CN113492468B

CN113492468B - Automatic feeding and discharging double-shaft grinding wheel scribing machine for semiconductor wafer processing

Info

Publication number: CN113492468B
Application number: CN202110765214.8A
Authority: CN
Inventors: 胡天; 龚胜; 陈逢军; 徐志强
Original assignee: Hunan Aikairuisi Intelligent Technology Co ltd
Current assignee: Hunan Aikairuisi Intelligent Technology Co ltd
Priority date: 2021-07-07
Filing date: 2021-07-07
Publication date: 2021-12-07
Anticipated expiration: 2041-07-07
Also published as: CN113492468A

Abstract

The invention belongs to the technical field of scribing machines, and discloses an automatic feeding and discharging double-shaft grinding wheel scribing machine for processing a semiconductor wafer. The automatic loading and unloading double-shaft grinding wheel scribing machine for processing the semiconductor wafer comprises a section bar rack, a marble lathe bed arranged on the section bar rack, a workpiece receiving and releasing device arranged on one side of the section bar rack, a workpiece workbench and a Y-Z shaft feeding system which are arranged on the marble lathe bed, a double-shaft scribing device arranged on the Y-Z shaft feeding system, and a manipulator loading and unloading device arranged above the workpiece workbench; the Y-Z axis feed system includes a Y axis feed module. The automatic feeding and discharging double-shaft grinding wheel scribing machine for processing the semiconductor wafer can accurately scribe various workpieces in a double-spindle mode, and can automatically feed and discharge the workpieces through the manipulator feeding and discharging device driven by the Y-axis feeding module, so that the size of equipment is saved, and the efficiency is high; the precision is high; the practicability is wide; strong adaptability and the like.

Description

Automatic feeding and discharging double-shaft grinding wheel scribing machine for semiconductor wafer processing

Technical Field

The invention relates to the technical field of scribing machines, in particular to an automatic feeding and discharging double-shaft grinding wheel scribing machine for processing semiconductor wafers.

Background

With the continuous development of the high and new technology field, the diode wafer; the demand for various semiconductor integrated circuit wafers such as silicon wafers is also increasing, which makes the integrated circuit industry such as semiconductors rapidly developed. Precision dicing equipment is often required in the manufacturing process of semiconductor wafers.

Most of the traditional grinding wheel type wafer scribing equipment adopts manual feeding and discharging, and the processing precision is low in the processing process; the processing efficiency is low; low automation degree and the like. In the production process pursuing high efficiency and high precision, the conventional scribing equipment has failed to meet the required requirements, and therefore, the development of a novel scribing equipment is urgently needed.

In order to solve the technical problems, the invention provides an automatic loading and unloading scribing machine which is named as an automatic loading and unloading scribing machine in China patent grant publication No. CN 106217214B, publication No. 2018, 2, 6, and comprises a rack, wherein an automatic material receiving and releasing device is arranged on one side of the rack, an automatic workpiece grabbing system is arranged above a scribing worktable and used for conveying workpieces loaded by the automatic material receiving and releasing device to the scribing worktable for scribing, and discharging cut workpieces through the automatic material receiving and releasing device, and a scribing main shaft device is used for scribing the workpieces on the scribing worktable through a scribing cutter along with the forward and backward movement and the up and down sliding of a Y-Z shafting feeding system. The invention can be high in precision; the efficiency is high; the workpiece feeding is automatically and stably finished; and (6) blanking. However, the equipment has the advantages of complex structure, high price and low practicability, and is not suitable for large-scale popularization in the industry.

Disclosure of Invention

The invention aims to provide an automatic loading and unloading double-shaft grinding wheel scribing machine for semiconductor wafer processing, and aims to solve the problems of complex structure, high price and low practicability of wafer scribing equipment.

