurity on the wafer surface, the first spring 18 is not conducted, the receiving plate 9 is not ejected, and at this time, it continues to rotate, and is cleaned by the cleaning plate 21 during the continuing rotation.
The cleaned wafer is detected by the second test board 4, the detection process is the same as that of the first test board, the qualified detection ejection is carried out, and the unqualified detection ejection continues to rotate.
The carrying plate 9 which cannot be conducted all the time passes through the third test plate 4, and the lower end of the third test plate 4 is provided with only two test brushes 20 which are contacted with the metal contacts 10, when the test brushes move to a designated position, the first springs 18 are positively electrified and contracted, the ejection of defective wafers is completed, the corresponding carrying plate 9 is emptied at the moment, and the subsequent transportation detection process is completed.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
Claims (6)
1. The full-automatic double-head wafer testing machine comprises a testing platform (1) and an electric turntable (5) arranged at the upper end of the testing platform (1), and is characterized in that a testing disc (6) is fixedly connected to the rotating end of the electric turntable (5), a plurality of equidistant mounting grooves (11) are formed in the edge of the upper end of the testing disc (6), a receiving plate (9) matched with a wafer is slidably connected in the mounting grooves (11), a plurality of groups of conducting assemblies positioned on one side of the mounting grooves (11) are fixedly connected to the upper end of the testing disc (6), and each conducting assembly comprises two metal contacts (10) with gaps;
the upper end of the test platform (1) is provided with an electric feeding sliding rail (7) positioned at the first side of the test disc (6), three groups of test devices are sequentially distributed around the test disc (6) at the upper end of the test platform (1), each group of test devices comprises a test plate (4), a first test assembly and a second test assembly, each group of test assemblies comprises a test brush (20) with a gap between two test plates, the lower ends of the first two test plates (4) which start from the electric feeding sliding rail (7) along the rotation direction of the electric turntable (5) are fixedly connected with the first test assemblies, the lower ends of the three test plates (4) are fixedly connected with the second test assemblies, the first test assemblies are matched with wafers, the second test assemblies are matched with the conducting assemblies, a driving device is arranged in the mounting groove (11), the driving device can realize the ejection of the wafers by controlling the positions of the bearing plates (9),
the driving device comprises a mounting shaft (16) rotationally connected with the inner wall of a mounting groove (11), two first gears (19) are fixedly connected to the mounting shaft (16), a first toothed plate (15) meshed with the first gears (19) is fixedly connected to the lower end of the bearing plate (9), a second toothed plate (17) meshed with the second first gears (19) is slidingly connected to the inner bottom of the mounting groove (11), the second toothed plate (17) is elastically connected with the inner wall of the mounting groove (11) through a first spring (18), a power supply is arranged in the testing plate (4), two metal contacts (10) are electrically connected with two ends of the first spring (18), a second testing assembly is electrically connected with the power supply to form an unclosed loop, and the first testing assembly is connected in series with the corresponding unclosed loop.
2. The full-automatic double-head wafer testing machine according to claim 1, wherein the testing device further comprises a guide rod (3) fixed at the upper end of the testing platform (1), the guide rod (3) penetrates through the testing plate (4) and is in sliding connection with the testing plate, an adjusting rod is connected to the side wall of the guide rod (3) in a threaded mode, and a first cam (12) located below the testing plate (4) is fixedly connected to the tail end of the adjusting rod.
3. The full-automatic double-head wafer testing machine according to claim 2, wherein a baffle is fixedly connected to the upper end of the guide rod (3), and a second spring (13) positioned between the baffle and the testing board (4) is sleeved outside the guide rod (3).
4. The full-automatic double-head wafer testing machine according to claim 1, wherein two conveyor belts (2) are installed at the upper end of the testing platform (1), and the two conveyor belts (2) are respectively located at one side of the two second testing components.
5. The full-automatic double-head wafer testing machine according to claim 1, wherein the upper end of the testing platform (1) is fixedly connected with a mounting seat (14), a strip-shaped opening is formed in the side wall of the mounting seat (14), a cleaning plate (21) penetrating through the strip-shaped opening and in sliding connection with the strip-shaped opening is arranged on one side of the mounting seat (14), a cleaning pad made of elastic materials is fixedly connected to the lower end of the cleaning plate (21), and a cleaning mechanism for driving the cleaning plate (21) to reciprocate is arranged at the upper end of the testing platform (1).
