JP2010162548A - Machining apparatus and program for the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To avoid any defective machining caused by the heat accumulation for irregularly arranged holes in a coarse/fine state in a laser drilling machine without prolonging the entire machining time more than necessary. <P>SOLUTION: The machining order of the hole position on an object to be machined is determined by a device S301 for extracting the hole groups forming elements of dense lattice points from the hole position data, a device S302 for collecting the extracted hole groups for each close point and dividing them in a lattice point area, a device S303 for determining the machining order of the hole group in each lattice point area so that the heat radiation is excellent, and a device S304 for determining the machining order of a single hole other than the element of the lattice point area and the dense lattice point. A machine drills holes according to the determined machining order. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a processing technique for making a hole in a predetermined sheet using, for example, a laser beam.

  In drilling by laser light irradiation, even if the processing parameters are such that good holes can be machined by single machining, the effect of heat storage will be affected when holes arranged at high density are continuously machined. As a result, deformation of the machining hole or deviation of the machining position occurs.

  In order to prevent this, the hole group arranged in a high-density lattice point is processed in a spiral shape from the center to the outside and processed while dissipating heat (see, for example, Patent Document 1). Or the method (for example, refer patent document 2) of setting the distance between the holes processed continuously long is proposed.

JP 2002-35977 A JP 2002-224874 A

  However, in a processing object such as a mother board such as a personal computer or a mobile phone, the processing holes are arranged in a dense and distorted manner, and the locations where processing defects occur due to heat storage are limited.

  For such an arrangement, when all the processing holes included in the processing target are regarded as a point group arranged in a high-density lattice point, when processing in a spiral shape from the center of the processing target toward the outside, Although heat dissipation is good, processing defects can be suppressed, but a new problem arises that processing time is unnecessarily extended. Similarly, there is a problem that the processing time is unnecessarily extended even in the method of limiting the shortest distance between holes when continuously drilling holes.

  In addition, the operator may designate a region or a group of holes where the effect of heat storage is large and instruct the processing order to be the above spiral shape, or the operator may manually change the processing order. However, considering the number of holes that can reach tens of thousands, there is a problem because the labor of the operator is too much.

  The present invention has been made in order to solve such problems, and its purpose is to provide a processing apparatus and a processing method or method that can avoid processing defects due to heat storage without unnecessarily extending the entire processing time. It is to provide a program for a processing apparatus.

  The subject of the present invention is a processing device for making a hole in the processing target by irradiating the processing target with laser light, and a dense lattice point element extraction for extracting a hole position as an element of a dense lattice point from hole position data A grid point area distribution unit that collects the extracted hole positions according to a certain rule and divides the extracted hole positions into one or more grid point areas, and heat is one-dimensionally or 2 for each of the one or more grid point areas. An intra-grid point order determining unit that determines a processing order of hole positions in the lattice point region so that the dimension is diffused outward from the center of the lattice point region, and the intra-grid point order determining unit. Processing of the one or more lattice point regions in which the processing order of the hole positions in each lattice point region is determined, and the hole positions not extracted as the dense lattice point elements by the dense lattice point element extraction unit Order, traveling salesman questions Characterized in that a grid point regions and the lattice points out of order determining unit for determining by using the solutions.

  According to the subject matter of the present invention, by providing a dense lattice point element extraction unit, a lattice point region distribution unit, and an intra-grid point order determination unit, heat is not generated in a hole position group in which the effect of heat storage becomes significant. The processing order in which the dissipation is good is taken, and the processing order that emphasizes the processing speed is taken for the hole position groups other than the elements of the dense lattice point group by providing the lattice point region and the out-of-grid point order determination unit. Therefore, it is possible to avoid machining defects due to the effect of heat storage without unnecessarily extending the machining time even for a group of hole positions to be machined that are irregularly arranged in a mixed manner.

  Hereinafter, various embodiments of the present invention will be described in detail together with effects and advantages based on the attached drawings.

It is a figure showing the outline of the whole laser beam machine concerning each embodiment of the present invention. It is a figure which shows an example of the hole arrangement | positioning on a process target. It is a figure which shows the structure of the process order determination apparatus which concerns on Embodiment 1 of this invention. It is a figure which shows the lattice point area | region extracted by the dense lattice point element extraction apparatus. It is a figure which shows the distribution process of the lattice point element by a lattice point area | region distribution apparatus. It is a figure which shows the distribution process of the lattice point element by a lattice point area | region distribution apparatus. It is a figure which shows the distribution process of the lattice point element by a lattice point area | region distribution apparatus. It is a figure which shows the distribution process of the lattice point element by a lattice point area | region distribution apparatus. It is a figure which shows an example of the process order in the lattice point area | region by the lattice point order determination apparatus. It is a figure which shows an example of the process order in the lattice point area | region by the lattice point order determination apparatus. It is a figure which shows an example of the process order which concerns on Embodiment 1 of this invention. It is a figure which shows an example of the process order which concerns on Embodiment 2 of this invention. It is a figure which shows an example of the process order in the lattice point area | region which concerns on Embodiment 3 of this invention. It is a figure which shows an example of the process order in the lattice point area | region which concerns on Embodiment 4 of this invention. It is a figure which shows an example of the process order in the lattice point area | region which concerns on Embodiment 4 of this invention. It is a figure which shows the structure of the processing order determination apparatus which concerns on Embodiment 6 of this invention. It is a figure which shows the structure of the processing order determination apparatus which concerns on Embodiment 7 of this invention. It is a figure which shows the structure of the processing order determination apparatus which concerns on Embodiment 8 of this invention. It is a figure which shows the structure of the processing order determination apparatus which concerns on Embodiment 9 of this invention.

(Embodiment 1)
The drilling method according to this embodiment of the present invention will be specifically described with reference to the drawings.

