CN113873765A - Circuit board manufacturing method and circuit board - Google Patents
Circuit board manufacturing method and circuit board Download PDFInfo
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- CN113873765A CN113873765A CN202111150363.XA CN202111150363A CN113873765A CN 113873765 A CN113873765 A CN 113873765A CN 202111150363 A CN202111150363 A CN 202111150363A CN 113873765 A CN113873765 A CN 113873765A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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Abstract
The invention relates to the technical field of circuit board manufacturing, and provides a circuit board manufacturing method, which comprises the following steps: providing a core board, wherein the core board comprises a first metal layer, a second metal layer and a dielectric layer, the first metal layer and the second metal layer are oppositely arranged, and the dielectric layer is positioned between the first metal layer and the second metal layer; processing first blind holes in a plurality of first areas on one surface of the first metal layer, which is far away from the second metal layer, wherein the bottoms of the first blind holes penetrate through the dielectric layer and extend to the second metal layer; second blind holes are processed in a plurality of second areas on the surface, far away from the first metal layer, of the second metal layer, the bottom of each second blind hole penetrates through the dielectric layer and extends to the first metal layer, and the plurality of first areas and the plurality of second areas are arranged in a staggered mode. The invention also provides a circuit board. The manufacturing method of the circuit board can avoid the core board from warping and irregular deformation caused by uneven stress, improve the dimensional stability and the process stability and reduce the processing cost.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a circuit board manufacturing method and a circuit board.
Background
The circuit board product with any layer of interconnection has very strict requirements on the dimensional stability of the core board layer, the laser processing mode of the core board layer plays a crucial role in the dimensional stability of the core board layer, and particularly when the hole density of the core board layer is high, the core board layer is easy to warp and deform after laser drilling, and adverse effects are caused on the post-processing procedure and the dimensional stability of the product.
The technology not only improves the poor effects of irregular deformation and poor warping of the core plate after laser, but also directly influences the hole shape of an X-shaped hole and the parameters of electroplating filling holes due to the fact that the depth of two times of blind hole drilling at the same position is easily influenced by copper thickness and laser energy to cause two times of laser depth fluctuation, and the hole shape of the X-shaped hole and the parameters of electroplating filling holes are directly influenced, so that the stability of a laser manufacturing process is relatively poor, the electroplating filling time of the X-shaped through hole is longer, and the processing cost is higher.
Disclosure of Invention
The invention provides a circuit board manufacturing method and a circuit board, aiming at solving the problems of irregular deformation and poor warping of a core board after drilling processing, improving the dimensional stability and the processing stability of the core board, and reducing the processing cost.
An embodiment of a first aspect of the present application provides a method for manufacturing a circuit board, including:
providing a core board, wherein the core board comprises a first metal layer, a second metal layer and a dielectric layer, the first metal layer and the second metal layer are oppositely arranged, and the dielectric layer is positioned between the first metal layer and the second metal layer;
processing first blind holes in a plurality of first areas on one surface, far away from the second metal layer, of the first metal layer, wherein the bottoms of the first blind holes penetrate through the dielectric layer and extend to the second metal layer;
and processing second blind holes in a plurality of second areas on one surface of the second metal layer, which is far away from the first metal layer, wherein the bottom of each second blind hole penetrates through the dielectric layer and extends to the first metal layer, and the plurality of first areas and the plurality of second areas are arranged in a staggered manner.
In some embodiments, at least two first blind holes are machined in each first region; at least two second blind holes are machined in each second area.
In some embodiments, when the first blind holes are processed in the plurality of first areas on the surface of the first metal layer away from the second metal layer, the first blind holes close to the center of the core plate are processed first, and then the first blind holes away from the center of the core plate are sequentially processed in the direction away from the center of the core plate.
In some embodiments, after the first blind hole near the center of the core plate is processed, the first blind holes around and adjacent to the processed first blind hole are sequentially processed.
