CN113990776A - Wafer static-removing device with sorting function - Google Patents
Wafer static-removing device with sorting function Download PDFInfo
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- CN113990776A CN113990776A CN202111114388.4A CN202111114388A CN113990776A CN 113990776 A CN113990776 A CN 113990776A CN 202111114388 A CN202111114388 A CN 202111114388A CN 113990776 A CN113990776 A CN 113990776A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/04—Carrying-off electrostatic charges by means of spark gaps or other discharge devices
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Abstract
The invention discloses a wafer static electricity removing device with a sorting function, which comprises a frame, wherein a blanking mechanism is arranged on the inner wall of one side of the frame, the blanking mechanism comprises a support frame, a support slide rail, a first motor, a first screw rod, a lifting block and a wafer box, the two support frames are connected to the inner wall of the frame, the support slide rail is connected to the top of the support frame, the first screw rod is arranged in the support slide rail, the lifting block is sleeved on the first screw rod, and the wafer box is connected between the lifting blocks. The automatic wafer feeding device is provided with the material pushing mechanism, the material pushing mechanism can circularly perform material pushing operation through the driving mechanism, automatic feeding is realized, the wafer is conveyed into the static electricity removing mechanism through the material receiving mechanism to be automatically subjected to static electricity removal, then whether the wafer is qualified or not is detected through the sorting mechanism, the unqualified wafer is subjected to static electricity removal again, manual operation is not needed, labor is greatly saved, and efficiency is improved.
Description
Technical Field
The invention relates to the technical field of static electricity removal of wafers, in particular to a static electricity removal device for a wafer with a sorting function.
Background
A wafer, also called a silicon wafer, is processed from a silicon ingot, millions of transistors can be etched on the silicon wafer through a special process, and the wafer is widely applied to the manufacturing of integrated circuits, the manufacturing process of the wafer is complex and has many processes, different chemical materials are used in different processes, impurities such as chemical agents, particles, metals and the like usually remain on the surface of the wafer, and the wafer needs to be cleaned, however, static electricity is inevitably generated in the cleaning process, and some fine dust adheres to the wafer after the wafer is charged with the static electricity. Therefore, to ensure absolute dust-free of the wafer, it is usually necessary to perform a destaticization process. Present destaticizing device needs artifical material loading, takes out again after carrying out the destaticizing machine, then puts into sorting mechanism and detects, if detect unqualifiedly, puts into destaticizing mechanism again by the manual work and destatics, complex operation, and the hand labor volume is big, and efficiency is difficult to improve.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a wafer static electricity removing apparatus having a sorting function.
The invention realizes the purpose through the following technical scheme: a wafer static electricity removing device with a sorting function comprises a blanking mechanism arranged on the inner wall of one side of a frame, the blanking mechanism comprises a support frame, a support slide rail, a first motor, a first lead screw, a lifting block and a wafer box, two support frames are connected to the inner wall of the frame, the support slide rail is connected to the top of the support frame, the first lead screw is arranged in the support slide rail, the lifting block is sleeved on the first lead screw, the wafer box is connected between the lifting blocks, the wafer box is positioned between the two support slide rails, the first motor is connected to the top of the frame, an output shaft of the first motor is connected with the first lead screw, a material pushing mechanism is arranged at the bottom of the support frame, a driving mechanism is arranged on the inner wall of one side of the frame and used for driving the material pushing mechanism to move, a static electricity removing mechanism is arranged on the inner top wall of the frame and positioned on one side of the support frame, diapire is located in the frame destatic mechanism below is provided with receiving mechanism, receiving mechanism keeps away from one side of unloading mechanism is provided with sorting mechanism, pushing equipment includes slide bar, supporting shoe, sliding sleeve, movable block, translation pole, bracing piece, fixed block, ejector pad, the support frame bottom is connected with two the supporting shoe, be connected with between the supporting shoe the slide bar, the cover has on the slide bar the sliding sleeve, the sliding sleeve bottom is connected with the translation pole, the cover has on the translation pole the movable block, movable block one side is connected with the bracing piece, the bracing piece top is connected with the fixed block, the fixed block top is connected with the ejector pad, the ejector pad is located between the support frame.
Preferably, actuating mechanism includes motor cabinet, two motors, turning block, dwang, connector, spring, be connected with on the frame inner wall the motor cabinet, the motor cabinet top is connected with the second motor, the output shaft of the second motor has the turning block, the turning block in-connection has the dwang, dwang one end is connected with the connector, the connector with the turning block is connected, the cover is equipped with on the dwang the spring, the spring is located the turning block with between the connector.
