CN114054385A - Full-automatic double-head wafer tester - Google Patents
Full-automatic double-head wafer tester Download PDFInfo
- Publication number
- CN114054385A CN114054385A CN202111329999.0A CN202111329999A CN114054385A CN 114054385 A CN114054385 A CN 114054385A CN 202111329999 A CN202111329999 A CN 202111329999A CN 114054385 A CN114054385 A CN 114054385A
- Authority
- CN
- China
- Prior art keywords
- testing
- wafer
- fixedly connected
- plate
- disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 claims abstract description 174
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 230000000712 assembly Effects 0.000 claims abstract description 4
- 238000000429 assembly Methods 0.000 claims abstract description 4
- 238000004140 cleaning Methods 0.000 claims description 23
- 230000007246 mechanism Effects 0.000 claims description 7
- 239000013013 elastic material Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 7
- 230000003044 adaptive effect Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 64
- 238000000034 method Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 15
- 238000009434 installation Methods 0.000 description 7
- 230000006978 adaptation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a full-automatic double-head wafer testing machine which comprises a testing platform and an electric turntable arranged at the upper end of the testing platform, wherein a testing disc is fixedly connected at the rotating end of the electric turntable, a plurality of mounting grooves which are distributed at equal intervals are formed in the edge of the upper end of the testing disc, a bearing plate which is adaptive to a wafer is connected in the mounting grooves in a sliding mode, a plurality of groups of conducting assemblies which are positioned on one side of the mounting grooves are fixedly connected at the upper end of the testing disc, each conducting assembly comprises two metal contacts with gaps between the two metal contacts, an electric feeding slide rail which is positioned on the first side of the testing disc is arranged at the upper end of the testing platform, and three groups of testing devices are sequentially distributed at the upper end of the testing platform around the testing disc. The invention solves the technical problem of automatic detection of the wafer.
Description
Technical Field
The invention relates to the technical field of wafer testing, in particular to a full-automatic double-head wafer testing machine.
Background
The wafer is a light emitting component of the LED lamp and is one of the most important parts of the inside thereof, and the wafer is made of a semiconductor material, which is mostly made of arsenic, aluminum, gallium, etc., and the wafer can emit light of different colors by changing the structure and material composition of the inside thereof.
The surface of one end of the wafer is smooth through a packaging surface, two conductive metal bumps are welded on the surface of the other end of the wafer, metal oxide layers or other stains can be attached to the surfaces of the metal bumps in the processing process, the conductive performance of the metal bumps is affected, the surface of the metal bumps needs to be subjected to conductive testing, but the existing wafer detection device cannot accurately and effectively detect and classify wafers in different conductive states, the automation degree needs to be improved, and therefore a full-automatic double-head wafer testing machine is needed.
Disclosure of Invention
Aiming at the problems, the invention provides a full-automatic double-head wafer testing machine, which solves the technical problem of automatic detection of wafers.
In order to solve the problems, the technical scheme adopted by the invention is as follows:
the full-automatic double-head wafer testing machine comprises a testing platform and an electric turntable arranged at the upper end of the testing platform, wherein a testing disc is fixedly connected to the rotating end of the electric turntable, a plurality of mounting grooves distributed at equal intervals are formed in the edge of the upper end of the testing disc, a bearing plate adaptive to wafers is connected in the mounting grooves in a sliding mode, a plurality of groups of conduction assemblies positioned on one side of the mounting grooves are fixedly connected to the upper end of the testing disc, each conduction assembly comprises two metal contacts with gaps, an electric feeding slide rail positioned on the first side of the testing disc is arranged at the upper end of the testing platform, three groups of testing devices are sequentially distributed on the upper end of the testing platform around the testing disc, each testing device comprises a testing plate, a first testing assembly and a second testing assembly, each testing assembly comprises two testing brushes with gaps, and a first testing group is fixedly connected to the lower ends of the two testing plates in the rotating direction of the electric turntable from the electric feeding slide rail The piece, it is three survey the equal fixedly connected with second test assembly of survey test panel lower extreme, first test assembly and wafer looks adaptation, second test assembly with switch on subassembly looks adaptation, be equipped with drive arrangement in the mounting groove, wherein drive arrangement can accept the position of board through control and realize popping out of wafer.