In some embodiments, the N first blind holes are distributed in at least one row along a first direction on a surface of the first metal layer away from the second metal layer, N is greater than 2 and is a positive integer, and the N first blind holes are processed in a plurality of first areas on the surface of the first metal layer away from the second metal layer, including the following steps:
machining the Mth first blind hole along the first direction, wherein if N is an odd number, M is 1/2 (N +1), and if N is an even number, M is 1/2N;
processing a Kth first blind hole along the first direction, wherein M is more than or equal to K and is less than or equal to N;
and machining the L-th first blind hole along the first direction, wherein L is more than or equal to 1 and is more than M.
In some embodiments, after the first blind hole close to the center of the core plate is processed, the first blind holes far away from the center of the core plate are sequentially processed in the direction far away from the center of the core plate according to the spiral path.
In some embodiments, when the first blind holes are processed in the plurality of first areas on the surface of the first metal layer away from the second metal layer, the first blind holes away from the center of the core plate are processed first, and then the first blind holes close to the center of the core plate are sequentially processed in the direction close to the center of the core plate.
In some embodiments, the P first blind holes are distributed in at least one row along a first direction on a surface of the first metal layer away from the second metal layer, where P is greater than 2 and is a positive integer, and the P first blind holes are processed in a plurality of first regions on the surface of the first metal layer away from the second metal layer, including the following steps:
machining a No. P first blind hole along the first direction;
processing the ith first blind hole along the first direction, wherein i is more than or equal to 1 and is more than P, and i is a positive integer;
and processing the jth first blind hole along the first direction, wherein j is more than i and less than P, and j is a positive integer.
In some embodiments, after the first blind hole far from the center of the core plate is processed, the first blind holes close to the center of the core plate are sequentially processed in a direction close to the center of the core plate according to a spiral path.
Embodiments of the second aspect of the present application provide a circuit board, which is processed by the circuit board manufacturing method according to the first aspect.
The circuit board manufacturing method provided by the embodiment of the invention has the beneficial effects that: because the first metal layer is far away from a plurality of first areas on the one side of the second metal layer and the second metal layer is far away from a plurality of second areas on the one side of the first metal layer, the first blind holes and the second blind holes are arranged in a staggered mode, after the first blind holes and the second blind holes are respectively processed in the first areas and the second areas, the core plate cannot be warped and deformed irregularly due to uneven stress of the core plate caused by the fact that the core plate is drilled only on the first metal layer or only on the second metal layer, the size stability and the process stability of the core plate are improved, the first blind holes and the second blind holes can be plated simultaneously in the follow-up electroplating hole filling process, the electroplating hole filling time is short, the electric power distribution is uniform, the plated copper thickness is more uniform, and the processing cost is reduced.
According to the circuit board, the first blind holes and the second blind holes are respectively processed in the first areas and the second areas on the first metal layer and the second metal layer on the core board in the circuit board, and the plurality of first areas and the plurality of second areas are arranged in a staggered mode, so that the core board can be uniformly contracted, stress is uniformly released, the core board is prevented from warping or irregularly deforming, the size stability of the circuit board is improved, the first blind holes and the second blind holes can be plated simultaneously during subsequent hole filling in electroplating, electric power distribution is uniform, the thickness of plated copper is more uniform, and the quality of the circuit board is further improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a flow chart of a method of fabricating a circuit board in one embodiment of the invention;
fig. 2 is a partial cross-sectional view of a core plate in a first embodiment of the invention;
fig. 3 is a partial cross-sectional view of a core plate in a second embodiment of the invention;
FIG. 4 is a diagram illustrating a processing path of a third embodiment of the present invention when first blind vias are processed in a plurality of first regions on a side of a first metal layer away from a second metal layer;
FIG. 5 is a diagram illustrating a processing path of a fourth embodiment of the present invention when first blind vias are processed in a plurality of first regions on a side of a first metal layer away from a second metal layer;
FIG. 6 is a diagram illustrating a processing path of a fifth embodiment of the present invention when first blind vias are processed in a plurality of first regions on a side of a first metal layer away from a second metal layer;
FIG. 7 is a diagram illustrating a processing path of a sixth embodiment of the present invention when first blind vias are processed in a plurality of first regions on a side of a first metal layer away from a second metal layer;
fig. 8 is a processing path diagram of a seventh embodiment of the present invention when first blind vias are processed in a plurality of first areas on a side of the first metal layer away from the second metal layer.
