CN114035020A - Back board circuit detection device and method - Google Patents
Back board circuit detection device and method Download PDFInfo
- Publication number
- CN114035020A CN114035020A CN202111154804.3A CN202111154804A CN114035020A CN 114035020 A CN114035020 A CN 114035020A CN 202111154804 A CN202111154804 A CN 202111154804A CN 114035020 A CN114035020 A CN 114035020A
- Authority
- CN
- China
- Prior art keywords
- circuit
- probe
- voltage
- detection
- back plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
Abstract
The invention relates to a backboard circuit detection device and a backboard circuit detection method. The backplane circuit detection device comprises: the needle inserting module is used for placing the back plate and performing driving connection and detection connection on a circuit on the back plate through probes, the probes are arranged in an array mode, and the position of the back plate in the first plane is adjustable; and the detection module is connected with the probe, drives the circuit on the back plate, detects the driven circuit and acquires the real-time voltage of the local position during detection. The three-dimensional position adjustment is realized, so that the probe can be conveniently adjusted to any position of the backboard circuit to be detected, the adjustment process is relatively simple, the operability is strong, and the damage to the backboard circuit can be effectively avoided; the real-time voltage of the circuit is acquired during detection, the state of the local position of the circuit is judged according to the real-time voltage, functional abnormal points can be found easily, compared with current acquisition judgment, the acquisition result accuracy is high, requirements on circuit load driving and the like are low in relative ratio, and the applicability is high.
Description
Technical Field
The invention relates to the technical field of circuit board detection, in particular to a backboard circuit detection device and a backboard circuit detection method.
Background
In contrast to LEDs, Micro LEDs are actually implemented by making the light emitting units of the LEDs thin-film, miniaturized, and arrayed, so that each unit is smaller than 100 microns, and as with OLEDs, each pixel can be addressed individually and driven to emit light individually. As an emerging display technology, Micro LEDs are similar to OLEDs, but have a longer screen life than OLEDs, while the response speed can reach the nanosecond level, faster than OLEDs. Moreover, Micro LEDs have many advantages such as high brightness, low power consumption, and ultra-high resolution.
However, in the development process of the Micro LED, there are still many technical challenges of chip preparation, good product sorting, bulk transfer, package heat dissipation, integrated driving, and the like, and these problems not only increase the production cost of the Micro LED, but also hinder the appearance and application of the commercial product. Although the current backplane technology is mature, the backplane electrical property inevitably changes through the UBM process, bulk transfer, glue sealing, QDCF and other processes, resulting in some poor display. The electrical performance of the backplane circuit needs to be detected, but the existing backplane circuit detection is generally based on weak current, the detection conditions are harsh, the detection cost is high, and the existing backplane circuit detection is generally a special design.
Therefore, how to find a backplane circuit detection technology with high detection efficiency and wide application range is a technical problem which needs to be solved urgently at present.
Disclosure of Invention
In view of the foregoing defects in the prior art, an object of the present application is to provide a backplane circuit detection technical solution, which aims to solve the technical problems of low detection efficiency and narrow application range of the existing backplane circuit detection technical solution.
A backplane circuit detection apparatus, comprising:
the needle inserting module is used for placing the back plate and performing driving connection and detection connection on a circuit on the back plate through probes, the probes are arranged in an array mode, and the position of the back plate in a first plane is adjustable; and
and the detection module is connected with the probe, drives the circuit on the back plate, detects the driven circuit and acquires the real-time voltage of a local position during detection.
According to the backboard circuit detection device, in the detection module, the plurality of probes are arranged in an array, and the position of the backboard in the first plane is adjustable, so that the backboard is convenient to adjust in position during detection and strong in operability; the detection module only collects the real-time voltage of the local position of the circuit and judges the state of the circuit according to the real-time voltage, compared with current collection and judgment, the detection module has the advantages of strong collection result accuracy, lower requirements on circuit load driving and the like, and stronger applicability.
Optionally, the insertion module comprises:
a base;
the backboard placing and adjusting unit is arranged on the base and used for placing the backboard and adjusting the position of the backboard in the first plane;
a probe unit including a plurality of the probes; and
the probe adjusting unit is used for adjusting the position of the probe unit in a first direction, driving the probe to be close to the back plate and electrically connected with a circuit on the back plate;
wherein the first direction is perpendicular to the first plane.
Among the above-mentioned backplate circuit detection device, place the regulating element through the backplate and adjust the position of backplate in the primary importance and through the probe regulating element to the position control of probe unit on the first direction, based on three-dimensional position control for the probe can conveniently be adjusted the optional position of the backplate circuit that needs detect, and accommodation process is simple relatively, and maneuverability is strong, can also effectively avoid the damage to backplate circuit.
Optionally, the base has an upper surface and a lower surface which are oppositely arranged, and the first plane is parallel to the upper surface of the base; the back plate placing and adjusting unit comprises a fine adjustment sliding table and a supporting platform deck, the fine adjustment sliding table is arranged on the base, the supporting platform deck is arranged on the fine adjustment sliding table, and the position of the supporting platform deck in the first plane is adjusted through the fine adjustment sliding table.
Optionally, the probe unit includes a lower pressing plate, a probe board and the probes, the probes are disposed on the probe board, and the probe board is disposed on the lower pressing plate.
