CN114026195A - 含有碱性物质的使用了亲水性高的研磨粒子的研磨用组合物 - Google Patents

含有碱性物质的使用了亲水性高的研磨粒子的研磨用组合物 Download PDF

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Publication number
CN114026195A
CN114026195A CN202080046110.5A CN202080046110A CN114026195A CN 114026195 A CN114026195 A CN 114026195A CN 202080046110 A CN202080046110 A CN 202080046110A CN 114026195 A CN114026195 A CN 114026195A
Authority
CN
China
Prior art keywords
polishing composition
organic compound
polishing
containing organic
basic nitrogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080046110.5A
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English (en)
Chinese (zh)
Inventor
三井滋
石水英一郎
西村透
大森恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Publication of CN114026195A publication Critical patent/CN114026195A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN202080046110.5A 2019-06-27 2020-06-26 含有碱性物质的使用了亲水性高的研磨粒子的研磨用组合物 Pending CN114026195A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019119362 2019-06-27
JP2019-119362 2019-06-27
PCT/JP2020/025284 WO2020262628A1 (ja) 2019-06-27 2020-06-26 塩基性物質を含有する水親和性の高い研磨粒子を用いた研磨用組成物

Publications (1)

Publication Number Publication Date
CN114026195A true CN114026195A (zh) 2022-02-08

Family

ID=74060172

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080046110.5A Pending CN114026195A (zh) 2019-06-27 2020-06-26 含有碱性物质的使用了亲水性高的研磨粒子的研磨用组合物

Country Status (6)

Country Link
US (1) US20220228031A1 (https=)
JP (1) JPWO2020262628A1 (https=)
KR (1) KR20220024083A (https=)
CN (1) CN114026195A (https=)
TW (1) TWI848137B (https=)
WO (1) WO2020262628A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210079263A1 (en) * 2019-09-17 2021-03-18 Fujimi Incorporated High molecular weight polyvinyl pyrrolidone for low-k removal rate suppresion
CN112978735B (zh) * 2021-02-04 2022-04-12 石家庄优士科电子科技有限公司 一种二氧化硅胶粒及包含其的分散液和制备方法
CN113500516A (zh) * 2021-07-13 2021-10-15 西安奕斯伟硅片技术有限公司 一种研磨装置的清洗方法及系统
KR20250060247A (ko) * 2022-09-07 2025-05-07 에이지씨 가부시키가이샤 연마제, 연마제용 첨가액 및 연마 방법
CN121285611A (zh) * 2023-09-27 2026-01-06 日产化学株式会社 保存稳定性优异的研磨用组合物及其制造方法
WO2025069272A1 (ja) * 2023-09-27 2025-04-03 日産化学株式会社 保存安定性に優れた研磨用組成物及びその製造方法
WO2025154728A1 (ja) * 2024-01-19 2025-07-24 富士フイルム株式会社 半導体基板用洗浄液、被対象物の洗浄方法、半導体デバイスの製造方法
WO2025254017A1 (ja) * 2024-06-04 2025-12-11 Ａｇｃ株式会社 研磨剤、研磨剤用添加液、研磨方法、及び、半導体部品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105658757A (zh) * 2013-10-23 2016-06-08 东进世美肯株式会社 金属膜抛光浆料组合物及使用其减少金属膜抛光时产生的划痕的方法
WO2018012174A1 (ja) * 2016-07-15 2018-01-18 株式会社フジミインコーポレーテッド 研磨用組成物、研磨用組成物の製造方法および研磨方法
WO2018116890A1 (ja) * 2016-12-22 2018-06-28 ニッタ・ハース株式会社 研磨用組成物
CN109690741A (zh) * 2016-06-09 2019-04-26 日立化成株式会社 Cmp用研磨液和研磨方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG54606A1 (en) * 1996-12-05 1998-11-16 Fujimi Inc Polishing composition
JP2010161201A (ja) * 2009-01-08 2010-07-22 Jsr Corp 化学機械研磨用水系分散体およびそれを用いた化学機械研磨方法、化学機械研磨用水系分散体の製造方法
JP6506913B2 (ja) 2014-03-31 2019-04-24 ニッタ・ハース株式会社 研磨用組成物及び研磨方法
WO2015200678A1 (en) * 2014-06-25 2015-12-30 Cabot Microelectronics Corporation Colloidal silica chemical-mechanical polishing concentrate
JP2016213216A (ja) * 2015-04-28 2016-12-15 花王株式会社 シリコンウェーハ用研磨液組成物
JP6589622B2 (ja) 2015-12-22 2019-10-16 日立化成株式会社 研磨液、研磨方法、半導体基板及び電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105658757A (zh) * 2013-10-23 2016-06-08 东进世美肯株式会社 金属膜抛光浆料组合物及使用其减少金属膜抛光时产生的划痕的方法
CN109690741A (zh) * 2016-06-09 2019-04-26 日立化成株式会社 Cmp用研磨液和研磨方法
WO2018012174A1 (ja) * 2016-07-15 2018-01-18 株式会社フジミインコーポレーテッド 研磨用組成物、研磨用組成物の製造方法および研磨方法
WO2018116890A1 (ja) * 2016-12-22 2018-06-28 ニッタ・ハース株式会社 研磨用組成物

Also Published As

Publication number Publication date
JPWO2020262628A1 (https=) 2020-12-30
US20220228031A1 (en) 2022-07-21
WO2020262628A1 (ja) 2020-12-30
KR20220024083A (ko) 2022-03-03
TWI848137B (zh) 2024-07-11
TW202129733A (zh) 2021-08-01

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