The designations in the figures mean:
10. a core board; 11. a first metal layer; 111. a first region; 12. a second metal layer; 121. a second region; 13. a dielectric layer; 14. a first blind hole; 15. a second blind hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings, which are examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In order to explain the technical solution of the present invention, the following description is made with reference to the specific drawings and examples.
Referring to fig. 1 and fig. 2, an embodiment of a first aspect of the present application provides a method for manufacturing a circuit board, including:
s10: a core board 10 is provided, the core board 10 includes a first metal layer 11 and a second metal layer 12 which are oppositely arranged, and a dielectric layer 13 located between the first metal layer 11 and the second metal layer 12.
Specifically, the core plate 10 is cut to a desired size according to design requirements.
Optionally, the core plates 10 are stacked together and baked to release the material stress of the core plates 10, improve the stability of the core plates 10, and prevent the phenomena of plate explosion and the like during subsequent processing.
Preferably, the core plates 10 are stacked together and baked for 4H at 180 ℃ in a vertical oven to relieve material stress and improve stability of the core plates 10.
Further, tool holes for subsequent machining alignment are drilled in the edges of the core 10.
Further, the core plate 10 is subjected to brown oxidation treatment, and the first metal layer 11 and the second metal layer 12 are cleaned and roughened, so that energy can be absorbed conveniently during subsequent blind hole processing.
S20: first blind holes 14 are processed in a plurality of first areas 111 on the surface of the first metal layer 11 far away from the second metal layer 12, and the bottoms of the first blind holes 14 penetrate through the dielectric layer 13 and extend to the second metal layer 12.
Specifically, the first blind via 14 may be processed by laser drilling, the first metal layer 11 is provided with a plurality of first regions 111, and one, two, or more first blind vias 14 may be processed in each first region 111.
S30: second blind holes 15 are processed in a plurality of second areas 121 on the surface, far away from the first metal layer 11, of the second metal layer 12, the bottoms of the second blind holes 15 penetrate through the dielectric layer 13 and extend to the first metal layer 11, and the plurality of first areas 111 and the plurality of second areas 121 are arranged in a staggered mode.
Specifically, the second blind via 15 may be processed by laser drilling, the second metal layer 12 is provided with a plurality of second regions 121, and one, two, or more second blind vias 15 may be processed in each second region 121.
Optionally, at least two first blind holes 14 are processed in each first region 111; at least two second blind holes 15 are machined in each second region 121.
Referring to fig. 2, in the first embodiment, a first blind hole 14 is processed in each first region 111, a second blind hole 15 is processed in each second region 121, and at this time, the plurality of first regions 111 and the plurality of second regions 121 are disposed alternately, and the plurality of first blind holes 14 and the plurality of second blind holes 15 are disposed alternately, that is, one first blind hole 14 is located between two adjacent second blind holes 15, and one second blind hole 15 is located between two adjacent first blind holes 14.
Referring to fig. 3, in the second embodiment, two first blind holes 14 are processed in each first region 111, two first blind holes 14 in the same first region 111 are a group, two second blind holes 15 are processed in each second region 121, and two second blind holes 15 in the same second region 121 are a group, at this time, the plurality of first regions 111 and the plurality of second regions 121 are arranged in a staggered manner, that is, one group of first blind holes 14 is located between two adjacent groups of second blind holes 15, and one group of second blind holes 15 is located between two adjacent groups of first blind holes 14.