Preferably, in order to realize popping out of the wafer, the driving device comprises an installation shaft rotatably connected with the inner wall of the installation groove, two first gears are fixedly connected to the installation shaft, a first toothed plate fixedly connected with the lower end of the receiving plate is meshed with the first gear, a second toothed plate meshed with the second first gear is slidably connected to the bottom of the installation groove, the second toothed plate is elastically connected with the inner wall of the installation groove through a first spring, a power supply is arranged in the test plate, the metal contact is electrically connected with two ends of the first spring, the second test component forms a non-closed loop with the power supply, and the first test component is connected in series in the middle of the corresponding non-closed loop.
Preferably, in order to adjust the height of the test board and further perform adaptive detection on wafers with different thicknesses, the test device further comprises a guide rod fixed at the upper end of the test platform, the guide rod penetrates through the test board and is in sliding connection with the test board, an adjusting rod is in threaded connection with the side wall of the guide rod, and a first cam located below the test board is fixedly connected to the tail end of the adjusting rod.
Preferably, in order to enable the testing brush to be in close contact with the metal contact and the wafer, a baffle is fixedly connected to the upper end of the guide rod, and a second spring located between the baffle and the testing board is sleeved outside the guide rod.
Preferably, in order to transport the detected wafer, two conveyor belts are installed at the upper end of the testing platform, and the two conveyor belts are respectively located at one side of the two second testing assemblies.
Preferably, in order to clean the surface of the wafer, a mounting seat is fixedly connected to the upper end of the test platform, a strip-shaped opening is formed in a side wall of the mounting seat, a cleaning plate penetrating through the strip-shaped opening and slidably connected with the strip-shaped opening is arranged on one side of the mounting seat, a cleaning pad made of an elastic material is fixedly connected to the lower end of the cleaning plate, and a cleaning mechanism for driving the cleaning plate to reciprocate is arranged at the upper end of the test platform.
Preferably, in order to enhance the cleaning effect on the wafer, the cleaning mechanism comprises a second gear rotatably connected with the upper end of the test platform, an outer gear ring meshed with the second gear is fixedly connected to the outer wall of the rotating end of the electric rotating disc, a second cam is fixedly connected to the upper end of the second gear, a driving rod matched with the second cam is fixedly connected to the lower end of the cleaning plate, and a third spring is connected between the tail end of the cleaning plate and the mounting seat.
The invention has the beneficial effects that:
1. carry out the contact test through the test brush to the metal bump on wafer surface, can let first spring be in the conducting state in the twinkling of an eye under the normal condition of conducting of metal bump, the in-process of first spring shrink is passed through drive arrangement and is driven the board removal of accepting, and then realizes popping out the wafer that finishes detecting.
2. The cleaning plate can clean an oxide layer and stains on the surface of the wafer in the reciprocating movement process, and the metal salient points on the surface of the wafer can be in a conducting state.
3. Set up three testing arrangement, can classify to the wafer that the electrically conductive condition in surface is different and place to whole process is automatic goes on, has improved the degree of accuracy and the degree of automation that detect.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2 according to the present invention;
FIG. 4 is a schematic side view of the present invention;
FIG. 5 is an enlarged view of the structure at B of the present invention;
FIG. 6 is an enlarged view of the structure at the point C of the present invention;
FIG. 7 is an enlarged view of the structure at D of the present invention;
FIG. 8 is an enlarged view of the structure at E of the present invention;
FIG. 9 is an enlarged view of the structure at F of the present invention;
FIG. 10 is a diagram illustrating a structure of a wafer in the prior art.
In the figure: the test device comprises a test platform 1, a conveyor belt 2, a guide rod 3, a test board 4, an electric rotating disc 5, a test disc 6, an electric feeding sliding rail 7, an outer toothed ring 8, a bearing plate 9, a metal contact 10, a mounting groove 11, a first cam 12, a second spring 13, a mounting seat 14, a first toothed plate 15, a mounting shaft 16, a second toothed plate 17, a first spring 18, a first gear 19, a test brush 20, a cleaning plate 21, a second cam 22 and a second gear 23.
Detailed Description
The invention is further illustrated with reference to the following figures and examples.
