CN111487518A - High-efficient test equipment of wafer electric capacity - Google Patents
High-efficient test equipment of wafer electric capacity Download PDFInfo
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- CN111487518A CN111487518A CN202010537866.1A CN202010537866A CN111487518A CN 111487518 A CN111487518 A CN 111487518A CN 202010537866 A CN202010537866 A CN 202010537866A CN 111487518 A CN111487518 A CN 111487518A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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Abstract
The invention relates to the technical field of electronic components, in particular to efficient testing equipment for a chip capacitor. The testing device comprises a controller, and a vibration feeding mechanism, a material sucking mechanism, a transposition mechanism, a testing mechanism and a discharging and bin dividing mechanism which are sequentially connected with the controller, wherein the vibration feeding mechanism, the material sucking mechanism, the transposition mechanism, the testing mechanism and the discharging and bin dividing mechanism are also respectively connected with corresponding driving cylinders; the silver alloy layer is provided with a small hole communicated with the groove hole, the lower end of the small hole is provided with a vacuum groove for adsorbing and positioning the chip capacitor, and the small hole is communicated with the vacuum groove. The whole working process runs smoothly, the production efficiency is greatly improved, and the chip capacitor does not rub against other workpieces and is not scratched.
Description
Technical Field
The invention relates to the technical field of electronic components, in particular to efficient testing equipment for a chip capacitor.
Background
The wafer capacitor is small in size and difficult to test, the conventional wafer capacitor is mainly tested by placing the wafer capacitor in a tooth groove of a toothed disc through a feeding device, pushing the capacitor to rotate to a test position for testing through rotation of a fluted disc, then rotating to each sub-bin position and discharging into a bin, and the wafer capacitor is easy to scratch or even clamp due to friction with a workpiece in the rotating process, so that the appearance and the performance of the capacitor are influenced, and the stability of equipment is low. Some test equipment designs adopt to install the suction head on circular rolling disc, utilize the vacuum to adsorb wafer electric capacity from above, in order to accomplish test and branch storehouse, the suction head need revolve the center of rolling disc and carry out rotary motion and up-and-down motion, cause wafer electric capacity to shift like this and throw even out, and efficiency is lower.
Disclosure of Invention
Aiming at the technical problems, the invention solves the damage problem in the wafer capacitance testing process, improves the working speed and improves the production efficiency.
In order to solve the technical problems, the invention provides the following specific scheme: a high-efficiency test device for chip capacitance comprises a controller, and a vibration feeding mechanism, a material sucking mechanism, a transposition mechanism, a test mechanism and a discharging and bin dividing mechanism which are sequentially connected with the controller, wherein the vibration feeding mechanism, the material sucking mechanism, the transposition mechanism, the test mechanism and the discharging and bin dividing mechanism are also respectively connected with corresponding driving cylinders; the silver alloy layer is provided with a small hole communicated with the groove hole, the lower end of the small hole is provided with a vacuum groove for adsorbing and positioning the chip capacitor, and the small hole is communicated with the vacuum groove.
Further: in the efficient testing equipment for the wafer capacitor, the testing mechanism and the discharging and bin dividing mechanism are respectively arranged on the upper side edge of the front surface of the compound turntable.
The material sucking mechanism comprises a slide rail, an eccentric wheel and a material sucking seat are arranged on the slide rail, a material sucking suction nozzle is arranged on the material sucking seat, and the material sucking seat is driven by a driving motor to transversely and longitudinally move through the eccentric wheel and the slide rail so as to send the wafer capacitor into a slotted hole of the compound turntable from the vibration feeding mechanism.
The vibration feeding mechanism comprises a vibration disc with an upward rotating inner step and a straight-line vibration groove butted with the vibration disc.
The testing mechanism comprises a tester and an upper testing head and a lower testing head which are connected with the tester.
The discharging and bin dividing mechanism comprises a bin dividing material box and is further provided with a material blowing nozzle. The bin dividing mechanism blows the wafer capacitor into the corresponding bin dividing material box under the action of the airflow according to the test result of the front testing mechanism.
The compound turntable is a disc-shaped epoxy resin plate. The silver alloy embedded on the epoxy plate and the small holes on the alloy use the silver alloy as a lower electrode and use the small holes to be communicated with the vacuum at the bottom to position the chip capacitor, thereby improving the efficiency and avoiding the damage to the chip capacitor.