So set up, utilize two drives of motor the turning block rotates, makes the dwang drives the connector rotates, the connector drives the pushing equipment activity.
Preferably, the static electricity removing mechanism comprises a static electricity removing box, an ion air gun, a nozzle and a vacuum pump, the top wall is connected with the static electricity removing box, the ion air gun is arranged in the static electricity removing box, the bottom of the ion air gun is connected with the nozzle, and one side of the static electricity removing box is connected with the vacuum pump.
According to the arrangement, the ion air gun is used for blowing out ion air to remove static electricity on the wafer, and the vacuum pump is used for pumping air.
Preferably, receiving mechanism includes fixed case, cylinder one, lifter plate, motor three, pivot, take-up (stock) pan, the diapire is connected with in the frame fixed case, the diapire is connected with in the fixed case cylinder one, the output shaft of cylinder one has the lifter plate, the lifter plate with fixed incasement wall connection, the lifter plate top is connected with motor three, the output shaft of motor three has the pivot, the pivot top is stretched out fixed case is connected with the take-up (stock) pan.
According to the arrangement, the first cylinder is used for driving the lifting plate to move up and down, and the third motor is used for driving the material receiving disc to rotate.
Preferably, receiving mechanism includes fixed case, lifter plate, three motors, pivot, take-up (stock) pan, four motors, two lead screws, the diapire is connected with in the frame fixed case, the diapire is connected with two in the fixed case four motors, the output shaft of four motors has two lead screws, the cover is equipped with the lifter plate on two lead screws, the lifter plate with fixed incasement wall connection, the lifter plate top is connected with three motors, the output shaft of three motors has the pivot, the pivot top is stretched out fixed case is connected with the take-up (stock) pan.
According to the arrangement, the lifting plate is driven to move up and down by the motor IV and the screw rod II, and the receiving tray is driven to rotate by the motor III.
Preferably, the sorting mechanism comprises a sorting machine, a motor box, a motor five, a rotary table, a cylinder two and a material rack, wherein the bottom wall of the frame is connected with the sorting machine, the front side of the sorting machine is connected with the motor box, the bottom wall of the motor box is connected with the motor five, an output shaft of the motor five is connected with the rotary table, the top of the rotary table is located outside the motor box, the top of the rotary table is connected with the cylinder two, and an output shaft of the cylinder two is connected with the material rack.
According to the arrangement, the second air cylinder drives the material rest to move, and the second air cylinder rotates through the fifth motor, so that the material rest moves the wafer to a proper position.
Preferably, the supporting block is welded to the supporting frame, the sliding rod is welded to the supporting block, the sliding sleeve is connected to the sliding rod in a sliding mode, the translation rod is welded to the sliding sleeve, and the movable block is connected to the translation rod in a sliding mode.
So set up, be convenient for the sliding sleeve with the movable block slides.
Preferably, motor two with motor cabinet bolted connection, motor two's output shaft with turning block fixed connection, the dwang with turning block sliding connection, the connector with the turning block welding, the connector with the movable block rotates to be connected.
So set up, be convenient for motor two carries out the dismouting, is convenient for the dwang is in the activity in the dwang piece.
Preferably, the first cylinder is connected with the fixed box through a bolt, the output shaft of the first cylinder is fixedly connected with the lifting plate, the lifting plate is connected with the fixed box in a sliding mode, the third motor is connected with the lifting plate through a bolt, the output shaft of the third motor is connected with the rotating shaft through a coupler, and the rotating shaft is welded with the material receiving disc.
So set up, be convenient for cylinder one with motor three carries out the dismouting, is convenient for the lifter plate reciprocates.
Preferably, the motor four is connected with the fixed box through a bolt, an output shaft of the motor four is connected with the lead screw two through a coupler, the lead screw two is connected with the lifting plate through a thread, the lifting plate is connected with the fixed box in a sliding mode, the motor three is connected with the lifting plate through a bolt, an output shaft of the motor three is connected with the rotating shaft through a coupler, and the rotating shaft is welded with the material receiving disc.
So set up, be convenient for motor four with motor three carries out the dismouting, is convenient for the lifter plate reciprocates.