Referring to fig. 1-10, full-automatic double-end wafer test machine, including test platform 1 and install in test platform 1 upper end electric turntable 5, electric turntable 5 rotates end fixedly connected with test tray 6, the edge of test tray 6 upper end is opened has a plurality of equidistance distribution's mounting groove 11, sliding connection has the board 9 of accepting with the wafer adaptation in mounting groove 11, it has the recess to accept board 9 surface division, its one side is opened, its size and wafer adaptation, the wafer can be located its interior spacing and is detected, change different board 9 of accepting according to the size of wafer, can detect different wafers.
The subassembly that switches on that 6 upper ends fixedly connected with multiunit of test disc are located mounting groove 11 one side, it includes that there is gapped metal contact 10 between two to switch on the subassembly, electronic pay-off slide rail 7 that is located 6 first sides of test disc is installed to test platform 1 upper end, the wafer is located electronic pay-off slide rail 7 and obtains the transport, finally enter into and accept and place in the board 9, the transportation process of electronic pay-off slide rail 7 and the rotation process of test disc 6 are controlled by the controller, wafer on the electronic pay-off slide rail 7 is carried to corresponding accepting the board 9 in the middle of the test disc 6 pivoted process, accomplish the autoloading of wafer.
Three groups of testing devices are sequentially distributed on the upper end of the testing platform 1 around the testing disc 6, each testing device comprises a testing plate 4, a first testing component and a second testing component, each group of testing components comprises two testing brushes 20 with gaps between, the lower ends of the first two testing plates 4 along the rotation direction of the electric rotary disc 5 from the electric feeding slide rail 7 are fixedly connected with the first testing components, the two testing components are positioned in the front of the clockwise rotation direction of the electric feeding slide rail 7 in the picture 2, the rotation direction of the testing disc 6 is also clockwise, the lower ends of the three testing plates 4 are fixedly connected with the second testing components, the first testing components are matched with the wafer, the second testing components are matched with the conducting components, a driving device is arranged in the mounting groove 11, wherein the driving device can realize the ejection of the wafer by controlling the position of the bearing plate 9 and can detect the wafer by the corresponding testing components, and finishing the detection process of the wafer after the wafer is ejected.
The driving device comprises a mounting shaft 16 which is rotationally connected with the inner wall of a mounting groove 11, two first gears 19 are fixedly connected on the mounting shaft 16, a first toothed plate 15 which is meshed with the first gears 19 is fixedly connected at the lower end of a bearing plate 9, a second toothed plate 17 which is meshed with the second first gears 19 is slidably connected at the bottom in the mounting groove 11, the second toothed plate 17 is elastically connected with the inner wall of the mounting groove 11 through a first spring 18, a power supply is arranged in a test board 4, two metal contacts 10 are electrically connected with two ends of the first spring 18, a second test component is electrically connected with the power supply to form a non-closed loop, the first test component is connected in series in the corresponding non-closed loop, in the rotating process of the test tray 6, wafers positioned in the bearing plate 9 sequentially pass through three test boards 4, and when passing through the first two test boards 4, metal convex points on the surfaces of the wafers are contacted with corresponding test brushes 20, the conduction is realized, the metal contact 10 contacts with the corresponding test brush 20, the conduction is realized, and a closed loop is further formed, at the moment, the first spring 18 is in a conduction state, the instant of conduction of the first spring 18 is contracted, the second gear plate 17 is pulled to drive the mounting shaft 16 to rotate, so that the receiving plate 9 is popped out, the chip on the receiving plate 9 is popped out, the detection process is completed, when the oxide layer on the surface of the chip is not conducted, the first spring 18 is not conducted, the receiving plate 9 cannot be conducted, it continues to rotate, receiving the following test process, when it turns to the last test plate 4, the lower end of the test board 4 is not provided with a first test component, at this time, as long as the test brush 20 is contacted with the metal contact 10, the first spring 18 is in a conducting state, at this time, the first spring 18 contracts, the ejection of the wafer is realized, and then the classification of the wafer is realized in the process of detecting the wafer.
The testing device further comprises a guide rod 3 fixed at the upper end of the testing platform 1, the guide rod 3 penetrates through the testing board 4 and is in sliding connection with the testing board, a regulating rod is in threaded connection with the side wall of the guide rod 3, the tail end of the regulating rod is fixedly connected with a first cam 12 located below the testing board 4, a baffle is fixedly connected with the upper end of the guide rod 3, a second spring 13 located between the baffle and the testing board 4 is sleeved outside the guide rod 3, the position where the side wall of the first cam 12 can be abutted against the testing board 4 can be changed by rotating the first cam, and under the action of the second spring 13, the height of the testing board 4 can be linearly adjusted, so that the testing electric brush 20 on the surface of the first cam can be tightly abutted against a wafer and a metal contact 10, and the conduction state of a circuit is guaranteed.
