CN113828929A - Polishing machine, composite laser polishing and method for repairing high-entropy alloy additive product - Google Patents
Polishing machine, composite laser polishing and method for repairing high-entropy alloy additive product Download PDFInfo
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- CN113828929A CN113828929A CN202111257259.0A CN202111257259A CN113828929A CN 113828929 A CN113828929 A CN 113828929A CN 202111257259 A CN202111257259 A CN 202111257259A CN 113828929 A CN113828929 A CN 113828929A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
- B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
Abstract
The invention discloses a polishing machine, a composite laser polishing method and a method for repairing a high-entropy alloy additive manufactured part, wherein the laser polishing technology is introduced into the field of high-entropy alloy additive manufacturing, so that the problems that a high-entropy alloy printed part is extremely high in hardness and roughness and wastes time and labor in a traditional polishing post-treatment mode are solved; on the other hand, the high-entropy alloy printing piece with a complex structure can also be polished, the application market of the powder bed melting molding high-entropy alloy printing piece is expanded, and the introduction of laser polishing is beneficial to improving the environment of polishing work and realizing automatic production. According to the invention, three light sources of large-area rough polishing, surface micro polishing and ultra-short pulse cold polishing are combined, the order of rough polishing, surface micro polishing and ultra-short pulse cold polishing is adopted, and on the premise of ensuring the polishing efficiency, the requirement of very high surface roughness can be met, so that a high-performance new material, namely a high-entropy alloy, can be applied more quickly.
Description
Technical Field
The invention belongs to the technical field of additive manufacturing surface post-treatment, and particularly relates to a polishing machine, a composite laser polishing method and a method for repairing a high-hardness refractory high-entropy alloy additive manufacturing formed part.
Background
With the continuous progress of high-end equipment manufacturing technology, advanced high-complexity and precise thermal and power machinery puts higher requirements on the performance and surface quality of the manufacturing of high-temperature-resistant parts with complex structures. Particularly in the fields of national defense and military industry and aerospace, a great number of key parts need to work under extremely high temperature conditions for a long time, and extremely strict requirements are imposed on the surface quality, appearance and service life of parts. Powder bed melt forming has been developed over decades and is well suited for forming metal parts of complex construction. The refractory high-entropy alloy adopts high-melting-point elements such as W, Mo, Nb, Ta and V and the like, and is considered to have excellent comprehensive properties such as high temperature resistance, high strength, high hardness and the like by mixing according to nearly equimolar atoms or equimolar ratio. The use of powder bed fusion forming of high entropy alloys to produce high precision, high temperature resistant key components is widely recognized as having great potential. However, the surface roughness of the parts formed by melting through the powder bed is generally 15-50 μm, which is much larger than that of the parts processed by the traditional method, and the refractory high-entropy alloy printing parts formed by melting through the powder bed often have the defects of cracks, pores and the like, and the parts still hardly meet the requirements of modern industry through post-treatment means such as mechanical polishing and the like. The reasons are mainly as follows:
1. the refractory high-entropy alloy can resist high temperature, and often has extremely high hardness, the hardness of a grinding tool needs to be higher than that of the high-entropy alloy by adopting traditional mechanical polishing, otherwise, the grinding material is very high in loss, the grinding material needs to be frequently replaced, time and labor are consumed, great difficulty is brought to traditional polishing methods such as mechanical polishing, the time required by polishing is greatly prolonged, and the production efficiency is influenced.
2. The traditional powder bed melting formed part is mechanically polished, shot-blasted and the like, the polishing place has dust, waste gas, noise and other pollution, the working environment is poor, the manual participation is inevitably needed, and the modernization and automatic production is difficult to realize.
3. The powder bed melt forming can produce parts with complex structures, if the parts are polished by using the traditional mechanical polishing means, the polishing of the parts with the internal structure or the complex structure can be realized only by the linkage of a complex multi-shaft machine tool, the multi-shaft machine tool is expensive in equipment and complex in operation, so that the polishing is very difficult, and the polishing efficiency and the marketization application of the high-entropy alloy printing piece are seriously influenced.
4. High-entropy alloy prints formed by powder bed melting often have defects such as cracks, pores and the like, and the performance of the prints is greatly reduced due to the existence of the defects. And if only conventional polishing is used as a post-treatment means, such as: mechanical polishing, electrochemical polishing and the like have extremely limited defect repair, so that high-entropy alloy printing pieces are difficult to widely use.
