CN113980535A - 保护膜形成膜、保护膜形成用复合片、以及带保护膜的半导体芯片的制造方法 - Google Patents

保护膜形成膜、保护膜形成用复合片、以及带保护膜的半导体芯片的制造方法 Download PDF

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Publication number
CN113980535A
CN113980535A CN202111107427.8A CN202111107427A CN113980535A CN 113980535 A CN113980535 A CN 113980535A CN 202111107427 A CN202111107427 A CN 202111107427A CN 113980535 A CN113980535 A CN 113980535A
Authority
CN
China
Prior art keywords
protective film
film
film forming
forming
ultraviolet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111107427.8A
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English (en)
Chinese (zh)
Inventor
小桥力也
山本大辅
加太章生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN113980535A publication Critical patent/CN113980535A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/402—Coloured
    • B32B2307/4026—Coloured within the layer by addition of a colorant, e.g. pigments, dyes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CN202111107427.8A 2014-10-29 2015-10-23 保护膜形成膜、保护膜形成用复合片、以及带保护膜的半导体芯片的制造方法 Pending CN113980535A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014220295 2014-10-29
JP2014-220295 2014-10-29
CN201580058160.4A CN107112219A (zh) 2014-10-29 2015-10-23 保护膜形成膜及保护膜形成用复合片

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201580058160.4A Division CN107112219A (zh) 2014-10-29 2015-10-23 保护膜形成膜及保护膜形成用复合片

Publications (1)

Publication Number Publication Date
CN113980535A true CN113980535A (zh) 2022-01-28

Family

ID=55857381

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201580058160.4A Pending CN107112219A (zh) 2014-10-29 2015-10-23 保护膜形成膜及保护膜形成用复合片
CN202111107427.8A Pending CN113980535A (zh) 2014-10-29 2015-10-23 保护膜形成膜、保护膜形成用复合片、以及带保护膜的半导体芯片的制造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201580058160.4A Pending CN107112219A (zh) 2014-10-29 2015-10-23 保护膜形成膜及保护膜形成用复合片

Country Status (6)

Country Link
JP (1) JP6585068B2 (fr)
KR (1) KR102467143B1 (fr)
CN (2) CN107112219A (fr)
SG (1) SG11201703250YA (fr)
TW (1) TWI671338B (fr)
WO (1) WO2016068042A1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI731964B (zh) * 2016-04-28 2021-07-01 日商琳得科股份有限公司 保護膜形成用複合片
TWI796297B (zh) * 2016-04-28 2023-03-21 日商琳得科股份有限公司 保護膜形成用複合片
TWI642544B (zh) * 2016-10-11 2018-12-01 武漢市三選科技有限公司 Sheet for forming cut-off substrate protective film, preparation method thereof, circuit board therewith and preparation method thereof
SG11201907214VA (en) * 2017-02-09 2019-09-27 Lintec Corp Curable resin film and sheet for forming a first protective film
JP6956193B2 (ja) * 2017-09-25 2021-11-02 富士フイルム株式会社 硬化性組成物、膜、赤外線透過フィルタ、固体撮像素子および光センサ
TW201936824A (zh) * 2017-10-27 2019-09-16 日商琳得科股份有限公司 保護膜形成用膜、保護膜形成用複合片及半導體晶片的製造方法
KR102529495B1 (ko) 2017-10-27 2023-05-04 린텍 가부시키가이샤 보호막 형성용 복합 시트 및 반도체 칩의 제조 방법
TWI810213B (zh) 2017-10-27 2023-08-01 日商琳得科股份有限公司 保護膜形成用複合片及半導體晶片的製造方法
TWI798277B (zh) 2017-10-27 2023-04-11 日商琳得科股份有限公司 保護膜形成用複合片及半導體晶片的製造方法
CN111279468B (zh) * 2017-10-27 2023-10-20 琳得科株式会社 保护膜形成用膜、保护膜形成用复合片及半导体芯片的制造方法
KR102175717B1 (ko) * 2017-12-14 2020-11-06 주식회사 엘지화학 다이싱 다이 본딩 필름
JP6916836B2 (ja) * 2019-05-14 2021-08-11 日東電工株式会社 積層体の製造方法
JP7333211B2 (ja) * 2019-06-21 2023-08-24 リンテック株式会社 保護膜形成用複合シート、及び保護膜付き半導体チップの製造方法
JP2021075620A (ja) * 2019-11-08 2021-05-20 リンテック株式会社 接着フィルム及び接着複合シート

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10172931A (ja) * 1996-12-05 1998-06-26 Mitsui Chem Inc 半導体ウエハの裏面研削方法及び該方法に用いる粘着フィルム
JP2004051736A (ja) * 2002-07-18 2004-02-19 Nitto Denko Corp 紫外線硬化型粘着シート

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3544362B2 (ja) * 2001-03-21 2004-07-21 リンテック株式会社 半導体チップの製造方法
JP2003305792A (ja) * 2002-04-15 2003-10-28 Toray Ind Inc 積層樹脂シート
JP5090695B2 (ja) * 2006-09-08 2012-12-05 大倉工業株式会社 偏光板の製造方法
JP2009036797A (ja) * 2007-07-31 2009-02-19 Nitto Denko Corp 光学フィルム、偏光板、および画像表示装置
JP2009138026A (ja) * 2007-12-03 2009-06-25 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP5640051B2 (ja) 2009-01-30 2014-12-10 日東電工株式会社 半導体装置の製造方法
JP5249290B2 (ja) 2010-07-20 2013-07-31 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
CN102516889B (zh) * 2011-12-07 2013-09-25 深圳市鑫东邦科技有限公司 一种高透光率的可紫外线固化的胶粘剂

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10172931A (ja) * 1996-12-05 1998-06-26 Mitsui Chem Inc 半導体ウエハの裏面研削方法及び該方法に用いる粘着フィルム
JP2004051736A (ja) * 2002-07-18 2004-02-19 Nitto Denko Corp 紫外線硬化型粘着シート

Also Published As

Publication number Publication date
CN107112219A (zh) 2017-08-29
JP6585068B2 (ja) 2019-10-02
WO2016068042A1 (fr) 2016-05-06
TWI671338B (zh) 2019-09-11
JPWO2016068042A1 (ja) 2017-08-10
SG11201703250YA (en) 2017-05-30
KR102467143B1 (ko) 2022-11-14
TW201620963A (zh) 2016-06-16
KR20170078630A (ko) 2017-07-07

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