Compared with the prior art, the invention has the following beneficial effects: the automatic wafer feeding device is provided with the material pushing mechanism, the material pushing mechanism can circularly perform material pushing operation through the driving mechanism, automatic feeding is realized, the wafer is conveyed into the static electricity removing mechanism through the material receiving mechanism to be automatically subjected to static electricity removal, then whether the wafer is qualified or not is detected through the sorting mechanism, the unqualified wafer is subjected to static electricity removal again, manual operation is not needed, labor is greatly saved, and efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a perspective view of a wafer electrostatic precipitator with sorting function according to the present invention;
FIG. 2 is a perspective view of a part of the structure of a wafer electrostatic elimination device with sorting function according to the present invention;
FIG. 3 is a right side view of a discharging mechanism of the wafer static electricity removing device with sorting function according to the present invention;
FIG. 4 is a perspective view of a material pushing mechanism of the wafer static electricity removing device with sorting function according to the present invention;
FIG. 5 is a perspective view of a driving mechanism of a wafer electrostatic precipitator with a sorting function according to the present invention;
FIG. 6 is a perspective view of a sorting mechanism of the electrostatic elimination device for wafers with sorting function according to the present invention;
FIG. 7 is a front view of the internal structure of a wafer electrostatic elimination device with sorting function according to the present invention;
FIG. 8 is a front view of a material receiving mechanism of an embodiment 1 of a wafer static electricity removing device with a sorting function according to the present invention;
fig. 9 is a front view of a material receiving mechanism of an embodiment 2 of a wafer static electricity removing device with a sorting function according to the present invention.
The reference numerals are explained below: 1. a frame; 2. a blanking mechanism; 201. a support frame; 202. supporting the slide rail; 203. a first motor; 204. a first screw rod; 205. a lifting block; 206. a wafer cassette; 3. a material pushing mechanism; 301. a slide bar; 302. a support block; 303. a sliding sleeve; 304. a movable block; 305. a translation rod; 306. a support bar; 307. a fixed block; 308. a material pushing rod; 4. a drive mechanism; 401. a motor base; 402. a second motor; 403. rotating the block; 404. rotating the rod; 405. a connector; 406. a spring; 5. a static electricity removing mechanism; 501. a static electricity removing box; 502. an ion air gun; 503. a nozzle; 504. a vacuum pump; 6. a material receiving mechanism; 601. a fixed box; 602. a first cylinder; 603. a lifting plate; 604. a third motor; 605. a rotating shaft; 606. a take-up pan; 607. a fourth motor; 608. a second screw rod; 7. a sorting mechanism; 701. a sorting machine; 702. a motor case; 703. a fifth motor; 704. a turntable; 705. a second air cylinder; 706. and a material rack.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The invention will be further described with reference to the accompanying drawings in which:
example 1
As shown in fig. 1-8, a wafer static electricity removing device with sorting function comprises a frame 1, a blanking mechanism 2 disposed on an inner wall of one side of the frame 1, the blanking mechanism 2 including a support frame 201, a support slide rail 202, a first motor 203, a first screw 204, a lifting block 205, and a wafer box 206, two support frames 201 connected to the inner wall of the frame 1, the support slide rail 202 connected to the top of the support frame 201, the first screw 204 disposed in the support slide rail 202, the lifting block 205 sleeved on the first screw 204, the wafer box 206 connected between the lifting block 205, the wafer box 206 disposed between the two support slide rails 202, the first motor 203 connected to the top of the frame 1, an output shaft of the first motor 203 connected to the first screw 204, a material pushing mechanism 3 disposed at the bottom of the support frame 201, a driving mechanism 4 disposed on an inner wall of one side of the frame 1, the driving mechanism 4 for driving the material pushing mechanism 3 to move, and a static electricity removing mechanism 5 disposed on an inner top wall of the frame 1 and on one side of the support frame 201, the bottom wall is provided with receiving mechanism 6 below destaticizing mechanism 5 in frame 1, one side that receiving mechanism 6 kept away from unloading mechanism 2 is provided with sorting mechanism 7, pushing equipment 3 includes slide bar 301, supporting shoe 302, sliding sleeve 303, movable block 304, translation pole 305, bracing piece 306, fixed block 307, material pushing rod 308, the support frame 201 bottom is connected with two supporting shoes 302, be connected with slide bar 301 between the supporting shoe 302, the cover has sliding sleeve 303 on the slide bar 301, sliding sleeve 303 bottom is connected with translation pole 305, translation pole 305 goes up the cover has movable block 304, movable block 304 one side is connected with bracing piece 306, bracing piece 306 top is connected with fixed block 307, fixed block 307 top is connected with material pushing rod 308, material pushing rod 308 is located between the support frame 201.
Preferably, the driving mechanism 4 comprises a motor base 401, a second motor 402, a rotating block 403, a rotating rod 404, a connecting head 405 and a spring 406, the motor base 401 is connected to the inner wall of the frame 1, the second motor 402 is connected to the top of the motor base 401, the rotating block 403 is connected to an output shaft of the second motor 402, the rotating rod 404 is connected to the rotating block 403, the connecting head 405 is connected to one end of the rotating rod 404, the connecting head 405 is connected to the moving block 304, the spring 406 is sleeved on the rotating rod 404, the spring 406 is located between the rotating block 403 and the connecting head 405, the static eliminating mechanism 5 comprises a static eliminating box 501, an ion air gun 502, a nozzle 503 and a vacuum pump 504, the static eliminating box 501 is connected to the inner top wall of the frame 1, the ion air gun 502 is arranged in the static eliminating box 501, the nozzle 503 is connected to the bottom of the ion air gun 502, the vacuum pump 504 is connected to one side of the static eliminating box 501, the material receiving mechanism 6 comprises a fixed box 601 and a first cylinder 602, The sorting mechanism 7 comprises a sorting machine 701, a motor box 702, a motor fifth 703, a rotary table 704, a rotary table 705 and a material rack 706, wherein the inner bottom wall of the frame 1 is connected with a fixed box 601, the inner bottom wall of the fixed box 601 is connected with a cylinder I602, the output shaft of the cylinder I602 is connected with the lifting plate 603, the lifting plate 603 is connected with the inner wall of the fixed box 601, the top of the lifting plate 603 is connected with the motor third 604, the output shaft of the motor third 604 is connected with the rotary table 605, the top of the rotary table 605 extends out of the fixed box 601 and is connected with the material rack 606, the sorting mechanism 7 comprises a sorting machine 701, a motor box 702, a motor fifth 702, a rotary table 703, a rotary table 704, a cylinder second 705 and a material rack 706, the inner bottom wall of the frame 1 is connected with the sorting machine 701, the front side of the sorting machine 701 is connected with the motor box 702, the inner bottom wall of the motor fifth 703 is connected with the rotary table 704, the output shaft of the rotary table 704, the top of the rotary table 704 is positioned outside the motor box 702, the rotary table 705 is connected with the cylinder second 705, the material rack 706, the supporting block 302 is welded with the supporting frame 201, the sliding rod 301 is welded with the supporting block 302, the sliding sleeve 303 is slidably connected with the sliding rod 301, the translation rod 305 is welded with the sliding sleeve 303, the movable block 304 is slidably connected with the translation rod 305, the second motor 402 is bolted with the motor base 401, an output shaft of the second motor 402 is fixedly connected with the rotating block 403, the rotating rod 404 is slidably connected with the rotating block 403, the connecting head 405 is welded with the rotating block 403, the connecting head 405 is rotatably connected with the movable block 304, the first cylinder 602 is bolted with the fixed box 601, an output shaft of the first cylinder 602 is fixedly connected with the lifting plate 603, the lifting plate 603 is slidably connected with the fixed box 601, the third motor 604 is bolted with the lifting plate 603, an output shaft of the third motor 604 is connected with the rotating shaft 605 through a coupler, and the rotating shaft 605 is welded with the material receiving disc 606.
Example 2
As shown in fig. 9, embodiment 2 differs from embodiment 1 in that: the material receiving mechanism 6 comprises a fixed box 601, a lifting plate 603, a motor III 604, a rotating shaft 605, a material receiving disc 606, a motor IV 607 and a screw II 608, the inner bottom wall of the frame 1 is connected with the fixed box 601, the inner bottom wall of the fixed box 601 is connected with the two motor IV 607, an output shaft of the motor IV 607 is connected with the screw II 608, the screw II 608 is sleeved with the lifting plate 603, the lifting plate 603 is connected with the inner wall of the fixed box 601, the top of the lifting plate 603 is connected with the motor III 604, an output shaft of the motor III 604 is connected with the rotating shaft 605, the top of the rotating shaft 605 extends out of the fixed box 601 and is connected with the material receiving disc 606, the motor IV 607 is in bolt connection with the fixed box 601, the output shaft of the motor IV 607 is connected with the screw II 608 through a coupler, the screw II 608 is in thread connection with the lifting plate 603, the lifting plate 603 is in sliding connection with the fixed box 601, the motor III 604 is in bolt connection with the lifting plate 603, the output shaft of the motor III 604 is connected with the rotating shaft 605 through a coupler, the rotating shaft 605 is welded with the take-up pan 606.