In view of the above four points, it is difficult to practically apply the high-entropy alloy powder bed molten molded article having excellent properties to the market.
Disclosure of Invention
The invention provides a polishing machine, a composite laser polishing method and a method for repairing a high-entropy alloy additive manufactured part, provides a new solution for the post-polishing treatment process of a high-entropy alloy powder bed molten molded part, and is beneficial to the marketization application of a high-entropy alloy printed part.
In order to achieve the purpose, the closed laser polishing machine comprises a sealed cabin, wherein a rough polishing laser, a micro polishing laser and an ultrashort pulse cold polishing laser are arranged at the top of the sealed cabin, and a holder for holding a processed workpiece is arranged at the lower part of the sealed cabin; the wavelength and the pulse width of the rough polishing laser are both larger than those of the micro polishing laser, and the pulse width of the ultra-short pulse cold polishing laser is picosecond level or below.
Further, the clamp is arranged in the sealed cabin through a support rod.
Further, an oxygen content detector is arranged in the sealed cabin.
A method for composite laser polishing and repairing a high-entropy alloy additive manufactured part based on the closed laser polishing machine comprises the following steps:
step 1, mounting a high-entropy alloy workpiece on a clamp holder;
step 8, starting the ultra-short pulse cold polishing laser, and adjusting the laser position to the initial processing position of the polished surface;
and 9, adjusting the power of the ultra-short pulse cold polishing laser to a target value, starting to carry out cold polishing along the same path as that in the step 6, and removing the residual bulges on the surface of the high-entropy alloy workpiece after micro-polishing.
Further, in step 3, argon is introduced into the sealed cabin until the oxygen concentration in the sealed cabin is reduced to below 200 PPm.
Further, in step 4, when the rough polishing laser is aligned to the initial processing position of the high-entropy alloy workpiece, the power of the rough polishing laser is adjusted to the minimum value.
Further, in step 5, under the target power, the energy density of the laser is greater than the ablation threshold of the high-entropy alloy part, and the depth of the molten pool is greater than the depth of the surface depression of the high-entropy alloy part.
Further, in step 7, the power of the micro-polishing laser is smaller than that of the rough-polishing laser in step 5, and the thickness of the molten pool is smaller than the distance from the surface of the polished surface to the pit.
Compared with the prior art, the invention has at least the following beneficial technical effects:
the device combines three light sources of a rough polishing laser, a surface micro polishing machine shutter and an ultrashort pulse cold polishing, the rough polishing laser, the surface micro polishing machine shutter and the ultrashort pulse cold polishing are movably arranged in a sealed cabin, the laser polishing can be digitally controlled, the support rod can move under the control of a computer to realize automatic polishing without human participation, the laser polishing can not generate dust, noise and other pollution, the working environment of polishing operation is greatly improved, the full-automatic flow line production of high-entropy alloy workpieces from printing molding to post-processing polishing is expected to be realized, and the production efficiency of the high-entropy alloy workpieces is greatly improved.
The invention introduces a laser polishing technology into the post-processing field of high-hardness refractory high-entropy alloy additive manufacturing, utilizes the advantages of wide application range, high precision, non-contact, automation realization, economy, environmental protection, high productivity and the like of the laser polishing technology, and solves the problems of long time, difficulty in automation realization, difficulty in polishing parts in the structure or in a complex structure, low defect repairing capability and the like of the traditional method for polishing high-entropy alloy printing parts. And the laser polishing does not need to consider the problem of material hardness.
High hardness refractory high entropy alloys can be generally manufactured by additive manufacturing using powder bed melting techniques, which can form parts having complex structures that can be polished very easily using digitally controlled laser polishing techniques.
The method disclosed by the invention combines three light sources of large-area rough polishing, surface micro polishing and ultrashort pulse cold polishing, according to the sequence of rough polishing, surface micro polishing and ultrashort pulse cold polishing, on the premise of ensuring the polishing efficiency, the method can meet the requirement of nanoscale surface roughness, and creates conditions for applying a high-performance refractory high-entropy alloy printing piece as a high-temperature-resistant key part to the fields of aerospace, war industry, national defense and the like.