In the method for manufacturing a circuit board according to the embodiment of the present invention, since the plurality of first areas 111 on the surface of the first metal layer 11 away from the second metal layer 12 and the plurality of second areas 121 on the surface of the second metal layer 12 away from the first metal layer 11 are staggered, after the first blind holes 14 and the second blind holes 15 are respectively processed in the first areas 111 and the second areas 121, the core board 10 is not warped or deformed irregularly due to uneven stress of the core board 10 caused by drilling only on the first metal layer 11 or only on the second metal layer 12, so as to improve the dimensional stability and the process stability of the core board, and the first blind holes 14 and the second blind holes 15 can be plated simultaneously during subsequent hole filling by electroplating, so that the hole filling time by electroplating is short, the power distribution is uniform, the plated copper thickness is more uniform, and the processing cost is reduced.
Referring to fig. 4 to 6, in some embodiments, when the first blind holes 14 are formed in the plurality of first areas 111 on the side of the first metal layer 11 away from the second metal layer 12, the first blind holes 14 close to the center of the core plate 10 are formed first, and then the first blind holes 14 away from the center of the core plate 10 are formed in sequence in the direction away from the center of the core plate 10.
By adopting the above scheme, the first blind holes 14 are dispersedly processed on the core plate 10, so that the core plate 10 is uniformly contracted along each direction, and the irregular deformation of the core plate 10 in each direction due to different release stress and contraction degree in the processing process is avoided.
It can be understood that, when the second blind holes 15 are processed in the second regions 121 on the side of the second metal layer 12 away from the first metal layer 11, the second blind holes 15 close to the center of the core plate 10 are processed first, and then the second blind holes 15 away from the center of the core plate 10 are processed in sequence in the direction away from the center of the core plate 10, so that the core plate 10 is drilled dispersedly, the core plate 10 is contracted uniformly in all directions, and irregular deformation of the core plate 10 in all directions due to different releasing stress and contraction degrees is avoided.
Referring to fig. 4, in the third embodiment, after the first blind hole 14 close to the center of the core plate 10 is processed, the first blind holes 14 around and adjacent to the processed first blind hole 14 are sequentially processed, the processing path is shown by an arrow in the figure, the first blind hole 14 marked by a solid line in the figure is the processed first blind hole 14, and the first blind hole 14 marked by a dotted line in the figure is the first blind hole 14 to be processed. All the first blind holes 14 are processed step by step through the path, so that the stress release and shrinkage of the core plate 10 along all directions are uniform, and the irregular deformation of the core plate 10 in all directions due to different stress release and shrinkage degrees in the processing process is avoided.
Referring to fig. 5, in some embodiments, the N first blind vias 14 are distributed in at least one row along the first direction on the surface of the first metal layer 11 away from the second metal layer 12, where N is greater than 2 and is a positive integer, and the N first blind vias 14 are processed in the plurality of first regions 111 on the surface of the first metal layer 11 away from the second metal layer 12, including the following steps:
first, the mth first blind via 14 in the first direction is machined, where M is 1/2 × N +1 if N is an odd number, and M is 1/2 × N if N is an even number.
And secondly, processing a Kth first blind hole 14 along the first direction, wherein M is more than K and less than or equal to N.
And finally, machining an L-th first blind hole 14 along the first direction, wherein L is more than or equal to 1 and is less than M.
For example, when N is 3, 3 first blind vias 14 are processed in the first regions 111 on the side of the first metal layer 11 away from the second metal layer 12, including the following steps: firstly, processing a 2 nd first blind hole 14 from left to right; secondly, a 3 rd first blind hole 14 from left to right is processed; finally, the 1 st first blind hole 14 is machined from left to right.
For example, when N is 10, 10 first blind vias 14 are processed in the first regions 111 on the side of the first metal layer 11 away from the second metal layer 12, including the following steps: firstly, a 5 th first blind hole 14 from left to right is processed; secondly, machining an 8 th first blind hole 14 from left to right; then, the 2 nd first blind hole 14 from left to right is processed, and finally, the processing of the remaining first blind holes 14 is performed.
Referring to fig. 5, in the fourth embodiment, the 6 first blind vias 14 are distributed in a row along a left-to-right direction on a surface of the first metal layer 11 away from the second metal layer 12, and the 6 first blind vias 14 are processed in the first areas 111 on the surface of the first metal layer 11 away from the second metal layer 12, which includes the following steps: firstly, processing a 3 rd first blind hole 14 from left to right, wherein the first blind hole 14 marked by a solid line in the figure is a processed first blind hole 14, and the first blind hole 14 marked by a dotted line in the figure is a first blind hole 14 to be processed; secondly, machining a 4 th first blind hole 14 from left to right; thirdly, processing a 2 nd first blind hole 14 from left to right; fourthly, processing a 5 th first blind hole 14 from left to right, and fifthly, processing a 1 st first blind hole 14 from left to right; and sixthly, a first blind hole 14 from the left to the right 6 th is machined, and the machining path is shown by an arrow in the figure.
By adopting the scheme, the stress release and shrinkage of the core plate 10 along the first direction in the machining process are more uniform, and the irregular deformation of the core plate 10 in the first direction due to different stress release and shrinkage degrees in the machining process is avoided.
Referring to fig. 6, in the fifth embodiment, after the first blind hole 14 close to the center of the core plate 10 is processed, the first blind holes 14 far from the center of the core plate 10 are sequentially processed according to a spiral path in the direction far from the center of the core plate 10, the processing path is shown as an arrow in the figure, the first blind hole 14 marked by a solid line in the figure is the processed first blind hole 14, and the first blind hole 14 marked by a dotted line in the figure is the first blind hole 14 to be processed. The spiral path in this embodiment is from inside to outside.
By adopting the scheme, the stress release and shrinkage of the core plate 10 in all directions are more uniform in the processing process, and the irregular deformation of the core plate 10 in all directions due to different stress release and shrinkage degrees in the processing process is avoided.
Referring to fig. 7 and 8, in some embodiments, when the first blind holes 14 are formed in the plurality of first areas 111 on the side of the first metal layer 11 away from the second metal layer 12, the first blind holes 14 away from the center of the core plate 10 are formed, and then the first blind holes 14 close to the center of the core plate 10 are sequentially formed in the direction close to the center of the core plate 10.
By adopting the above scheme, the first blind holes 14 are dispersedly processed on the core plate 10, so that the core plate 10 is uniformly contracted along each direction, and the irregular deformation of the core plate 10 in each direction due to different release stress and contraction degree in the processing process is avoided.
It can be understood that, when the second blind holes 15 are processed in the second regions 121 on the side of the second metal layer 12 away from the first metal layer 11, the second blind holes 15 away from the center of the core plate 10 are processed first, and then the second blind holes 15 close to the center of the core plate 10 are processed in sequence in the direction close to the center of the core plate 10, so that the core plate 10 can shrink uniformly in all directions, and irregular deformation of the core plate 10 in all directions due to different stress release and shrinkage degrees is avoided.
Referring to fig. 7, in some embodiments of the first embodiment, the P first blind holes 14 are distributed in at least one row along the first direction on the side of the first metal layer 11 away from the second metal layer 12, where P is greater than 2 and is a positive integer, and the P first blind holes 14 are processed in the plurality of first regions 111 on the side of the first metal layer 11 away from the second metal layer 12, including the following steps:
first, the pth first blind hole 14 in the first direction is machined.
And secondly, processing an ith first blind hole 14 along the first direction, wherein i is more than or equal to 1 and is less than P, and i is a positive integer.
And finally, processing a jth first blind hole 14 along the first direction, wherein i is more than j and less than P, and j is a positive integer.
For example, when P is 3, 3 first blind vias 14 are processed in the first regions 111 on the side of the first metal layer 11 away from the second metal layer 12, including the following steps: firstly, a 3 rd first blind hole 14 from left to right is processed; secondly, processing a 1 st first blind hole 14 from left to right; finally, the 2 nd first blind hole 14 is machined from left to right.
For example, when P is 10, 10 first blind vias 14 are processed in the first regions 111 on the side of the first metal layer 11 away from the second metal layer 12, including the following steps: firstly, a 10 th first blind hole 14 from left to right is processed; secondly, processing a 1 st first blind hole 14 from left to right; then, the 5 th first blind hole 14 from left to right is processed, and finally, the processing of the remaining first blind holes 14 is performed.
Referring to fig. 7, in the sixth embodiment, the 6 first blind vias 14 are distributed in a row along a left-to-right direction on a surface of the first metal layer 11 away from the second metal layer 12, and the 6 first blind vias 14 are processed in the first areas 111 on the surface of the first metal layer 11 away from the second metal layer 12, which includes the following steps: firstly, processing a 6 th first blind hole 14 from left to right, wherein the first blind hole 14 marked by a solid line in the figure is a processed first blind hole 14, and the first blind hole 14 marked by a dotted line in the figure is a first blind hole 14 to be processed; secondly, processing a 1 st first blind hole 14 from left to right; thirdly, processing a 5 th first blind hole 14 from left to right; fourthly, processing a 2 nd first blind hole 14 from left to right, and fifthly, processing a 4 th first blind hole 14 from left to right; and sixthly, machining a 3 rd first blind hole 14 from left to right along a machining path shown by an arrow in the figure.
Referring to fig. 8, in the seventh embodiment, after the first blind hole 14 far from the center of the core plate 10 is processed, the first blind holes 14 close to the center of the core plate 10 are sequentially processed in the direction close to the center of the core plate 10 according to a spiral path, the processing path is shown by an arrow in the figure, the first blind hole 14 marked by a solid line in the figure is the processed first blind hole 14, and the first blind hole 14 marked by a dotted line in the figure is the first blind hole 14 to be processed. The spiral path in this embodiment is from outside to inside.
By adopting the scheme, the core plate 10 can be uniformly contracted in all directions in the processing process, and the irregular deformation of the core plate 10 in all directions due to different release stress and contraction degrees in the processing process is avoided.
Embodiments of the second aspect of the present application provide a circuit board, which is processed by the circuit board manufacturing method of the first aspect.
It is understood that the circuit board manufacturing process may include, in addition to the circuit board manufacturing method according to the first aspect, horizontal copper deposition, blind via filling, inner layer circuit, image etching, AOI, pressing, browning, laser blind via, horizontal copper deposition, blind via filling, outer layer circuit, image etching, AOI, solder mask, gold deposition, molding, testing, FQC, FQA, and packaging.
Specifically, the horizontal copper deposition means that a layer of thin copper is formed on the hole wall of the first blind hole and the hole wall of the second blind hole and is used as a conductive layer for blind hole electroplating filling, so that subsequent blind hole electroplating filling manufacturing is facilitated.
Specifically, the blind hole filling refers to filling copper into the first blind hole and the second blind hole by using an electroplating hole filling line, and in order to ensure the conductivity of the first blind hole and the second blind hole, the concavity of the first blind hole and the second blind hole after hole filling needs to be ensured to be less than or equal to 15um, such as 15um, 14um, 13um, 12um or 11 um.
According to the circuit board, the first blind holes and the second blind holes are respectively processed in the first areas and the second areas on the first metal layer and the second metal layer on the core board in the circuit board, and the plurality of first areas and the plurality of second areas are arranged in a staggered mode, so that the core board can be uniformly contracted, stress is uniformly released, the core board is prevented from warping or irregularly deforming, the size stability of the circuit board is improved, the first blind holes and the second blind holes can be plated simultaneously during subsequent hole filling in electroplating, electric power distribution is uniform, the thickness of plated copper is more uniform, and the quality of the circuit board is further improved.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. A circuit board manufacturing method is characterized by comprising the following steps:
providing a core board, wherein the core board comprises a first metal layer, a second metal layer and a dielectric layer, the first metal layer and the second metal layer are oppositely arranged, and the dielectric layer is positioned between the first metal layer and the second metal layer;
processing first blind holes in a plurality of first areas on one surface, far away from the second metal layer, of the first metal layer, wherein the bottoms of the first blind holes penetrate through the dielectric layer and extend to the second metal layer;
and processing second blind holes in a plurality of second areas on one surface of the second metal layer, which is far away from the first metal layer, wherein the bottom of each second blind hole penetrates through the dielectric layer and extends to the first metal layer, and the plurality of first areas and the plurality of second areas are arranged in a staggered manner.
2. The method for manufacturing a circuit board according to claim 1, wherein at least two first blind holes are processed in each first region; at least two second blind holes are machined in each second area.
3. The method of claim 1 or 2, wherein when the first blind holes are formed in the first areas of the first metal layer on the surface thereof away from the second metal layer, the first blind holes close to the center of the core board are formed first, and then the first blind holes away from the center of the core board are formed in sequence in a direction away from the center of the core board.
4. The method of claim 3, wherein after the first blind hole near the center of the core board is processed, the first blind holes around and adjacent to the processed first blind hole are processed in sequence.
5. The method for manufacturing a circuit board according to claim 3, wherein the N first blind holes are distributed in at least one row along a first direction on a surface of the first metal layer away from the second metal layer, N is greater than 2 and is a positive integer, and the N first blind holes are processed in a plurality of first areas on the surface of the first metal layer away from the second metal layer, comprising the steps of:
machining the Mth first blind hole along the first direction, wherein if N is an odd number, M is 1/2 (N +1), and if N is an even number, M is 1/2N;
processing a Kth first blind hole along the first direction, wherein M is more than or equal to K and is less than or equal to N;
and machining the L-th first blind hole along the first direction, wherein L is more than or equal to 1 and is more than M.
6. The method of claim 3, wherein after the first blind holes near the center of the core are processed, the first blind holes far from the center of the core are sequentially processed according to a spiral path in a direction far from the center of the core.
7. The method of claim 1 or 2, wherein when the first blind holes are formed in the first areas of the first metal layer on the surface thereof away from the second metal layer, the first blind holes away from the center of the core board are formed first, and then the first blind holes close to the center of the core board are formed in sequence in a direction close to the center of the core board.
8. The method for manufacturing a circuit board according to claim 3, wherein the P first blind holes are distributed in at least one row along a first direction on a surface of the first metal layer away from the second metal layer, P is greater than 2 and is a positive integer, and the P first blind holes are processed in a plurality of first areas on the surface of the first metal layer away from the second metal layer, comprising the steps of:
machining a No. P first blind hole along the first direction;
processing the ith first blind hole along the first direction, wherein i is more than or equal to 1 and is more than P, and i is a positive integer;
and processing the jth first blind hole along the first direction, wherein j is more than i and less than P, and j is a positive integer.
9. The method of claim 7, wherein after the first blind holes are processed away from the center of the core board, the first blind holes are sequentially processed toward the center of the core board according to a spiral path.
10. A circuit board manufactured by the method for manufacturing a circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN116390361A (en) * | 2023-06-07 | 2023-07-04 | 淄博芯材集成电路有限责任公司 | Method for optimizing stress uniformity of X-type laser hole based on convolution type laser track |
| TWI838065B (en) | 2023-01-05 | 2024-04-01 | 健鼎科技股份有限公司 | Printed circuit board with symmetrical lamination structure and method for producing the same |
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