Compared with the prior art, the high-efficiency test equipment for the chip capacitors is characterized in that the chip capacitors are placed into the vibration feeding mechanism, and the chip capacitors are queued one by one and fed to the material suction port after being vibrated. The material suction nozzle of the material suction mechanism sucks up the chip capacitors by vacuum and sends the chip capacitors into the slot holes of the composite turntable of the indexing mechanism. When the composite turntable rotates one grid, the material suction nozzle sends a wafer capacitor. In the process of rotating the composite turntable, the wafer capacitor enters the testing mechanism to complete the test of each parameter of the wafer capacitor. The tested wafer capacitors are transferred into the discharging and bin dividing mechanism through the composite turntable, and the tested wafer capacitors are respectively placed into the bin dividing boxes under the condition that the blowing air nozzle blows air according to the previous test result. In order to improve the production efficiency and avoid scratching the chip capacitor in the production process, the invention designs the composite turntable, the main body of the turntable is made of a circular epoxy resin plate, the composite turntable adopts a horizontal layout, the periphery of the front surface of the composite turntable is uniformly provided with slotted holes, the bottom ends of the slotted holes are provided with slotted holes, and the bottom parts of the slotted holes are embedded with silver alloy layers serving as lower electrodes; the silver alloy layer is provided with a small hole communicated with the groove hole, and the lower end of the small hole is communicated with a vacuum groove for adsorption and positioning of the wafer capacitor. The material sucking mechanism sucks the wafer capacitor from the feeding mechanism, places the wafer capacitor at the small hole on the alloy in the composite turntable groove, and sucks and positions the wafer capacitor by using vacuum at the lower part. Therefore, the chip capacitor does not generate friction with other workpieces in the rotation process of the indexing mechanism, and the chip capacitor is not scratched or clamped. The whole working process runs smoothly, and the production efficiency is greatly improved.
Drawings
FIG. 1 is a top view of an apparatus for efficient testing of wafer capacitance in accordance with the present invention;
FIG. 2 is a front view of the suction mechanism of the present invention;
FIG. 3 is an enlarged top view of the composite turntable of the present invention;
wherein, 1 inhale material mechanism, 2 test mechanism, 3 row material branch storehouse mechanisms, 4 compound turntables, 5 slotted holes, 6 apertures, 7 slide rails, 8 inhale material seat, 9 inhale material suction nozzle, 10 vibration discs, 11 straight row vibration tanks.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following further explains the technical solution of the present invention with reference to the drawings.
As shown in fig. 1-3: the utility model provides a high-efficient test equipment of wafer electric capacity, includes the controller, the vibration feeding mechanism who connects gradually with the controller, inhale material mechanism 1, indexing mechanism, accredited testing organization 2 and arrange material and divide storehouse mechanism 3, vibration feeding mechanism, inhale material mechanism, indexing mechanism, accredited testing organization and arrange material and divide storehouse mechanism still to link to each other its characterized in that with corresponding driving motor cylinder respectively: the indexing mechanism comprises a compound turntable 4, the compound turntable adopts a horizontal layout, slotted holes 5 are uniformly formed in the periphery of the front face of the compound turntable, slotted holes are formed in the bottom ends of the slotted holes, and a silver alloy layer serving as a lower electrode is embedded at the bottom of each slotted hole; the silver alloy layer is provided with a small hole 6 communicated with the groove hole, the lower end of the small hole is provided with a vacuum groove for adsorbing and positioning the chip capacitor, and the small hole is communicated with the vacuum groove. The testing mechanism and the discharging and bin distributing mechanism are respectively arranged on the upper side edge of the front surface of the compound turntable. The material sucking mechanism comprises a slide rail 7, an eccentric wheel and a material sucking seat 8 are arranged on the slide rail 7, a material sucking suction nozzle 9 is arranged on the material sucking seat, and the material sucking seat is driven by a driving motor to transversely and longitudinally move up and down through the eccentric wheel and the slide rail, as shown in figure 2. The vibration feeding mechanism comprises a vibration disk 10 with a rotary upward inner step and a straight vibration groove 11 butted with the vibration disk. The testing mechanism comprises a tester and an upper testing head and a lower testing head which are connected with the tester. The discharging and bin dividing mechanism comprises a bin dividing material box, and the bin dividing mechanism is provided with a blowing air nozzle. The compound turntable is a disc-shaped epoxy resin plate.