Two conveyer belts 2 are installed to 1 upper end of test platform, and two conveyer belts 2 are located two second test component one sides respectively, and conveyer belt 2 can be carried the wafer after detecting qualified, can survey 4 departments at last test panel and set up the collection box, realize the collection to the wafer.
1 upper end fixedly connected with mount pad 14 of test platform, 14 lateral walls of mount pad are opened there is the bar mouth, 14 one side of mount pad is equipped with runs through the bar mouth and with it sliding connection's clean board 21, clean board 21 lower extreme fixedly connected with is by the cleaning pad that elastic material made, 1 upper end of test platform is equipped with the clean mechanism of the clean board 21 reciprocating motion of drive, the cleaning pad can offset with the wafer surface, can realize the cleanness to its surface among the process that the wafer removed, survey between board 4 and the second survey test board 4 with it setting at first survey, can let the second survey test board 4 and detect once more to the wafer after the cleanness, the realization is to the tertiary classification of wafer.
Clean mechanism includes the second gear 23 of being connected with the rotation of test platform 1 upper end, the outer ring gear 8 of rotation end outer wall fixedly connected with and second gear 23 meshing of electric turntable 5, second gear 23 upper end fixedly connected with second cam 22, clean 21 lower extreme fixedly connected with of board and second cam 22 matched with actuating lever, be connected with the third spring between clean 21 end and the mount pad 14, under the effect of mechanisms such as second cam 22 and third spring, clean 21 board can be at test 6 pivoted in-process reciprocating motion, the cleaning ability to the wafer has been strengthened.
The working principle of the invention is as follows: the wafer that needs to detect is carried through electronic pay-off slide rail 7 and is entered into in proper order on accepting board 9, and electric turntable 5 can drive test tray 6 and rotate and pass through three test panel 4 in proper order, the test brush 20 and the contact of wafer and metal contact 10 of the first test panel 4 lower extreme, when the metal salient point on wafer surface is in normal conducting state, the first spring 18 that corresponds this moment switches on, first spring 18 is in the shrink in the twinkling of an eye that switches on, second gear 17 drives installation axle 16 and rotates this moment, installation axle 16 drives first gear 19 and rotates and finally lets and accept board 9 and pop out, the board 9 that accepts that pops out drops and obtains the transport on conveyer belt 2.
When the wafer surface has the erasable impurities, the first spring 18 can not be conducted, the bearing plate 9 is not ejected, and the bearing plate continues to rotate, and is cleaned by the cleaning plate 21 in the process of continuous rotation.
The cleaned wafer is tested by the second test board 4, the testing process is the same as above, the qualified wafer is ejected and conveyed, and the unqualified wafer is rotated continuously.
The bearing plate 9 which can not be conducted all the time passes through the third test plate 4, the lower end of the third test plate 4 is only provided with two test brushes 20 which are contacted with the metal contact 10, when the bearing plate moves to a specified position, the first spring 18 is electrified and contracted certainly at the moment, the ejection of the defective wafer is completed, the corresponding bearing plate 9 is vacated at the moment, and the subsequent transportation detection process is completed.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (7)
1. The full-automatic double-head wafer testing machine comprises a testing platform (1) and an electric turntable (5) arranged at the upper end of the testing platform (1), and is characterized in that a testing disc (6) is fixedly connected to the rotating end of the electric turntable (5), a plurality of mounting grooves (11) distributed at equal intervals are formed in the edge of the upper end of the testing disc (6), a bearing plate (9) matched with a wafer is slidably connected in the mounting grooves (11), a plurality of groups of conducting assemblies located on one side of the mounting grooves (11) are fixedly connected to the upper end of the testing disc (6), and each conducting assembly comprises two metal contacts (10) with gaps between the two metal contacts;
the upper end of the test platform (1) is provided with an electric feeding slide rail (7) positioned at the first side of the test disc (6), three groups of testing devices are sequentially distributed at the upper end of the testing platform (1) around the testing disc (6), the testing device comprises testing boards (4), a first testing component and a second testing component, each group of testing components comprises two testing electric brushes (20) with gaps between, the lower ends of the first two testing boards (4) starting from the electric feeding slide rail (7) along the rotating direction of the electric turntable (5) are fixedly connected with the first testing component, the lower ends of the three testing boards (4) are fixedly connected with the second testing component, the first testing component is matched with the wafer, the second testing component is matched with the conducting component, a driving device is arranged in the mounting groove (11), wherein the driving device can eject the wafer by controlling the position of the bearing plate (9).