The working principle is as follows: the wafer box 206 is fixed between two lifting blocks 205, then the second motor 402 drives the rotating block 403 to rotate clockwise, the rotating block 403 drives the rotating rod 404 to rotate, at the moment, the spring 406 extends, the rotating rod 404 moves in the rotating block 403, the rotating rod 404 drives the movable block 304 to move through the connecting head 405, the movable block 304 drives the translation rod 305 to move towards the static eliminating mechanism 5, meanwhile, the movable block 304 drives the supporting rod 306 to move, so that the pushing rod 308 pushes the wafer at the lowest end in the wafer box 206 onto the material receiving disc 606, when the connecting head 405 starts to rotate downwards, the connecting head 405 drives the movable block 304 to move downwards on the translation rod 305, when the connecting head 405 rotates for a circle and returns to the initial position, the movable block 304 moves back and forth once before descending, and moves back and forth once again, and simultaneously, the translation rod 305 drives the sliding sleeve 303 to move back and forth once, so as to realize cyclic material pushing, when the wafer is pushed onto the material receiving disc 606, the lifting plate 603 is driven to move upwards by the first air cylinder 602, or the second screw rod 608 is driven to rotate by the fourth motor 607, the second screw rod 608 drives the lifting plate 603 to move upwards, the lifting plate 603 drives the third motor 604, the rotating shaft 605 and the material receiving tray 606 to move upwards, so that the wafer is conveyed to the static electricity removing box 501, the third motor 604 drives the material receiving tray 606 to rotate, then the ion air gun 502 and the nozzle 503 remove static electricity to the wafer, the static electricity removing is completed, then the vacuum pump 504 performs air suction, then the lifting plate 603 moves downwards, so that the material receiving tray 606 is positioned below the material holder 706, the wafer falls on the material holder 706, then the second air cylinder 705 contracts, then the fifth motor 703 drives the rotary table 704 to rotate, the rotary table 704 drives the second air cylinder 705 to rotate, so that the wafer is conveyed into the sorting machine 701 to be detected, if the detection is unqualified, the wafer 705 is conveyed to the material receiving mechanism 6 again, then the static electricity is removed again, if the detection is qualified, the wafer is conveyed to the next procedure, and then the first motor 203 drives the first screw rod 204 to rotate, the first screw rod 204 drives the lifting block 205 to descend, the lifting block 205 drives the wafer box 206 to descend for a certain distance, and then the operation is repeated to remove static electricity for the next wafer.
Example 3
The embodiment further provides a wafer sorting and static electricity removing method, which uses the apparatus of embodiment 1 or 2, and comprises the following steps:
s1: fixing a wafer box 206 loaded with wafers between two lifting blocks 205, driving a rotating block 403 to rotate clockwise by a second motor 402, driving a rotating block 404 to rotate by the rotating block 403, extending a spring 406 at the moment, enabling the rotating block 404 to move in the rotating block 403, driving a movable block 304 to move by the rotating block 404 through a connecting head 405, driving a translation rod 305 to move towards the static electricity removing mechanism 5 by the movable block 304, and driving a supporting rod 306 to move by the movable block 304 at the same time, so that a material pushing rod 308 pushes the wafer at the lowest end in the wafer box 206 to a material receiving plate 606; when the connecting head 405 starts to rotate downwards, the connecting head 405 drives the movable block 304 to move downwards on the translation rod 305, when the connecting head 405 rotates for a circle and returns to the initial position, the movable block 304 moves back and forth once after going down, and meanwhile, the translation rod 305 drives the sliding sleeve 303 to move back and forth once, so that the material pushing rod 308 returns to the initial position;
s2: after the wafer is pushed to the material receiving tray 606, the first cylinder 602 drives the lifting plate 603 to move upwards, or the fourth motor 607 drives the second screw 608 to rotate, the second screw 608 drives the lifting plate 603 to move upwards, and the lifting plate 603 drives the third motor 604, the rotating shaft 605 and the material receiving tray 606 to move upwards, so that the wafer is conveyed to the static electricity removing box 501;
s3: a third motor 604 drives a material receiving disc 606 to rotate, an ion air gun 502 and a nozzle 503 which are arranged in a static box 501 are used for removing static electricity of the wafer, a vacuum pump 504 is used for pumping air while removing the static electricity, then a lifting plate 603 moves downwards to enable the material receiving disc 606 to be located below a material rack 706, the wafer falls on the material rack 706, a second air cylinder 705 contracts, a fifth motor 703 drives a rotary table 704 to rotate, the rotary table 704 drives the second air cylinder 705 to rotate, and therefore the wafer is conveyed into a sorting machine 701 to be detected;
s4: if the detection is not qualified, the wafer is sent to the upper part of the material receiving mechanism 6 again, then static electricity is removed again, if the detection is qualified, the wafer is sent to the next process, the first motor 203 drives the first screw rod 204 to rotate, the first screw rod 204 drives the lifting block 205 to descend, the lifting block 205 drives the wafer box 206 to descend for a certain distance, and the steps S1-S3 are repeated to remove the static electricity for the next wafer.
