CN114040843A - 层叠体、固化物和电子部件 - Google Patents
层叠体、固化物和电子部件 Download PDFInfo
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- CN114040843A CN114040843A CN202080047080.XA CN202080047080A CN114040843A CN 114040843 A CN114040843 A CN 114040843A CN 202080047080 A CN202080047080 A CN 202080047080A CN 114040843 A CN114040843 A CN 114040843A
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- resin
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- C—CHEMISTRY; METALLURGY
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
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JP2019120167 | 2019-06-27 | ||
JP2019-120167 | 2019-06-27 | ||
PCT/JP2020/024665 WO2020262405A1 (ja) | 2019-06-27 | 2020-06-23 | 積層体、硬化物および、電子部品 |
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CN114040843A true CN114040843A (zh) | 2022-02-11 |
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CN202080047080.XA Pending CN114040843A (zh) | 2019-06-27 | 2020-06-23 | 层叠体、固化物和电子部件 |
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KR (1) | KR20220024430A (ja) |
CN (1) | CN114040843A (ja) |
TW (1) | TW202110930A (ja) |
WO (1) | WO2020262405A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107207703A (zh) * | 2014-12-15 | 2017-09-26 | Dic株式会社 | 热固性树脂组合物、其固化物、及其中使用的活性酯树脂 |
CN107236253A (zh) * | 2016-03-29 | 2017-10-10 | 味之素株式会社 | 树脂片 |
CN107708999A (zh) * | 2015-08-25 | 2018-02-16 | 三井金属矿业株式会社 | 带树脂层的金属箔、覆金属层叠板和印刷电路板的制造方法 |
JP2018145409A (ja) * | 2017-03-03 | 2018-09-20 | 味の素株式会社 | 樹脂組成物 |
Family Cites Families (4)
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JP2006089595A (ja) | 2004-09-24 | 2006-04-06 | Sumitomo Chemical Co Ltd | ビルドアップ用樹脂組成物およびその用途 |
JP2013075948A (ja) * | 2011-09-29 | 2013-04-25 | Sekisui Chem Co Ltd | 硬化物の製造方法、硬化物及び多層基板 |
JP6277595B2 (ja) * | 2013-03-28 | 2018-02-14 | Dic株式会社 | 硬化性組成物、硬化物、及びプリント配線基板 |
JP6705312B2 (ja) * | 2016-07-01 | 2020-06-03 | 味の素株式会社 | 樹脂組成物 |
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- 2020-06-23 JP JP2021527658A patent/JPWO2020262405A1/ja active Pending
- 2020-06-23 WO PCT/JP2020/024665 patent/WO2020262405A1/ja active Application Filing
- 2020-06-24 TW TW109121558A patent/TW202110930A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107207703A (zh) * | 2014-12-15 | 2017-09-26 | Dic株式会社 | 热固性树脂组合物、其固化物、及其中使用的活性酯树脂 |
CN107708999A (zh) * | 2015-08-25 | 2018-02-16 | 三井金属矿业株式会社 | 带树脂层的金属箔、覆金属层叠板和印刷电路板的制造方法 |
CN107236253A (zh) * | 2016-03-29 | 2017-10-10 | 味之素株式会社 | 树脂片 |
JP2018145409A (ja) * | 2017-03-03 | 2018-09-20 | 味の素株式会社 | 樹脂組成物 |
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JPWO2020262405A1 (ja) | 2020-12-30 |
KR20220024430A (ko) | 2022-03-03 |
TW202110930A (zh) | 2021-03-16 |
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