Furthermore, high-hardness refractory high-entropy alloy is usually formed by melting through a powder bed, so that the formed high-entropy alloy product has very high surface roughness, the surface roughness is generally 15-50 μm, the surface of the product has large fluctuation, good surface quality is difficult to obtain by simply adopting one-time laser polishing, mechanical polishing pretreatment and laser fine polishing are generally needed, and the mechanical polishing is very difficult due to the overlarge hardness of the product. The invention firstly utilizes rough polishing laser with long wavelength and long pulse width to carry out large-area rapid rough polishing to remove the large fluctuation on the surface of a workpiece; and then, micro-polishing the surface by using laser with shorter wavelength and pulse, and removing small fluctuation generated when the surface melt flows and collides with a solidification region due to too high energy density after rough polishing. The laser melts the raised portions and the melt fills the depressed portions under the action of gravity, thereby reducing surface roughness. Finally, the cold polishing laser with ultra-short pulse width is used for removing the residual bulges on the surface after micro-polishing, so that the roughness is further reduced. Therefore, the invention adopts three laser polishing modes in sequence, and can well solve the problem that the surface roughness of the workpiece is overlarge and the workpiece is difficult to be polished by mechanical polishing pretreatment and laser finish polishing due to overlarge hardness.
Furthermore, the powder bed is adopted to melt and mold the high-hardness refractory high-entropy alloy, so that the generation of defects such as cracks, pores and the like cannot be avoided generally, and the performance of a finished piece is greatly influenced due to the existence of the defects. The invention adopts the polishing mode combining three light sources of rough polishing, micro polishing and cold polishing, so that the polishing process also has a repairing function. The rough polishing adopts a laser light source with large energy density, long wavelength and long pulse width, and because of the large energy density, a deeper molten pool can be formed on the polished surface, and a melt substance can flow under the action of gravity to fill cracks and pores, thereby playing a certain repairing role. However, due to the fact that laser energy density is high, microcracks are inevitably generated due to a large temperature gradient, and then a micro-polishing laser with low energy density, short wavelength and pulse is adopted for secondary polishing, so that small protrusions on the surface are melted, and the cracks generated by rough polishing are filled up by a melt. Finally, the ultrashort pulse laser is used for carrying out final surface polishing treatment. The laser thermal effect of the ultrashort pulse can be ignored, so that no crack is generated as the final surface treatment, and the surface polishing quality can be improved.
Furthermore, the invention firstly adopts rough polishing laser with long wavelength and wide pulse width to polish the high-entropy alloy printing piece, and because the energy density is high, and the laser irradiates the surface of the manufactured piece, the heating and cooling process of the surface substance is very quick, thereby forming a quenching layer on the surface of the manufactured piece, further improving the surface hardness and expanding the application range of the high-entropy alloy.
Drawings
FIG. 1 is a flow chart of the present invention;
FIG. 2 is a three-dimensional view illustrating a high-entropy alloy part to be polished formed by melting from a powder bed;
FIG. 3 is a schematic representation of the original surface topography of a high entropy alloy article prior to polishing;
FIG. 4 is a schematic diagram of the surface topography of a high-entropy alloy article after laser rough polishing;
FIG. 5 is a schematic view of the surface topography of a high entropy alloy article after laser micro-polishing;
FIG. 6 is an enlarged schematic view of the surface topography of a high-entropy alloy workpiece after ultra-short pulse laser cold polishing;
FIG. 7 is a schematic diagram of the compounding device of the present invention;
in the drawings: 1. sealing the cabin; 2. a rough polishing laser; 3. a micro-polishing laser; 4. ultra-short pulse cold-polished lasers; 5. a high entropy alloy part; 6. a holder; 7. a support rod.
Detailed Description
In order to make the objects and technical solutions of the present invention clearer and easier to understand. The present invention will be described in further detail with reference to the following drawings and examples, wherein the specific examples are provided for illustrative purposes only and are not intended to limit the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified. In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 7, for example, polishing the irregular high-entropy alloy workpiece to be polished, which is formed by melting the powder bed shown in fig. 2, a large-area curved surface on the upper part of the workpiece needs to be polished. A method for composite laser polishing and repairing of a high-hardness refractory high-entropy alloy additive manufacturing formed part comprises the following steps:
step 1, correctly placing a high-entropy alloy workpiece 5 formed by fusing a powder bed on a clamp 6 of a closed laser polishing machine, and clamping a cylindrical part of a lower base of the workpiece by using the clamp 6 to fix the workpiece. The original surface topography of the workpiece 5 to be polished is shown in FIG. 3, the surface has large fluctuation and large roughness, and the roughness is more than 15 μm;
and 5, opening the rough polishing laser 2 with long wavelength and long pulse width, wherein the wavelength range of the rough polishing laser 2 is more than 500nm, such as green light, red light, near infrared light lasers and the like, the pulse width is continuous laser or microsecond-level laser, and the rough polishing laser is selected according to the absorption degree of the polished material to light. Firstly, the power is adjusted to the minimum, the laser position is observed, and if the laser deviates from the area needing to be processed, the position of the rough polishing laser 2 is adjusted to be aligned to the initial processing position of the curved surface area needing to be processed.
And 6, adjusting the power of the rough polishing laser 2 with long wavelength and long pulse width to be high, so that the energy density of the laser is greater than the ablation threshold of the high-entropy alloy part 5, and the depth of a molten pool is greater than the depth of the concave part on the surface of the high-entropy alloy part 5, thereby achieving the surface deep melting state. Parameters such as power, track spacing, defocusing amount, scanning speed and the like are adjusted according to the depth of a molten pool, the surface ablation condition and the polishing effect, if the molten pool is too deep and the surface ablation condition is serious, the surface quality is poor, the power of the rough polishing laser 2 is reduced, and the parameters such as track spacing, defocusing amount, scanning speed and the like are increased to reduce the laser energy density; otherwise, if the molten pool is too shallow and the surface melting is insufficient, the power of the rough polishing laser 2 is increased, and the track spacing, the defocusing amount and the scanning speed are reduced to increase the laser energy density until proper parameters are adjusted. The laser begins to polish along a predetermined path. And (4) closing the rough polishing laser 2 after polishing is finished, and naturally cooling the high-entropy alloy workpiece 5. The surface appearance of the high-entropy alloy workpiece 5 after rough polishing is shown in FIG. 4, the surface fluctuation is reduced, and the roughness is reduced;
and 7, after rough polishing, cooling the high-entropy alloy workpiece 5, and turning on the micro-polishing laser 3 with shorter wavelength and pulse, wherein the wavelength range is less than 500nm, such as ultraviolet light, blue light laser and the like, and the pulse width is in nanosecond level. Firstly, the power of the micro-polishing laser is reduced, and the initial processing position of the laser is adjusted by using the minimum power of the selected micro-polishing laser.
And 8, adjusting the power of the micro-polishing laser 3 to a proper power, so that the energy density of the laser is slightly larger than the ablation threshold of the polished material, and the thickness of a molten pool is smaller than the distance from the surface of the polished surface to the pit, thereby achieving a superficial melting state of the surface. And similarly to the method in the step 6, reducing the power if the molten pool is too deep, increasing the track spacing, defocusing amount and scanning speed if the molten pool is too shallow and insufficient in melting, and increasing the power if the molten pool is too shallow, reducing the track spacing, defocusing amount and scanning speed. The energy density of the laser is controlled by adjusting parameters, so that the laser can just melt the micro-protrusions on the polished surface, but not melt the pits to the optimal energy density, and the melted protrusion parts can fill the pits under the action of gravity and surface tension, thereby achieving good polishing effect. The laser then begins polishing along the same path as in step 6. And after polishing is finished, closing the micro-polishing laser 3, and naturally cooling the high-entropy alloy workpiece 5. The surface topography of the polished piece 5 after micro-polishing is shown in figure 5, and the surface roughness is already low.
And 9, after micro polishing, cooling the workpiece, further reducing the pulse width to the maximum extent, and starting the ultra-short pulse width cold polishing laser 4, wherein the pulse width of the ultra-short pulse cold polishing laser 4 is picoseconds, femtosecond magnitude or even shorter. The energy of the ultra-short pulse cold-polishing laser 4 is adjusted to be the lowest firstly, and then the laser position is adjusted to the initial processing position of the polished curved surface.
And step 10, adjusting parameters of the ultra-short pulse cold-polishing laser 4, and increasing the power of the ultra-short pulse cold-polishing laser 4 to a proper power, so that the energy density of the laser can just remove the surface convex part of the polished material. The micro-protrusions on the micro-polished surface can be directly removed in the form of plasma by laser irradiation without damaging other surface parts. And then, the laser starts to carry out cold polishing along the preset path in the step 6, and small projections remained on the surface of the high-entropy alloy workpiece 5 after micro polishing are removed. The final surface topography of the high entropy alloy article 5 after cold polishing is shown in fig. 6.
And step 11, after the cold polishing is finished, opening the sealed cabin 1 of the laser polishing machine to loosen the clamp 6 for clamping the workpiece, and taking out the polished workpiece 5.
Referring to fig. 7, the enclosed laser polishing machine includes a sealed chamber 1, a rough polishing laser 2, a micro polishing laser 3, an ultra-short pulse cold polishing laser 4, a holder 6 and a support rod 7.
The rough polishing laser 2, the micro polishing laser 3, the ultra-short pulse cold polishing laser 4, the holder 6 and the support rod 7 are all arranged in the sealed cabin 1, wherein the rough polishing laser 2, the micro polishing laser 3 and the ultra-short pulse cold polishing laser 4 are movably arranged at the top of the sealed cabin 1, the support rod 7 is arranged on the bottom plate of the sealed cabin 1, the lower end of the holder 6 is hinged on the support rod 7, and the upper end of the holder is used for holding a processed workpiece.
The rough polishing laser 2, the micro polishing laser 3 and the ultra-short pulse cold polishing laser 4 are driven by different motors respectively and independently move in the vertical or horizontal direction in the sealed cabin under the control of a computer. The wavelength of the rough polishing laser 2 is more than that of the micro polishing laser 3.
The wavelength range of the rough polishing laser 2 is more than 500nm, such as green light, red light, near infrared light laser and the like, the pulse width is continuous laser or microsecond laser, and the rough polishing laser is selected according to the absorption degree of the polished material to light.
The wavelength range of the micro-polishing laser 3 is less than 500nm, such as ultraviolet light, blue light laser and the like, and the pulse width is in nanosecond order.
The pulse width of the ultra-short pulse width cold polishing laser 4 is picoseconds, femtosecond magnitude or even shorter.
The model parameters of the rough polishing laser 2, the micro polishing laser 3 and the ultra-short pulse cold polishing laser 4 need to be selected according to specific materials, and the lasers are independent from each other, so that different laser models can be conveniently and freely replaced, and different materials can be conveniently polished.
The support rod 7 and the clamper 6 can be controlled by a computer in the three-dimensional space of the sealed cabin 1, and the motor drives the free rotation or movement so as to facilitate the processing of complex high-entropy alloy parts.
The invention introduces the laser polishing technology into the post-treatment field of high-hardness refractory high-entropy alloy additive manufacturing, and can solve the problems of difficult mechanical polishing, time waste and labor waste of high-hardness metal. And secondly, the laser polishing can polish the parts with complex structures very easily, and is particularly suitable for high-entropy alloy molded parts with complex structures formed by powder bed melting. Finally, laser polishing can change the current situations that the traditional polishing mode needs manpower, the working environment is poor and the production efficiency is low, and realize automatic production.
The invention integrates three light sources of large-area rough polishing, surface micro polishing and ultrashort pulse cold polishing, according to the sequence of rough polishing, surface micro polishing and ultrashort pulse cold polishing, and can meet the requirement of very high surface roughness on the premise of ensuring the polishing efficiency. In addition, the invention utilizes three light sources to carry out polishing, can not only solve the problems that the surface roughness of the high-entropy alloy piece formed by powder bed melting is too large, the fluctuation is too large, and the high-entropy alloy piece can not be finely polished by laser, but also can repair the defects of cracks, pores and the like frequently generated in the forming process of the high-entropy alloy piece, and form a quenching layer on the surface to improve the surface hardness of the piece.
The above-mentioned contents are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereby, and any modification made on the basis of the technical idea of the present invention falls within the protection scope of the claims of the present invention.
Claims (8)
1. A closed laser polishing machine is characterized by comprising a sealed cabin (1), wherein a rough polishing laser (2), a micro polishing laser (3) and an ultrashort pulse cold polishing laser (4) are arranged at the top of the sealed cabin (1), and a holder (6) for holding a processed workpiece is arranged at the lower part of the sealed cabin (1); the wavelength and the pulse width of the rough polishing laser (2) are both larger than those of the micro polishing laser (3), and the pulse width of the ultra-short pulse cold polishing laser (4) is picosecond and below.
2. The closed laser polishing machine according to claim 1, characterized in that the holder (6) is mounted in the capsule (1) by means of a support rod (7).
3. The closed laser polishing machine according to claim 1, characterized in that an oxygen content detector is arranged in the sealed cabin (1).
4. A method for composite laser polishing and repairing a high-entropy alloy additive manufactured part based on the closed laser polishing machine of claim 1, which is characterized by comprising the following steps:
step 1, mounting a high-entropy alloy workpiece (5) on a holder (6);
step 2, closing a sealed cabin of the sealed laser polishing machine, and enabling the air tightness to meet the requirement;
step 3, introducing argon into the sealed cabin (1);
step 4, turning on the rough polishing laser (2) to align the rough polishing laser to the initial processing position of the high-entropy alloy workpiece (5);
step 5, adjusting the power of the rough polishing laser (2) to a target power, starting to polish the high-entropy alloy workpiece (5) along a preset path, and closing the rough polishing laser (2) after polishing the high-entropy alloy workpiece (5) by using the rough polishing laser (2) to cool the processed workpiece;
step 6, turning on the micro-polishing laser (3), and adjusting the initial processing position of the laser;
step 7, adjusting the power of the micro-polishing laser (3) to a target value, starting polishing the high-entropy alloy workpiece 5 along the same path as that in the step 6, and closing the micro-polishing laser (3) after polishing is finished so as to cool the polished high-entropy alloy workpiece (5);
step 8, starting the ultra-short pulse cold polishing laser (4), and adjusting the laser position to the initial processing position of the polished surface;
and 9, adjusting the power of the ultra-short pulse cold polishing laser (4) to a target value, starting to carry out cold polishing along the same path as that in the step 6, and removing the residual bulges on the surface of the high-entropy alloy workpiece (5) after micro-polishing.
5. The composite laser polishing and repairing method for the high-entropy alloy additive manufacturing part according to claim 4, wherein in the step 3, argon gas is introduced into the sealed cabin (1) until the oxygen concentration in the sealed cabin (1) is reduced to below 200 PPm.
6. The composite laser polishing and repairing method for the high-entropy alloy additive manufacturing element according to claim 4, wherein in the step 4, when the rough polishing laser (2) is aligned with the initial processing position of the high-entropy alloy manufacturing element (5), the power of the rough polishing laser (2) is adjusted to the minimum value.
7. The composite laser polishing and repairing method for the high-entropy alloy additive manufacturing element is characterized in that in the step 5, under the target power, the energy density of the laser is larger than the ablation threshold of the high-entropy alloy manufacturing element (5), and the depth of a molten pool is larger than the depth of a concave position on the surface of the high-entropy alloy manufacturing element (5).
8. The method for composite laser polishing and repairing the high-entropy alloy additive manufactured part according to claim 4, wherein in the step 7, the power of the micro-polishing laser (3) is smaller than that of the rough-polishing laser (2) in the step 5, and the thickness of the molten pool is smaller than the distance from the surface of the polished surface to the pit.
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| CN108115269A (en) * | 2017-12-29 | 2018-06-05 | 上海驰声新材料有限公司 | Non-crystaline amorphous metal laser cryogenic polishing system and method |
| CN109848566A (en) * | 2018-12-07 | 2019-06-07 | 香港生产力促进局 | A kind of method and device of hybrid laser sanding and polishing components and mold |
| CN111299838A (en) * | 2019-11-22 | 2020-06-19 | 武汉大学 | Laser polishing process for integrated circuit interconnection line |
| CN112548343A (en) * | 2020-12-07 | 2021-03-26 | 上海智能制造功能平台有限公司 | Ultrafast-continuous laser asynchronous polishing powder feeding additive manufacturing metal surface process |
| CN113199140A (en) * | 2021-04-30 | 2021-08-03 | 沈阳工业大学 | Nano-pico femtosecond combined laser parallel finishing and polishing processing method |
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