2. The fully automatic double-ended wafer testing machine according to claim 1, wherein said driving means comprises a mounting shaft (16) rotatably connected to an inner wall of the mounting groove (11), two first gears (19) are fixedly connected to the mounting shaft (16), a first toothed plate (15) meshed with the first gear (19) is fixedly connected to the lower end of the bearing plate (9), a second toothed plate (17) meshed with a second first gear (19) is connected to the bottom in the mounting groove (11) in a sliding manner, the second toothed plate (17) is elastically connected with the inner wall of the mounting groove (11) through a first spring (18), a power supply is arranged in the test board (4), the two metal contacts (10) are electrically connected with the two ends of the first spring (18), the second testing component is electrically connected with the power supply to form an unclosed loop, and the first testing component is connected in series in the corresponding unclosed loop.
3. The full-automatic double-ended wafer testing machine according to claim 1, wherein the testing device further comprises a guide rod (3) fixed on the upper end of the testing platform (1), the guide rod (3) penetrates through the testing plate (4) and is slidably connected with the testing plate, an adjusting rod is screwed on the side wall of the guide rod (3), and a first cam (12) positioned below the testing plate (4) is fixedly connected to the tail end of the adjusting rod.
4. The fully automatic double-ended wafer testing machine according to claim 3, wherein a baffle is fixedly connected to the upper end of the guide rod (3), and a second spring (13) is sleeved outside the guide rod (3) and positioned between the baffle and the test plate (4).
5. The fully automatic double-ended wafer testing machine according to claim 1, wherein two conveyor belts (2) are mounted on the upper end of the testing platform (1), and the two conveyor belts (2) are respectively located on one side of the two second testing components.
6. The fully automatic double-head wafer testing machine according to claim 1, wherein a mounting seat (14) is fixedly connected to the upper end of the testing platform (1), a strip-shaped opening is formed in the side wall of the mounting seat (14), a cleaning plate (21) which penetrates through the strip-shaped opening and is slidably connected with the strip-shaped opening is arranged on one side of the mounting seat (14), a cleaning pad made of elastic material is fixedly connected to the lower end of the cleaning plate (21), and a cleaning mechanism for driving the cleaning plate (21) to reciprocate is arranged on the upper end of the testing platform (1).
7. The full-automatic double-head wafer testing machine according to claim 6, wherein the cleaning mechanism comprises a second gear (23) rotatably connected with the upper end of the testing platform (1), an outer wall of the rotating end of the electric rotating disc (5) is fixedly connected with an outer toothed ring (8) meshed with the second gear (23), a second cam (22) is fixedly connected with the upper end of the second gear (23), a driving rod matched with the second cam (22) is fixedly connected with the lower end of the cleaning plate (21), and a third spring is connected between the tail end of the cleaning plate (21) and the mounting seat (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111329999.0A CN114054385B (en) | 2021-11-11 | 2021-11-11 | Full-automatic double-head wafer tester |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111329999.0A CN114054385B (en) | 2021-11-11 | 2021-11-11 | Full-automatic double-head wafer tester |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114054385A true CN114054385A (en) | 2022-02-18 |
| CN114054385B CN114054385B (en) | 2024-02-09 |
Family
ID=80274878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111329999.0A Active CN114054385B (en) | 2021-11-11 | 2021-11-11 | Full-automatic double-head wafer tester |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114054385B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6441606B1 (en) * | 2000-10-17 | 2002-08-27 | Micron Technology, Inc. | Dual zone wafer test apparatus |