Adding the wafer capacitors into a vibration disc 10 of a vibration feeding mechanism, and queuing the wafer capacitors one by one and feeding the wafer capacitors into a straight-line vibration groove 11 under the vibration action; the material suction nozzle 9 of the material suction mechanism reciprocates under the drive of the drive motor, and sucks up a single wafer capacitor by using vacuum, and the single wafer capacitor is sent to the silver alloy in the slotted hole 5 of the compound turntable 4 of the indexing mechanism and positioned by using the vacuum at the lower part through the small hole 6 on the silver alloy; the wafer capacitor rotates to the testing mechanism 2 along with the composite turntable, the testing mechanism 2 is driven by the air cylinder, a lower testing needle of the testing mechanism moves upwards to contact with the silver alloy below the wafer capacitor, and an upper testing needle moves downwards to contact with the wafer capacitor, so that the testing of the wafer capacitor parameter is completed; and then the tested wafer capacitors are transferred to a discharging and bin dividing mechanism 3 along with the indexing mechanism, and according to the test parameters, the wafer capacitors with different parameter values are blown into corresponding bin dividing material boxes by the instructions of the control system through the airflow of the material blowing nozzle. The silver alloy embedded on the epoxy plate and the small holes on the alloy use the silver alloy as a lower electrode and use the small holes to be communicated with the vacuum at the bottom to position the chip capacitor, thereby improving the efficiency and avoiding the damage to the chip capacitor. The chip capacitor does not generate friction with other workpieces in the rotation process of the indexing mechanism, and the chip capacitor is not scratched or clamped. The whole working process runs smoothly, and the production efficiency is greatly improved.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (7)
1. The utility model provides a high-efficient test equipment of wafer electric capacity, includes the controller, the vibration feeding mechanism who connects gradually with the controller, inhale material mechanism (1), indexing mechanism, accredited testing organization (2) and arrange material and divide storehouse mechanism (3), vibration feeding mechanism, inhale material mechanism, indexing mechanism, accredited testing organization and arrange material and divide storehouse mechanism still to link to each other its characterized in that with corresponding driving motor cylinder respectively: the indexing mechanism comprises a compound turntable (4), the compound turntable is horizontally arranged, slotted holes (5) are uniformly formed in the periphery of the front face of the compound turntable, slotted holes are formed in the bottom ends of the slotted holes, and a silver alloy layer serving as a lower electrode is embedded at the bottom of each slotted hole; the silver alloy layer is provided with a small hole (6) communicated with the groove hole, the lower end of the small hole is provided with a vacuum groove for adsorbing and positioning the chip capacitor, and the small hole is communicated with the vacuum groove.
2. The apparatus for efficient testing of wafer capacitance of claim 1, wherein: the testing mechanism and the discharging and bin distributing mechanism are respectively arranged on the upper side edge of the front surface of the compound turntable.
3. The apparatus for efficient testing of wafer capacitance of claim 1, wherein: the material sucking mechanism comprises a sliding rail (7), an eccentric wheel and a material sucking seat (8) are arranged on the sliding rail (7), a material sucking nozzle (9) is arranged on the material sucking seat, and the material sucking seat is driven by a driving motor to transversely and longitudinally move through the eccentric wheel and the sliding rail.
4. The apparatus for efficient testing of wafer capacitance of claim 1, wherein: the vibration feeding mechanism comprises a vibration disc (10) with an upward rotating inner step and a straight-line vibration groove (11) butted with the vibration disc.
5. The apparatus for efficient testing of wafer capacitance of claim 1, wherein: the testing mechanism comprises a tester and an upper testing head and a lower testing head which are connected with the tester.
6. The apparatus for efficient testing of wafer capacitance of claim 1, wherein: the discharging and bin dividing mechanism comprises a bin dividing material box and is further provided with a material blowing nozzle.
7. The apparatus for efficient testing of wafer capacitance as recited in any of claims 1-6, wherein: the compound turntable is a disc-shaped epoxy resin plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010537866.1A CN111487518A (en) | 2020-06-12 | 2020-06-12 | High-efficient test equipment of wafer electric capacity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010537866.1A CN111487518A (en) | 2020-06-12 | 2020-06-12 | High-efficient test equipment of wafer electric capacity |
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| Publication Number | Publication Date |
|---|---|
| CN111487518A true CN111487518A (en) | 2020-08-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010537866.1A Pending CN111487518A (en) | 2020-06-12 | 2020-06-12 | High-efficient test equipment of wafer electric capacity |
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| CN (1) | CN111487518A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114054385A (en) * | 2021-11-11 | 2022-02-18 | 四川和恩泰半导体有限公司 | Full-automatic double-head wafer tester |
| CN114101119A (en) * | 2021-11-12 | 2022-03-01 | 绍兴奥美电子科技有限公司 | Wafer frequency sorting machine and sorting method thereof |
| CN116047166A (en) * | 2023-01-28 | 2023-05-02 | 四川绵润科技有限公司 | Insulation resistance test fixture based on electric capacity |
-
2020
- 2020-06-12 CN CN202010537866.1A patent/CN111487518A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114054385A (en) * | 2021-11-11 | 2022-02-18 | 四川和恩泰半导体有限公司 | Full-automatic double-head wafer tester |
| CN114054385B (en) * | 2021-11-11 | 2024-02-09 | 四川和恩泰半导体有限公司 | Full-automatic double-head wafer tester |
| CN114101119A (en) * | 2021-11-12 | 2022-03-01 | 绍兴奥美电子科技有限公司 | Wafer frequency sorting machine and sorting method thereof |
| CN116047166A (en) * | 2023-01-28 | 2023-05-02 | 四川绵润科技有限公司 | Insulation resistance test fixture based on electric capacity |
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