Optionally, the probe adjusting unit comprises a side plate structure, a driving structure and a supporting and guiding structure; the side plate structure is arranged on the base and is positioned above the back plate placing and adjusting unit in the first direction; the driving structure is arranged on the side plate structure and drives the probe unit to move towards the back plate placing and adjusting unit along the first direction; the supporting and guiding structure is arranged along the first direction, one end of the supporting and guiding structure is arranged on the base, and the other end of the supporting and guiding structure is arranged on the side plate structure; the probe unit is arranged on the supporting and guiding structure and can slide along the first direction relative to the supporting and guiding structure.
Optionally, the side plate structure at least includes a first side plate, a second side plate and a third side plate, the first side plate and the second side plate are both disposed on the base, the first side plate and the second side plate are disposed opposite to each other, one end of the third side plate is disposed at one end of the first side plate away from the base along the first direction, and the other end of the third side plate is disposed at one end of the second side plate away from the base along the first direction.
Optionally, the driving structure comprises a first bearing seat, a second bearing seat, a transmission shaft, a pressure plate and a handle; the first bearing seat is arranged on the first side plate, the second bearing seat is arranged on the second side plate, and the first bearing seat and the second bearing seat are oppositely arranged along a second direction; one end of the transmission shaft is arranged on the first bearing seat, the other end of the transmission shaft penetrates through the second bearing seat and the second side plate and then is connected with the handle, the pressing plate is arranged in a matched manner with the transmission shaft, so that the rotation of the transmission shaft can drive the pressing plate to linearly move in the first direction, and when the pressing plate moves in the first direction close to the backboard placing and adjusting unit, the pressing plate can abut against the lower pressing plate to drive the lower pressing plate to be close to the backboard placing and adjusting unit; wherein the second direction is parallel to the first plane.
Optionally, a pulley is disposed at one end of the pressing plate close to the backboard along the first direction.
Optionally, the supporting and guiding structure includes N supporting and guiding substructures, where N is an integer greater than or equal to 3, the supporting and guiding substructures include a guide pillar, a first spring, and a second spring, the guide pillar is disposed along the first direction, one end of the guide pillar is disposed on the base, and the other end of the guide pillar is disposed on the third side plate; the lower pressing plate is provided with N guide holes penetrating through the lower pressing plate along the first direction, N supporting guide substructures and N guide holes in the lower pressing plate are arranged in a one-to-one corresponding matching mode, the lower pressing plate is provided with an upper surface and a lower surface which are oppositely arranged along the first direction, in each supporting guide substructure, the guide pillar penetrates through the guide holes, the first spring sleeve and the second spring are respectively sleeved on the guide pillar, one end of the first spring is abutted against the third side plate, the other end of the first spring is abutted against the upper surface of the lower pressing plate, one end of the second spring is abutted against the base, and the other end of the second spring is abutted against the lower surface of the lower pressing plate.
Optionally, the lower pressing plate is further provided with N guide sleeves, the N guide sleeves correspond to the N guide holes one by one and are arranged on the same central axis, in each support guide substructure, the guide post simultaneously penetrates through the guide hole and the guide sleeve, the inner diameter of each guide sleeve is larger than that of each guide hole, and one of the first spring and the second spring also penetrates through the guide sleeve.
Optionally, the pricking module further comprises a microscope, the microscope is arranged on the third side plate, and the microscope is connected with a display device through a wire harness.
Optionally, the detection module includes a first driving unit, a second driving unit and a voltage detection unit, and the probe includes a first probe, a second probe and a third probe; the first driving unit is electrically connected to a circuit on the back plate through the first probe to provide working voltage for the circuit; the second driving unit is electrically connected to a circuit on the back plate through the second probe to provide detection voltage for the circuit; the voltage detection unit is electrically connected to the circuit on the back plate through the third probe so as to detect the real-time voltage of the local position of the circuit.
Optionally, the first driving unit includes a switch button, the switch button controls an on/off state of the operating voltage, and the switch button is disposed on the base.
Optionally, the operating voltage at least includes a positive power voltage, a ground, a reference voltage, an initial voltage, and a data voltage, and the detection voltage at least includes a first driving voltage, a second driving voltage, and a third driving voltage.
Optionally, the detection voltage has at least two different states, and when the circuit is detected, the voltage detection unit respectively collects and detects real-time voltages of local positions of the circuit in two or more different states of the detection voltage.
Based on the same inventive concept, the present application further provides a backplane circuit detection method, including:
providing the back plate, wherein a circuit is arranged on the back plate;
according to the structure of the circuit, providing a working voltage and a detection voltage for the circuit;
changing the state of the detection voltage, adjusting the local on-off state of the circuit, and detecting the real-time voltage of the local position of the circuit in a corresponding state;
for the real-time voltage detected in each state, judging whether a function abnormal point exists in the local position of the circuit according to the real-time voltage; and
and analyzing by combining the judgment results of the local positions of the circuit in at least two different states, and judging whether the circuit has the function abnormal point.
According to the backboard circuit detection method, the real-time voltage in the on-off (power-on) state of the local position of the circuit is acquired, the state of the local position of the circuit is judged according to the real-time voltage, and the state of the whole circuit is judged by combining the judgment results of the plurality of local positions, so that the function abnormal point can be easily found and can be positioned.
Optionally, the detection voltage may control a local position of the circuit to be turned on, the detection voltage has two or more different states, and the local positions of the circuit where the detection voltages in the different states are turned on are different correspondingly.
Optionally, when detecting the real-time voltage of the local position of the circuit, the real-time voltage is collected for at least one point of the local position of the circuit.