Further, the wafer is loaded into a new cassette after passing the detection in step S4.
Further, after all the wafers in the pod 206 are destaticized, the pod is turned upside down and the steps S1-S4 are repeated to destaticize the other side of the wafer. Thereby realizing the static electricity removal of both sides of the wafer.
According to the wafer sorting and static removing method, the material pushing rod 308 pushes the wafers in the wafer box to the material receiving tray 606 one by one from bottom to top, then the material receiving tray 606 is lifted to enable the wafers to enter the ion air gun 502 and the nozzle 503 which are arranged in the static box 501 to remove static of the wafers, then whether the wafers are qualified or not is detected through sorting, the unqualified wafers are subjected to static removal again, manual operation is not needed, labor is greatly saved, and efficiency is improved.
Further, a vacuum pump 504 for pumping air is connected to one side of the static eliminating box 501.
Further, the static electricity removing box 501 is square or circular, and the pumping holes of the vacuum pump 504 are distributed on the side wall of the static electricity removing box 501, and the setting height of the pumping holes is lower than the height of the wafer during static electricity removing. Static electricity removal and air extraction are carried out simultaneously, so that dust separated from adhesion can be smoothly sucked away by the air extraction opening.
Further, the surfaces of the material pushing rod 308, the rotating block 403, the material receiving disc 606 and the like which are in contact with the wafer are made of teflon materials.
Further, the ion wind gun 502 and the nozzle 503 are aligned to the center of the wafer so that the de-ionizing wind blows over the wafer in a vacuum.
Further, after the wafer is sent to the next process, before the receiving tray 606 receives the next wafer, the receiving tray 606 is lifted and sent to the static electricity eliminating box 501 to eliminate static electricity. And dust on the receiving tray is removed, so that the wafer is prevented from being polluted by the receiving tray.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (10)
1. The wafer static electricity removing device with the sorting function comprises a frame (1), wherein a blanking mechanism (2) is arranged on the inner wall of one side of the frame (1), the blanking mechanism (2) comprises support frames (201), support slide rails (202), a motor I (203), a screw rod I (204), lifting blocks (205) and a wafer box (206), the two support frames (201) are connected to the inner wall of the frame (1), the support slide rails (202) are connected to the tops of the support frames (201), the screw rod I (204) is arranged in the support slide rails (202), the lifting blocks (205) are sleeved on the screw rod I (204), the wafer box (206) is connected between the lifting blocks (205), the wafer box (206) is located between the two support slide rails (202), the motor I (203) is connected to the top of the frame (1), the output shaft of the first motor (203) is connected with the first screw rod (204), and the device is characterized in that: the automatic material pushing device is characterized in that a material pushing mechanism (3) is arranged at the bottom of the support frame (201), a driving mechanism (4) is arranged on the inner wall of one side of the frame (1), the driving mechanism (4) is used for driving the material pushing mechanism (3) to move, a static electricity removing mechanism (5) is arranged on one side of the inner top wall of the frame (1) and located on the support frame (201), a material receiving mechanism (6) is arranged below the static electricity removing mechanism (5) on the inner bottom wall of the frame (1), a sorting mechanism (7) is arranged on one side, far away from the blanking mechanism (2), of the material receiving mechanism (6), the material pushing mechanism (3) comprises a sliding rod (301), a supporting block (302), a sliding sleeve (303), a movable block (304), a translation rod (305), a supporting rod (306), a fixed block (307) and a material pushing rod (308), wherein the bottom of the support frame (201) is connected with two supporting blocks (302), be connected with between the supporting shoe (302) slide bar (301), slide bar (301) go up the cover have slide sleeve (303), slide sleeve (303) bottom is connected with translation pole (305), the cover has on translation pole (305) movable block (304), movable block (304) one side is connected with bracing piece (306), bracing piece (306) top is connected with fixed block (307), fixed block (307) top is connected with material pushing rod (308), material pushing rod (308) are located between support frame (201).
2. The wafer static electricity removing device with sorting function as claimed in claim 1, wherein: actuating mechanism (4) are including motor cabinet (401), two (402) motors, turning block (403), dwang (404), connector (405), spring (406), be connected with on frame (1) inner wall motor cabinet (401), motor cabinet (401) top is connected with two (402) motors, the output shaft of two (402) motors is connected with turning block (403), turning block (403) in-connection has dwang (404), dwang (404) one end is connected with connector (405), connector (405) with movable block (304) is connected, the cover is equipped with on dwang (404) spring (406), spring (406) are located turning block (403) with between connector (405).
3. The wafer static electricity removing device with sorting function as claimed in claim 1, wherein: destatic mechanism (5) are including destatic case (501), ion air gun (502), nozzle (503), vacuum pump (504), the roof is connected with destatic case (501) in frame (1), be provided with in destatic case (501) ion air gun (502), ion air gun (502) bottom is connected with nozzle (503), destatic case (501) one side is connected with vacuum pump (504).
4. The wafer static electricity removing device with sorting function as claimed in claim 1, wherein: the material receiving mechanism (6) comprises a fixed box (601), a first cylinder (602), a lifting plate (603), a third motor (604), a rotating shaft (605) and a material receiving disc (606), wherein the inner bottom wall of the frame (1) is connected with the fixed box (601), the inner bottom wall of the fixed box (601) is connected with the first cylinder (602), an output shaft of the first cylinder (602) is connected with the lifting plate (603), the lifting plate (603) is connected with the inner wall of the fixed box (601), the top of the lifting plate (603) is connected with the third motor (604), an output shaft of the third motor (604) is connected with the rotating shaft (605), and the top of the rotating shaft (605) extends out of the fixed box (601) and is connected with the material receiving disc (606).
5. The wafer static electricity removing device with sorting function as claimed in claim 1, wherein: the material receiving mechanism (6) comprises a fixed box (601), a lifting plate (603), a motor III (604), a rotating shaft (605), a material receiving disc (606), a motor IV (607) and a screw rod II (608), wherein the bottom wall of the frame (1) is connected with the fixed box (601), the bottom wall of the fixed box (601) is connected with the motor IV (607), an output shaft of the motor IV (607) is connected with the screw rod II (608), the lifting plate (603) is sleeved on the screw rod II (608), the lifting plate (603) is connected with the inner wall of the fixed box (601), the top of the lifting plate (603) is connected with the motor III (604), an output shaft of the motor III (604) is connected with the rotating shaft (605), and the top of the rotating shaft (605) extends out of the fixed box (601) and is connected with the material receiving disc (606).
6. The wafer static electricity removing device with sorting function as claimed in claim 1, wherein: sorting mechanism (7) is including sorter (701), motor case (702), motor five (703), revolving stage (704), cylinder two (705), work or material rest (706), the diapire is connected with in frame (1) sorter (701), sorter (701) front side is connected with motor case (702), the diapire is connected with in motor case (702) motor five (703), the output shaft of motor five (703) has revolving stage (704), revolving stage (704) top is located motor case (702) outside, revolving stage (704) top is connected with cylinder two (705), the output shaft of cylinder two (705) has work or material rest (706).
7. The wafer static electricity removing device with sorting function as claimed in claim 1, wherein: the supporting block (302) is welded with the supporting frame (201), the sliding rod (301) is welded with the supporting block (302), the sliding sleeve (303) is in sliding connection with the sliding rod (301), the translation rod (305) is welded with the sliding sleeve (303), and the movable block (304) is in sliding connection with the translation rod (305).
8. The wafer static electricity removing device with sorting function as claimed in claim 2, wherein: motor two (402) with motor cabinet (401) bolted connection, the output shaft of motor two (402) with turning block (403) fixed connection, dwang (404) with turning block (403) sliding connection, connector (405) with turning block (403) welding, connector (405) with movable block (304) rotate and are connected.
9. The wafer static electricity removing device with sorting function as claimed in claim 4, wherein: the cylinder I (602) is connected with the fixed box (601) through bolts, an output shaft of the cylinder I (602) is fixedly connected with the lifting plate (603), the lifting plate (603) is connected with the fixed box (601) in a sliding mode, the motor III (604) is connected with the lifting plate (603) through bolts, an output shaft of the motor III (604) is connected with the rotating shaft (605) through a coupler, and the rotating shaft (605) is welded with the material receiving disc (606).
10. The wafer static electricity removing device with sorting function as claimed in claim 5, wherein: the motor four (607) is connected with the fixed box (601) through bolts, an output shaft of the motor four (607) is connected with the screw rod two (608) through a coupler, the screw rod two (608) is connected with the lifting plate (603) through threads, the lifting plate (603) is connected with the fixed box (601) in a sliding mode, the motor three (604) is connected with the lifting plate (603) through bolts, an output shaft of the motor three (604) is connected with the rotating shaft (605) through a coupler, and the rotating shaft (605) is welded with the material receiving disc (606).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111114388.4A CN113990776A (en) | 2021-09-23 | 2021-09-23 | Wafer static-removing device with sorting function |
| PCT/CN2021/139136 WO2023045131A1 (en) | 2021-09-23 | 2021-12-17 | Wafer static eliminating device having sorting function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111114388.4A CN113990776A (en) | 2021-09-23 | 2021-09-23 | Wafer static-removing device with sorting function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113990776A true CN113990776A (en) | 2022-01-28 |
Family
ID=79736353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111114388.4A Withdrawn CN113990776A (en) | 2021-09-23 | 2021-09-23 | Wafer static-removing device with sorting function |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113990776A (en) |
| WO (1) | WO2023045131A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115835465A (en) * | 2023-02-13 | 2023-03-21 | 杭州芯云半导体技术有限公司 | Side ESD dissipation device, method and installation method for sorting machine |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116298566B (en) * | 2023-05-19 | 2023-08-04 | 埃用仪器(苏州)有限公司 | Industrial electrostatic tester |
| CN117253827B (en) * | 2023-11-16 | 2024-02-02 | 郯城宏创高科技电子产业园有限公司 | Laminating device is used in processing of high accuracy semiconductor component |
| CN118464791A (en) * | 2024-05-08 | 2024-08-09 | 浙江晶睿电子科技有限公司 | Surface detection equipment for wafer particles |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201454870U (en) * | 2009-07-22 | 2010-05-12 | 咸阳文林机电设备制造有限公司 | Fully-automatic LED chip selector |
| JP2011171591A (en) * | 2010-02-19 | 2011-09-01 | Disco Corp | Apparatus for carry in/carry out of wafer |
| CN108174502A (en) * | 2016-12-08 | 2018-06-15 | 镇江立中机械设备有限公司 | Feeding Destaticizing device |
| CN212421825U (en) * | 2020-04-13 | 2021-01-29 | 争丰半导体科技(苏州)有限公司 | Full-automatic cutting and cleaning integrated machine for wafer |
| CN212580906U (en) * | 2020-05-22 | 2021-02-23 | 江西合力泰科技有限公司 | Polaroid feeding device |
| CN112235927B (en) * | 2020-09-26 | 2021-05-25 | 江苏亚电科技有限公司 | Wafer static electricity removing and cleaning device |
| CN213278047U (en) * | 2020-11-19 | 2021-05-25 | 冠礼控制科技（上海）有限公司 | Single wafer carrying device |
| CN114023668A (en) * | 2021-09-23 | 2022-02-08 | 江苏亚电科技有限公司 | Wafer sorting and static electricity removing method |
-
2021
- 2021-09-23 CN CN202111114388.4A patent/CN113990776A/en not_active Withdrawn
- 2021-12-17 WO PCT/CN2021/139136 patent/WO2023045131A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115835465A (en) * | 2023-02-13 | 2023-03-21 | 杭州芯云半导体技术有限公司 | Side ESD dissipation device, method and installation method for sorting machine |
| CN115835465B (en) * | 2023-02-13 | 2023-05-30 | 杭州芯云半导体技术有限公司 | ESD (electrostatic discharge) dissipation device at side of sorting machine, electrostatic dissipation method and installation method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023045131A1 (en) | 2023-03-30 |
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