  FIG. 1 is a diagram schematically showing an overall configuration of a laser beam machine according to the present embodiment. Note that FIG. 1 is also used in all other embodiments described later.

  In FIG. 1, the angle of the laser light 102 emitted from the laser light source 101 is adjusted by the galvanometer mirrors 103 a and 103 b, condensed by the fθ lens 104, and after passing through the protective window 105, the object to be processed 106 is melted and a hole is made. Here, the protection window 105 protects the fθ lens 104 from processing waste generated when the processing target 106 is processed. The processing target 106 is mounted on the XY stage 107.

  The processing position is adjusted by the XY stage 107 and the two galvanometer mirrors 103a and 103b. Although the galvanometer mirrors 103a and 103b can move and position at high speed, the size of the fθ lens 104 is limited, so that the adjustable range by the galvanometer mirrors 103a and 103b is the size of the processing object 106 ( For example, it is limited to a small range (for example, 50 mm square). On the other hand, although the movement speed of the XY stage 107 is low, the workpiece 106 can be moved greatly.

  In general processing, the hole group of the processing object 106 is grouped by a range of an adjustable range by the galvanometer mirrors 103a and 103b (hereinafter, referred to as “galvano range”), and the holes in each galvano range. The processing of the group is performed only by adjusting the position by the galvanometer mirrors 103a and 103b without moving the XY stage 107. Then, when all the processing within one galvano range is completed, the process moves to processing within another galvano range by the movement of the XY stage 107.

  However, a method of processing the processing target 106 while simultaneously moving the XY stage 107 and the galvanometer mirrors 103a and 103b is also known.

  The present invention is primarily concerned with processing sequences within the galvano range.

  FIG. 2 is a diagram schematically showing holes arranged in one galvano range. In FIG. 2, the holes are arranged so as to be densely packed, and are arranged irregularly as a whole. However, in many places where the holes are arranged at a high density, the holes are often arranged in a grid pattern. This is because the size of the semiconductor component mounted on the processing target 106 with the holes is defined by the standard, so even if the semiconductor components are arranged at a high density, the result is that the intervals are constant. This is because the holes are arranged.

  FIG. 3 is a diagram showing a configuration of an apparatus for determining a hole processing order according to the present embodiment. Hereinafter, based on FIG. 3, the processing order determination method in this Embodiment is described. Note that each of the devices S301, S302, S303, and S304 illustrated in FIG. 3 may be implemented as hardware as a circuit that exhibits each function, but may be implemented as software using a microcomputer, a DSP, or the like. In the following description, for example, a program mounted on a microcomputer included in a control device that controls the operation of the laser beam machine in FIG. 1 (see, for example, control device S1801 in FIG. 18 described later). As a result, the processing order when the laser processing machine of FIG. 1 processes the processing target 106 is determined. In that sense, FIG. 3 shows each processing function (corresponding to each device in FIG. 3) of a program for determining and controlling the order in which the laser processing machine in FIG. It can be said that it corresponds to the flowchart shown.

  The hole position data is input to the dense lattice point element extraction device S301 through a network such as a LAN or an information device medium such as a USB memory. It is assumed that the hole position data is represented by an absolute position or the like within the galvano range (x-axis direction, y-axis direction). Here, it is assumed that the position on the processing target 106 is expressed in two dimensions of appropriately defined x-axis coordinates and y-axis coordinates. However, the hole position data may be expressed by a relative position or the like, and the position expression method on the processing target 106 is not limited to the two-dimensional expression of the x-axis coordinate and the y-axis coordinate, and the present invention is input. It is not limited to the data format.

  The processing order determination parameter is appropriately used by each of the devices S301 to S304 illustrated in FIG. 3 in order to avoid the influence of heat storage. Note that the parameters and / or order determination methods used in the following description may be specified individually, or may be specified by several types of parameter sets prepared in advance in a table format.

  The dense lattice point element extraction device S301 extracts a hole group (hole position group) that is an element of a dense lattice point that is greatly affected by heat storage from the input hole position data, and extracts the extracted hole group from the other hole position data. Separate from the group of holes. Extraction of dense lattice point elements is performed as follows.

  The dense lattice point element extraction device S301 is configured so that all the hole positions (hereinafter referred to as “points”) within a certain distance with respect to both the x-axis direction and the y-axis direction from a certain point. If a point exists, the point is extracted as a point of the dense lattice point element. For example, if the coordinates of the points i, j, and k are (0, 0), (d1, 0), and (0, d2), respectively, and the absolute values of d1 and d2 are smaller than the reference distance d, The dense lattice point element extraction device S301 extracts a point i at coordinates (0, 0) as an element of a dense lattice point. Here, the reference distance d corresponds to the processing order determination parameter used by the apparatus S301.

  At this time, the x-axis direction (y-axis direction) does not need to be exactly the same, and some margin may be taken. For example, the coordinates of the points i, j, and k are (0, 0), (d1, e1), and (e2, d2), respectively, the absolute values of d1 and d2 are smaller than the reference distance d, and e1 And e2 are smaller than the reference distance e, the dense lattice point element extraction device S301 extracts the point i at the coordinates (0, 0) as an element of the dense lattice point. At this time, the reference distance e is preferably about a fraction of the minimum distance between holes determined by the semiconductor size standard.

  Further, the values of the reference distances d and e are different with respect to the x-axis direction and the y-axis direction, and there are other points within a reference distance da from a certain point i with respect to the x-axis direction (y-axis direction). If there is another point within the distance db (> da) in the other y-axis direction (x-axis direction), the dense lattice point element extraction device S301 determines that the point i is the dense lattice point. It may be extracted as an element.

