CN114007401A - 电磁屏蔽膜的制作方法 - Google Patents
电磁屏蔽膜的制作方法 Download PDFInfo
- Publication number
- CN114007401A CN114007401A CN202010740648.8A CN202010740648A CN114007401A CN 114007401 A CN114007401 A CN 114007401A CN 202010740648 A CN202010740648 A CN 202010740648A CN 114007401 A CN114007401 A CN 114007401A
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- layer
- insulating
- mass
- electromagnetic shielding
- ink layer
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Abstract
本发明提供一种电磁屏蔽膜的制作方法,包括:采用导电油墨通过喷墨印刷方式形成导电油墨层;采用绝缘油墨通过喷墨印刷方式在所述导电油墨层上形成绝缘油墨层;以及对所述导电油墨层和所述绝缘油墨层进行烧结形成电磁屏蔽层和绝缘层,以制得所述电磁屏蔽膜。
Description
技术领域
本发明涉及屏蔽材料技术领域,尤其涉及一种电磁屏蔽膜的制作方法。
背景技术
电磁屏蔽性是指能够屏蔽掉外部干扰电磁信号,使电子元件不受其它设备的影响或干扰,是产品质量的重要指标之一。随着人们对网络通讯速度要求的不断提高,智能手机等便携式终端设备对超高频(1Ghz~50Ghz)信号的屏蔽要求越来越高,其屏蔽性通常借助于电子设备中设置的电磁屏蔽膜来实现。
通常,电磁屏蔽膜包括金属层、胶层和保护层,所述金属层为金属箔或为通过溅镀形成的金属膜。该类电磁屏蔽膜制程工艺复杂且制作成本较高。
发明内容
有鉴于此,有必要提供一种能够解决上述技术问题的电磁屏蔽膜的制作方法。
本发明提供一种电磁屏蔽膜的制作方法,包括:采用导电油墨通过喷墨印刷方式形成导电油墨层;采用绝缘油墨通过喷墨印刷方式在所述导电油墨层上形成绝缘油墨层;以及对所述导电油墨层和所述绝缘油墨层进行烧结形成电磁屏蔽层和绝缘层,以制得所述电磁屏蔽膜。
本发明提供的电磁屏蔽膜的制作方法中,通过喷墨印刷方式直接在待屏蔽元件上形成所述电磁屏蔽层和所述绝缘层,其工艺简单且制作成本较低。且制得的所述电磁屏蔽膜,仅包括电磁屏蔽层和绝缘层两层结构,有利于电磁屏蔽膜的薄型化。
附图说明
图1是本发明一实施方式提供的导电油墨层的结构示意图。
图2是在图1所示的导电油墨层上形成绝缘油墨层后的结构示意图。
图3是本申请一实施方式提供的电磁屏蔽膜的结构示意图。
主要元件符号说明
导电油墨层 10
电磁屏蔽层 20
绝缘油墨层 30
绝缘层 40
电磁屏蔽膜 100
微孔 60
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面将结合本发明实施方式中的附图,对本发明实施方式中的技术方案进行清楚、完整地描述,显然,所描述的实施方式仅仅是本发明一部分实施方式,而不是全部的实施方式。基于本发明中的实施方式,本领域普通技术人员在没有付出创造性劳动前提下所获得的所有其他实施方式,都属于本发明保护的范围。
本发明一实施方式提供一种电磁屏蔽膜的制作方法,其包括以下步骤:
S1,采用导电油墨通过喷墨印刷方式形成导电油墨层;
S2,采用绝缘油墨通过喷墨印刷方式在所述导电油墨层上形成绝缘油墨层;以及
S3,对所述导电油墨层和所述绝缘油墨层进行烧结形成电磁屏蔽层和绝缘层,以制得所述电磁屏蔽膜。
请参阅图1,在步骤S1中,采用导电油墨通过喷墨印刷方式形成导电油墨层10。
所述导电油墨包括质量百分数为5~50%的纳米电磁屏蔽粒子、质量百分数为0.1~3%的导向剂、质量百分数为0.1~5%的粘合剂、质量百分数为0.1~5%的抗冻剂、质量百分数为0.1~5%的分散剂、质量百分数为0.1~1%的有机硅表面助剂、质量百分数为0.1~1%的附着力促进剂以及质量百分数为32~95%的溶剂。
所述纳米电磁屏蔽粒子可对待屏蔽元件产生电磁屏蔽效果。本实施方式中,所述纳米电磁屏蔽粒子为金属粒子,所述金属粒子可包括银、铜、金、镍、钯、铬、铂、钴中的一种或多种。在其他实施方式中,所述纳米电磁屏蔽粒子还可包括石墨、碳黑、纳米碳管、纳米碳球、碳纤维、镀镍石墨等。