Optionally, the step of determining, for the real-time voltage detected in each of the states, whether a functional abnormal point exists in the circuit local area according to the real-time voltage includes:
and comparing the real-time voltage with the corresponding theoretical voltage aiming at each real-time voltage, wherein if the real-time voltage is equal to the theoretical voltage, the function abnormal point does not exist on the corresponding branch, and otherwise, the function abnormal point exists.
Optionally, the specific location of the functional anomaly point can be determined by cross-analysis of two or more of the branches.
Optionally, the operating voltage is applied to the circuit through a first probe, the detection voltage is applied to the circuit through a second probe, and the real-time voltage is acquired from the circuit through a third probe.
Drawings
Fig. 1-4 are schematic structural views of a needle insertion module of a back plate circuit detection device according to an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating a step of a method for detecting a backplane circuit according to an embodiment of the present invention;
FIG. 6 is a pixel circuit diagram of a backplane circuit according to an embodiment of the present invention;
FIG. 7 is a timing diagram of the detection voltage according to an embodiment of the present invention;
fig. 8-9 are schematic views of partial conduction of a backplane circuit according to an embodiment of the present invention.
Description of reference numerals:
1-a base; 2-a back plate placement adjustment unit; 21-fine tuning the sliding table; 22-supporting the carrier; 3-a probe unit; 31-a lower press plate; 311-guide sleeves; 3A-a pilot hole; 32-a probe card; 33-a probe; 4-a probe modulation unit; 41-side plate structure; 42-a drive structure; 43-supporting a guide structure; 411-a first side panel; 412-a second side panel; 413-a third side plate; 421-a first bearing seat; 422-second bearing seat; 423-a drive shaft; 424-platen; 425-a handle; 431-guide column; 432-a first spring; 433-a second spring; 5-a back plate; 6-a microscope; 7-switch button; T1-T7-MOS tube; a Q-light emitting device; c1-sample-and-hold capacitance; VDD-positive power supply; VSS-ground; vref-reference voltage; vinit-initial voltage; vdata-data voltage; gate — first drive voltage; reset-second drive voltage; EM-third drive voltage.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
After the backplane circuit is subjected to multiple processes, the electrical performance of the backplane circuit needs to be detected, and the inventor researches and finds that the existing detection technology still has many problems: the existing backboard circuit detection is generally based on weak current, the requirement on the load driving capability of the circuit is high, the detection condition is harsh, and the detection cost is high; the detection technical scheme is generally a special design, a specific detection device and a detection method need to be formulated for a specific circuit, and the detection device and the detection method have poor transportability and no general popularization capability.
Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.
The invention provides a backboard circuit detection device, which comprises:
the needle inserting module is used for placing the back plate and performing driving connection and detection connection on a circuit on the back plate through probes, the probes are arranged in an array mode, and the position of the back plate in the first plane is adjustable; and
and the detection module is connected with the probe, drives the circuit on the back plate, detects the driven circuit and acquires the real-time voltage of the local position during detection.
In an alternative embodiment of the present invention, as shown in fig. 1, the needle insertion module includes:
a base 1;
the backboard placing and adjusting unit 2 is arranged on the base 1 and used for placing the backboard 5 and adjusting the position of the backboard 5 in the first plane;
a probe unit 3 including a plurality of probes; and
the probe adjusting unit 4 is used for adjusting the position of the probe unit 3 in the first direction, driving the probe to be close to the back plate and electrically connected with a circuit on the back plate;
the first direction is a Z-axis direction, the first plane is an XY plane, and the first direction is perpendicular to the first plane.
In detail, as shown in fig. 1 and 2, the base 1 has an upper surface and a lower surface which are oppositely arranged, and the first plane is parallel to the upper surface of the base 1; the backboard placing and adjusting unit 2 comprises a fine adjustment sliding table 21 and a support carrier 22, the fine adjustment sliding table 21 is arranged on the base 1, the support carrier 22 is arranged on the fine adjustment sliding table 21, the position of the support carrier 22 in the first plane is adjusted through the fine adjustment sliding table 21, and then the position of the backboard 5 placed on the support carrier 22 in the first plane is adjusted.
In detail, as shown in fig. 1 and 2, the probe unit 3 includes a lower pressing plate 31, a probe card 32, and probes 33, wherein the probes 33 are arranged on the probe card 32 in an array, and the probe card 32 is arranged on the lower pressing plate 31. The plurality of probes 33 are arranged in an array on the probe card 32, have a precision of the order of μm, and are suitable for various high-resolution back plate detections.
In detail, as shown in fig. 1 and 2, the probe adjusting unit 4 includes a side plate structure 41, a driving structure 42, and a supporting guide structure 43; the side plate structure 41 is arranged on the base 1 and is positioned above the backboard placing and adjusting unit 2 in the first direction; the driving structure 42 is arranged on the side plate structure 41, and the driving structure 42 drives the probe unit 3 to move towards the back plate placing and adjusting unit 2 along the first direction; the supporting and guiding structure 43 is arranged along the first direction, one end of the supporting and guiding structure is arranged on the base 1, and the other end of the supporting and guiding structure is arranged on the side plate structure 41; the probe unit 3 is disposed on the support guide structure 43, and the probe unit 3 can slide along the first direction relative to the support guide structure 43.
In more detail, as shown in fig. 1 and fig. 2, the side plate structure 41 at least includes a first side plate 411, a second side plate 412 and a third side plate 413, the first side plate 411 and the second side plate 412 are both disposed on the base 1, the first side plate 411 and the second side plate 412 are disposed opposite to each other, one end of the third side plate 413 is disposed on one end of the first side plate 411 away from the base 1 along the first direction, and the other end of the third side plate 413 is disposed on one end of the second side plate 412 away from the base 1 along the first direction.