In order to achieve the purpose, the invention is realized by the following technical scheme: an automatic loading and unloading double-shaft grinding wheel scribing machine for processing semiconductor wafers comprises a section bar rack, a marble lathe bed arranged on the section bar rack, a workpiece placing and receiving device arranged on one side of the section bar rack, a workpiece workbench and a Y-Z shaft feeding system which are arranged on the marble lathe bed, a double-shaft scribing device arranged on the Y-Z shaft feeding system, and a manipulator loading and unloading device arranged above the workpiece workbench.

The Y-Z axis feeding system comprises a Y axis feeding module; a first Z-axis feeding module and a second Z-axis feeding module; the first Z-axis feeding module and the second Z-axis feeding module are respectively arranged at two ends of the Y-axis feeding module.

The double-shaft scribing device comprises a first main shaft scribing device and a second main shaft scribing device which are respectively arranged on the first Z-axis feeding module and the second Z-axis feeding module.

Preferably, the workpiece receiving device comprises a workpiece box and a lifting platform assembly; the lifting platform assembly is used for driving the workpiece box to move up and down; the workpiece box is positioned above the lifting platform component.

Preferably, the workpiece box comprises a box frame, a bottom plate arranged below the box frame and a baffle plate arranged behind the box frame; the left side and the right side in the box frame are provided with a plurality of dividing grooves for storing workpiece discs; a handle is arranged above the box frame; and a positioning block is arranged at the bottom of the bottom plate.

Preferably, the lifting platform assembly comprises a mounting frame, a bottom box arranged above the mounting frame, a baffle arranged above the bottom box, a support plate arranged below the mounting frame and a motor fixedly arranged on the support plate; the mounting frame is fixedly connected with a linear bearing; the supporting plate is connected with the bottom box through an optical axis; the bottom box can move up and down under the driving of a motor; and an anti-collision ring is arranged on the optical axis.

Preferably, the workpiece table comprises an X-axis feed module; rotating the vacuum adsorption disc; the rotary vacuum adsorption device comprises an ejection module and a waterproof module, wherein the rotary vacuum adsorption disc and the ejection module are arranged on an X-axis feeding module, and the waterproof module is arranged on the X-axis feeding module and used for waterproof protection.

Preferably, the ejection module comprises a mounting plate arranged above the X-axis feeding module, and four cylinders fixedly mounted on the mounting plate, wherein two front push plates and two rear plates are arranged on the left side and the right side above the cylinders respectively and can be driven by the cylinders to move up and down.

Preferably, one side of each baffle close to the workpiece workbench is provided with a dirt removing mechanism, each dirt removing mechanism comprises a material passing plate, the outer sides of the two baffles are respectively provided with a guide groove, the two sides of each material passing plate are fixedly connected with an L-shaped rod, and the two L-shaped rods are clamped in the two guide grooves, the material passing plate is fixedly connected with the corresponding front push plate through bolts, the material passing plate is provided with a strip-shaped hole for a workpiece disc to pass through, a sewage suction cavity is arranged in the material passing plate and at the upper side of the strip-shaped hole, the front side of the material passing plate is provided with a sewage discharge hole, the sewage discharge hole is communicated with the sewage suction cavity, the upper wall of the strip-shaped hole is provided with a sewage suction hole for being externally connected with dust collection equipment, and the sewage pumping hole is communicated with the sewage sucking cavity, the sewage pumping hole is fixedly communicated with a sewage pumping hose, the sewage pumping hose is positioned in the strip-shaped hole, the shielding film is adhered between the sewage pumping hose and the workpiece box on the upper wall of the strip-shaped hole, and the shielding film is contacted with the sewage pumping hose.

Preferably, the manipulator loading and unloading device comprises a gas claw; a guide assembly; a sliding component and a mounting component; the pneumatic gripper is installed at the last unloader end of manipulator for go up unloading to the work piece dish, eight and along bar shape hole length direction equidistance arrangement are no less than to the quantity of taking out dirty hose, take out dirty hose and keep away from the top of sheltering from film one side and be provided with the fold in order to conveniently buckle, the bottom opening of taking out dirty hose is isosceles triangle, and its one side that is close to sheltering from the film is its base, take out dirty hose and the bottom that shelters from the film all contact with the lower wall in bar shape hole.

