CN113921419B - 光加热装置及加热处理方法 - Google Patents

光加热装置及加热处理方法

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Publication number
CN113921419B
CN113921419B CN202110733073.1A CN202110733073A CN113921419B CN 113921419 B CN113921419 B CN 113921419B CN 202110733073 A CN202110733073 A CN 202110733073A CN 113921419 B CN113921419 B CN 113921419B
Authority
CN
China
Prior art keywords
light
substrate
temperature
main surface
led element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110733073.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN113921419A (zh
Inventor
北川铁也
沟尻贵文
中村祥章
横森岳彦
金津桂太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ushio Denki KK
Original Assignee
Ushio Denki KK
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Filing date
Publication date
Application filed by Ushio Denki KK filed Critical Ushio Denki KK
Publication of CN113921419A publication Critical patent/CN113921419A/zh
Application granted granted Critical
Publication of CN113921419B publication Critical patent/CN113921419B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/27—Control of temperature characterised by the use of electric means with sensing element responsive to radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H05B45/18—Controlling the intensity of the light using temperature feedback
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • H05B47/155—Coordinated control of two or more light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • H05B47/16—Controlling the light source by timing means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Control Of Resistance Heating (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Furnace Details (AREA)
CN202110733073.1A 2020-07-10 2021-06-28 光加热装置及加热处理方法 Active CN113921419B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-118998 2020-07-10
JP2020118998A JP7501177B2 (ja) 2020-07-10 2020-07-10 光加熱装置及び加熱処理方法

Publications (2)

Publication Number Publication Date
CN113921419A CN113921419A (zh) 2022-01-11
CN113921419B true CN113921419B (zh) 2026-01-20

Family

ID=79173377

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110733073.1A Active CN113921419B (zh) 2020-07-10 2021-06-28 光加热装置及加热处理方法

Country Status (5)

Country Link
US (1) US12171051B2 (https=)
JP (1) JP7501177B2 (https=)
KR (1) KR102796647B1 (https=)
CN (1) CN113921419B (https=)
TW (1) TWI849313B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102401862B1 (ko) * 2018-06-25 2022-05-25 가부시키가이샤 스크린 홀딩스 열처리 방법 및 열처리 장치
US12322613B2 (en) * 2019-08-07 2025-06-03 Samsung Electronics Co., Ltd. Pressure heating apparatus
JP7445571B2 (ja) * 2020-09-24 2024-03-07 東京エレクトロン株式会社 加熱装置及び加熱方法
JP7750154B2 (ja) * 2022-03-28 2025-10-07 ウシオ電機株式会社 光加熱装置、加熱処理方法
JP7750120B2 (ja) * 2022-01-26 2025-10-07 ウシオ電機株式会社 光加熱装置
JP2024006279A (ja) * 2022-07-01 2024-01-17 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
JP2024129925A (ja) * 2023-03-14 2024-09-30 株式会社Ｓｃｒｅｅｎホールディングス 放射率調整方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261038A (ja) * 2001-03-02 2002-09-13 Tokyo Electron Ltd 熱処理装置
JP4029613B2 (ja) * 2001-12-25 2008-01-09 ウシオ電機株式会社 閃光放射装置および光加熱装置
JP4558411B2 (ja) * 2004-08-24 2010-10-06 富士通セミコンダクター株式会社 急速熱処理装置及び方法
US7102141B2 (en) * 2004-09-28 2006-09-05 Intel Corporation Flash lamp annealing apparatus to generate electromagnetic radiation having selective wavelengths
JP4862280B2 (ja) 2005-05-18 2012-01-25 ウシオ電機株式会社 半導体ウエハ急速加熱装置
US9498845B2 (en) * 2007-11-08 2016-11-22 Applied Materials, Inc. Pulse train annealing method and apparatus
EP3573092B1 (en) * 2008-05-02 2021-12-22 Applied Materials, Inc. System for non radial temperature control for rotating substrates
US8404499B2 (en) * 2009-04-20 2013-03-26 Applied Materials, Inc. LED substrate processing
US9499909B2 (en) * 2013-03-15 2016-11-22 Applied Materials, Inc. Methods for photo-excitation of precursors in epitaxial processes using a rotary scanning unit
JP6770915B2 (ja) * 2017-03-08 2020-10-21 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
JP7461214B2 (ja) * 2020-05-19 2024-04-03 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
JP7677797B2 (ja) * 2021-01-07 2025-05-15 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
JP2024046797A (ja) * 2022-09-26 2024-04-05 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
JP2024116492A (ja) * 2023-02-16 2024-08-28 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置

Also Published As

Publication number Publication date
US12171051B2 (en) 2024-12-17
JP2022015867A (ja) 2022-01-21
KR20220007520A (ko) 2022-01-18
TW202205386A (zh) 2022-02-01
TWI849313B (zh) 2024-07-21
KR102796647B1 (ko) 2025-04-16
US20220015213A1 (en) 2022-01-13
JP7501177B2 (ja) 2024-06-18
CN113921419A (zh) 2022-01-11

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