WO2017088209A1

WO2017088209A1 - Laser beam machining center

Info

Publication number: WO2017088209A1
Application number: PCT/CN2015/096476
Authority: WO
Inventors: 胡增荣; 孙茜; 陈长军; 张敏; 王晓南; 郭华锋; 徐家乐; 严凯; 秦兰兰
Original assignee: 苏州大学张家港工业技术研究院
Priority date: 2015-11-24
Filing date: 2015-12-04
Publication date: 2017-06-01
Also published as: CN105414769A; CN105414769B

Abstract

A laser beam machining center comprises a control system (1), a laser (2), an optical path system (3), a machine tool (4), an optical condenser system (5), a laser cutting head (6), a gas source (7), and a waste collection device (8). The laser cutting head (6) is movably mounted on the machine tool (4). The optical path system are connected to and located between the laser (2) and the laser cutting head (6). The laser cutting head (6) is provided therein with a protective gas nozzle (9) in communication with the gas source (7). The optical condenser system (5) is located between the optical path system (3) and the laser cutting head (6). The waste collection device (8) is located below the laser cutting head (6), and the laser (2) and the machine tool (4) are both communicatively connected to the control system (1). The laser beam machining center has a high working efficiency and superior machining precision, and is energy saving and environmentally friendly.

Description

Laser machining center

The present application claims the priority of the Chinese Patent Application Serial No. PCT Application Serial No.

Technical field

The invention relates to the field of mechanical processing, and in particular to a laser processing center.

Background technique

With the advancement of technology, the methods and means of machining parts are becoming more and more diversified. The methods of machining and forming mechanical parts can be divided into two categories from the basic idea. One is to gradually remove the materials from the whole and finally get the finished products. Parts, such as traditional car, milling, drilling, grinding, planing, etc.; the other is to add materials layer by layer from the perspective of discrete addition, such as various rapid prototyping methods, sls, lom, fdm, etc. People have developed a variety of new machining and forming equipment, such as EDM, wire cutting technology, laser cutting, and waterjet cutting technology, along with two ideas or two ideas.

These existing parts processing methods have their own advantages and disadvantages, such as the traditional cutting method, the consumption of tools, the cutting force is large, the processing system is easy to deform, affecting the machining accuracy, and at the same time, most cutting operations require cutting fluid, and Cutting fluids often have toxic side effects, and processing materials are limited, such as particularly hard materials, or other special materials are difficult to process. Most of the discrete stacking methods can only be used to make prototype parts, and the strength and precision of the parts are low, and most of them cannot be practically applied. Others such as EDM also have the disadvantages of high pollution and low efficiency. The microscopic surface of the parts is still undulating after machining. Many applications require parts with high surface accuracy, so they need to be finished. Finishing of complex curved surfaces is difficult.

Laser technology is an emerging science developed in the early 1960s. With the development of laser technology, a series of new laser processing methods have been gradually formed in material processing - collectively referred to as laser processing (Lasser Beam Machining referred to as IBM). ). Laser processing can be used in various fields such as punching, cutting, marking, welding, heat treatment, and laser engraving. Since laser processing does not require processing tools, and the processing speed is fast, the surface deformation is small, and various materials can be processed, it has been more and more displayed in the field of production practice, and has been paid more and more attention. Laser processing is Using the energy of light, through lens coking, it achieves a high energy density in the focus, and relies on the photothermal effect to process various materials.

In the machining industry, some materials are particularly difficult to process in the machining of metal parts or other materials. For example, high-temperature alloys in the aerospace industry, ceramic materials, etc., the tool life is low during the machining process, and the cutting quality is not easy to guarantee. If high-energy lasers can be used to replace traditional tools, the problem of large tool consumption and cutting heat and cutting force affecting the quality of the machining can be solved, and materials that are difficult to machine by conventional cutting methods, such as glass, ceramics, etc., can be processed.

In view of the above shortcomings, the designer actively researches and innovates in order to create a laser processing center to make it more industrially valuable.

Summary of the invention

In order to solve the above technical problems, an object of the present invention is to provide a laser processing center with high work efficiency, high processing precision, energy saving and environmental protection.