6. The full-automatic double-head wafer testing machine according to claim 5, wherein the cleaning mechanism comprises a second gear (23) rotationally connected with the upper end of the testing platform (1), an outer gear ring (8) meshed with the second gear (23) is fixedly connected to the outer wall of the rotating end of the electric turntable (5), a second cam (22) is fixedly connected to the upper end of the second gear (23), a driving rod matched with the second cam (22) is fixedly connected to the lower end of the cleaning plate (21), and a third spring is connected between the tail end of the cleaning plate (21) and the mounting seat (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111329999.0A CN114054385B (en) | 2021-11-11 | 2021-11-11 | Full-automatic double-head wafer tester |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111329999.0A CN114054385B (en) | 2021-11-11 | 2021-11-11 | Full-automatic double-head wafer tester |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114054385A CN114054385A (en) | 2022-02-18 |
| CN114054385B true CN114054385B (en) | 2024-02-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111329999.0A Active CN114054385B (en) | 2021-11-11 | 2021-11-11 | Full-automatic double-head wafer tester |
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| CN (1) | CN114054385B (en) |
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| US6441606B1 (en) * | 2000-10-17 | 2002-08-27 | Micron Technology, Inc. | Dual zone wafer test apparatus |
| CN2566451Y (en) * | 2002-06-10 | 2003-08-13 | 万润科技股份有限公司 | Crystal chip tester |
| CN2877897Y (en) * | 2005-09-30 | 2007-03-14 | 南京熊猫仪器仪表有限公司 | Wafer sorting device |
| CN101149394A (en) * | 2006-09-22 | 2008-03-26 | 未来产业株式会社 | Pushing block and a handler with the pushing block |
| TW201014771A (en) * | 2008-10-15 | 2010-04-16 | All Ring Tech Co Ltd | Classifying device for a chip tester |
| CN106115194A (en) * | 2016-08-31 | 2016-11-16 | 昆山市张浦镇科伟自动化设备厂 | A kind of automatic detection system |
| CN111123063A (en) * | 2020-01-06 | 2020-05-08 | 北京享云智汇科技有限公司 | Semiconductor device and probe test method thereof |
| CN111487518A (en) * | 2020-06-12 | 2020-08-04 | 肇庆华鑫隆自动化设备有限公司 | High-efficient test equipment of wafer electric capacity |
| WO2020261949A1 (en) * | 2019-06-26 | 2020-12-30 | 末晴 宮川 | Wafer testing apparatus |
-
2021
- 2021-11-11 CN CN202111329999.0A patent/CN114054385B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6441606B1 (en) * | 2000-10-17 | 2002-08-27 | Micron Technology, Inc. | Dual zone wafer test apparatus |
| CN2566451Y (en) * | 2002-06-10 | 2003-08-13 | 万润科技股份有限公司 | Crystal chip tester |
| CN2877897Y (en) * | 2005-09-30 | 2007-03-14 | 南京熊猫仪器仪表有限公司 | Wafer sorting device |
| CN101149394A (en) * | 2006-09-22 | 2008-03-26 | 未来产业株式会社 | Pushing block and a handler with the pushing block |
| TW201014771A (en) * | 2008-10-15 | 2010-04-16 | All Ring Tech Co Ltd | Classifying device for a chip tester |
| CN106115194A (en) * | 2016-08-31 | 2016-11-16 | 昆山市张浦镇科伟自动化设备厂 | A kind of automatic detection system |
| WO2020261949A1 (en) * | 2019-06-26 | 2020-12-30 | 末晴 宮川 | Wafer testing apparatus |
| CN111123063A (en) * | 2020-01-06 | 2020-05-08 | 北京享云智汇科技有限公司 | Semiconductor device and probe test method thereof |
| CN111487518A (en) * | 2020-06-12 | 2020-08-04 | 肇庆华鑫隆自动化设备有限公司 | High-efficient test equipment of wafer electric capacity |
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| Publication number | Publication date |
|---|---|
| CN114054385A (en) | 2022-02-18 |
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