  Alternatively, the dense lattice point element extraction device S301 may simply extract the dense lattice point elements by using the density. For example, when there are h or more other points within a circular area having a radius d from a certain point i, the dense lattice point element extraction device S301 extracts the point i as a dense lattice point element. Alternatively, when there are h1 or more other points within a circular area of radius d1 from a certain point i, and there are h2 or more other points within a circular area of radius d2 from a certain point i, a dense lattice The point element extraction device S301 may divide the reference distance into several stages so as to extract the point i as a dense lattice point element.

  The dense lattice point element extraction device S301 extracts, for example, a point group as shown in FIG. 4 from the hole arrangement of FIG.

  Next, the lattice point region distribution device S302 in FIG. 3 divides the point group extracted by the dense lattice point element extraction device S301 into one or more sets according to a certain rule.

  First, the apparatus S302 sorts the extracted point groups in ascending order of the x coordinates. For the point group having the same x coordinate, the apparatus S302 sorts in the ascending order of the y coordinate. Then, as shown in FIG. 5, the apparatus S302 sets a point group having the same x coordinate as one column. In addition, as shown in FIG. 6, the apparatus S302 sets a group of points having the same point-to-point distance in each column. Finally, as shown in FIG. 7, the apparatus S302 has the same point-to-point distance in the set (in the y-axis direction in the figure) and the same distance between the sets (in the x-axis direction in the figure). In addition, a group in which the minimum coordinate in the y-axis direction and the maximum coordinate in the y-axis direction are equal at the points in the group are collected as one region.

  Through these processes, each region becomes a rectangular lattice point group having the same distance between points in the x-axis direction and the y-axis direction.

  At this time, if the margin range is within a range smaller than the distance between points in each set, the lattice point region distribution device S302 takes a margin between the minimum coordinate in the y-axis direction and the maximum coordinate in the y-axis direction. They may be combined into one area. The margin in this case corresponds to the processing order determination parameter used by the apparatus S302.

  Alternatively, as shown in FIG. 8, the lattice point region distribution device S302 may adjust the minimum coordinate in the y-axis direction to the larger one and divide the maximum coordinate in the y-axis direction to the smaller one when dividing the set into regions. good.

  Alternatively, the lattice point region distribution device S302 performs a series of operations by exchanging the x-axis direction and the y-axis direction, and selects one of the preferable region divisions, or sequentially from both created region divisions. A preferred region may be selected. At that time, the grid point region distribution device S302 has a preferable number of points to be selected as a number of points included in one region, a number of regions to be created, or a number of points in the x-axis direction. It is better to select one that is close to the number of points in the y-axis direction.

  The in-grid point order determination device S303 in FIG. 3 determines the processing order in each lattice point region divided by the lattice point region distribution device S302. At this time, the apparatus S303 determines the processing order of each lattice point region so that heat dissipation in each lattice point region is improved. A command for instructing which of several possible processing order determination methods to be adopted that improves heat dissipation in the lattice point region corresponds to the processing order determination parameter used by the apparatus S303. .

  For example, the processing points in a lattice point area are arranged in the form of (n × m) lattice points in which n points are arranged in the y-axis direction and m points are arranged in the x-axis direction. Shall.

  When n ≧ m, the intra-lattice order determination device S303 performs ascending order in the y-axis direction as shown in FIG.

And the ascending order in the x-axis direction

The processing sequence is to start drilling holes starting from the points in the row given by (3), and perform processing for (n−m + 2) points including the start point in the positive y-axis direction in the row including the start point. decide. here,

Is a floor function of a real number x, and the maximum integer not exceeding the real number x is output. Thereafter, the intra-grid point order determination device S303 determines the processing order clockwise so as to surround the processed points in the lattice point region.

  When m> n, the intra-lattice order determination device S303 performs ascending order in the y-axis direction as shown in FIG.

And the ascending order in the x-axis direction

The processing order is determined to start processing from the point of the column given in (3), and to perform processing for (m−n + 2) points including the start point in the positive x-axis direction in the column including the start point. . Thereafter, the intra-grid point order determination device S303 determines the processing order counterclockwise so as to surround the processed points in the lattice point region.

  By determining the processing order in this way, the points in each lattice point region are processed while heat is dissipated from the center toward the outside, so that heat storage that causes processing defects can be suppressed.

  Examples of other processing order determination methods include the following methods.

  For example, there is a method of dissipating heat in a one-dimensional direction from the center to the outside by processing points in each lattice point region in units of rows or columns.

  When n ≧ m, the intra-lattice order determination device S303 performs ascending order in the x-axis direction as shown in FIG.

The processing sequence is started from the column given in (1), and the processing sequence for performing positive and negative equal processing in the x-axis direction is determined so as to surround the processed column in the lattice point region.

  On the other hand, when m> n, the intra-lattice order determination device S303 performs ascending order in the y-axis direction as shown in FIG.

The processing order is started from the line given in (1), and the processing order for performing positive and negative equal processing in the y-axis direction is determined so as to surround the processed line in the lattice point region.

  In this example, the processing is performed in the longitudinal direction in the row direction or the column direction, but processing may be performed in the short direction.

  Alternatively, the intra-grid point order determination device S303 may order the columns (rows) within a certain distance so as not to be processed continuously, and this ordering may be combined with the above-described intra-region processing order determination method. .

  Alternatively, the intra-lattice point order determination device S303 may perform ordering so that points within a certain distance are not continuously processed, and this ordering may be combined with the above-described in-region processing order determination method.

  The lattice point region and lattice point out-of-grid order determination device S304 of FIG. 3 includes an order of processing the (generally a plurality of) lattice point regions whose processing order is determined by the intra-grid point order determination device S303, and a dense lattice point element extraction device. The order of processing points (hereinafter referred to as “single points”) that have not been extracted as dense lattice point elements in S301 is also determined. At that time, for the processing for a single point, a processing order emphasizing the processing speed is adopted.

  In order to determine these processing orders, it is possible to use a solution to the traveling salesman problem (hereinafter referred to as “TSP”). Here, TSP is a kind of graph problem, and given the cost of moving between multiple vertices and vertices, the total when returning to the first vertex through all vertices once It is a problem for obtaining a moving order that minimizes the cost of the above.

  Since the machining time monotonously increases with respect to the total distance of the path connecting the points, the solution of the TSP problem with the point-to-point distance as a cost to reduce the machining time, especially under circumstances where the effect of heat storage is not considered Widely used in order determination.

  The following method can be adopted as a method for determining the processing order using the TSP solution.

  That is, the center coordinates of each grid point area are set as the representative points of the grid point area, and the TSP problem is solved for the set of each representative point and each single point. When a representative point is selected as the processing order, the lattice point region and out-of-grid point order determination device S304 determines the processing determined by the intra-grid point order determination device S303 for the lattice point region corresponding to the representative point. After applying the order, move to the next point.

  Alternatively, when moving from a point outside a certain grid point area to a point representing the grid point area as a point representing each grid point area, the start point in the processing order in the grid point area When moving from a point representing a certain grid point area to a point outside the grid point area, a method using the end point in the processing order in the grid point area However, it can be adopted.

  Finally, the lattice point region and out-of-grid point order determination device S304 determines the processing order as shown in FIG. In FIG. 11, a reference symbol S represents a starting point of machining, and a reference symbol E represents an end point of machining. Then, an output signal giving the processing order determined by the apparatus S304 is transmitted to a control device (not shown) of the laser processing machine or an external computer, and processing for displaying the processing path by appropriate means is performed. Thus, it is configured so that the operator can confirm the machining route. Then, if necessary, the processing path is corrected by the operator, and the laser processing machine shown in FIG. 1 performs drilling according to the finally determined processing order under the control of the control device. To do.

  According to the present embodiment, only the elements of dense lattice points scattered in the processing object 106 are extracted, and the processing order (one-dimensionally or two-dimensionally) in which heat dissipation is favorable for the elements of dense lattice points. The order in which heat is dissipated outwardly from the center of each lattice point region) is determined by the laser processing machine 106 according to the processing order determined by the conventional method for points other than the dense lattice points. Therefore, the effect of preventing processing defects due to heat storage can be obtained while suppressing the extension of the processing time. Accordingly, since the processing time or the actual working time of the processing machine can be reduced, the power consumed in the processing machine can be reduced (energy saving).

(Embodiment 2)
In the first embodiment, the lattice point region and out-of-grid point order determination device S304 collectively obtains the processing order of the lattice point region and the single point by the TSP solution. The method for determining the processing order of single points may be divided.

  For example, the lattice point region and out-of-grid point order determination device S304 in FIG. 3 sets the processing order of the dense lattice point region in which processing defects are likely to occur due to the effect of heat storage to finish before processing of single points. By doing, the influence of the heat storage by processing of a single point can be avoided, and the effect which suppresses the processing defect by the influence of heat storage increases.

  Specifically, the grid point region and grid point out-of-grid order determination device S304 uses the TSP solution method using the representative points of each grid point region as in the first embodiment, and the like. Determine the processing order. When the processing order of the lattice point region is determined, the apparatus S304 processes all points on the processing target 106 by connecting the processing order of single points determined using the TSP solution after the processing order. Determine the order.

  At this time, when the apparatus S304 determines the processing order of each lattice point region so that adjacent lattice point regions are not continuously processed, processing defects due to the influence of heat storage can be further effectively suppressed. The proximity determination at that time is executed by, for example, a method of comparing the shorter distance between the closest distance in the x-axis direction and the closest distance in the y-axis direction with the reference distance.

  In addition, when the apparatus S304 excludes the lattice point area for which the proximity determination has been made from the candidates for the processing order determination until only the lattice point area for which the processing order has not been determined, the processing defect is further effectively suppressed. I can do it.

  In addition, a large number of grid point areas from which proximity determination is made in a certain area of the processing target 106 are arranged. As a result, when processing is performed continuously, the apparatus S304 selects some grid point areas. The processing order is determined such that processing is performed after processing a single point. Such processing order determination is effective in further suppressing processing defects due to the influence of heat storage.

  According to the present embodiment, since the processing is performed in the processing order as shown in FIG. 12, each lattice point region is affected by heat storage due to processing of other lattice point regions and processing of single points. This embodiment is effective in suppressing the occurrence of processing defects due to heat storage.

(Embodiment 3)
In the first embodiment, the lattice point region distribution device S302 in FIG. 3 converts the point group extracted by the dense lattice point element extraction device S301 into a rectangular lattice point region having the same number of points included in all rows or columns. However, all the points connected when all points within the reference distance from each point are connected may be set as one grid area. That is, all the points in the lattice area are connected by following a point within the reference distance.

  Then, the intra-lattice point order determination device S303 in FIG. 3 determines the processing order of the point group in each lattice point region as follows. First, the apparatus S303 obtains the center point in the lattice point area as follows. That is, the apparatus S303 obtains the centroid by dividing the sum of the x coordinate values and the sum of the y coordinate values of the points included in each grid point area by the number of points included in the grid point area, and calculating the centroid. Is determined as the center point of the lattice point region.

  Then, the apparatus S303 determines the processing order so that the point group in each lattice point region is sequentially processed from a point having a short distance from the center point of the lattice point region. However, with respect to a point group having the same distance from the center point, the apparatus S303 processes points whose y coordinate is greater than or equal to the center of gravity in ascending order of x coordinates, and thereafter processes points whose y coordinate is smaller than the center of gravity in descending order of x coordinates. The processing order is determined.

  For example, the processing order of the point group in a certain lattice point region is as shown in FIG. The black dots in FIG. 13 represent the center points, and the numbers represent the processing order of the points.

  According to the present embodiment, even if the number of points included in one row or column is different, the point group is treated as one lattice point region, so the number of points included in each lattice point region increases. As a result, it is possible to obtain an effect that the processing time is shortened and the processing order in which heat is favorably dissipated is determined.

(Embodiment 4)
In the third embodiment, the center of gravity position of each grid point area is set as the center point of the grid point area, but the point to be processed closest to the center of gravity position may be set as the center point. The distance between the points is often a natural number multiple of the unit length (for example, 50 μm) according to the size standard of the semiconductor element. Therefore, if the center point is set so as to coincide with the point to be processed, As a result of an increase in the number of point groups having the same distance from the point, it becomes easy to set a processing order in which heat dissipation is good and processing time is short.

  As a method for determining the processing order of the point group in the lattice point region, in addition to the determination method described in the third embodiment, the following determination method can be adopted. Further reduction in processing time is expected.

  That is, when the distance in the x coordinate direction from a center point is represented by Δx and the distance in the y coordinate direction is represented by Δy, the intra-grid point order determination device S303 in FIG. ) Is decided to be processed sequentially from a small point. At that time, regarding the point group in which the added value (Δx + Δy) is the same value, the apparatus S303 first processes each point having an x coordinate value smaller than the x coordinate value of the center point in ascending order of the y coordinate. Thereafter, the processing order is determined so that each point having an x-coordinate value equal to or greater than the x-coordinate value of the center point is processed in descending y-coordinate order. As a result, for example, the processing order is as shown in FIG. In FIG. 14, the numerals represent the processing order, and the center point is the processing order 1 point.

  Alternatively, the intra-lattice point order determination device S303 of FIG. 3 may determine the processing order of the point group in the lattice point region by the following method.

  That is, when the distance in the x-coordinate direction from a center point is expressed as Δx and the distance in the y-coordinate direction is expressed as Δy, the apparatus S303 sequentially starts from the point where the value of Max {Δx, Δy} is small. It is decided to process. At that time, regarding the point group having the same value of Max {Δx, Δy}, the apparatus S303 firstly has the x coordinate value smaller than the x coordinate value of the center point and the y coordinate value is the stop point. A point that is greater than or equal to the y coordinate value is processed in ascending x coordinate order and y coordinate ascending order, and then the x coordinate value is greater than or equal to the x coordinate value of the center point, and the y coordinate value is greater than or equal to the coordinate value of the stop point. Are processed in ascending order of x coordinate and descending order of y coordinate, and thereafter, a point whose x coordinate value is greater than or equal to the x coordinate value of the center point and whose y coordinate value is smaller than the y coordinate value of the stop point is descended in x coordinate descending order. And the y-coordinate descending order, and thereafter, the x-coordinate value is smaller than the x-coordinate value of the center point and the y-coordinate value is smaller than the y-coordinate value of the stop point. The processing order to be processed is determined.

  The processing order in that case is as shown in FIG. 15, for example. In FIG. 15, numerals represent the machining order, and the center point is the point of machining order 1.

  According to the present embodiment, since the number of point groups having the same distance from the center point in the lattice point region increases, the number of point groups in which the irradiation point of the laser beam 102 in FIG. The setting of the order becomes easy, and the effect of further suppressing the heat dissipation is good and the processing time is extended.

(Embodiment 5)
In each of the first to fourth embodiments, all points of the point group extracted by the dense lattice point element extraction device S301 are included in any lattice point region by the lattice point region distribution device S302 of FIG. In the subsequent processing of the apparatus, the processing order is determined according to a rule different from the single point. However, when there are few elements included in one grid point area in the grid point area distribution device S302 (for example, in the case of several elements), the device S302 uses a single point group included in the grid point region as a single point. You may perform the process which returns to a point.

  According to the present embodiment, since the point group included in the lattice point region with a small number of points and a small effect of heat storage is treated as a single point, the number of points to which the TSP problem solution is applied increases or the proximity of the lattice point region is increased. Since the frequency at which the determination is output is reduced, the processing time is shortened as a result.

(Embodiment 6)
In each of the first to fifth embodiments, the operator evaluates the processing order data output by the lattice point region and out-of-grid point order determination device S304 in FIG. 3, and if necessary, the processing order determination parameters. It is assumed that the operator changes and outputs the processing order data again. However, the parameters for determining the processing order may be automatically adjusted using a simulation and inspection apparatus. The present embodiment relates to the realization of this improved point.

  FIG. 16 is an apparatus configuration diagram corresponding to a functional block diagram schematically showing a processing order determination method in the present embodiment. Compared with the above-described first to fifth embodiments (FIG. 3), the functional units of the heat storage amount calculation device S1601 and the parameter change device S1602 are added to the software program. Of course, these devices S1601 and S1602 are also components that can be realized by hardware, but in this example, they are components realized by software by a microcomputer or the like.

  In FIG. 16, a series of processing steps until the grid point region and grid point out-of-grid order determination device S304 first outputs the processing order data are the same as those described in the first embodiment (however, As each processing order determination parameter used for the initial processing order determination, a changeable initial parameter for processing order determination is used.) In each of the devices S301 to S304 whose operation is described in the first embodiment. The description of the processing is omitted here.

  The heat storage amount calculation device S1601 in FIG. 16 includes 1) processing parameters such as the output and oscillation frequency of the laser light 102, the moving speed of the galvano mirrors 103a and 103b, and the material of the processing target 106, and 2) the lattice. When the laser processing machine shown in FIG. 1 performs a drilling process on the processing target 106 according to the processing order from the point area and the processing order data output by the grid point out-of-grid order determination device S304, And the position at which the laser beam 102 passes through the fθ lens 104 and the protective window 105 (the laser beam 10 reaches a processing point to be processed positively). The temperature of each passing point on the light path) is calculated, and the calculated temperature at each point is compared with the preset temperature in order. To determine the up and down relationship between the two in management.

  If the temperature of each processing point calculated by the heat storage amount calculation device S1601 is equal to or lower than the corresponding predetermined temperature, or the temperature of each passing point of the laser beam 10 calculated by the device S1601 corresponds to the predetermined temperature. The heat storage amount calculation device S1601 outputs the processing sequence data created by the lattice point region and lattice point out-of-grid order determination device S304 only when the temperature is equal to or lower than the predetermined temperature.

  In contrast, when there is a point where the temperature calculated by the heat storage amount calculation device S1601 is higher than the predetermined temperature (hereinafter referred to as “overheat storage point”), the heat storage amount calculation device S1601. In response to the command signal from, the parameter changing device S1602 in FIG. 16 changes at least one machining order determination parameter used in any of the devices S301 to S303. The processing order determination parameter change process at this time is performed under the following policy, for example.

  If the excessive heat storage point exists at a single point, that is, if there is a leak in the dense lattice point element extraction, the parameter changing device S1602 increases the distance criterion in the dense lattice point element extracting device S301. Set. If there is an excessive heat storage point in the lattice point area, the parameter changing device S1602 1) determines the processing order of the point group in the lattice point region in the lattice point order determining device S303. The processing order determination parameters are changed so that the embodiment (determination method) in which the heat dissipation is good is appropriately selected, or 2) the lattice is determined in the lattice point region and lattice point out-of-grid order determination device S303. It is possible to take measures such as changing the reference distance for the proximity determination of the point regions to be longer, or 3) changing the processing order of the lattice point regions after the single point processing. Even when an excessive heat storage point exists in each passing point of the laser beam 10, the parameter changing device S1602 performs a process of appropriately changing the parameters for determining the processing order. Alternatively, it is possible for the operator or the designer to cope with this by changing the setting or changing the design of the optical component (in this example, the fθ lens 104 and / or the protective window 105) determined to be an excessive heat storage point. .

  As a result of the change of the processing order determination parameter, the heat storage amount calculation device S1601 executes again the processing simulation based on the processing order data created and output by the lattice point region and out-of-grid order determination device S304. And only when it is detected that the temperature of each point calculated through the machining simulation is equal to or lower than a predetermined temperature, the heat storage amount calculation device S1601 calculates the lattice point region and the lattice point. The processing order data newly created by the out-of-spot order determination device S304 is output. On the other hand, when the heat storage amount calculation device S1601 detects the presence of the excessive heat storage point again, the parameter change device S1602 executes the parameter change again, and the operations of the devices S301 to S304 are repeated.

  According to the present embodiment, if a temperature condition causing a machining defect is input as the above-described predetermined temperature, the machining is adjusted so that the temperature condition is satisfied and the machining time is not extended as much as possible. Since the order data is output from the heat storage amount calculation device S1601, there is an effect that it is possible to save the labor of parameter adjustment for determining the processing order by the operator.

(Embodiment 7)
In the sixth embodiment, when the presence of the excessive heat storage point is detected by the heat storage amount calculation device S1607, the parameter for device order determination is changed by the parameter changing device S1602, and each of the devices S301 to S304 is again executed. However, the heat storage amount calculation device S1601 may directly perform an operation while observing the order determination process of the lattice point region and lattice point out-of-grid order determination device S304.

  FIG. 17 is an apparatus configuration diagram corresponding to a functional block diagram schematically showing the processing order determination method according to the present embodiment.

  In FIG. 17, the heat storage amount calculation device S <b> 1601 watches the process in which the lattice point region and lattice point out-of-grid order determination device S <b> 304 sequentially determines the processing order from the processing start point. That is, the apparatus S1601 calculates the heat accumulation of the point group or single point in the added grid point region every time one processing order (grid point region or single point) is determined, and the comparison processing described above. Execute.

  If it is detected by the processing of the heat storage amount calculation device S1601 that an excessive heat storage point exists in the point group in the added lattice point region, the grid is received in response to reception of the output signal from the device S1601. The point area and out-of-grid point order determination device S304 discards the addition of the lattice point area to the processing order and outputs a proximity determination to the lattice point area. That is, the apparatus S304 executes processing for shifting the processing order of the grid point area to the back side. This process also includes shifting the order of the lattice point regions after processing single points.

  Alternatively, when it is detected that an excessive heat storage point exists at a single point, since there is a leak in the extraction of dense lattice point elements as in the points described in the sixth embodiment, the heat storage amount calculation device S1601 Instructs the parameter changing device S1602 to change the parameters for determining the processing order used in the dense lattice point element extracting device S301. Upon receiving this instruction, the parameter changing device S1602 executes the parameter changing process as instructed.

  Alternatively, when an excessive heat storage point exists in the point group in the added lattice point region, the lattice point region and out-of-grid point order determination device S304 adds the lattice point region to the processing order. , The proximity determination processing described above may be left to the heat storage amount calculation device S1601, and the proximity determination of the lattice point region may not be processed internally. In this case, the device S304 inquires of the heat storage amount calculation device S1601 whether or not another lattice point region or a single point that replaces the discarded lattice point region to be discarded may be determined as an additional candidate. Thus, the heat storage amount calculation device S1601 determines whether or not the additional candidate is acceptable based on the temperature data held by the heat storage amount calculation device S1601. When an additional candidate is permitted by the heat storage amount calculation device S1601, the lattice point region and lattice point out-of-grid order determination device S304 adds the additional candidate to the processing order.

  Note that there is no limit to the determination of the processing order of the lattice point regions unless the heat storage amount calculation device S1601 determines that there are excessive heat storage points in a point group within a certain lattice point region.

  According to the present embodiment, since the order of the grid point area and the single point is determined while calculating the heat storage amount as needed, the proximity determination of the grid point area where heat storage does not become a problem can be ignored, so the processing time is reduced. There is an effect that it can be further suppressed. In addition, there is an effect that the number of steps required to determine the processing order can be reduced.