所述导向剂用于导向所述纳米电磁屏蔽粒子,其可为本领域所熟知的任何适用于导电油墨的导向剂,包括但不限于聚氧乙烷(PEO)-聚氧丙烷(PPO)-聚氧乙烷(PEC)三嵌段共聚物(PEO-PPO-PEO)。本实施方式中,所述导向剂为F127。
所述还原剂用于将金属离子还原为金属原子,其可为本领域所熟知的任何适用于导电油墨的还原剂,包括但不限于:水合肼、硼氢化钠、抗坏血酸、氢碘酸。本实施方式中,所述还原剂为抗坏血酸。
所述粘合剂用于在所述纳米电磁屏蔽粒子之间提供结合力,并使所述导电油墨层10具有粘附力。所述粘合剂可为本领域所熟知的任何适用于导电油墨的粘合剂,包括但不限于:丙烯酸粘合剂、聚乙烯吡咯烷酮粘合剂。本实施方式中,所述粘合剂为聚乙烯吡咯烷酮粘合剂。
所述抗冻剂用于提高所述导电油墨的抗冻性。所述抗冻剂可为本领域所熟知的任何适用于导电油墨的抗冻剂,包括但不限于:硫酸锌、硫酸亚铁、硝酸钙、硝酸镁、褪黑素、季戊四醇、甘油、丙二醇、丙三醇、乙二醇、尿素中。本实施方式中,所述抗冻剂为乙二醇。
所述分散剂有助于所述纳米电磁屏蔽粒子均匀分散于溶剂中。所述分散剂可为本领域所熟知的任何适用于导电油墨的分散剂,包括但不限于:水解聚马来酸酐、聚乙二醇、聚乙烯蜡。本实施方式中,所述分散剂为聚乙二醇。
所述表面张力调整剂用于调整所述导电油墨的表面张力。所述表面张力调整剂可为本领域所熟知的任何适用于导电油墨的表面张力调整剂,包括但不限于:有机硅系添加剂、疏水性单体、疏水性有机溶剂、乙炔二醇、异丙醇。本实施方式中,所述表面张力调整剂为有机硅系添加剂。
所述附着力促进剂用于提高所述导电油墨的粘性。所述附着力促进剂可为本领域所熟知的任何适用于导电油墨的附着力促进剂,包括但不限于:氨基硅烷、环氧磷酸酯。本实施方式中,所述附着力促进剂为环氧磷酸酯。
所述溶剂可为去离子水、乙醇、乙二醇、丙三醇、异丙醇、正丁醇、丁二醇等中的一种或几种。本实施方式中,所述溶剂为正丁醇。
所述导电油墨的粘度为5~30cps,其表面张力为30~50dyn/cm。所述导电油墨适用于进行喷墨印刷。
在步骤S1中,在形成所述导电油墨层的同时,对所述导电油墨层进行干燥。所述绝缘油墨层形成在干燥的导电油墨层上。在其他实施方式中,干燥导电油墨层的步骤还可以在形成导电油墨层的步骤之后进行。
所述导电油墨层可采用红外光照射或紫外光照射进行干燥。干燥温度为150~250℃,干燥时间小于5秒。
请参阅图2,在步骤S2中,采用绝缘油墨通过喷墨印刷方式在所述导电油墨层上形成绝缘油墨层30。
所述绝缘油墨包括质量百分数为3~25%的碳黑、质量百分数为3~15%的热固性树脂、质量百分数为3~15%的柔性树脂、质量百分数为0.5~5%的硬化剂、质量百分数为0.1~1%的表面张力调整剂、质量百分数为0.1~1%的附着力促进剂以及质量百分数为38~91%的溶剂。
所述碳黑用作色膏。在其他实施方式中,还可采用其他色膏。
所述热固性树脂可为本领域所熟知的任意热固性熟知,包括但不限于:环氧树脂、聚酰亚胺、聚氨酯、亚克力、酚醛树脂、硅胶中的一种或多种。本实施方式中,所述热固性树脂为环氧树脂。
所述柔性树脂可为本领域所熟知的任意柔性树脂。本实施方式中,所述柔性树脂为丁腈橡胶。
所述硬化剂可为本领域所熟知的任何硬化剂。本实施方式中,所述硬化剂为咪唑类硬化剂。
所述表面张力调整剂用于调整所述绝缘油墨的表面张力。所述表面张力调整剂可为本领域所熟知的任何适用于绝缘油墨的表面张力调整剂,包括但不限于:有机硅系添加剂、疏水性单体、疏水性有机溶剂、乙炔二醇、异丙醇。本实施方式中,所述表面张力调整剂为有机硅系添加剂。
所述附着力促进剂用于提高所述绝缘油墨的粘性。所述附着力促进剂可为本领域所熟知的任何适用于绝缘油墨的附着力促进剂,包括但不限于:氨基硅烷、环氧磷酸酯。本实施方式中,所述附着力促进剂为环氧磷酸酯。
所述溶剂可为去离子水、乙醇、乙二醇、丙三醇、异丙醇、正丁醇、丁二醇等中的一种或几种。本实施方式中,所述溶剂为乙醇。
在步骤S2中,在形成所述绝缘油墨层的同时,对所述绝缘油墨层进行干燥。所述绝缘油墨层可采用红外光照射或紫外光照射进行干燥。干燥温度为150~250℃,干燥时间小于5秒。在其他实施方式中,干燥绝缘油墨层的步骤还可以在形成绝缘油墨层的步骤之后进行。
请参阅图2和图3,在步骤S3中,对所述导电油墨层10和所述绝缘油墨层30进行烧结形成电磁屏蔽层20和绝缘层40,以制得所述电磁屏蔽膜100。
所述导电油墨层10烧结后形成所述电磁屏蔽层20。烧结温度为150~200℃,烧结时间为30~60分钟。在进行烧结时,所述导电油墨层10中的纳米电磁屏蔽粒子因受热产生连结。
对所述导电油墨层10进行烧结后,所述导电油墨层10中的溶剂挥发形成微孔60,导致烧结后形成的电磁屏蔽层20中具有多个微孔60。该些微孔60有利于水汽散逸,可降低待屏蔽结构水汽爆板的机会。
所述绝缘油墨层30烧结后形成所述绝缘层40。烧结温度为150~200℃。在进行烧结时,所述绝缘油墨层30中的环氧树脂和丁腈橡胶完全交联固化形成所述绝缘层40,以达到保护所述电磁屏蔽层20的作用。
本实施方式中,在形成所述绝缘油墨层30后,对所述导电油墨层10和所述绝缘油墨层30进行烧结,且所述导电油墨层10和所述绝缘油墨层30同时进行烧结后形成所述电磁屏蔽层20所述绝缘层40。在其他实施方式中,所述导电油墨层10和所述绝缘油墨层30可分别进行烧结,例如,在形成所述导电油墨层10后即刻进行烧结以形成所述电磁屏蔽层20,所述绝缘油墨层30形成在所述电磁屏蔽层20上;在形成所述绝缘油墨层30后进行烧结以形成所述绝缘层40。
下表为所述导电油墨和所述绝缘油墨的三种配方。
将上述银、抗坏血酸、乙二醇、聚乙二醇、聚乙烯吡咯烷酮、PEO-PPO-PEO、有机硅系添加剂、环氧磷酸酯混合,溶解在溶剂丁醇中,形成所述导电油墨。将上述碳黑、环氧树脂、丁腈橡膠、咪唑、有机硅系添加剂、环氧磷酸酯溶解于乙醇中,形成所述绝缘油墨。
在满足各成分比例范围的情况下,所述配方的参数重量可作调整,并不以此为限。
所述电磁屏蔽层20和所述绝缘层40的总厚度小于10μm,所述电磁屏蔽层的厚度为0.05~3μm,所述绝缘层的厚度为1~9.9μm。所述电磁屏蔽层20的屏蔽效应为60~70dB。所述电磁屏蔽层20耐酸、耐碱、耐醇。所述电磁屏蔽层20具有较好的粘附力和耐弯折性。
本发明实施方式提供的电磁屏蔽膜100的制作方法中,通过喷墨印刷方式直接在待屏蔽元件上形成所述电磁屏蔽层20和所述绝缘层40,其工艺简单且制作成本较低。且制得的所述电磁屏蔽膜100,仅包括电磁屏蔽层20和绝缘层40两层结构,有利于电磁屏蔽膜100的薄型化。
以上所揭露的仅为本发明较佳实施方式而已,当然不能以此来限定本发明,因此依本发明所作的等同变化,仍属本发明所涵盖的范围。
Claims (10)
1.一种电磁屏蔽膜的制作方法,包括:
采用导电油墨通过喷墨印刷方式形成导电油墨层;
采用绝缘油墨通过喷墨印刷方式在所述导电油墨层上形成绝缘油墨层;以及对所述导电油墨层和所述绝缘油墨层进行烧结形成电磁屏蔽层和绝缘层,以制得所述电磁屏蔽膜。
2.如权利要求1所述的电磁屏蔽膜的制作方法,其特征在于,在形成所述导电油墨层的同时对所述导电油墨层进行干燥,在形成所述绝缘油墨层的同时对所述绝缘油墨层进行干燥。
3.如权利要求2所述的电磁屏蔽膜的制作方法,其特征在于,采用紫外光照射或红外光照射对所述导电油墨层和所述绝缘油墨层进行干燥。
4.如权利要求1所述的电磁屏蔽膜的制作方法,其特征在于,烧结步骤在形成绝缘油墨层的步骤之后进行,所述导电油墨层和所述绝缘油墨层同时进行烧结形成所述电磁屏蔽层和所述绝缘层。
5.如权利要求1所述的电磁屏蔽膜的制作方法,其特征在于,所述电磁屏蔽层和所述绝缘层的总厚度小于10μm,所述电磁屏蔽层的厚度为0.05~3μm,所述绝缘层的厚度为1~9.9μm。
6.如权利要求1所述的电磁屏蔽膜的制作方法,其特征在于,所述导电油墨包括质量百分数为5~50%的纳米电磁屏蔽粒子、质量百分数为0.1~3%的导向剂、质量百分数为0.1~5%的粘合剂、质量百分数为0.1~5%的抗冻剂、质量百分数为0.1~5%的分散剂、质量百分数为0.1~1%的有机硅表面助剂、质量百分数为0.1~1%的附着力促进剂以及质量百分数为32~95%的溶剂。
7.如权利要求6所述的电磁屏蔽膜的制作方法,其特征在于,所述纳米电磁屏蔽粒子包括银、铜、金、镍、钯、铬、铂、钴中的一种或多种。
8.如权利要求6所述的电磁屏蔽膜的制作方法,其特征在于,所述导电油墨的粘度为5~30cps,所述导电油墨的表面张力为30~50dyn/cm。
9.如权利要求1所述的电磁屏蔽膜的制作方法,其特征在于,所述绝缘油墨包括质量百分数为3~25%的碳黑、质量百分数为3~15%的热固性树脂、质量百分数为3~15%的柔性树脂、质量百分数为0.5~5%的硬化剂、质量百分数为0.1~1%的表面张力调整剂、质量百分数为0.1~1%的附着力促进剂以及质量百分数为38~91%的溶剂。
10.如权利要求9所述的电磁屏蔽膜的制作方法,其特征在于,所述热固性树脂包括环氧树脂、聚酰亚胺、聚氨酯、亚克力、酚醛树脂、硅胶中的一种或多种。
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US20150201535A1 (en) * | 2014-01-14 | 2015-07-16 | Guangzhou Fang Bang Electronics Co., Ltd. | Electromagnetic wave shielding film and method for producing a circuit board comprising the shielding film |
CN107690269A (zh) * | 2016-08-31 | 2018-02-13 | 江苏汉印机电科技股份有限公司 | 电磁屏蔽层的喷墨打印制造方法 |
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US20080200333A1 (en) * | 2006-06-29 | 2008-08-21 | Gotou Akiko | Protective film temporarily lamination to electromagnetic wave shielding sheet, method for producing the same, and electromagnetic wave shielding sheet |
TW200933758A (en) * | 2008-01-17 | 2009-08-01 | En-Min Jow | Semiconductor package with antenna and manufacture method thereof |
CN102241950A (zh) * | 2010-05-14 | 2011-11-16 | 3M创新有限公司 | 电磁屏蔽胶带 |
TWI537142B (zh) * | 2013-11-29 | 2016-06-11 | Metal Ind Res & Dev Ct | Composite electromagnetic shielding material and its manufacturing method |
US10905017B2 (en) * | 2016-03-26 | 2021-01-26 | Nano Dimension Technologies Ltd. | Fabrication of PCB and FPC with shielded tracks and/or components using 3D inkjet printing |
CN110235538B (zh) * | 2017-02-08 | 2020-12-22 | 拓自达电线株式会社 | 电磁波屏蔽膜、屏蔽印制线路板及电子设备 |
WO2019035697A1 (ko) * | 2017-08-18 | 2019-02-21 | 주식회사 네패스 | Emi 차폐필름 |
TWI699279B (zh) * | 2018-10-22 | 2020-07-21 | 長興材料工業股份有限公司 | 電磁波屏蔽膜及其製備方法與用途 |
KR102567412B1 (ko) * | 2018-10-31 | 2023-08-16 | 삼성전자주식회사 | 복수의 레이어를 포함하는 차폐 필름 및 그것을 사용하는 전자 장치 |
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US20150201535A1 (en) * | 2014-01-14 | 2015-07-16 | Guangzhou Fang Bang Electronics Co., Ltd. | Electromagnetic wave shielding film and method for producing a circuit board comprising the shielding film |
CN107690269A (zh) * | 2016-08-31 | 2018-02-13 | 江苏汉印机电科技股份有限公司 | 电磁屏蔽层的喷墨打印制造方法 |
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