A laser processing center according to the present invention is characterized by comprising: a control system, a laser, an optical path system, a processing machine tool, a concentrating system, a laser cutter head, a gas source and a waste receiving device, wherein the laser cutter head is movably mounted in the processing In the machine tool, the optical path system is connected between the laser and the laser cutter head, wherein the laser cutter head is provided with a shielding gas nozzle, and the shielding gas nozzle is connected with the gas source, the concentrating system Located between the optical path system and the laser cutter head, the waste receiving device is located below the laser cutter head, and both the laser and the machining machine are communicatively coupled to the control system.

As a further improvement of the present invention, a laser cooling system is also included, the laser cooling system being a laser cooler, the laser being mounted in the laser cooler and communicatively coupled to the laser cooler.

As a further improvement of the present invention, a security system is also included, the security system being a monitoring device, the laser and the processing machine being in communication with the security system, the security system being in communication with the control system.

As a further improvement of the present invention, the processing machine includes a bed, a clamp, a column, a beam, and a cantilever, and the clamp is fixed on the bed to clamp the workpiece, and the column is two and vertically vertical Fixed on the two sides of the rear end of the bed, the beam is vertically connected to the column, the cantilever is movably connected to the beam, the cantilever is perpendicular to the beam, and the laser head is The front and rear movement is connected below the cantilever.

As a further improvement of the present invention, the waste receiving device is a water tank, and an open cavity is provided in the middle of the bed, and the water tank is placed in the cavity.

As a further improvement of the present invention, a baffle is fixed around the end surface of the bed.

As a further improvement of the present invention, the concentrating system is a convex lens, and the concentrating system is fixedly mounted at an upper end of the laser cutter head.

As a further improvement of the present invention, an outer air wall of the laser cutter head is provided with a gas inlet, the gas inlet is connected to the gas protection nozzle, and the gas inlet is connected to the gas source through a gas pipe.

As a further improvement of the present invention, a gas valve is fixed at an air outlet of the air source, and a switch is fixed at an exit of the optical path system.

As a further improvement of the invention, the control system is a computer.

With the above solution, the present invention has at least the following advantages: the laser processing center of the present invention uses a high-energy laser beam as a processing tool without using a conventional tool, has almost no cutting force, and has no cooling and lubrication problems, and is almost free from material limitations. Processing a variety of high hardness, brittle, tough materials. High work efficiency, high processing accuracy, energy saving and environmental protection. At the same time, the invention comprehensively utilizes two kinds of processing ideas, guided by discrete ideas, and uses high-energy laser to accurately remove materials as a means to process parts with high efficiency and high precision, which is a new breakthrough of the manufacturing method. By using a high-energy laser beam, the surface of the part is scanned at an appropriate power so that the protrusion portion is melted and retracted toward the surface of the part substrate, thereby realizing the finishing process of the part.

The above description is only an overview of the technical solutions of the present invention, and the technical means of the present invention can be more clearly understood and can be implemented in accordance with the contents of the specification. Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

DRAWINGS

1 is a schematic view showing the composition of a laser processing center of the present invention;

2 is a schematic structural view of a processing machine tool according to the present invention;

3 is a schematic structural view of a laser cutter head according to the present invention;

Figure 4 is a schematic view of the processing of parts in an experimental example;

Figure 5 is a schematic view of a laser scanning path in an experimental example;

Among them: 1-control system; 2-laser; 3-light path system; 4-machining machine tool; 5-concentrating system; 6-laser bit; 7-gas source; 8--waste receiving device; 9-protecting gas nozzle; 10-laser cooling system; 11-safety system; 12-air pipe; 13-valve valve; 14-switch; 15-workpiece; 41-bed body; 42-clamp; 43-column; 44-beam; 45-cantilever; - baffle; 61 - air port.

detailed description

The specific embodiments of the present invention are further described in detail below with reference to the drawings and embodiments. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.

Embodiment: A laser machining center comprising a control system 1, a laser 2, an optical path system 3, a processing machine 4, a concentrating system 5, a laser cutter head 6, a gas source 7, and a waste receiving device 8, the laser cutter head being movably mounted In the processing machine tool, the optical path system is connected between the laser and the laser cutter head, and a protective gas nozzle 9 is disposed in the laser cutter head, and the protection gas nozzle is connected to the gas source. The concentrating system is located between the optical path system and the laser cutter head, the waste receiving device is located below the laser cutter head, and both the laser and the processing machine tool are communicatively coupled to the control system.

The laser machining center uses a high-energy laser beam as a machining tool. It does not require cutting tools, has no cutting force, and has no cooling and lubrication problems. It is almost free of material constraints and can process a variety of high-hard, brittle, and tough materials. High work efficiency, high processing accuracy, energy saving and environmental protection. At the same time, according to the processing needs, a corresponding gas can be introduced into the laser cutter head, such as an inert protective gas, so as to interact with the laser beam in the workpiece processing area to form an inert protective atmosphere to the processing area, and complete the cutting work.

The laser processing center utilizes two kinds of processing ideas, guided by discrete ideas, and uses the method of accurately removing the material by high-energy laser as a means to separate the parts and the blanks separately, and simultaneously compare the layers, which will not belong to the parts. The material is removed by laser, so that it is carried out layer by layer until the finished part is processed, and the parts are processed efficiently and with high precision, which is a new breakthrough in the manufacturing method. At the same time, it is also possible to use a high-energy laser beam to scan the surface of the part at an appropriate power so that the protrusion portion is melted and retracted toward the surface of the part substrate, thereby realizing the finishing process of the part.

Also included is a laser cooling system 10 that is a laser cooler that is mounted in the laser cooler and communicatively coupled to the laser cooler.

Also included is a security system 11 that is a monitoring device that is in communication with the security system, the security system being in communication with the control system.

The processing machine tool comprises a bed 41, a clamp 42, a column 43, a beam 44 and a cantilever 45. The clamp is fixed on the bed, the clamp is for clamping a workpiece, and the columns are two and vertically fixed respectively. On the two sides of the rear end of the bed, the beam is vertically connected to the column, the cantilever is movably connected to the beam, the cantilever is perpendicular to the beam, and the laser head moves back and forth Connected below the cantilever.

The waste receiving device is a water tank, and an open cavity is provided in the middle of the bed, and the water tank is placed in the cavity. A black liquid that absorbs excess laser energy, such as carbon ink, is stored in the water tank to absorb the energy of the excess beam after laser cutting the workpiece material to ensure the safety of the machine tool; dust collection and suction can be set on the side of the cutting area as needed. And a smoke removing device for removing vaporized metal soot to ensure smooth cutting.

A baffle 46 is fixed around the end surface of the bed.

The concentrating system is a convex lens, and the concentrating system is fixedly mounted at an upper end of the laser cutter head.

An air inlet 61 is disposed on the outer wall of the laser cutter head, and the air inlet is connected to the shielding gas nozzle, and the air inlet is connected to the air source through the air pipe 12.

A gas valve 13 is fixed at an air outlet of the air source, and a switch 14 is fixed at an exit of the optical path system.

The control system is a computer.

After the laser is focused, the light energy is converted into heat, which can melt and vaporize almost any material. For example, heat-resistant ceramics, stone, diamond and other hard and brittle materials can be processed; laser spot size can be focused to the micron level, the output power can be adjusted, so it can be used for precision micro-machining; the tool used for processing is laser beam, non-contact processing So there is no obvious mechanical force and no tool loss. The processing speed is fast, the heat affected zone is small, and the processing process is easy to be automated; compared with electron beam processing, the laser processing device is relatively simple, and does not require complicated vacuuming device; laser processing is instantaneous, local melting, gasification Hot processing has many influencing factors. Therefore, precision, especially repeatability and surface roughness are not guaranteed during fine processing. It is necessary to carry out trial and error and find reasonable parameters to achieve certain processing requirements. Metal gas and Mars generated during processing. When splashing, pay attention to ventilation and the operator should wear protective glasses.