In more detail, as shown in fig. 1 and 2, the driving structure 42 includes a first bearing seat 421, a second bearing seat 422, a transmission shaft 423, a pressing plate 424 and a handle 425; the first bearing seat 421 is disposed on the first side plate 411, the second bearing seat 422 is disposed on the second side plate 412, and the first bearing seat 421 and the second bearing seat 422 are disposed opposite to each other along the second direction; one end of the transmission shaft 423 is arranged on the first bearing seat 421, the other end of the transmission shaft 423 penetrates through the second bearing seat 422 and the second side plate 412 and then is connected with the handle 425, the pressing plate 424 is arranged in a matching manner with the transmission shaft 423, so that the rotation of the transmission shaft 423 can drive the pressing plate 424 to move linearly in the first direction, and when the pressing plate 424 moves in the first direction close to the backboard placing adjusting unit 2, the pressing plate can abut against the lower pressing plate 31 to drive the lower pressing plate 31 to place the adjusting unit 2 close to the backboard; wherein the second direction (e.g., the X-axis direction) is parallel to the first plane.
Further, as shown in fig. 1 and 2, a pulley is disposed at an end of the pressing plate 424 close to the backboard placing adjusting unit 2 along the first direction, and the pressing plate 31 is elastically pressed by the pulley.
In more detail, as shown in fig. 1 and 2, the supporting and guiding structure 43 includes 4 supporting and guiding sub-structures, each of the supporting and guiding sub-structures includes a guide post 431, a first spring 432 and a second spring 433, the guide post 431 is disposed along the first direction, one end of the guide post 431 is disposed on the base 1, and the other end of the guide post 431 is disposed on the third side plate 413; the lower pressing plate 31 is provided with 4 guide holes 3A penetrating through the lower pressing plate 31 along the first direction, 4 support guide substructures are arranged in a one-to-one corresponding manner with the 4 guide holes 31 on the lower pressing plate 31, the lower pressing plate 31 is provided with an upper surface and a lower surface which are oppositely arranged along the first direction, in each support guide substructure, a guide pillar 431 penetrates through the guide holes 3A, a first spring 432 and a second spring 433 are respectively sleeved on the guide pillar 431, one end of the first spring 432 abuts against the third side plate 413, the other end of the first spring 432 abuts against the upper surface of the lower pressing plate 31, one end of the second spring 433 abuts against the base 1, and the other end of the second spring 433 abuts against the lower surface of the lower pressing plate 31.
More specifically, as shown in fig. 1 and 2, 4 guide sleeves 311 are further disposed on the lower press plate 31, the 4 guide sleeves 311 are one-to-one corresponding to the 4 guide holes 3A and are disposed on the same central axis, in each support guide substructure, the guide post 431 simultaneously passes through the guide holes 3A and the guide sleeves 311, the inner diameter of the guide sleeve 311 is greater than the inner diameter of the guide hole 3A, and one of the first spring 432 and the second spring 433 also passes through the guide sleeve 311.
It is understood that the number of the supporting guide substructures in the supporting guide structure 43 is not limited to 4 shown in fig. 1-2, and the supporting guide structure 43 may also include other numbers of supporting guide substructures, such as 3, 5, etc., as long as the supporting guide structure 43 can ensure balanced support of the probe unit 3, i.e., the supporting guide structure 43 may include N supporting guide substructures, where N is an integer greater than or equal to 3. Correspondingly, the lower pressing plate 31 is further provided with N guide holes 3A and N guide sleeves 311, and the N guide sleeves 311 correspond to the N guide holes 3A one by one and are arranged on the same central axis.
In more detail, as shown in fig. 1 and 2, the pricking module further includes a microscope 6, the microscope 6 is disposed on the third side plate 413, and the microscope 6 is connected to the display device through a wire harness. The back plate 5 and the circuitry thereon can be observed by means of a microscope 6.
In detail, as shown in fig. 3-4, during detection, the back plate 5 is placed on the supporting stage 22, the relative positions of the supporting stage 22 and the back plate 5 in the first plane (i.e., XY plane) are adjusted by the fine adjustment sliding table 21, after the circuit to be detected is aligned with the probe array in the probe unit 3, the handle 425 is shaken to press down the probe array until part of the probes 33 make ohmic contact with the electrodes of the circuit on the back plate 5, and the driving connection and the detection connection of the probes 33 and the circuit are completed.
In detail, the detecting module includes a first driving unit, a second driving unit and a voltage detecting unit (not shown in the figure), and the probe 33 further includes a first probe, a second probe and a third probe (not shown in the figure); the first driving unit is electrically connected to a circuit on the back plate 5 through a first probe to provide working voltage for the circuit; the second driving unit is electrically connected to a circuit on the back plate 5 through a second probe to provide detection voltage for the circuit; the voltage detection unit is electrically connected to the circuit on the back plate 5 through a third probe to detect the real-time voltage of the local position of the circuit.
In more detail, the first driving unit includes a switch button 7, the switch button 7 controls an on-off state of the operating voltage, and the switch button 7 is provided on the base 1, as shown in fig. 1 to 4. The working voltage at least comprises a positive power supply voltage, a ground, a reference voltage, an initial voltage and a data voltage, and the detection voltage at least comprises a first driving voltage, a second driving voltage and a third driving voltage.
