CN113851386A - 膜厚测定装置、成膜装置、膜厚测定方法、电子器件的制造方法及存储介质 - Google Patents

膜厚测定装置、成膜装置、膜厚测定方法、电子器件的制造方法及存储介质 Download PDF

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Publication number
CN113851386A
CN113851386A CN202110675688.3A CN202110675688A CN113851386A CN 113851386 A CN113851386 A CN 113851386A CN 202110675688 A CN202110675688 A CN 202110675688A CN 113851386 A CN113851386 A CN 113851386A
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CN
China
Prior art keywords
substrate
film thickness
measurement
thickness measuring
film
Prior art date
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Pending
Application number
CN202110675688.3A
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English (en)
Chinese (zh)
Inventor
佐藤祐希
小林康信
谷和宪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Tokki Corp
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Canon Tokki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Tokki Corp filed Critical Canon Tokki Corp
Publication of CN113851386A publication Critical patent/CN113851386A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electroluminescent Light Sources (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Physical Vapour Deposition (AREA)
CN202110675688.3A 2020-06-26 2021-06-18 膜厚测定装置、成膜装置、膜厚测定方法、电子器件的制造方法及存储介质 Pending CN113851386A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-110574 2020-06-26
JP2020110574A JP7424927B2 (ja) 2020-06-26 2020-06-26 膜厚測定装置、成膜装置、膜厚測定方法、電子デバイスの製造方法、プログラム及び記憶媒体

Publications (1)

Publication Number Publication Date
CN113851386A true CN113851386A (zh) 2021-12-28

Family

ID=78973043

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110675688.3A Pending CN113851386A (zh) 2020-06-26 2021-06-18 膜厚测定装置、成膜装置、膜厚测定方法、电子器件的制造方法及存储介质

Country Status (3)

Country Link
JP (1) JP7424927B2 (ja)
KR (1) KR102659924B1 (ja)
CN (1) CN113851386A (ja)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3647622B2 (ja) * 1997-11-26 2005-05-18 大日本スクリーン製造株式会社 膜厚測定装置
JP3944693B2 (ja) 2001-10-04 2007-07-11 オムロン株式会社 膜厚測定装置
KR100848336B1 (ko) * 2006-10-30 2008-07-25 삼성에스디아이 주식회사 증착되는 박막의 두께를 실시간으로 측정가능한 증착 장치및 증착 방법
KR101018644B1 (ko) 2008-09-05 2011-03-03 에스엔유 프리시젼 주식회사 증착장치 및 이를 이용한 증착방법
US20110033957A1 (en) 2009-08-07 2011-02-10 Applied Materials, Inc. Integrated thin film metrology system used in a solar cell production line
US20130159445A1 (en) * 2010-08-10 2013-06-20 Zonka And Associates Multi-media electronic greeting card with social media component
JP2016172259A (ja) 2015-03-16 2016-09-29 東レエンジニアリング株式会社 描画装置
JP2018155842A (ja) 2017-03-16 2018-10-04 東芝メモリ株式会社 計測方法、計測プログラム、及び計測システム
KR101866139B1 (ko) 2017-08-25 2018-06-08 캐논 톡키 가부시키가이샤 얼라인먼트 방법, 얼라인먼트 장치, 이를 포함하는 진공증착방법 및 진공증착장치
KR102355418B1 (ko) * 2018-04-26 2022-01-24 캐논 톡키 가부시키가이샤 기판 반송 시스템, 전자 디바이스 제조장치 및 전자 디바이스 제조방법

Also Published As

Publication number Publication date
JP2022007541A (ja) 2022-01-13
JP7424927B2 (ja) 2024-01-30
KR102659924B1 (ko) 2024-04-22
KR20220000825A (ko) 2022-01-04

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