| CN2566451Y (en) * | 2002-06-10 | 2003-08-13 | 万润科技股份有限公司 | Crystal chip tester |
| CN2877897Y (en) * | 2005-09-30 | 2007-03-14 | 南京熊猫仪器仪表有限公司 | Wafer sorting device |
| CN101149394A (en) * | 2006-09-22 | 2008-03-26 | 未来产业株式会社 | Pushing block and a handler with the pushing block |
| TW201014771A (en) * | 2008-10-15 | 2010-04-16 | All Ring Tech Co Ltd | Classifying device for a chip tester |
| CN106115194A (en) * | 2016-08-31 | 2016-11-16 | 昆山市张浦镇科伟自动化设备厂 | A kind of automatic detection system |
| CN111123063A (en) * | 2020-01-06 | 2020-05-08 | 北京享云智汇科技有限公司 | Semiconductor device and probe test method thereof |
| CN111487518A (en) * | 2020-06-12 | 2020-08-04 | 肇庆华鑫隆自动化设备有限公司 | High-efficient test equipment of wafer electric capacity |
| WO2020261949A1 (en) * | 2019-06-26 | 2020-12-30 | 末晴 宮川 | Wafer testing apparatus |
-
2021
- 2021-11-11 CN CN202111329999.0A patent/CN114054385B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6441606B1 (en) * | 2000-10-17 | 2002-08-27 | Micron Technology, Inc. | Dual zone wafer test apparatus |
| CN2566451Y (en) * | 2002-06-10 | 2003-08-13 | 万润科技股份有限公司 | Crystal chip tester |
| CN2877897Y (en) * | 2005-09-30 | 2007-03-14 | 南京熊猫仪器仪表有限公司 | Wafer sorting device |
| CN101149394A (en) * | 2006-09-22 | 2008-03-26 | 未来产业株式会社 | Pushing block and a handler with the pushing block |
| TW201014771A (en) * | 2008-10-15 | 2010-04-16 | All Ring Tech Co Ltd | Classifying device for a chip tester |
| CN106115194A (en) * | 2016-08-31 | 2016-11-16 | 昆山市张浦镇科伟自动化设备厂 | A kind of automatic detection system |
| WO2020261949A1 (en) * | 2019-06-26 | 2020-12-30 | 末晴 宮川 | Wafer testing apparatus |
| CN111123063A (en) * | 2020-01-06 | 2020-05-08 | 北京享云智汇科技有限公司 | Semiconductor device and probe test method thereof |
| CN111487518A (en) * | 2020-06-12 | 2020-08-04 | 肇庆华鑫隆自动化设备有限公司 | High-efficient test equipment of wafer electric capacity |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114054385B (en) | 2024-02-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100904496B1 (en) | A System for Manufacturing Semiconductor Package and A Method for Manufacturing Semiconductor Package | |
| US4699274A (en) | Cleaning device of ray transmission window incorporated into optical selector | |
| KR20110013904A (en) | Apparatus and method of mounting electronic parts | |
| JPH07105421B2 (en) | High speed integrated circuit handler | |
| CN114054385A (en) | Full-automatic double-head wafer tester | |
| KR20080077540A (en) | Sawing and handling apparatus for manufacturing semiconductor package | |
| CN114578214A (en) | PCB detection system and detection method thereof | |
| KR101058886B1 (en) | PCC feeder of plasma processing equipment | |
| KR20040104366A (en) | sawing and handler system for manufacturing semiconductor package | |
| JPS5925627B2 (en) | Cleaning device for color particle sorting equipment | |
| JPH09275299A (en) | Electronic component mounting device | |
| CN209806342U (en) | High-speed LED chip mounter with LED chip screening function | |
| KR101360111B1 (en) | Classifying device of parts and device for characteristic-inspection/classification of electronic parts | |
| JPH10202206A (en) | Color sorter of square cut vegetables | |
| CN210942447U (en) | Automatic screening device of diode braider | |
| CN212349537U (en) | Sorting apparatus | |
| CN209486007U (en) | A kind of bad circuit board detecting system | |
| KR100923906B1 (en) | X-ray INSPECTION APPARATUS OF GETTER FOR LIQUID CRYSTAL DISPLAY | |
| KR100904495B1 (en) | A Tray Picker Assembly | |
| CN211638946U (en) | Automatic ratchet wheel assembly machine | |
| CN112824850B (en) | A get and put material controlling means and module check out test set for can opening and shutting frock | |
| CN111632853A (en) | Food sorting device | |
| CN111804608A (en) | Automatic change RFID label detection device | |
| CN112452820A (en) | Automatic detection device of electric capacity | |
| KR100835135B1 (en) | Tool for transferring semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |