CN113994484A - 图像显示装置的制造方法以及图像显示装置 - Google Patents
图像显示装置的制造方法以及图像显示装置 Download PDFInfo
- Publication number
- CN113994484A CN113994484A CN202080043827.4A CN202080043827A CN113994484A CN 113994484 A CN113994484 A CN 113994484A CN 202080043827 A CN202080043827 A CN 202080043827A CN 113994484 A CN113994484 A CN 113994484A
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- China
- Prior art keywords
- light
- layer
- image display
- display device
- semiconductor layer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0421—Structural details of the set of electrodes
- G09G2300/0426—Layout of electrodes and connections
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0439—Pixel structures
- G09G2300/0452—Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/08—Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements
- G09G2300/0809—Several active elements per pixel in active matrix panels
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/032—Manufacture or treatment of electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/833—Transparent materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/835—Reflective materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019088536 | 2019-05-08 | ||
| JP2019-088536 | 2019-05-08 | ||
| JP2019179860 | 2019-09-30 | ||
| JP2019-179860 | 2019-09-30 | ||
| PCT/JP2020/017014 WO2020226044A1 (ja) | 2019-05-08 | 2020-04-20 | 画像表示装置の製造方法および画像表示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113994484A true CN113994484A (zh) | 2022-01-28 |
Family
ID=73051096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080043827.4A Pending CN113994484A (zh) | 2019-05-08 | 2020-04-20 | 图像显示装置的制造方法以及图像显示装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20220059518A1 (https=) |
| JP (1) | JP7457255B2 (https=) |
| KR (1) | KR102927545B1 (https=) |
| CN (1) | CN113994484A (https=) |
| TW (1) | TWI865522B (https=) |
| WO (1) | WO2020226044A1 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4216290A4 (en) * | 2020-09-17 | 2024-10-23 | Nichia Corporation | Production method for image display device and image display device |
| WO2022113949A1 (ja) * | 2020-11-25 | 2022-06-02 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
| CN116420240B (zh) * | 2020-11-25 | 2026-02-10 | 日亚化学工业株式会社 | 图像显示装置的制造方法以及图像显示装置 |
| KR102899002B1 (ko) | 2020-12-02 | 2025-12-10 | 엘지디스플레이 주식회사 | 발광 소자의 전사 방법 및 이를 이용한 표시 장치의 제조 방법 |
| JP2024099072A (ja) * | 2021-03-17 | 2024-07-25 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
| JP2024099071A (ja) * | 2021-03-17 | 2024-07-25 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
| JP7796318B2 (ja) * | 2021-03-29 | 2026-01-09 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
| CN116783641A (zh) * | 2021-03-29 | 2023-09-19 | 日亚化学工业株式会社 | 图像显示装置的制造方法和图像显示装置 |
| JP7820654B2 (ja) * | 2021-03-30 | 2026-02-26 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
| CN116897383A (zh) * | 2021-03-30 | 2023-10-17 | 日亚化学工业株式会社 | 图像显示装置的制造方法和图像显示装置 |
| WO2022210402A1 (ja) * | 2021-03-31 | 2022-10-06 | 株式会社ジャパンディスプレイ | 表示装置 |
| CN115483327B (zh) * | 2022-11-09 | 2023-03-24 | 镭昱光电科技(苏州)有限公司 | Micro LED微显示芯片及其制造方法 |
| KR20240103491A (ko) * | 2022-12-27 | 2024-07-04 | 엘지디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
| KR20260016253A (ko) * | 2024-07-26 | 2026-02-03 | 엘지디스플레이 주식회사 | 인셀 터치 표시패널 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1877874A (zh) * | 2005-06-06 | 2006-12-13 | 日立电线株式会社 | 发光二极管及其制造方法 |
| CN101529605A (zh) * | 2006-10-27 | 2009-09-09 | 佳能株式会社 | 半导体构件、半导体物品制造方法以及使用该制造方法的led阵列 |
| US20100197054A1 (en) * | 2007-10-04 | 2010-08-05 | Canon Kabushiki Kaisha | Method for manufacturing light emitting device |
| JP2010219310A (ja) * | 2009-03-17 | 2010-09-30 | Sharp Corp | 光デバイスおよび光デバイス構造 |
| US20120171866A1 (en) * | 2009-09-15 | 2012-07-05 | Canon Kabushiki Kaisha | Substrate structure including functional region and method for transferring functional region |
| CN105742449A (zh) * | 2016-04-01 | 2016-07-06 | 清华大学 | 发光二极管的电极制备方法 |
| CN108022550A (zh) * | 2016-11-01 | 2018-05-11 | 群创光电股份有限公司 | 显示装置 |
| WO2018132070A1 (en) * | 2017-01-13 | 2018-07-19 | Massachusetts Institute Of Technology | A method of forming a multilayer structure for a pixelated display and a multilayer structure for a pixelated display |
| US20180254226A1 (en) * | 2015-09-11 | 2018-09-06 | Sharp Kabushiki Kaisha | Image display device |
| JP2018205456A (ja) * | 2017-06-01 | 2018-12-27 | 株式会社ブイ・テクノロジー | フルカラーled表示パネル |
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| JP2002141492A (ja) | 2000-10-31 | 2002-05-17 | Canon Inc | 発光ダイオードディスプレイパネル及びその製造方法 |
| JP4852322B2 (ja) * | 2006-03-03 | 2012-01-11 | ローム株式会社 | 窒化物半導体発光素子及びその製造方法 |
| US8941141B2 (en) * | 2006-10-17 | 2015-01-27 | Epistar Corporation | Light-emitting device |
| JP2010114106A (ja) * | 2008-11-04 | 2010-05-20 | Canon Inc | 機能性領域の移設方法、ledアレイ、ledプリンタヘッド、及びledプリンタ |
| KR20230174763A (ko) * | 2009-11-13 | 2023-12-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 이 표시 장치를 구비한 전자 기기 |
| JP2013037139A (ja) * | 2011-08-05 | 2013-02-21 | Panasonic Corp | 自発光型表示装置 |
| JP2014049603A (ja) | 2012-08-31 | 2014-03-17 | Toshiba Corp | 半導体発光装置 |
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| KR102699567B1 (ko) * | 2016-07-11 | 2024-08-29 | 삼성디스플레이 주식회사 | 초소형 발광 소자를 포함하는 픽셀 구조체, 표시장치 및 그 제조방법 |
| KR102772357B1 (ko) * | 2016-12-20 | 2025-02-21 | 엘지디스플레이 주식회사 | 발광 다이오드 칩 및 이를 포함하는 발광 다이오드 디스플레이 장치 |
| TWI626738B (zh) * | 2017-04-06 | 2018-06-11 | 宏碁股份有限公司 | 顯示裝置及其製造方法 |
| JP6870592B2 (ja) * | 2017-11-24 | 2021-05-12 | 豊田合成株式会社 | 発光装置 |
| JP2021135328A (ja) | 2020-02-25 | 2021-09-13 | 株式会社ジャパンディスプレイ | 表示装置 |
-
2020
- 2020-04-20 JP JP2021518333A patent/JP7457255B2/ja active Active
- 2020-04-20 KR KR1020217034930A patent/KR102927545B1/ko active Active
- 2020-04-20 WO PCT/JP2020/017014 patent/WO2020226044A1/ja not_active Ceased
- 2020-04-20 CN CN202080043827.4A patent/CN113994484A/zh active Pending
- 2020-04-30 TW TW109114490A patent/TWI865522B/zh active
-
2021
- 2021-11-05 US US17/520,040 patent/US20220059518A1/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1877874A (zh) * | 2005-06-06 | 2006-12-13 | 日立电线株式会社 | 发光二极管及其制造方法 |
| CN101529605A (zh) * | 2006-10-27 | 2009-09-09 | 佳能株式会社 | 半导体构件、半导体物品制造方法以及使用该制造方法的led阵列 |
| US20100026779A1 (en) * | 2006-10-27 | 2010-02-04 | Canon Kabushiki Kaisha | Semiconductor member, semiconductor article manufacturing method, and led array using the manufacturing method |
| US20100197054A1 (en) * | 2007-10-04 | 2010-08-05 | Canon Kabushiki Kaisha | Method for manufacturing light emitting device |
| JP2010219310A (ja) * | 2009-03-17 | 2010-09-30 | Sharp Corp | 光デバイスおよび光デバイス構造 |
| US20120171866A1 (en) * | 2009-09-15 | 2012-07-05 | Canon Kabushiki Kaisha | Substrate structure including functional region and method for transferring functional region |
| US20180254226A1 (en) * | 2015-09-11 | 2018-09-06 | Sharp Kabushiki Kaisha | Image display device |
| CN105742449A (zh) * | 2016-04-01 | 2016-07-06 | 清华大学 | 发光二极管的电极制备方法 |
| CN108022550A (zh) * | 2016-11-01 | 2018-05-11 | 群创光电股份有限公司 | 显示装置 |
| WO2018132070A1 (en) * | 2017-01-13 | 2018-07-19 | Massachusetts Institute Of Technology | A method of forming a multilayer structure for a pixelated display and a multilayer structure for a pixelated display |
| JP2018205456A (ja) * | 2017-06-01 | 2018-12-27 | 株式会社ブイ・テクノロジー | フルカラーled表示パネル |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020226044A1 (ja) | 2020-11-12 |
| KR102927545B1 (ko) | 2026-02-19 |
| US20220059518A1 (en) | 2022-02-24 |
| TWI865522B (zh) | 2024-12-11 |
| JP7457255B2 (ja) | 2024-03-28 |
| KR20220006052A (ko) | 2022-01-14 |
| TW202113774A (zh) | 2021-04-01 |
| JPWO2020226044A1 (https=) | 2020-11-12 |
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