More specifically, the detection voltage has at least two different states, and when the circuit is detected, the voltage detection unit respectively collects the real-time voltages of the local positions of the detection circuit in two or more different states of the detection voltage, and judges the state of the circuit according to the real-time voltages: the method comprises the steps of firstly driving a circuit part, collecting real-time voltages of a plurality of points of the local circuit, judging whether the local circuit has a function abnormal point or not according to the real-time voltages, and then comprehensively judging by combining the states of the local circuits collected under two or more states.
Based on the above backplane circuit detection device, the present invention further provides a backplane circuit detection method, as shown in fig. 5, which includes:
s1, providing a back plate, wherein a circuit is arranged on the back plate;
s2, providing working voltage and detection voltage for the circuit according to the structure of the circuit;
s3, changing the state of the detection voltage, adjusting the local on-off state of the circuit, and detecting the real-time voltage of the local position of the circuit in the corresponding state;
s4, judging whether a function abnormal point exists in the local position of the circuit according to the real-time voltage detected in each state; and
and S5, analyzing by combining the judgment results of the local positions of the circuit in at least two different states, and judging whether a function abnormal point exists in the circuit.
In step S2, the operating voltage at least includes positive power voltage, ground, reference voltage, initial voltage, data voltage, etc., the detection voltage can control the local position of the circuit to be turned on, the detection voltage has two or more different states, and the detection voltages in different states correspond to different local positions of the circuit to be turned on, thereby covering the whole circuit to be turned on.
In step S3, when the real-time voltage at the local position of the circuit is detected, the real-time voltage is acquired at least at one point of the local position of the circuit.
Specifically, the working voltage is applied to the circuit through the first probe, the detection voltage is applied to the circuit through the second probe, and the real-time voltage is acquired from the circuit through the third probe.
In detail, the step S3 of determining whether a functional anomaly point exists in the circuit-location according to the real-time voltage for the real-time voltage detected in each state further includes: comparing the real-time voltage with the corresponding theoretical voltage according to each real-time voltage, wherein if the real-time voltage is equal to the theoretical voltage, a functional abnormal point does not exist on the corresponding branch, and otherwise, the functional abnormal point exists; and the position or the approximate range of the function abnormal point can be further determined according to the real-time voltages of the front stage and the rear stage of the abnormal point and the corresponding theoretical voltage, if the specific position of the function abnormal point cannot be determined through a single branch, the detection results of two or more branches can be subjected to cross analysis, and the specific position of the function abnormal point can be determined.
In an alternative embodiment of the invention, for the pixel circuit shown in fig. 6, T1 to T7 are MOS transistors, Q is a light emitting device to be driven, C1 is a sample-and-hold capacitor, VDD is a positive power supply, VSS is ground, Vref is a reference voltage, Vinit is an initial voltage, and Vdata is a data voltage. Gate is the first driving voltage, Reset is the second driving voltage, and EM is the third driving voltage.
Before the pixel circuit is detected, a plurality of first probes are in ohmic contact with electrodes of each working voltage on the pixel circuit through the driving of the pricking structure, then the switch button 7 is turned on, and a plurality of working voltages (positive power supply VDD, ground VSS, reference voltage Vref, initial voltage Vinit, data voltage Vdata) are applied to the pixel circuit through the first probes. Then, the plurality of second probes are first in ohmic contact with the gates of the plurality of PMOS transistors on the pixel circuit by driving of the pinning structure, and a plurality of detection voltages (a first driving voltage Gate, a second driving voltage Reset, and a third driving voltage EM) are applied to the pixel circuit through the second probes, and a timing chart corresponding to the detection voltages is shown in fig. 7.
When the pixel circuit is detected, the real-time voltages of the local position of the pixel circuit under different detection voltage states are respectively collected and compared with the corresponding theoretical voltage, and then whether the pixel circuit has a function abnormal point is judged:
(1) at time T1, as shown in fig. 8, the third driving voltage EM is high, the first driving voltage Gate and the second driving voltage Reset are both low, the MOS transistors T1, T2, T4, and T7 are theoretically turned on, the MOS transistors T3 and T5 are theoretically turned off, at this time, real-time voltages at the drain terminals of the MOS transistors T1 and T4 are collected, if the real-time voltages are VDD and VDD + Vth, respectively, and Vth is the turn-on voltage of the MOS transistors, the real-time voltages are equal to the corresponding theoretical voltages, which indicates that the electrical properties of the MOS transistors T1, T2, T3, T4, and T7 are normal, and if the real-time voltages are not VDD and VDD + Vth, the pixel circuit is abnormal;
(2) at time T2, as shown in fig. 9, the first driving voltage Gate and the third driving voltage EM are both low level, the second driving voltage Reset is high level, the MOS transistors T2, T4, T5, and T6 are theoretically turned on, and the MOS transistors T1 and T7 are theoretically turned off, at this time, the source voltage of the MOS transistor T5 and the anode voltage of the light emitting device Q are collected, and if the voltages are Vref and VDD respectively, the voltages are equal to the corresponding theoretical voltages, and it can be determined that the electrical characteristics of the MOS transistors T2, T4, T5, and T6 are normal, otherwise, the voltages are abnormal.
Therefore, through detection and test at two moments, whether the electrical property of each component in the pixel circuit is normal or not is verified respectively, and whether the function of the pixel circuit is normal or not can be judged.
Note that the light emitting device Q is a Micro LED.