Preferably, the sliding assembly comprises a guide rail mounting plate fixedly mounted on the section bar rack, a linear guide rail mounted on the guide rail mounting plate, a first sliding block and a second sliding block which can slide left and right on the linear guide rail, and a manipulator sliding table mounted on the first sliding block and the second sliding block.

Preferably, the mounting assembly comprises a manipulator arm fixedly mounted on the front side of the manipulator sliding table and a manipulator mounting plate fixedly mounted on the rear side of the manipulator sliding table, and the guide assembly comprises a guide cylinder mounted above the manipulator mounting plate; a guide pin fixed below the guide cylinder; the positioning plate is positioned on the upper side of the guide cylinder, and the manipulator push plate is fixedly arranged on the second spindle scribing device.

By adopting the technical scheme, the invention has the beneficial effects that:

1; this semiconductor wafer processing is with automatic unloading biax emery wheel scriber of going up, this equipment can carry out the accurate cutting to multiple work piece under two main shaft modes to can carry out automatic unloading of going up to the work piece through the unloader on the manipulator by Y axle feed module driven, simplified equipment structure, reduced the drive part number, saved the volume of equipment, have advantages such as high efficiency, high accuracy, practicality are wide, strong adaptability.

2; this automatic unloading biax emery wheel scribing machine of going up for semiconductor wafer processing adopts brand-new scrubbing mechanism, to the structural feature after the wafer processing, can the pertinence carry out high-efficient the collection to the impurity that the scribing produced, ensures the wafer cleanliness factor.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the hidden rack of the present invention;

FIG. 2 is a schematic view of a work receiving apparatus according to the present invention;

FIG. 3 is a schematic view of the construction of the work box of the present invention;

FIG. 4 is a schematic view of the bottom structure of the workpiece box of the present invention;

FIG. 5 is a schematic view of a workpiece table of the present invention;

FIG. 6 is a schematic view of the overall structure of the loading and unloading apparatus of the robot of the present invention;

FIG. 7 is a left side view of the loading/unloading structure of the robot of the present invention;

FIG. 8 is an enlarged partial schematic view of the robot mounting assembly of the present invention;

FIG. 9 is a schematic view of the overall elevation structure of the present invention;

FIG. 10 is a schematic diagram of the overall left side view configuration of the present invention;

FIG. 11 is a schematic diagram of the overall right view configuration of the present invention;

FIG. 12 is a schematic view of the installation structure of the dirt removing mechanism and the baffle plate of the present invention;

FIG. 13 is a schematic structural view of the decontaminating mechanism of the present invention;

FIG. 14 is a front cross-sectional view of a material passing plate of the present invention;

FIG. 15 is a schematic view of the structure of the guide groove of the baffle plate of the present invention;

fig. 16 is a schematic view of the construction of the drain hose of the present invention.

In the figure: 1, a section bar frame; 2, a marble lathe bed; 3, a workpiece accommodating device; 31 a work box; 311 boxes; 312 a base plate; 313 baffle plate; 314 a handle; 315 a positioning block; 316 separating the groove; 32 a lift platform assembly; a motor 321; 322 supporting the plate; 323 optical axis; 324 a base; 325 baffle plate; 326 a mounting bracket; 327 linear bearings; 328 fixing base; 329 an anti-collision ring; 4, a workpiece workbench; a 41X-axis feed module; 42 rotating the vacuum adsorption disk; 43 a topping module; 431 cylinders; 432 mounting plate; 433 front push plate; 434 rear push plate; 44 a waterproof module; 5, a main shaft scribing device; 51 a first spindle device; 52 a second spindle assembly; 6, a manipulator loading and unloading device; 61, air claw; 62 a guide assembly; 621 a guide cylinder; 622 guide pins; 623 positioning plates; 624 pushing the plate by the manipulator; 63 a sliding component; 631 a linear guide; 632 a guide rail mounting plate; 633 a first slider; 634 second slide block; 635 mechanical arm sliding table; 64 mounting the assembly; 641 an arm; 642 mounting the manipulator; 7 YZ-axis feed systems; 71Y-axis feed module; 72 a first Z-axis feed module; 73 a second Z-axis feed module; 8, a workpiece disc; 9 a decontamination mechanism; 91 passing a material plate; 92 a guide groove; 93L-shaped rods; 94 strip-shaped holes; 95 a sewage suction cavity; 96 sewage draining holes; 97 a sewage pumping hole; 98 a sewage pumping hose; 99 masking the film; 10 folds.

Detailed Description

Referring to fig. 1-16, the present invention provides a technical solution: an automatic loading and unloading double-shaft grinding wheel scribing machine for processing semiconductor wafers comprises a section frame 1, a marble bed body 2 arranged on the section frame 1, a workpiece accommodating device 3 arranged on one side of the section frame 1, a workpiece workbench 4 and a Y-Z-axis feeding system 7 which are arranged on the marble bed body 2, a double-shaft scribing device 5 arranged on the Y-Z-axis feeding system, and a manipulator loading and unloading device 6 arranged above the workpiece workbench 4.

The Y-Z axis feed system 7 includes a Y-axis feed module 71; a first Z-axis feeding module 72 and a second Z-axis feeding module 73; the first Z-axis feeding module 72 and the second Z-axis feeding module 73 are respectively installed at both ends of the Y-axis feeding module 71.

The dual-axis dicing apparatus 5 includes a first spindle dicing apparatus 51 and a second spindle dicing apparatus 52 mounted on a first Z-axis feeding module 72 and a second Z-axis feeding module 73, respectively.

Preferably, the workpiece receiver 3 includes a workpiece box 31 and a lifting platform assembly 32; the lifting platform assembly 32 is used for driving the workpiece box 31 to move up and down; the work box 31 is positioned above the lift platform assembly 32.

Preferably, the work box 31 includes a box frame 311, a bottom plate 312 installed below, and a stopper 313 installed behind; the left side and the right side inside the box frame 311 are provided with a plurality of dividing grooves 316 for storing the workpiece disc 8; a handle 314 is arranged above the box frame 311; the bottom of the bottom plate 312 is provided with a positioning block 315.

Preferably, the elevating platform assembly 32 includes a mounting bracket 326, a bottom case 324 disposed above the mounting bracket 326, a baffle 325 disposed above the bottom case 324, a support plate 322 disposed below the mounting bracket 326, and a motor 321 fixedly mounted on the support plate 322; the mounting bracket 326 is fixedly connected with a linear bearing 327; the supporting plate 322 is connected with the bottom case 324 through an optical axis 323; the bottom box 324 can move up and down by being driven by a motor 321; an anti-collision ring 329 is arranged on the optical axis 323.

Preferably, the workpiece table 4 comprises an X-axis feeding module 41; the rotary vacuum adsorption disk 42; the rotary vacuum adsorption disc 42 and the ejection module 43 are arranged on the X-axis feeding module 41, and the waterproof module 44 is arranged on the X-axis feeding module 41 and used for waterproof protection.

Preferably, the ejector module 43 includes a mounting plate 432 mounted above the X-axis feeding module 41, and four air cylinders 431 fixedly mounted on the mounting plate 432, and two front push plates 433 and two rear plates 434 are respectively provided on both left and right sides above the air cylinders 431 and can be moved up and down by the driving of the air cylinders 431.

Preferably, a dirt removing mechanism 9 is arranged on one side of the baffle 325 close to the workpiece workbench 4, the dirt removing mechanism 9 comprises a material passing plate 91, guide grooves 92 are respectively formed on the outer sides of the two baffle 325, L-shaped rods 93 are fixedly connected to the two sides of the material passing plate 91, the two L-shaped rods 93 are clamped in the two guide grooves 92, the material passing plate 91 is fixedly connected with corresponding front push plates 433 through bolts, a strip-shaped hole 94 is formed in the material passing plate 91 and used for allowing a workpiece disc 8 to pass through, a dirt suction cavity 95 is formed in the material passing plate 91 and located on the upper side of the strip-shaped hole 94, a dirt discharge hole 96 is formed in the front side of the material passing plate 91 and communicated with the dirt suction cavity 95, a dirt suction hole 97 is formed in the upper wall of the strip-shaped hole 94 and used for externally connecting dust collecting equipment, the dirt suction hole 97 is communicated with the dirt suction cavity 95, a dirt suction hose 98 is fixedly communicated with the dirt suction hole 97, and the dirt suction hose 98 is located in the strip-shaped hole 94, a shielding film 99 is adhered to the upper wall of the strip-shaped hole 94 and between the dirt suction hose 98 and the workpiece box, and the shielding film 99 is in contact with the dirt suction hose 98.

Preferably, the manipulator loading and unloading device 6 comprises a gas claw 61; a guide assembly 62; glide assembly 63 and mount assembly 64; the gas claw 61 is arranged at the tail end of the manipulator loading and unloading device 6 and is used for loading and unloading the workpiece disc 8, the number of the dirt pumping hoses 98 is not less than eight and the dirt pumping hoses are arranged at equal intervals along the length direction of the strip-shaped hole 94, the top end of the dirt pumping hose 98, which is far away from the side of the masking film 99, is provided with a fold 10 for facilitating bending, the bottom end opening of the dirt pumping hose 98 is in an isosceles triangle shape, and one side of the dirt-pumping hose 98 close to the shielding film is the bottom edge of the shielding film, the bottom ends of the dirt-pumping hose 98 and the shielding film 99 are both contacted with the lower wall of the strip-shaped hole 94, the dirt-pumping hose 98 can be used for pumping out impurities of the wafer subjected to scribing, the bendable dirt-pumping hose 98 can be used for realizing accurate dirt pumping for the position of a cutting groove after scribing, the cleanliness 99 of the wafer subjected to scribing is ensured, and the triangular opening design helps to pull the dirt hose 98 into the cutting slot and push out the dust generated by the cut.

Preferably, the sliding assembly 63 includes a guide rail mounting plate 632 fixedly mounted on the profile frame 1, a linear guide rail 631 mounted on the guide rail mounting plate 632, a first slider 633 and a second slider 634 capable of sliding on the linear guide rail 631 left and right, and a manipulator sliding table 635 mounted on the first slider 633 and the second slider 634.

Preferably, the mounting assembly 64 includes a robot arm 641 fixedly mounted on the front side of the robot sliding table 635 and a robot mounting plate 642 fixedly mounted on the rear side of the robot sliding table 635, and the guide assembly 62 includes a guide cylinder 621 mounted above the robot mounting plate 642; a guide pin 622 fixed below the guide cylinder 621; a positioning plate 623 positioned at the upper side of the guide cylinder 621 and a robot push plate 624 fixedly mounted on the second spindle scribing device 52.

When the automatic loading and unloading double-shaft grinding wheel dicing saw for processing the semiconductor wafer works, the external dust suction equipment is respectively started through the sewage discharge hole 96, the workpiece disc 8 is placed in the workpiece box 31 in the workpiece accommodating device 3, go up unloading through last unloader 6 of manipulator, it links to each other with manipulator push pedal 624 on second main shaft scribing device 52 to drive guide pin 622 through direction cylinder 621 on last unloader 6 of manipulator, unloader 6 of manipulator removes about the drive of Y axle feed module 71, cylinder 431 among liftout module 43 jack-up push pedal upwards, the work piece dish 8 of getting is got to rethread gas claw 621 and is drawn the material, work piece dish 8 slides to work piece workstation 4 top along preceding push pedal 433 and back push pedal 434, loosen gas claw 621 this moment, cylinder 431 moves down, work piece dish 8 is placed on work piece workstation 4, accomplish the material loading process.

When scribing is performed, the guide cylinder 621 of the manipulator loading and unloading device 6 drives the guide pin 622 to be disconnected from the manipulator push plate 624 fixedly mounted on the second spindle scribing device 52, the manipulator loading and unloading device 6 is hung on the linear guide rail 631 mounted on the section bar frame 1 and does not move left and right along with the Y-axis feeding module 71, and the first spindle scribing device 51 and the second spindle scribing device 52 scribe the workpiece disc 8 along with the left and right movement and up and down movement of the YZ-axis feeding system 7, the front and back movement of the Z-axis feeding module 41 and the rotary movement of the rotary vacuum adsorption disc 42.

After scribing is finished, the connection operation of the manipulator feeding and discharging device 6 and the Y-axis feeding module 71 is repeated, the material ejecting module 43 ejects the workpiece disc 8 upwards, the air claw 621 clamps the workpiece disc 8, the workpiece disc 8 is driven by the Y-axis feeding module 71 to move left and right, the workpiece disc 8 is pushed to the workpiece accommodating device 3 to be stored, in the material pushing process, the workpiece disc 8 passes through the strip-shaped hole 94, the shielding film 99 is lifted, part of the dirt suction hose 98 is clamped into the cutting groove, scribing impurities are removed, and the discharging process is finished.

The lifting platform assembly 32 on the workpiece accommodating device 3 moves upwards one grid under the driving of the motor 321, and then the feeding operation is carried out, so that the automatic feeding and discharging operation is circularly realized.

The above-mentioned embodiments are merely illustrative of the preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, and various modifications and improvements made to the technical solution of the present invention by those skilled in the art without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. The utility model provides a semiconductor wafer processing is with automatic unloading biax emery wheel wafer scriber of going up, includes section bar frame (1), dress marble lathe bed (2) on section bar frame (1), its characterized in that: the marble cutting machine further comprises a workpiece accommodating device (3) arranged on one side of the section frame (1), a workpiece workbench (4) and a Y-Z shaft feeding system (7) which are arranged on the marble lathe bed (2), a double-shaft scribing device (5) arranged on the Y-Z shaft feeding system, and a manipulator loading and unloading device (6) arranged above the workpiece workbench (4);

the Y-Z axis feeding system (7) comprises a Y axis feeding module (71); a first Z-axis feed module (72) and a second Z-axis feed module (73); the first Z-axis feeding module (72) and the second Z-axis feeding module (73) are respectively arranged at two ends of the Y-axis feeding module (71);

the double-shaft scribing device (5) comprises a first main shaft scribing device (51) and a second main shaft scribing device (52) which are respectively arranged on a first Z-axis feeding module (72) and a second Z-axis feeding module (73);

the workpiece accommodating device (3) comprises a workpiece box (31) and a lifting platform assembly (32); the lifting platform component (32) is used for driving the workpiece box (31) to move up and down; the workpiece box (31) is positioned above the lifting platform component (32);

the workpiece box (31) comprises a box frame (311), a bottom plate (312) arranged below and a blocking piece (313) arranged behind; the left side and the right side of the interior of the box frame (311) are provided with a plurality of dividing grooves (316) for storing the workpiece disc (8); a handle (314) is arranged above the box frame (311); a positioning block (315) is arranged at the bottom of the bottom plate (312);

the lifting platform assembly (32) comprises a mounting frame (326), a bottom box (324) arranged above the mounting frame (326), a baffle plate (325) arranged above the bottom box (324), a support plate (322) arranged below the mounting frame (326) and a motor (321) fixedly arranged on the support plate (322); the mounting frame (326) is fixedly connected with a linear bearing (327); the supporting plate (322) is connected with the bottom box (324) through an optical axis (323); the bottom box (324) can move up and down by being driven by a motor (321); an anti-collision ring (329) is arranged on the optical axis (323);