(Embodiment 8)
In the sixth and seventh embodiments, when the temperature characteristics of the processing target 106 are not accurately known, the operator checks the quality of the trial processing by the laser processing machine after the processing sequence data is generated, and the result When the set temperature condition is inappropriate, adjustment is necessary as appropriate, but the work may be replaced by using an inspection apparatus.

  FIG. 18 is a configuration diagram showing a functional block diagram schematically showing the processing order determination method according to the present embodiment. Compared to the first to fifth embodiments (FIG. 3), in this embodiment, the parameter changing device S1602, the laser processing machine control device S1801, and the machining result inspection device S1802 described in the sixth embodiment are used. Has been added.

  The laser processing machine control device S1801 in FIG. 18 controls the execution of the processing by operating the laser processing machine in FIG. 1 based on the processing parameters such as the output and oscillation frequency of the laser beam 102 and the processing order. Although it was used at the time of processing in the above-described first to seventh embodiments, it was not explicitly shown.

  The processing result inspection apparatus S1802 shoots and measures the processing target 106 after the trial processing is finished with an imaging device such as a camera, compares the processed hole position with the target position, and processes the processed hole shape. A process of comparing the ideal hole shape and the like is executed to inspect whether or not a processing failure due to the effect of heat storage has occurred.

  When the machining result inspection apparatus S1802 detects that a machining defect has occurred in the machining target 106, the parameter changing apparatus S1602 uses the parameter for determining the machining order as in the case described in the sixth embodiment. Are changed so that the heat dissipation is good, and each of the devices S301 to S304 generates data of the processing order again.

  On the other hand, when the processing result inspection apparatus S1802 cannot confirm the processing failure on the processing target 106, the processing machine of FIG. This processing is performed under control.

  According to the present embodiment, since the parameters for determining the processing order are adjusted while performing the trial processing, even if the temperature characteristics of the processing target 106 are unclear, the heat is heated to such an extent that processing defects do not occur. Since it is possible to determine the processing order adjusted so that the diffusion is good and the processing time is not extended as much as possible, there is an effect of saving the labor of parameter adjustment for determining the processing order by the operator.

(Embodiment 9)
In the eighth embodiment, the simulation of the heat storage was not performed, but the heat storage amount calculation device S1601 described in the sixth or seventh embodiment was added to the device in FIG. 18 in the eighth embodiment. Also good.

  FIG. 19 is an apparatus configuration diagram corresponding to a functional block diagram schematically showing a processing order determination method according to the present embodiment.

  Even if the temperature characteristics of the workpiece 106 are not accurate, the heat storage amount calculation device S1601 can grasp the position where heat storage is easy and can derive a rough temperature condition. Therefore, the heat storage amount calculation device S1601 It is possible to eliminate the processing order in which the influence appears remarkably.

  According to the present embodiment, since the processing order in which the effect of heat storage appears remarkably is excluded in the heat storage amount calculation device S1601, even if the temperature characteristics of the processing target 106 are unclear, the trial There is an effect that the number of times of processing can be reduced.

(Embodiment 10)
Processing steps for realizing a part or all of the functions of each device except for hardware such as a camera of the processing result inspection device S1802 may be realized on an external computer (such as a personal computer). That is, you may make it mount the program which performs the processing order determination process described in each of Embodiment 1-9 in an external computer. In this case, the configuration of the “processing device” is defined including the corresponding functional unit in the external computer.

  In such a case, the effect that the cost required for introduction and maintenance can be reduced is obtained.

  In each of the first to ninth embodiments, the dense lattice point element extraction device S301, the lattice point region distribution device S302, the in-grid point order determination device S303, the lattice point region and lattice point out-of-grid order determination device S304, the heat storage As described above, the quantity calculation device S1601, the parameter change device S1602, and the processing result inspection device S1802 may be separately installed as hardware devices.

(Appendix)
While the embodiments of the present invention have been disclosed and described in detail above, the above description exemplifies aspects to which the present invention can be applied, and the present invention is not limited thereto. In other words, various modifications and variations to the described aspects can be considered without departing from the scope of the present invention.

  DESCRIPTION OF SYMBOLS 101 Laser light source, 102 Laser light, 106 Processing object, S301 Dense lattice point element extraction apparatus, S302 Lattice point area distribution apparatus, S303 Intra-lattice point order determination apparatus, S304 Lattice point area and out-of-grid point order determination apparatus, S1601 Calculation device, S1602 Parameter changing device, S1802 Processing result inspection device.

Claims (8)