In summary, in the device and the method for detecting the backplane circuit provided by the present invention, the position of the backplane in the first plane is adjusted by the backplane placement adjustment unit and the position of the probe unit in the first direction is adjusted by the probe adjustment unit, based on the three-dimensional position adjustment, the probe can be conveniently adjusted to any position of the backplane circuit to be detected, the adjustment process is relatively simple, the operability is strong, and the damage to the backplane circuit can be effectively avoided; meanwhile, real-time voltage in a circuit local position conducting state is acquired during detection, the state of the local position of the circuit is judged according to the real-time voltage, and the state of the whole circuit is judged by combining judgment results of a plurality of local positions, so that functional abnormal points can be found easily and can be positioned.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (15)
1. A backplane circuit detection apparatus, comprising:
the needle inserting module is used for placing the back plate and performing driving connection and detection connection on a circuit on the back plate through probes, the probes are arranged in an array mode, and the position of the back plate in a first plane is adjustable; and
and the detection module is connected with the probe, drives the circuit on the back plate, detects the driven circuit and acquires the real-time voltage of a local position during detection.
2. The backplane circuit detection device of claim 1, wherein the needle module comprises:
a base;
the backboard placing and adjusting unit is arranged on the base and used for placing the backboard and adjusting the position of the backboard in the first plane;
a probe unit including a plurality of the probes; and
the probe adjusting unit is used for adjusting the position of the probe unit in a first direction, driving the probe to be close to the back plate and electrically connected with a circuit on the back plate;
wherein the first direction is perpendicular to the first plane.
3. The backplane circuit detection apparatus of claim 2, wherein the base has an upper surface and a lower surface disposed opposite to each other, the first plane being parallel to the upper surface of the base; the back plate placing and adjusting unit comprises a fine adjustment sliding table and a supporting platform deck, the fine adjustment sliding table is arranged on the base, the supporting platform deck is arranged on the fine adjustment sliding table, and the position of the supporting platform deck in the first plane is adjusted through the fine adjustment sliding table.
4. The back plate circuit testing apparatus of claim 3, wherein the probe unit comprises a lower pressing plate, a probe card and the probes, a plurality of the probes are disposed on the probe card, and the probe card is disposed on the lower pressing plate.
5. The backplane circuit detection apparatus of claim 4, wherein the probe adjustment unit comprises a side plate structure, a driving structure, and a support guide structure; the side plate structure is arranged on the base and is positioned above the back plate placing and adjusting unit in the first direction; the driving structure is arranged on the side plate structure and drives the probe unit to move towards the back plate placing and adjusting unit along the first direction; the supporting and guiding structure is arranged along the first direction, one end of the supporting and guiding structure is arranged on the base, and the other end of the supporting and guiding structure is arranged on the side plate structure; the probe unit is arranged on the supporting and guiding structure and can slide along the first direction relative to the supporting and guiding structure.
6. The backplane circuit detection apparatus of claim 5, wherein the side board structure comprises at least a first side board, a second side board, and a third side board, the first side board and the second side board are both disposed on the base, and the first side board and the second side board are disposed opposite to each other, one end of the third side board is disposed on an end of the first side board away from the base along the first direction, and the other end of the third side board is disposed on an end of the second side board away from the base along the first direction.
7. The backplane circuit detection apparatus of claim 6, wherein the driving structure comprises a first bearing block, a second bearing block, a transmission shaft, a pressure plate, and a handle; the first bearing seat is arranged on the first side plate, the second bearing seat is arranged on the second side plate, and the first bearing seat and the second bearing seat are oppositely arranged along a second direction; one end of the transmission shaft is arranged on the first bearing seat, the other end of the transmission shaft penetrates through the second bearing seat and the second side plate and then is connected with the handle, the pressing plate is arranged in a matched manner with the transmission shaft, so that the rotation of the transmission shaft can drive the pressing plate to linearly move in the first direction, and when the pressing plate moves in the first direction close to the backboard placing and adjusting unit, the pressing plate can abut against the lower pressing plate to drive the lower pressing plate to be close to the backboard placing and adjusting unit; wherein the second direction is parallel to the first plane.
8. The backplane circuit testing apparatus of claim 7, wherein the pressing plate has a pulley at an end thereof adjacent to the backplane placing the adjusting unit in the first direction.
9. The backplane circuit detection device according to claim 7, wherein the supporting and guiding structure comprises N supporting and guiding substructures, N being an integer greater than or equal to 3, the supporting and guiding substructures comprising a guide post, a first spring, and a second spring, the guide post being disposed along the first direction, one end of the guide post being disposed on the base, and the other end of the guide post being disposed on the third side plate; the lower pressing plate is provided with N guide holes penetrating through the lower pressing plate along the first direction, N supporting guide substructures and N guide holes in the lower pressing plate are arranged in a one-to-one corresponding matching mode, the lower pressing plate is provided with an upper surface and a lower surface which are oppositely arranged along the first direction, in each supporting guide substructure, the guide pillar penetrates through the guide holes, the first spring sleeve and the second spring are respectively sleeved on the guide pillar, one end of the first spring is abutted against the third side plate, the other end of the first spring is abutted against the upper surface of the lower pressing plate, one end of the second spring is abutted against the base, and the other end of the second spring is abutted against the lower surface of the lower pressing plate.
10. The apparatus as claimed in claim 9, wherein the lower pressing plate further has N guide sleeves, the N guide sleeves are disposed in one-to-one correspondence with the N guide holes and are disposed along a central axis, in each of the supporting and guiding substructures, the guide post passes through the guide hole and the guide sleeve simultaneously, an inner diameter of the guide sleeve is larger than an inner diameter of the guide hole, and one of the first spring and the second spring also passes through the guide sleeve.