The working principle of the laser processing center is: using a high-energy laser beam to instantaneously melt or vaporize the corresponding area of the workpiece to remove the material. When the laser spot size is certain, the capacity distribution law is certain, and the irradiation time is certain. The distance between the light action point and the machining surface of the part is constant, and the amount of material removed by the high-energy laser beam unit pulse or unit time is determined when the workpiece material is fixed. We analogize the principle of powder laser sintering in rapid prototyping. In powder laser sintering, the 3D CAD model of the part is layered and sliced (automatically completed by computer) and then scanned by laser layer to form the final part. In the laser machining center, the three-dimensional CAD model of the part blank and the part is simultaneously sliced, and then the corresponding slice profile of the part is subtracted from the corresponding slice profile of the blank, and the remaining area is the material to be removed. The high-energy laser beam is then moved in a certain scanning manner within the contour of the removed material, such that the material is removed layer by layer to form a finished part.

Experimental example: As shown in Fig. 4, the blank that needs to be machined is a rectangular material. Assuming that the axis of the circular hole is in the z-axis direction, the plane is clearly perpendicular to the plane of the z-axis, and the contour of any section is the same within the range of the part. For each part, the shaded portion is the material to be removed. In the case where the parameters are fixed, if the laser beam is moved at a certain scanning speed and the depth of the material removed is h (for example, 0.05 mm), then the slice cad software can be set and sliced every h height. The control computer then scans the blank removal material layer by layer according to the slice data, and finally obtains the corresponding parts. Of course, this is a special case of equal section. The process of changing the section is exactly the same, but the slice thickness at this time will directly affect the final machining accuracy and surface quality of the part. Theoretically, the thinner the slice, the more precise the part being machined. Of course, the laser parameters should be adjusted accordingly so that the depth of the removed material is compatible with the depth of the slice.

The scanning path can be based on a variety of ways, and its optimized method can be used to learn the scanning path optimization algorithm of the laser spot in laser sintering. The scanning path is shown in Figure 5.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention. It should be noted that those skilled in the art can make some improvements without departing from the technical principles of the present invention. And modifications and variations are also considered to be within the scope of the invention.

Claims

A laser processing center, comprising: a control system, a laser, an optical path system, a processing machine tool, a concentrating system, a laser cutter head, a gas source and a waste receiving device, wherein the laser cutter head is movably mounted on the processing machine tool An optical path system is connected between the laser and the laser cutter head, wherein the laser cutter head is provided with a protective gas nozzle, the protective gas nozzle is in communication with the gas source, and the light collecting system is located at the optical path Between the system and the laser cutter head, the waste receiving device is located below the laser cutter head, and both the laser and the machining machine are communicatively coupled to the control system.
A laser machining center according to claim 1, further comprising a laser cooling system, said laser cooling system being a laser cooler, said laser being mounted in said laser cooler and said laser cooler Communication connection.
A laser processing center according to claim 1, further comprising a security system, said security system being a monitoring device, said laser and said processing machine being communicatively coupled to said security system, said security system The control system is in communication connection.
A laser processing center according to any one of claims 1 to 3, wherein the processing machine comprises a bed, a jig, a column, a beam and a cantilever, and the jig is fixed to the bed, the jig For the workpiece clamping, the columns are two and are respectively vertically fixed on two sides of the rear end of the bed, the beam is vertically connected to the column, and the cantilever is connected to the beam by left and right. The cantilever is perpendicular to the beam, and the laser cutter head is moved back and forth under the cantilever.
A laser machining center according to claim 4, wherein said waste receiving means is a water tank, and an open cavity is provided in the middle of said bed, said water tank being placed in said cavity.
The laser processing center according to claim 5, wherein a baffle is fixed around the end surface of the bed.
The laser processing center according to claim 6, wherein the concentrating system is a convex lens, and the concentrating system is fixedly mounted at an upper end of the laser head.
The laser processing center according to claim 7, wherein an outer wall of the laser cutter head is provided with an air inlet, the air inlet is connected to the shielding gas nozzle, and the air inlet passes through the air tube and the gas. Source connection.
The laser processing center according to claim 8, wherein a gas valve is fixed at an air outlet of the air source, and a switch is fixed at an exit of the optical path system.
The laser machining center according to claim 9, wherein said control system is a computer.