A processing device for making a hole in the processing target by irradiating the processing target with laser light,
A dense lattice point element extraction unit that extracts hole positions that are elements of dense lattice points from hole position data;
A grid point area distribution unit that collects the extracted hole positions according to a certain rule and divides the hole positions into one or more grid point areas;
Processing order of hole positions in the lattice point area so that heat is dissipated from the center of the lattice point area to the outside in a one-dimensional or two-dimensional manner for each of the one or more lattice point areas. An in-grid point order determination unit for determining
The one or more lattice point regions whose hole position processing order in each lattice point region is determined by the lattice point order determining unit, and the dense lattice point element extracted by the dense lattice point element extraction unit A lattice point region and a lattice point out-of-grid order determination unit for determining the processing order of the hole positions that have not been performed using a solution to the traveling salesman problem,
It is characterized by having,
Processing equipment. The processing apparatus according to claim 1,
The processing target is processed in accordance with the processing order from the processing parameters including the output and oscillation frequency of the laser light and the material to be processed, and the processing order output from the lattice point region and out-of-lattice order determination unit. When performing a simulation to calculate the temperature of each laser light irradiation point on the object to be processed and the temperature of each passing point on the optical path until the laser light reaches each laser light irradiation point, Each calculated temperature is compared with a predetermined temperature as a temperature condition corresponding to the temperature at which a processing defect occurs, and each of the calculated temperatures is equal to or lower than the corresponding predetermined temperature. A heat storage amount calculation unit that outputs the processing sequence used in the simulation only in the case;
When the heat storage amount calculation unit detects the presence of a laser beam irradiation point whose calculated temperature is higher than the corresponding predetermined temperature, or the calculated temperature is higher than the corresponding predetermined temperature. When the presence of a passing point on the optical path of the higher laser beam is detected, the dense lattice point element extraction unit, the lattice point region distribution unit, the intra-grid point order determination unit, and the lattice point region and the lattice point A parameter changing unit that changes a processing order determining parameter used by at least one of the outer order determining units,
When the parameter changing unit changes the processing order determination parameter, the dense lattice point element extraction unit, the lattice point region distribution unit, the intra-grid point order determination unit, and the lattice point region and the lattice point outside The order determining unit determines the processing order again and outputs it to the heat storage amount calculating unit,
Processing equipment. The processing apparatus according to claim 1,
A processing result inspection unit that detects whether a processing failure due to the effect of heat storage has occurred on the processing target after being subjected to trial processing according to the processing order output from the lattice point region and out-of-grid order determination unit,
When the processing result inspection unit detects the occurrence of processing failure, the dense lattice point element extraction unit, the lattice point region distribution unit, the intra-grid point order determination unit, and the lattice point region and the order outside the lattice points A parameter changing unit that changes a processing order determination parameter used by at least one of the determining units;
When the parameter changing unit changes the processing order determination parameter, the dense lattice point element extraction unit, the lattice point region distribution unit, the intra-grid point order determination unit, and the lattice point region and the lattice point outside The order determining unit determines and outputs the processing order again,
Processing equipment. The processing apparatus according to claim 2,
It further comprises a processing result inspection unit that detects whether or not a processing failure due to the effect of heat storage has occurred on the processing target after being subjected to trial processing according to the processing order output from the heat storage amount calculation unit,
The parameter changing unit is characterized by changing the processing order determination parameter even when the processing result inspection unit detects the occurrence of processing failure.
Processing equipment. A program for deciding a processing order of a processing apparatus for making a hole in the processing target by irradiating the processing target with laser light,
Dense lattice point element extraction processing for extracting hole positions that are elements of dense lattice points from hole position data;
Grid point area distribution processing for collecting the extracted hole positions according to a certain rule and dividing the hole positions into one or more grid point areas;
Processing order of hole positions in the lattice point area so that heat is dissipated from the center of the lattice point area to the outside in a one-dimensional or two-dimensional manner for each of the one or more lattice point areas. In-grid point order determination processing for determining
The one or more lattice point regions whose hole position processing order in each lattice point region is determined by the lattice point order determination process, and the dense lattice point element is extracted by the dense lattice point element extraction process. A grid point region and a grid point out-of-grid order determination process for determining the processing order of the hole positions that have not been performed using a method for solving the traveling salesman problem,
It is characterized by being prepared for the computer to realize,
Program for machining equipment. A program for a machining apparatus according to claim 5,
In order to realize the computer,
The processing target is processed in accordance with the processing order from the processing parameters including the output and oscillation frequency of the laser light and the material to be processed, and the processing order output by the lattice point region and out-of-grid point order determination processing. When performing a simulation to calculate the temperature of each laser light irradiation point on the object to be processed and the temperature of each passing point on the optical path until the laser light reaches each laser light irradiation point, Each calculated temperature is compared with a predetermined temperature as a temperature condition corresponding to the temperature at which a processing defect occurs, and each of the calculated temperatures is equal to or lower than the corresponding predetermined temperature. A heat storage amount calculation process for outputting the processing sequence used in the simulation only when
When it is detected by the heat storage amount calculation process that the calculated temperature is higher than the corresponding predetermined temperature, or the calculated temperature is higher than the corresponding predetermined temperature. If the presence of a passing point on the optical path of the higher laser beam is detected, the dense lattice point element extraction processing, the lattice point region distribution processing, the lattice point order determination processing, and the lattice point region and lattice point A parameter change process for changing a processing order determination parameter used by at least one of the outer order determination processes;
When the parameter for processing order determination is changed by the parameter change processing, the dense lattice point element extraction processing, the lattice point region distribution processing, the lattice point order determination processing, and the lattice point regions and lattice points After the outside order determination process is executed again and the processing order is determined again, the heat storage amount calculation process is executed again,
Program for machining equipment. A program for a machining apparatus according to claim 5,
In order to realize the computer,
A processing result inspection process for detecting whether or not a processing failure due to the effect of heat storage has occurred in the processing target after being subjected to the test processing according to the processing order determined by the lattice point region and the out-of-grid order determination processing;
When processing defects are detected by the processing result inspection processing, the dense lattice point element extraction processing, the lattice point region distribution processing, the intra-grid point order determination processing, and the lattice point region and out of the lattice points A parameter change process for changing a processing order determination parameter used by at least one of the order determination processes;
When the parameter for processing order determination is changed by the parameter change processing, the dense lattice point element extraction processing, the lattice point region distribution processing, the lattice point order determination processing, and the lattice point regions and lattice points The outside order determination process is executed again, the processing order is determined again, and then the processing result inspection process is executed again.
Program for machining equipment. A program for a machining apparatus according to claim 6,
In order to realize the computer,
It further includes a processing result inspection process for detecting whether a processing failure due to the effect of heat storage has occurred on the processing target after being subjected to trial processing according to the processing order output by the heat storage amount calculation processing,
The parameter changing process for changing the parameters for determining the processing order is executed even when the occurrence of a processing defect is detected by the processing result inspection process,
Program for machining equipment.

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