the workpiece table (4) comprises an X-axis feeding module (41); a rotating vacuum adsorption disk (42); the rotary vacuum adsorption disc comprises an ejection module (43) and a waterproof module (44), the rotary vacuum adsorption disc (42) and the ejection module (43) are arranged on an X-axis feeding module (41), and the waterproof module (44) is arranged on the X-axis feeding module (41) and used for waterproof protection;

the material ejecting module (43) comprises a mounting plate (432) arranged above the X-axis feeding module (41) and four cylinders (431) fixedly arranged on the mounting plate (432), two front push plates (433) and two rear plates (434) are respectively arranged on the left side and the right side above the cylinders (431), and can be driven by the cylinders (431) to move up and down;

the cleaning device is characterized in that a cleaning mechanism (9) is arranged on one side, close to the workpiece workbench (4), of the baffle plate (325), the cleaning mechanism (9) comprises two baffle plates (91), guide grooves (92) are formed in the outer sides of the two baffle plates (325), L-shaped rods (93) are fixedly connected to the two sides of each baffle plate (91), the two L-shaped rods (93) are clamped in the two guide grooves (92), each baffle plate (91) is fixedly connected with the corresponding front push plate (433) through a bolt, a strip-shaped hole (94) is formed in each baffle plate (91) and used for allowing a workpiece disc (8) to pass through, a dirt suction cavity (95) is formed in each baffle plate (91) and located on the upper side of the strip-shaped hole (94), a dirt discharge hole (96) is formed in the front side of each baffle plate (91), the dirt discharge hole (96) is communicated with the dirt suction cavity (95), and a dirt suction hole (97) is formed in the upper wall of each strip-shaped hole (94) and used for external dust collection equipment, and take out dirty hole (97) and soil pick-up chamber (95) intercommunication, take out dirty hole (97) department fixed intercommunication have take out dirty hose (98), take out dirty hose (98) and be in bar hole (94), the upper wall of bar hole (94) just is in to take out to bond between dirty hose (98) and the work piece box and has sheltered from film (99), shelters from film (99) and takes out dirty hose (98) contact.

2. The automatic loading and unloading biaxial grinding wheel dicing saw for semiconductor wafer processing as set forth in claim 1, wherein: the manipulator loading and unloading device (6) comprises a pneumatic claw (61); a guide assembly (62); a sliding assembly (63) and a mounting assembly (64); pneumatic claw (61) are installed at manipulator unloader (6) end for go up unloading to work piece dish (8), eight and along bar hole (94) length direction equidistance are no less than in the quantity of taking out dirty hose (98), the top of taking out dirty hose (98) and keeping away from sheltering from film (99) one side is provided with fold (10) in order to make things convenient for buckling, the bottom opening of taking out dirty hose (98) is isosceles triangle, and its one side that is close to sheltering from film (99) is its base, the bottom of taking out dirty hose (98) and sheltering from film (99) all contacts with the lower wall in bar hole (94).

3. The automatic loading and unloading biaxial grinding wheel dicing saw for semiconductor wafer processing as set forth in claim 2, wherein: the sliding assembly (63) comprises a guide rail mounting plate (632) fixedly mounted on the section bar rack (1), a linear guide rail (631) mounted on the guide rail mounting plate (632), a first sliding block (633) and a second sliding block (634) which can slide left and right on the linear guide rail (631), and a manipulator sliding table (635) mounted on the first sliding block (633) and the second sliding block (634).

4. The automatic loading and unloading biaxial grinding wheel dicing saw for semiconductor wafer processing as set forth in claim 3, wherein: the mounting assembly (64) comprises a manipulator arm (641) fixedly mounted on the front side of the manipulator sliding table (635) and a manipulator mounting plate (642) fixedly mounted on the rear side of the manipulator sliding table (635), and the guide assembly (62) comprises a guide cylinder (621) mounted above the manipulator mounting plate (642); a guide pin (622) fixed below the guide cylinder (621); a positioning plate (623) positioned at the upper side of the guide cylinder (621) and a manipulator push plate (624) fixedly arranged on the second main shaft scribing device (52).