11. The backplane circuit detection apparatus of claim 10, wherein the needle insertion module further comprises a microscope, the microscope is disposed on the third side plate, and the microscope is connected to a display device through a wire harness.
12. The apparatus of claim 11, wherein the test module comprises a first driving unit, a second driving unit and a voltage testing unit, and the probes comprise a first probe, a second probe and a third probe; the first driving unit is electrically connected to a circuit on the back plate through the first probe to provide working voltage for the circuit; the second driving unit is electrically connected to a circuit on the back plate through the second probe to provide detection voltage for the circuit; the voltage detection unit is electrically connected to the circuit on the back plate through the third probe so as to detect the real-time voltage of the local position of the circuit.
13. The backplane circuit detection device according to claim 12, wherein the first driving unit comprises a switch button that controls an on/off state of the operating voltage, and the switch button is disposed on the base.
14. The backplane circuit detection device of claim 13, wherein the detection voltage has at least two different states, and the voltage detection unit respectively collects real-time voltages for detecting local positions of the circuit in the two or more different states of the detection voltage when the circuit is detected.
15. A method for detecting a backplane circuit, comprising:
providing the back plate, wherein a circuit is arranged on the back plate;
according to the structure of the circuit, providing a working voltage and a detection voltage for the circuit;
changing the state of the detection voltage, adjusting the local on-off state of the circuit, and detecting the real-time voltage of the local position of the circuit in a corresponding state;
for the real-time voltage detected in each state, judging whether a function abnormal point exists in the local position of the circuit according to the real-time voltage; and
and analyzing by combining the judgment results of the local positions of the circuit in at least two different states, and judging whether the circuit has the function abnormal point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111154804.3A CN114035020A (en) | 2021-09-29 | 2021-09-29 | Back board circuit detection device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111154804.3A CN114035020A (en) | 2021-09-29 | 2021-09-29 | Back board circuit detection device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114035020A true CN114035020A (en) | 2022-02-11 |
Family
ID=80134532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111154804.3A Pending CN114035020A (en) | 2021-09-29 | 2021-09-29 | Back board circuit detection device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114035020A (en) |
Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004213454A (en) * | 2003-01-07 | 2004-07-29 | Hitachi Ltd | Failure diagnostic method and device of load |
| CN201909917U (en) * | 2010-12-29 | 2011-07-27 | 京东方科技集团股份有限公司 | Test fixture |
| CN104036730A (en) * | 2014-06-12 | 2014-09-10 | 上海和辉光电有限公司 | Pixel test circuit for AMOLED |
| CN104091562A (en) * | 2014-06-27 | 2014-10-08 | 京东方科技集团股份有限公司 | Pixel circuit, display panel and display device |
| CN203895093U (en) * | 2014-05-26 | 2014-10-22 | 京东方科技集团股份有限公司 | Pixel circuit and display device |
| CN204347383U (en) * | 2014-11-21 | 2015-05-20 | 京东方科技集团股份有限公司 | A kind of measurement jig |
| CN105096786A (en) * | 2015-08-19 | 2015-11-25 | 京东方科技集团股份有限公司 | Array detection reliability judgment method, and organic light emitting backplane detection method and device |
| CN106841990A (en) * | 2017-02-16 | 2017-06-13 | 京东方科技集团股份有限公司 | Display screen detection means |
| CN106972737A (en) * | 2017-04-20 | 2017-07-21 | 天索（苏州）控制技术有限公司 | With the MOSFET parallel driver circuits for flowing protection |
| CN107680522A (en) * | 2017-09-30 | 2018-02-09 | 京东方科技集团股份有限公司 | A kind of display panel testing method and its device |
| CN108169577A (en) * | 2018-01-26 | 2018-06-15 | 京东方科技集团股份有限公司 | A kind of capacitance determining method |
| CN109697944A (en) * | 2017-10-20 | 2019-04-30 | 京东方科技集团股份有限公司 | The detection method of pixel circuit, the driving method of display panel and display device |
| CN110361621A (en) * | 2018-04-11 | 2019-10-22 | 佛山市顺德区美的电热电器制造有限公司 | Load detecting circuit and method |
| CN110689840A (en) * | 2019-11-15 | 2020-01-14 | 京东方科技集团股份有限公司 | Pixel circuit, short circuit detection method and display panel |
| CN110827730A (en) * | 2019-11-28 | 2020-02-21 | 京东方科技集团股份有限公司 | Circuit and method for detecting characteristics of transistors in pixel region of LTPSAMOLED display substrate |
| CN111179793A (en) * | 2020-01-06 | 2020-05-19 | 京东方科技集团股份有限公司 | Detection method and device for display substrate |
| CN111951733A (en) * | 2020-08-25 | 2020-11-17 | 京东方科技集团股份有限公司 | Pixel driving circuit, driving method thereof, display panel and display device |
| CN111983447A (en) * | 2020-09-01 | 2020-11-24 | 深圳市英威腾电动汽车驱动技术有限公司 | Motor controller and fault detection method and circuit of three-phase bridge arm inverter circuit thereof |
| CN212674982U (en) * | 2021-01-04 | 2021-03-09 | 武汉精毅通电子技术有限公司 | Panel precision crimping jig and testing equipment |
| CN213277403U (en) * | 2020-11-10 | 2021-05-25 | 重庆康佳光电技术研究院有限公司 | Detection circuit of LED display back plate and LED display panel |
| CN113237517A (en) * | 2021-06-07 | 2021-08-10 | 英铂科学仪器(上海)有限公司 | System and device for comprehensively detecting photoelectric characteristics of two sides of chip |
-
2021
- 2021-09-29 CN CN202111154804.3A patent/CN114035020A/en active Pending
Patent Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004213454A (en) * | 2003-01-07 | 2004-07-29 | Hitachi Ltd | Failure diagnostic method and device of load |
| CN201909917U (en) * | 2010-12-29 | 2011-07-27 | 京东方科技集团股份有限公司 | Test fixture |
| CN203895093U (en) * | 2014-05-26 | 2014-10-22 | 京东方科技集团股份有限公司 | Pixel circuit and display device |
| CN104036730A (en) * | 2014-06-12 | 2014-09-10 | 上海和辉光电有限公司 | Pixel test circuit for AMOLED |
| CN104091562A (en) * | 2014-06-27 | 2014-10-08 | 京东方科技集团股份有限公司 | Pixel circuit, display panel and display device |
| CN204347383U (en) * | 2014-11-21 | 2015-05-20 | 京东方科技集团股份有限公司 | A kind of measurement jig |
| CN105096786A (en) * | 2015-08-19 | 2015-11-25 | 京东方科技集团股份有限公司 | Array detection reliability judgment method, and organic light emitting backplane detection method and device |
| CN106841990A (en) * | 2017-02-16 | 2017-06-13 | 京东方科技集团股份有限公司 | Display screen detection means |
| CN106972737A (en) * | 2017-04-20 | 2017-07-21 | 天索（苏州）控制技术有限公司 | With the MOSFET parallel driver circuits for flowing protection |
| CN107680522A (en) * | 2017-09-30 | 2018-02-09 | 京东方科技集团股份有限公司 | A kind of display panel testing method and its device |
| CN109697944A (en) * | 2017-10-20 | 2019-04-30 | 京东方科技集团股份有限公司 | The detection method of pixel circuit, the driving method of display panel and display device |
| CN108169577A (en) * | 2018-01-26 | 2018-06-15 | 京东方科技集团股份有限公司 | A kind of capacitance determining method |
| CN110361621A (en) * | 2018-04-11 | 2019-10-22 | 佛山市顺德区美的电热电器制造有限公司 | Load detecting circuit and method |
| CN110689840A (en) * | 2019-11-15 | 2020-01-14 | 京东方科技集团股份有限公司 | Pixel circuit, short circuit detection method and display panel |
| CN110827730A (en) * | 2019-11-28 | 2020-02-21 | 京东方科技集团股份有限公司 | Circuit and method for detecting characteristics of transistors in pixel region of LTPSAMOLED display substrate |
| CN111179793A (en) * | 2020-01-06 | 2020-05-19 | 京东方科技集团股份有限公司 | Detection method and device for display substrate |
| CN111951733A (en) * | 2020-08-25 | 2020-11-17 | 京东方科技集团股份有限公司 | Pixel driving circuit, driving method thereof, display panel and display device |
| CN111983447A (en) * | 2020-09-01 | 2020-11-24 | 深圳市英威腾电动汽车驱动技术有限公司 | Motor controller and fault detection method and circuit of three-phase bridge arm inverter circuit thereof |
| CN213277403U (en) * | 2020-11-10 | 2021-05-25 | 重庆康佳光电技术研究院有限公司 | Detection circuit of LED display back plate and LED display panel |
| CN212674982U (en) * | 2021-01-04 | 2021-03-09 | 武汉精毅通电子技术有限公司 | Panel precision crimping jig and testing equipment |
| CN113237517A (en) * | 2021-06-07 | 2021-08-10 | 英铂科学仪器(上海)有限公司 | System and device for comprehensively detecting photoelectric characteristics of two sides of chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10962567B2 (en) | Systems and methods for electrical inspection of flat panel displays using cell contact probing pads | |
| US7397266B2 (en) | System and method for testing the electromagnetic susceptibility of an electronic display unit | |
| CN203981380U (en) | The optical characteristic test device of a kind of OLED | |
| US20060061380A1 (en) | Testing flat panel display plates using high frequency AC signals | |
| CN104101744B (en) | Probe clamp, and LED rapid lightening testing apparatus and method | |
| CN109559687B (en) | Display panel | |
| CN101769944B (en) | Micromotion detection device used for detecting LED chip | |
| CN110098248A (en) | Flexible display panels and preparation method thereof, display device | |
| CN102147327A (en) | Method and system for detecting light-emitting diode (LED) | |
| CN114035020A (en) | Back board circuit detection device and method | |
| TWI223097B (en) | Method and apparatus for testing OLED pixels | |
| CN106531038B (en) | The detection method of display device and display panel | |
| CN209842009U (en) | Power panel testing device | |
| US8188760B2 (en) | Curve tracer signal conversion for integrated circuit testing | |
| CN208722547U (en) | Display panel tests circuit and testing device of display panel | |
| JP4369112B2 (en) | Semiconductor device and electronic equipment | |
| KR101007107B1 (en) | Inspecting apparatus for in led module | |
| CN113436562B (en) | Display panel, testing method and display device | |
| CN220251995U (en) | False piezoelectric measuring clamp for touch screen | |
| CN100356416C (en) | Method and system for testing active display technology drive circuit | |
| CN206832950U (en) | Resistance substrate test device | |
| CN218068160U (en) | Detection module and detection tool | |
| CN115376438A (en) | Display substrate, detection equipment, detection method and display device | |
| CN100334459C (en) | Organic luminescent display pixel testing method and apparatus | |
| US6982566B1 (en) | Method and apparatus for operating a burn-in board to achieve lower equilibrium temperature and to minimize thermal runaway |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |