CN113811136B - Bendable display device and heat dissipation device thereof - Google Patents

Bendable display device and heat dissipation device thereof Download PDF

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Publication number
CN113811136B
CN113811136B CN202010538543.4A CN202010538543A CN113811136B CN 113811136 B CN113811136 B CN 113811136B CN 202010538543 A CN202010538543 A CN 202010538543A CN 113811136 B CN113811136 B CN 113811136B
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heat
bending
bendable
bent
heat conducting
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CN113811136A (en
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吴会鹏
刘华
施健
靳林芳
周阿龙
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Priority to CN202310594255.4A priority Critical patent/CN116782591A/en
Priority to CN202010538543.4A priority patent/CN113811136B/en
Priority to PCT/CN2021/098495 priority patent/WO2021249316A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The application provides a heat abstractor, but heat abstractor and display device and terminal equipment bend, heat abstractor is used for but bending electronic equipment, equipment includes first, second support component and bending member, the device includes first heat conduction portion and second heat conduction portion that covers first, second support component respectively at least partially, extend between first and second heat conduction portion, and the bending heat conduction portion of fold part appears along with bending member bending or expansion in first direction and locate the first limit structure of bending heat conduction portion and extending along the second direction with first heat conduction portion interval, when bending heat conduction portion appears fold part, first limit structure is used for limiting fold part in the first range of movement of third direction of first side of bending heat conduction portion. The fold part is formed by bending the heat conduction part along with the bending or unfolding of the bending member, so that the temperature equalization of the support members at two sides is realized, and the change of the section lengths of different sections in bending and unfolding is adapted.

Description

Bendable display device and heat dissipation device thereof
Technical Field
The present disclosure relates to heat dissipation devices, and particularly to a heat dissipation device and a display device using the same.
Background
In order to meet consumer demands for a large screen experience as well as a portable terminal at the same time, folding terminals have become one of the important trends of terminal devices. Folding type terminal products, such as folding mobile phones, are portable large-screen terminals realized through flexible bending technology, can be used as tablet computers to bring large-screen experience in an unfolding state, and have better portability as mobile phones in a bending state. The bendable terminal is connected with two supporting members through bending members, and the supporting members respectively or jointly support one display area. In order to match with low-time delay and high-smoothness experience and reduce wiring between two main boards of the bendable terminal, main heating devices (such as a system chip and a camera module) of the bendable terminal are often concentrated on one main board, so that heat of the bendable terminal is concentrated on one side, and therefore a heat dissipation component capable of repeatedly bending is needed to realize heat transfer across the bending component, and heat of the two main boards is even.
In addition, during the bending process of the bendable terminal, the devices of each layer are positioned on different tangential planes and are repeatedly stretched or compressed, and it is understood that during the bending process, some devices are positioned on the inner side of the bending and some devices are positioned on the outer side of the bending. Referring to fig. 1a, 1b, three layers of devices 10, 11, 12 are schematically illustrated, having a length L in the deployed state as shown in fig. 1 a. When the bendable regions 13 of the devices 10, 11, 12 are bent in the bending direction as shown in fig. 1b, the device 11 is located inside the bending of the device 10 and the device 12 is located outside the bending of the device 10. When the devices 10, 11, 12 are sequentially attached, e.g., glued, the two ends of the bent devices 10, 11, 12 remain aligned at A1-B1 and A2-B2, as shown in fig. 1B. Thus, the device 11 located inside the bend is compressed relative to the device 10, while the device 12 located outside the bend is stretched relative to the device 10, i.e. the device located inside the bend is compressed to a greater extent relative to the device located outside the bend when the bending apparatus is folded from unfolded to folded, and the device located outside the bend is stretched to a greater extent relative to the device located inside the bend, contrary to the above-described process when the bending apparatus is folded from unfolded to folded. Since the heat conductive material in the existing heat dissipation member does not have elasticity, i.e., does not have extensibility such as stretching or compression, when the heat dissipation member is repeatedly bent and unfolded along with the bending device, the heat dissipation member may be affected in performance due to the repeated compression and stretching. Meanwhile, the heat conducting material which can be repeatedly bent and has elasticity has poor heat conducting effect, and heat can not be transferred across the bending member, so that the temperature uniformity at two sides of the folding mobile phone can not be realized.
The foldable terminal needs a bendable heat dissipation member that can accommodate stretching and compression in both the folded and unfolded states while achieving heat transfer across the bending region to equalize the temperature across the folded terminal.
Disclosure of Invention
The embodiment of the invention provides a bendable display device, a heat dissipation device thereof and a terminal device, wherein the heat dissipation device is used for bendable electronic equipment and can adapt to the change of the section lengths of different sections of the bendable electronic equipment in the bending and unfolding processes.
In a first aspect, an embodiment of the present invention provides a heat dissipating device for a bendable electronic device. The heat dissipating device includes: the bending heat conduction part is used for bending along with bending of the electronic equipment and unfolding along with unfolding of the electronic equipment; a first heat conducting portion extending from a first side of the bent heat conducting portion for dissipating heat from the electronic device; and a first fixing mechanism for movably fixing the first heat conduction portion to the electronic apparatus; wherein the first thermally conductive section includes a first movement mechanism for cooperating with the first securing mechanism to move the first thermally conductive section relative to the first securing mechanism. Through the first heat conduction part which moves relative to the first fixing mechanism, the heat dissipation device can adapt to the section length change of different sections of the electronic equipment when the electronic equipment is bent and unfolded, and the heat dissipation device can achieve the stretching and shrinking effects on the sections of the heat dissipation device.
Based on the first aspect, in a first implementation manner of the first aspect, the first moving mechanism is a through hole on the first heat conducting portion, the first fixing mechanism is disposed in the through hole, and the through hole has a gap for providing a stroke of relative movement of the through hole and the first fixing mechanism. Through the clearance reserved in the through hole, the through hole can move for a certain stroke relative to the first fixing mechanism, so that the first heat conduction part moves relative to the first fixing mechanism.
In a second implementation form of the first aspect, based on the first aspect, the first securing mechanism is a protrusion secured within the electronic device.
In a third implementation form of the first aspect as such or according to the second implementation form of the first aspect, the first fixing mechanism has a threaded hole and is fixed in the electronic device by a screw.
In a fourth implementation form of the first aspect, based on the first aspect, the first moving mechanism is one of a protrusion and a groove that cooperate with each other, and the first fixing mechanism is the other of the protrusion and the groove that cooperate with each other, wherein the groove is configured to provide a moving track of the protrusion. By means of the projection and the recess, a reliable moving fit between the first moving mechanism and the first fixing mechanism can be provided with a simple structure.
In a fifth implementation form of the first aspect as such or any of the first to fourth implementation forms thereof, the first thermally conductive section moves in a first direction relative to the first fixing mechanism when the bent thermally conductive section is bent with the electronic device; when the bent heat conducting part is unfolded along with the electronic equipment, the first heat conducting part moves towards the direction opposite to the first direction relative to the first fixing mechanism.
In a sixth implementation manner of the first aspect, based on the first aspect, the first heat conducting portion is integrally formed with the bent heat conducting portion or is formed separately.
In a seventh implementation manner of the first aspect, based on the first aspect, the heat dissipating device further includes: a second thermally conductive portion extending from a second side of the bent thermally conductive portion, the second side being opposite the first side; and a second fixing mechanism for movably fixing the second heat conduction part to the electronic device, wherein the second heat conduction part comprises a second moving mechanism for being matched with the second fixing mechanism to move the second heat conduction part relative to the second fixing mechanism. Through setting up second heat conduction portion and first heat conduction portion respectively in the both sides that electronic equipment was bent, can realize the both sides samming of bending of electronic equipment, through setting up this first and second heat conduction portion that moves respectively for first and second fixed establishment for heat abstractor can adapt to the change of the tangent plane length of electronic equipment at different tangent planes in bending and expansion process.
In an eighth implementation manner of the first aspect, based on the first aspect, the heat dissipating device is a temperature equalizing plate, or a heat pipe, or a heat dissipating plate.
In a second aspect, an embodiment of the present invention provides a heat dissipation device for a bendable electronic apparatus, where the electronic apparatus includes a first support member, a second support member, and a bending member located between the two support members, and the heat dissipation device includes: a first thermally conductive portion at least partially covering the first support member; a second thermally conductive portion at least partially covering the second support member; a bent heat conduction portion extending between the first heat conduction portion and the second heat conduction portion, and having a wrinkle portion occurring with bending or expanding of the bending member; and the first limiting structure is arranged on the first side of the bending heat conduction part, and is used for limiting a first moving range of the bending heat conduction part on the first side of the bending heat conduction part when the bending heat conduction part is provided with the folding part. The heat of the first and second support members can be transferred between the first heat conduction portion and the second heat conduction portion through the bending heat conduction portion, and the bending heat conduction portion can be folded along with bending or unfolding of the bending members, so that the temperature equalization of the support members at two sides is realized, and the change of the section lengths of different sections in bending and unfolding is adapted.
Based on the second aspect, in a first implementation manner of the second aspect, the heat dissipation device further includes: the second limiting structure is arranged on a second side of the bent heat conducting part, the second side is opposite to the first side, and when the bent heat conducting part is provided with the fold part, the second limiting structure is used for limiting a second movement range of the fold part on the second side of the bent heat conducting part. Limiting the fold portion to a certain range of movement ensures that the fold portion does not affect other components when bending or expanding, for example does not seize the bending member to affect its bending and/or expanding.
In a second implementation manner of the second aspect, the first limit structure and the second limit structure form a limit frame, and the bent heat conducting portion extends through the limit frame.
Based on the second aspect, in a third implementation manner of the second aspect, the first limiting structure includes a plurality of limiting blocks that are disposed at intervals on the first side of the bent heat conducting portion. Through the interval setting of a plurality of stopper, can restrict the fold part in the range of movement of different positions to guarantee that fold part can not influence other components and parts.
In a fourth implementation manner of the second aspect, based on the second aspect, the first limiting structure includes a magnetic component, and the magnetic component generates a magnetic force on the bent heat conducting portion. The first limiting structure serves as a magnetic component, limits the movement range of the bent heat conducting part through magnetic force, and limits the crease part through a simpler structure.
Based on the second aspect, in a fifth implementation manner of the second aspect, the first limiting structure includes a magnetic component, and the heat dissipating device further includes: the structural part is arranged on the second side of the bent heat conduction part, the second side is opposite to the first side, and the magnetic part generates magnetic force on the structural part. The fold part of the bending heat conduction part is limited by the magnetic force between the structural part and the magnetic part, so that the metal or magnetic bending heat conduction part is not required, and the limit of the fold part can be realized by a simple structure.
In a sixth implementation manner of the second aspect, based on the second aspect, the first limiting structure includes a first magnetic component, and the second limiting structure includes a second magnetic component, and the first magnetic component and the second magnetic component are disposed on the first side and the second side of the bent heat conducting part correspondingly, so as to generate magnetic force with each other.
In a third aspect, an embodiment of the present invention provides a bendable display device, where the bendable display device includes a display panel including a display area, the display area including a first display area, a second display area, and a bending area defined between the first display area and the second display area; a bendable device; and the heat dissipation device is positioned between the display panel and the bendable device, and the surface of the heat dissipation device is attached to the surface of the bendable device. The bendable device comprises a first supporting member for supporting a first area of the display panel corresponding to the first display area; a second supporting member for supporting a second region of the display panel corresponding to the second display region; and a bending member connected between the first and second support members to overlap the bending region and guiding the display panel to bend or unfold the display panel with respect to the bending region. Wherein the heat dissipating device is the heat dissipating device in the first aspect and any implementation manner thereof. The heat of one supporting member in the bendable display device can be transferred to the supporting member at the other side by the heat dissipation device crossing the bending member, so that the heat dissipation area is enlarged, the temperature equalization of the supporting members at the two sides can be realized, and the heat dissipation capacity of the whole terminal equipment is improved.
In a fourth aspect, an embodiment of the present invention provides a bendable display device, where the bendable display device includes a display panel including a display area, the display area including a first display area, a second display area, and a bending area defined between the first display area and the second display area; a bendable device; and the heat dissipation device is positioned between the display panel and the bendable device, and the surface of the heat dissipation device is attached to the surface of the bendable device. The bendable device comprises a first supporting member for supporting a first area of the display panel corresponding to the first display area; a second supporting member for supporting a second region of the display panel corresponding to the second display region; and a bending member connected between the first and second support members to overlap the bending region and guide the display panel to start bending or unfolding of the display panel with respect to the bending region. Wherein the heat dissipating device is the heat dissipating device in the second aspect and any implementation manner thereof. The heat of one supporting member in the bendable display device can be transferred to the supporting member at the other side by the heat dissipation device crossing the bending member, so that the heat dissipation area is enlarged, the temperature equalization of the supporting members at the two sides can be realized, and the heat dissipation capacity of the whole terminal equipment is improved.
In a fifth aspect, an embodiment of the present invention provides a terminal device, including a bendable display device, where the bendable display device is a bendable display device according to the foregoing third aspect or the fourth aspect. The heat of one side of the supporting member can be transferred to the supporting member of the other side by the heat conducting material in the membranous heat radiating member crossing the bending member, so that the heat radiating area is enlarged, the temperature equalization of the supporting members at two sides can be realized, and the whole heat radiating capacity of the terminal equipment is improved. The heat of one supporting member in the bendable display device can be transferred to the supporting member at the other side by the heat dissipation device crossing the bending member, so that the heat dissipation area is enlarged, the temperature equalization of the supporting members at the two sides can be realized, and the heat dissipation capacity of the whole terminal equipment is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments will be briefly described below. It is evident that these drawings are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a schematic illustration of a folded inner and outer layer in a bendable terminal being compressed or stretched;
FIG. 2 is a schematic diagram of a bendable electronic device;
FIG. 3 is a schematic cross-sectional view of a flexible temperature uniformity plate and a film-shaped heat dissipation plate;
fig. 4 is a schematic diagram of a heat dissipating device according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a heat dissipating device according to another embodiment of the present invention;
FIG. 6 is a schematic diagram of a heat dissipating device according to another embodiment of the present invention;
FIG. 7 is a schematic plan view of a fixing mechanism according to an embodiment of the present invention;
FIG. 8 is a schematic view of a fixing mechanism according to another embodiment of the present invention;
FIG. 9 is a schematic cross-sectional view of a heat dissipating device according to another embodiment of the present invention;
FIG. 10 is a schematic cross-sectional view of a heat dissipating device according to another embodiment of the present invention;
FIG. 11 is a schematic diagram of a limiting structure according to an embodiment of the present invention;
fig. 12 is a schematic view of a limiting structure according to another embodiment of the present invention.
Detailed Description
First, several concepts introduced in the present application are presented.
The heat conductive material is a metal or nonmetal material having high heat conductive property (the heat conductive coefficient may be more than 10W/(m·k), but is not limited to this value) for realizing rapid heat conduction. In this application, the thermally conductive material may be graphite, aluminum foil, or copper foil.
The flexible material has strong flexibility, and is deformable and foldable. Flexible materials include, but are not limited to: foam, rubber, polyimide (PI) or Polyamide (PA, or nylon), or composites with other organic materials. It should be noted that a flexible material is understood to be a material that is flexible and can withstand suitable deformation. Flexibility (or, in other words, pliability) is understood to be a physical property of a material as opposed to stiffness. The flexible material deforms after being stressed, and the material itself cannot recover its original shape after losing the applied force, or can still recover its original shape as a resilient flexible material. A flexible material is a material that is deformable (e.g., stretch, bend, twist, squeeze, deform, etc.) without substantially compromising performance, and thus, a flexible material can be said to be a material that has high tensile strength and high elongation. The deformed flexible material is not damaged in the deformed area and the internal structure is not exposed. After deformation, the deformed region of the flexible material having a smooth surface still presents a smooth, seamless surface. And the flexible material can be recovered to be original after being bent for a plurality of times by external force, and has a certain service life.
The adhesive layer is a material layer with an adhesive function, can also have certain elasticity, can be compressed or stretched, and can be one or more layers.
Referring to fig. 2, fig. 2 is a schematic diagram of a bendable electronic device 100, and the bendable electronic device 100 may include a display panel 1, a bendable device 2, and a heat sink 3. The display panel 1 may include a display region including a first display region 101, a second display region 102, and a bending region 103 defined between the first display region 101 and the second display region 102. The heat sink 3 is located inside or outside the bendable device 2, i.e. the heat sink 3 may be located on the side of the bendable device 2 close to the display panel 1 or on the side of the bendable device 2 remote from the display panel 1.
As shown in fig. 2, the bendable device 2 comprises two support members 201, 202 and a bending member 203. The support member 201 supports a first region of the display panel 1 corresponding to the first display region 101; the support member 202 supports a second region of the display panel corresponding to the second display region 102; the bending member 203 is connected between the two support members 201, 202 to at least partially overlap the bending region 103, and guides the display panel 1 so that the display panel 1 is folded or unfolded with respect to the bending region 103, for example, as shown in direction a. In other embodiments of the invention, it is also possible to fold in the opposite direction to direction a.
The heat sink 3 in fig. 2 includes, but is not limited to: flexible heat pipe, flexible temperature equalizing plate or membranous heat dissipating plate. In table 1 below, various forms of the heat sink 3 are partially enumerated:
Figure BDA0002537955790000051
table 1
The examples of the heat sink 3 in table 1 all have good heat conduction properties and reliable bending properties, and after ten thousand times bending, the heat conduction coefficient loss is small.
The flexible portion of the flexible heat pipe and the flexible temperature equalizing plate may include a flexible material, such as a flexible polymer material, such as PI or rubber, or a metal material cover plate with bending freedom and small stress at the bending position, such as a metal material cover plate with dense mesh openings. The flexible heat pipe and the flexible temperature equalizing plate can be integrally made of flexible materials to complete integral bending, or the flexible materials are locally used for overlapping the non-bending area to complete local bending.
The heat pipe is a component for transferring heat source to far end, and is typically composed of pipe shell, liquid suction core and end cover, and after the interior of pipe is pumped into a certain negative pressure, a proper quantity of working substance (working medium) is filled, so that the capillary holes of liquid suction core close to the inner wall of pipe are filled with liquid, and then sealed. When one end of the heat pipe is heated, the working medium in the capillary core is evaporated and vaporized, the vapor flows to the other end under a tiny pressure difference to release heat and then is condensed into liquid, and the liquid flows back to the evaporation end along the porous material by virtue of capillary force and gravity, so that the heat is transferred continuously in a circulating way.
The temperature equalizing plate can be called as a vapor equalizing plate, a superconducting heat plate, a heat guide plate and the like. The temperature equalizing plate mainly comprises a shell, a capillary structure, working fluid, a supporting structure and the like, and a vacuum cavity is formed in the inner wall, as shown in fig. 3 a.
The film-shaped heat dissipation plate can comprise flexible and bending-resistant heat conduction materials such as graphite, and can also comprise heat dissipation plates formed by compounding other metal or nonmetal heat conduction materials and flexible materials, as shown in fig. 3a and 3 b.
Fig. 3a is a schematic cross-sectional view of a flexible isopipe 200.
As shown in fig. 3a, the flexible temperature uniformity plate 200 includes a first heat conductive portion 210, a second heat conductive portion 220, and a flexible heat conductive portion 230 therebetween. As shown, the first and second heat conductive portions 210, 220 communicate with the cavities at both sides through the capillary structure e to achieve overall soaking of the flexible soaking plate 200; the flexible thermally conductive section 230 is composed of a flexible material to meet the bending requirements. The first and second heat conductive parts 210, 220 include a condensing side case a, an evaporating side case b, and a side wall c, the condensing side case a being connected to the evaporating side case b through the side wall c and being sealed, thereby defining an inner cavity d of the temperature equalizing plate 200, a capillary structure e being provided in the inner cavity d, the inner cavity d being vacuumized and filled with a certain amount of working liquid, the working liquid being capable of being adsorbed in the capillary structure e. In addition, since the inner cavity d is vacuumized, in order to prevent the outer shell of the temperature equalization plate 200 from being flattened by external air pressure, a supporting structure f may be provided in the inner cavity d, both ends of which are connected to the condensation-side outer shell a and the capillary structure e, respectively.
When heat is transferred from the heat source g to the evaporation-side housing b, the working liquid inside the capillary structure e absorbs the heat, and starts to undergo an evaporation boiling phase change in an environment of low vacuum degree, changing from the liquid phase to the gas phase (arrows in the capillary structure e in fig. 3a indicate the possible flow direction of the working liquid in the liquid phase, and arrows outside the capillary structure e indicate the possible flow direction of the working liquid in the gas phase). The gas-phase working liquid fills the whole internal cavity d quickly, condensation is generated when the gas-phase working liquid contacts a relatively cold area, heat accumulated during evaporation is released, the condensed liquid-phase working liquid returns to the evaporation heat source again due to the capillary adsorption of the capillary structure e, the process is repeatedly performed in the cavity, and the circulation can bring the heat generated by the heat source g to the area of the temperature equalizing plate 200 far away from the heat source g, and then the heat is brought to the external environment.
Fig. 3b and 3c are schematic cross-sectional views of a film-shaped heat dissipation plate 300b and 300 c.
As shown in fig. 3b, the heat dissipation plate 300b is formed by stacking a layer of heat conductive material 301 and an upper layer of flexible material 302 along the horizontal direction in the drawing, the heat conductive material and the flexible material can be adhered by an adhesive layer 303, and the adhesive layer 303 can be a double-sided adhesive tape or the like. Also schematically shown in fig. 3b are support members 305, 306 of the bendable device 304 and a bending member 307 located therebetween, one surface of the heat dissipating plate 300b being directly attached to the surface of the bendable device 304 or indirectly attached through another layer of flexible material or glue, in particular, the heat dissipating plate 300b spans both support members 305, 306 to cover the bending member 307, thereby transferring heat between the two support members 305, 306 across the bending member 307.
The heat spreader plate may also be formed by stacking multiple layers of flexible thermally conductive material, such as heat spreader plate 300c shown in fig. 3c, where two layers of flexible thermally conductive material are stacked. The heat dissipation plate 300c includes two layers of flexible heat conductive materials 311, 312, each of which is a structure formed by compounding at least one heat conductive layer and at least one flexible layer. Wherein one flexible layer 314 of the flexible heat conductive material 312 is close to or in contact with the heat generating component 320 near the left side of the heat radiating plate 300b, absorbs heat released from the heat generating component 320, and then is conducted to the heat conductive layer, and is conducted from the heat conductive layer across the bending region (at the rotation axis) to a region far from the heat generating component 320, for example, the right side of the heat radiating plate 300c.
It will be appreciated that fig. 3b and 3c show schematic cross-sectional views of heat dissipation plates 300b and 300c, the actual heat dissipation plates being in the form of two-dimensional films with thicknesses on the order of micrometers.
The application provides a heat dissipation device which can be applied to bendable terminal equipment to provide a heat dissipation solution for the bendable terminal equipment, wherein the bendable terminal equipment can be electronic equipment with flexibility or bendable forms such as mobile phones, tablet computers, notebook computers and multimedia playing equipment. The heat dissipation device provided by the application can adapt to the length change on the tangent plane when the terminal is folded or unfolded, and can be applied to heat dissipation members such as the flexible heat pipes, the flexible temperature equalizing plates or the membranous heat dissipation plates.
Example 1
Fig. 4 is a schematic diagram of a heat dissipating device 400 according to an embodiment of the invention. Fig. 4a shows a schematic plan view of the heat sink 400 in an unfolded state, fig. 4b shows a schematic perspective view of the heat sink 400 in a bent state, and fig. 4c shows a schematic plan view of the first heat conducting portion 401 when the heat sink 400 is in a bent state. In the example of fig. 4, the heat sink 400 is presented as rectangular, but the embodiment of the present application is not limited to rectangular, and the heat sink 400 may be other irregular shapes. The heat sink 400 may be used in a bendable electronic device such as the electronic device 100 shown in fig. 2, i.e., the heat sink 400 is one of the embodiments of the heat sink 3.
As shown in fig. 4a, the heat dissipating device 400 includes a first heat conducting portion 401, a second heat conducting portion 402, and a bent heat conducting portion 403. The first and second heat conductive portions 401 and 402 serve to absorb heat generated by heat generating components on the electronic device 100 and to diffuse/release the heat to the surrounding environment. The bent heat conductive part 403 extends between the first heat conductive part 401 and the second heat conductive part 402, and is used for transferring heat between the heat conductive parts 401 and 402 so that the heat is relatively evenly diffused or released, thereby realizing soaking of two sides of the electronic device 100. The folded heat conducting portion 403 is also folded and unfolded along with the folding of the electronic device 100, and thus, the folded heat conducting portion 403 is placed with respect to the folded member 203 as shown in fig. 2, specifically, the folded heat conducting portion 403 is at least partially overlapped with the folded member 203, for example, the folded portion 203 of the heat sink 400 is partially overlapped and disposed outside the folded member 203, such as inside the fold, outside the fold, or the folded portion 203 may be partially disposed inside the folded member 203.
In one embodiment of the present application, the first heat conductive portion 401, the second heat conductive portion 402, and the bent heat conductive portion 403 may be integrally formed (e.g., integrally formed with a flexible integrated material), such as a flexible heat dissipating plate composed of a metal or non-metal material, or a composite material thereof, as shown in table 1. In another embodiment of the present application, the first heat conducting portion 401, the second heat conducting portion 402, and the bent heat conducting portion 403 may be formed separately, in segments, or in layers (for example, the two sides are non-flexible heat conducting materials, and the bent portions are flexible heat conducting materials), and are fixed by splicing, adhesion, including but not limited to, by bonding or embedding, wherein each portion may be formed by combining one or more layers of materials. The heat sink 400 formed by the split structure may be a metal or nonmetal material, or a composite material, or a two-phase component, such as a temperature equalizing plate, a heat pipe, etc., as shown in table 1. For example, the first heat conducting portion 401 and the second heat conducting portion 402 may be made of a high heat conducting material, and the bent heat conducting portion 403 may be made of a flexible heat conducting material with both flexibility and heat conductivity, and the joint surfaces of the two may be bonded together by an adhesive, so that when the main heat generating component approaches the first heat conducting portion 401, the heat absorbed by the first heat conducting portion 401 from the heat generating component may be transferred to the second heat conducting portion 402 through the bent heat conducting portion 403, thereby realizing soaking of the bendable electronic device 100 extending in the regions at two sides of the bend.
In a specific embodiment, the heat sink 400 is located between the display panel 1 and the bendable device 2 shown in fig. 2. Wherein the first heat conducting portion 401 is located between the support member 201 and the first area of the display panel 1 corresponding to the first display area 101, the second heat conducting portion 402 is located between the support member 202 and the second area of the display panel 1 corresponding to the second display area 102, the bending heat conducting portion 403 is located between the bending member 203 and the bending area 103 of the display panel 1, and the heat dissipating device 400 may be folded or unfolded along with the bendable device 2, for example, folded in a direction a as shown in fig. 2, or folded in a direction opposite to the direction a.
Referring again to fig. 4a-4c, the heat sink 400 further includes a plurality of fixing mechanisms 420, 421, 422, 423 for fixing the heat sink 400 to other parts or components in the electronic apparatus 100, for example, to a middle frame or some hardware parts between the display panel 1 and the bendable device 2 shown in fig. 2, so that the heat sink 400 is folded and unfolded with the bendable device 2. The fixing means 420, 421, 422, 423 are respectively movable to fix the heat sink 400 via corresponding through holes 410, 411, 412, 413 in the heat sink 400, wherein after each through hole is fitted with a corresponding fixing means, the through holes also have a reserved gap ( gaps 40, 41, 42, 43 as shown) so that at least a part of the heat sink 400 can move or slide with respect to one or more fixing means. As shown in fig. 4a, the heat dissipating device 400 is substantially planar in the unfolded state, the first heat conducting portion 401 is provided with fixing means 420, 421 respectively abutting or approaching the left side edges of the through holes 410, 411, and the second heat conducting portion 402 is provided with fixing means 422, 423 respectively abutting or approaching the right side edges of the through holes 412, 413.
As shown in fig. 4b, during the process of unfolding the heat dissipating device 400 from unfolding to folding, the first heat conducting part 401 slides with respect to the fixing means 420, 421 within the range allowed by the clearance of the through holes 410, 411, e.g. in the opposite X direction, and/or the second heat conducting part 402 slides with respect to the fixing means 422, 423 within the range allowed by the clearance of the through holes 412, 413, e.g. in the X direction. That is, the first heat conductive portion 401 and/or the second heat conductive portion 402 slide in a direction away from the bent heat conductive portion 403. It should be appreciated that the maximum sliding travel of the heat conducting parts is related to the clearance reserved for the through holes, for example, when one fixing mechanism provided on the first heat conducting part 401 abuts against the other side of the corresponding through hole, the first heat conducting part 401 is not slid any more. In another embodiment of the present application, the first heat conducting portion 401 and/or the second heat conducting portion 402 may also slide in a direction approaching the bent heat conducting portion 403, as shown in fig. 5 b. This embodiment will be described in detail later with reference to fig. 5.
In the description of the present application, for convenience of description, the X direction may be regarded as a direction always adhering to the surface of the heat dissipating device 400, and the X direction defined throughout is a direction from the first heat conducting portion 401 toward the second heat conducting portion 402, and may be a bending direction along with the folding and unfolding of the heat dissipating device 400, as shown in fig. 4b, the X direction is a direction in which the second heat conducting portion 402 is far away from the bending heat conducting portion 403, and the opposite direction of X may be a direction in which the first heat conducting portion 401 is far away from the bending heat conducting portion 403. In addition, the Y direction may be considered to be in the surface of the heat sink 400 and perpendicular to the X direction, while the Z direction is simultaneously perpendicular to the X, Y direction, or the Z direction is perpendicular to the surface of the heat sink 400. It should be appreciated that when the X direction is considered as a bending direction during folding and unfolding of the heat sink 400, the Y direction is still in the surface of the heat sink 400 and perpendicular to the X direction, so that the Y direction is still a straight line direction, and the Z direction perpendicular to the X and Y directions is changed along with the bending of the X direction, or the Z direction is perpendicular to the surface of the heat sink 400 at any point on the surface of the heat sink 400.
Referring again to fig. 4a, the maximum inner diameter of the through hole 410 in the X direction is LX0 IN The fixing mechanism 420 has a maximum outer diameter LX0 in the X direction OUT Wherein LX0 IN ＞LX0 OUT When the fixing mechanism 420 is disposed or mounted in the through hole 410, the through hole 410 has a gap 40, the gap 40 being in the X directionThe sum of the lengths on the upper layer is LX0 GAP ＝LX0 IN -LX0 OUT The maximum travel of the heat sink 400 relative to the fixing mechanism 420 in the X-direction, i.e. the maximum movement travel, should therefore be substantially equal to the total length LX0 of the gap 40 in the X-direction GAP 。
Similarly, the maximum stroke of the through holes 411, 412, 413 that respectively allow the fixing mechanisms 421, 422, 423 to slide in the X direction is the total length LX1 of the gaps 41, 42, 43 respectively in the X direction GAP 、LX2 GAP 、LX3 GAP . It should be appreciated that LX0 GAP 、LX1 GAP 、LX2 GAP 、LX3 GAP May be provided in the same or different lengths. Preferably, the reserve gaps of the through holes provided on the first heat conductive portion 401 have the same first length SX1 in the X direction, wherein sx1=lx0 GAP ＝LX1 GAP The clearance of the through holes provided on the second heat conduction portion 402 has the same second length SX2 in the X direction, where sx2=lx2 GAP ＝LX3 GAP . At this time, when the heat sink 400 is folded and unfolded following the bendable device 2, the first heat conductive part 401 has the maximum sliding stroke SX1 correspondingly, and the second heat conductive part 402 has the maximum sliding stroke SX2 correspondingly.
Advantageously, in the embodiment of the present application, the fixing mechanism is matched with the through hole, so that the heat dissipating device 400 is movably installed in the electronic device 100, and when the electronic device 100 is folded or unfolded, the heat dissipating device can slide relative to the fixing mechanism through a reserved gap of the through hole, so as to adapt to the change of the tangential plane where the heat dissipating device is located in the folding or unfolding process. The heat dissipating device 400 provided by the application does not need to have telescopic performance, and when the heat dissipating device slides relative to the fixing mechanism, the thickness of the heat dissipating device in the direction perpendicular to the tangential plane is not changed, and no interference is caused to other components in the electronic equipment 100. Therefore, the heat dissipation device 400 provided by the application can better realize heat transfer of the bendable electronic equipment in a folding state, an unfolding state or in the folding and unfolding processes, so that the requirement of temperature equalization of two sides on the electronic equipment is met.
In one of the present applicationIn an embodiment, the reserved gap of the through hole may also provide an active space in the Y direction. For example, the maximum inner diameter of the through hole 410 in the Y direction is LY0 IN The maximum outer diameter of the fixing mechanism 420 in the Y direction is LY0 OUT Wherein LY0 IN ≥LY0 OUT When the fixing mechanism 420 is disposed or mounted in the through hole 410, the length of the gap 40 in the Y direction should be LY0 GAP ＝LY0 IN -LY0 OUT The heat sink 400 can move or slide in the Y direction relative to the fixing mechanism 420, and its maximum movement stroke should be substantially equal to the total length LY0 of the gap 40 in the Y direction GAP 。
Similarly, the maximum travel of the through holes 411, 412, 413 that can also allow the fixing mechanisms 421, 422, 423 to slide in the Y direction, respectively, is the total length LY1 of the gaps 41, 42, 43, respectively, in the Y direction GAP 、LY2 GAP 、LY3 GAP . It should be appreciated that LY0 GAP 、LY1 GAP 、LY2 GAP 、LY3 GAP May be provided in the same or different lengths, and is preferably provided in the same third length SY, LY0 GAP ＝LY1 GAP ＝LY2 GAP ＝LY3 GAP At this time, the maximum stroke of the heat sink 400 sliding in the Y direction with respect to the fixing mechanism is the third length SY. In a preferred embodiment, SY < SX1 and SY < SX2. It should be understood that the heat dissipating device 400 provided in the present application may also be fixed relative to the fixing mechanism in the Y direction, and whether it is movable and slidable in the Y direction is not intended as a limitation of the present application.
Fig. 4c shows that in the bent state, the first heat conductive portion 401 of the heat dissipating device 400 abuts against the right edge of the through hole 40 after moving or sliding in the opposite direction X, and from fig. 4a to fig. 4c, the maximum movement stroke of the first heat conductive portion 401 is the first length SX1. Preferably, the bendable electronic device is fully folded after the first heat conductive part 401 of the heat sink 400 is moved by the first length SX1 in the X-direction as shown in fig. 4c, and fully unfolded after the first heat conductive part 401 of the heat sink 400 is moved by the first length SX1 in the X-direction as shown in fig. 4 a. However, this should not be taken as a limitation of the present application, and in other embodiments, when the foldable electronic device is completely folded, the displacement of the first heat conducting portion 401 of the heat dissipating device 400 in the X opposite direction is smaller than the first length SX, that is, the gap reserved by the through hole on the first heat conducting portion 401 is larger than the actual movement stroke. Similarly, the gap reserved by the through hole on the second heat conducting portion 401 may be equal to or greater than the actual movement stroke thereof.
Referring to fig. 4b again, as shown in the drawing, the fixing mechanisms 420, 421, 422, 423 of the heat dissipating device 400 are fixed on the first component 45 of the bendable electronic apparatus, and the heat dissipating device 400 is located inside the bend of the first component 45, so when the bendable electronic apparatus is folded, the first heat conducting portion 401 and the second heat conducting portion 402 of the heat dissipating device 400 are stretched in the opposite direction of the X direction and the X direction with respect to the fixing mechanisms and the first component 45, respectively; when the bendable electronic device is unfolded, the process is reversed. Therefore, the heat dissipation device 400 can adapt to the length change of the section where the heat dissipation device is located along with the unfolding and bending of the bendable electronic device.
It should be appreciated that, in order to prevent the heat dissipating device 400 from being detached from the first component 45, in one embodiment of the present application, a third component is further disposed on the inside of the bend of the heat dissipating device 400 and is attached to the heat dissipating device 400, so that the heat dissipating device 400 is not detached from the first component 45 due to the provision of the through holes 410, 411, 412, 413. In another embodiment of the present application, the fixing mechanism 420, 421, 422, 423 may further include a portion extending in the X-direction, such as an umbrella portion, which spans the through holes 410, 411, 412, 413, thereby preventing the heat sink 400 from being detached from the first member 45.
In one embodiment of the present application, the first component 45 may be, for example, a middle frame of a bendable electronic device, a bending mechanism, or the like, and for example, the heat dissipating device 400 may be fixed to the middle frame by a fixing mechanism 420, 421, 422, 423, so that the heat dissipating device 400 is attached to a display screen, a power supply, or other electronic components to dissipate heat. In one embodiment of the present application, the first component 45 may be a combination of multiple components, for example, the heat dissipating device 400 may be fixed to the middle frame by the fixing mechanisms 420 and 422, and fixed to the bending mechanism by the fixing mechanisms 421 and 423, so that the heat dissipating device 400 is attached to the display screen, the power supply, or other electronic components to dissipate heat.
Specifically, when the heat sink 400 is folded from the unfolded state shown in fig. 4a to the folded state shown in fig. 4b, the tangential plane of the heat sink 400 located at the inner side of the fold with respect to the first member is compressed with respect to the first member, and thus, the slidable portion of the heat sink 400 is stretched in the tangential plane direction thereof, which is the opposite direction in which the tangential plane is compressed. Specifically, the heat dissipating device 400 slides relative to the fixing mechanisms 420, 421, 422, 423, wherein the first heat conducting portion 401 slides in the X-direction by a first stroke (the first stroke may be SX1 at maximum) as shown in fig. 4b, and/or the second heat conducting portion 402 slides in the X-direction by a second stroke (the second stroke may be SX2 at maximum) as shown in fig. 4 b. When the heat sink 400 returns from the folded state shown in fig. 4b to the unfolded state shown in fig. 4a, the first heat conduction portion 401 and/or the second heat conduction portion 402 slide in the opposite directions.
Fig. 5 is a schematic diagram of a heat dissipating device 500 according to another embodiment of the invention. In the embodiment shown in fig. 5, the fixing mechanisms 520, 521, 522, 523 of the heat sink 500 are fixed to the second member 55 of the bendable electronic device, and the heat sink 500 is located outside the bend of the second member 55. The heat sink 500 is contracted in its length direction with respect to the fixing mechanism and the second member 55 during bending of the bendable electronic device, and the bendable electronic device is reversed during unfolding. Therefore, the heat dissipation device 500 can adapt to the length change of the section where the heat dissipation device is located along with the unfolding and bending of the bendable electronic device. Although the heat sink 500 is positioned differently (outside or inside of the bend) from the heat sink 400 with respect to the first and second members 45, 55, the same or similar structures are substantially the same or similar, and in fig. 5, the same or similar structures are given the same or similar reference numerals, and will not be repeated here.
In one embodiment of the present application, the second component 55 may be, for example, a middle frame of a bendable electronic device, a bending mechanism, or the like, for example, the heat dissipating device 500 is fixed to the middle frame by the fixing mechanisms 520, 521, 522, 523, so that the heat dissipating device 500 may be attached to a display screen, a power supply, or other electronic components to dissipate heat. In one embodiment of the present application, the second component 55 may be a combination of multiple components, for example, the heat dissipating device 500 may be fixed to the middle frame by the fixing mechanisms 520, 522 and fixed to the bending mechanism by the fixing mechanisms 521, 523, so that the heat dissipating device 500 is attached to the display screen, the power supply, or other electronic components to dissipate heat.
Specifically, when the heat sink 500 is folded from the unfolded state shown in fig. 5a to the folded state shown in fig. 5b, the section of the heat sink 500 located at the outer side of the fold with respect to the second member is stretched with respect to the second member, and thus the slidable portion of the heat sink 500 is retracted in the direction of the section thereof, the retraction direction being the opposite direction in which the section is stretched. Specifically, the heat dissipating device 500 slides relative to the fixing mechanisms 520, 521, 522, 523, wherein the first thermally conductive section 501 slides a first stroke in the X direction as shown in fig. 5b and/or the second thermally conductive section 502 slides a second stroke in the opposite X direction as shown in fig. 5 b. When the heat dissipating device 500 returns from the folded state shown in fig. 5b to the unfolded state shown in fig. 5a, the first heat conducting portion 501 and/or the second heat conducting portion 502 slide in the opposite directions.
Fig. 6 is a schematic diagram of a heat dissipating device 600 according to another embodiment of the invention. The heat sink 600 is similar in structure to the heat sinks 400, 500 and like reference numerals are used. The first heat conducting portion 601 of the heat dissipating device 600 may move or slide, which is the same as or similar to the previous embodiment, and will not be described here again. The second thermally conductive section 602 of the heat sink 600 is bonded to a heat source or structure of the bendable electronic device via an adhesive layer, for example, via a back adhesive, a dispensing adhesive, and a heat generating component 630. Advantageously, the second heat conducting portion 602 is fixed to the heat generating component 630 to better absorb heat of the heat generating component 630 to quickly dissipate the heat thereof, and when the bendable electronic device is in a folded state, or an unfolded state, or during folding or unfolding, the heat dissipating device 600 is stretched at the outer side of the bend with respect to the first component or the second component, or compressed at the inner side of the bend with respect to the first component or the second component, and the first heat conducting portion 601 slides in the X direction or the X opposite direction with respect to the fixing mechanisms 620 and 621. Therefore, the heat dissipating device 600 provided by the application does not need to have stretchable performance, and can adapt to the section change of the whole machine when the whole machine is bent or unfolded no matter at the inner side or the outer side of the bending, and meanwhile, heat transfer across the bending area can be realized, so that heat is soaked at two sides of the whole machine.
In another embodiment of the present application, the first heat conducting portion 601 may also be fixed to the heat source or the structural member by back or dispensing, so that the second heat conducting portion 602 moves or slides. When the bendable electronic device is bent or unfolded, the second heat conducting part 602 slides telescopically relative to the fixing mechanism, so as to adapt to the change when the tangent plane where the second heat conducting part is positioned is compressed or stretched.
In the above-described embodiments of fig. 4 to 6 of the present application, the bent heat conducting portion 403/503/603 may be configured to be fixed with respect to the bending member 203, for example, by being adhered to the bending member 203 by an adhesive, or may be configured to move or slide with respect to the bending member 203, for example, to suspend or attach to the bending member 203 or attach to another component, so that the bent heat conducting portion moves or slides with respect to the bending member 203 during bending or expanding of the electronic device 100. It should be appreciated that the direction and maximum travel of the sliding movement of the bent heat conducting portion 403 is dependent on the clearance of the through holes provided in the first heat conducting portion 401 and the second heat conducting portion 402, i.e. on the maximum travel SX1, SX2 described above. The provision of the folded heat conducting portion 403 as fixed or movable is not a limitation of the present application, and thus the manner of fixing thereof is not limited in any way herein.
Fig. 7 is a schematic plan view of a fixing mechanism 70-73 according to an embodiment of the present invention. The securing mechanisms 70, 71, 72, 73 include structural members 702, 712, 722, 732, respectively. The structural members are generally rectangular, square, round, etc., and the corners of the structural members may be rounded to avoid stress concentrations. It should be understood that the structural members on the heat sink may have other shapes as well, not just the shape illustrated in fig. 7. The structural members 702, 712, 722, 732 may be protruding members of other structures on the bendable electronic device, or may be separate parts from the other structures and mounted by screws or bonded by glue layers. For example, the structural members 702, 712 also include screw holes 703, 713, respectively, for engaging screws (not shown) to secure the heat sink to other structures of the bendable electronic device, such as a center frame. In another embodiment of the present application, the structural member may include a plurality of screw holes.
Also shown in fig. 7 are through holes 701, 711, 721, 731 on the heat sink. The via profile is generally rectangular, square, circular, oval, etc., and the corners of the via may be rounded designs to avoid stress concentrations. It should be understood that the through holes in the heat sink may have other shapes as well, not just the shape illustrated in fig. 7. The fixing mechanisms 70, 71, 72, 73 shown in fig. 7 are respectively arranged in the through holes 701, 711, 721, 731, and since the through holes respectively have the reserved gaps 700, 710, 720, 730, the fixing mechanisms can be arranged in the middle of the corresponding through holes, or near the left and right edges, or near the upper and lower edges. Preferably, when the foldable electronic device is in an unfolded state or a folded state, the fixing mechanism is arranged to abut against the edge of the through hole in the X direction, so as to provide the greatest movement stroke for the heat dissipating device in the folding process or the unfolding process, so as to cope with the compression or the extension of the tangential plane where the heat dissipating device is located.
The fixing mechanism may also be disposed against an edge of the through hole in the Y direction, or disposed at a middle of the through hole in the Y direction, and the heat sink may be moved or slid in the Y direction with respect to the fixing mechanism. The movement of the heat sink in the Y direction is not limited in any way.
Although fig. 7 shows various through holes and fixing mechanisms, it should be understood that in another embodiment of the present application, the through holes and fixing mechanisms provided on the heat dissipating device may have different forms, where as long as the heat dissipating device has two structures with gaps, the two structures may relatively move by being matched in the gaps, so as to meet the movement stroke required by the heat dissipating device to be compressed or stretched in the bending or flattening process, that is, one implementation of the heat dissipating device provided in the present application.
Fig. 8 shows a schematic diagram of a heat dissipating device 800, 810 according to another embodiment of the present invention. Unlike the foregoing heat sinks 400, 500 and 600, the first heat conductive portions of the heat sinks 800, 810 and/or the first heat conductive portions are not provided with through holes, but are provided with protrusions on the surfaces thereof. Protrusions 804, 805, and 806, 807 are provided on the first and second thermally conductive portions 801, 802, respectively, of the heat sink 800, while protrusions 814, 815 are provided on the second thermally conductive portion 812 of the heat sink 800. Each protrusion is matched with a chute, a slideway or a slide rail which is arranged on the bendable electronic equipment to move or slide. When the heat dissipating device 800, 810 is bent or unfolded along with the bendable electronic device, the protrusion moves along the chute, the slideway or the slide rail, that is, the first heat conducting portion 801, and the first heat conducting portion 802, 812 moves relative to the chute, the slideway or the slide rail, so that the heat dissipating device 800, 810 can be adapted to the length changes of different sections when the bendable electronic device is bent or unfolded.
In the embodiment shown in fig. 8, the protrusion may be disposed on one side of the bending direction (such as the heat dissipating device 810) or on the other side of the bending direction (such as the heat dissipating device 800), and it should be understood that the location where the protrusion is disposed, and the shape of the protrusion should not be construed as limiting the application, and in other embodiments of the application, the protrusion may have a shape different from that shown in fig. 8 and be disposed on the first heat conducting portion and/or the second heat conducting portion in a region different from that shown in fig. 8.
In another embodiment of the present application, the protrusion may be disposed on the bendable electronic device, and the heat dissipating device 800, 810 has a sliding groove, a sliding way, or a sliding rail thereon for matching with the protrusion, so that the heat dissipating device 800, 810 may move relative to the protrusion.
Since the heat dissipating device 800, 810 merely moves or slides in a manner different from the previous embodiments, the other aspects are the same as or similar to the previous embodiments, and thus, a detailed description thereof is omitted herein. Furthermore, it should be understood that the heat dissipating devices in the above embodiments may be combined with each other, for example, the heat dissipating device may be provided with a protrusion and a through hole at the same time, so as to implement movement or sliding by respectively matching with the sliding groove or the fixing mechanism in different areas.
According to the heat dissipation device in the embodiment, the sliding of at least one part of the heat dissipation device in the bending or unfolding process is realized through the cooperation of the fixing mechanism and the reserved gap or the cooperation of the sliding groove and the protrusion. The above embodiments provide through holes/protrusions disposed at different positions on the first heat conducting portion and/or the second heat conducting portion, it should be understood that only one through hole/protrusion may be disposed on the first heat conducting portion to match a fixing mechanism/chute on an electronic device, or only one through hole/protrusion may be disposed on the second heat conducting portion to match a fixing mechanism/chute on an electronic device, in such embodiments, the first heat conducting portion and/or the second heat conducting portion may also move relative to the fixing mechanism/chute, so that the heat dissipating device may adapt to a change in a section length during unfolding or bending of the electronic device.
Example two
Fig. 9 is a schematic cross-sectional view of a heat dissipating device 900 according to another embodiment of the present invention. The heat dissipation device 900 includes a first heat conduction portion 901, a second heat conduction portion 902, and a bent heat conduction portion 903, wherein the first heat conduction portion 901 is fixed to a first support structure 921 of the bendable electronic device, the second heat conduction portion 902 is fixed to a second support structure 922 of the electronic device, and the bent heat conduction portion 903 is disposed above a bendable mechanism 923, such as a hinge mechanism, between the first support structure 921 and the second support structure 922. The two ends of the bent heat conductive part 903 may be embedded in or adhered to the corresponding two ends of the first heat conductive part 901 and the second heat conductive part 902 as described above in connection with fig. 4, and may be fixed to the first support structure 921, the second support structure 922, or the bendable mechanism 923 by other fixing mechanisms.
In the embodiment shown in fig. 9, the heat dissipating device 900 further includes a first fixing structure 911 and a second fixing structure 912 for fixing two sides of the bent heat conducting portion 903, specifically, the fixing structures 911 and 912 fix two sides of the bent heat conducting portion 903 to the first supporting structure 921 and the second supporting structure 922, respectively, or to two ends of the hinge structure 923, respectively. Between the fixed structures 911, 912, the bent heat conducting portion 903 is suspended above the bending mechanism 923, or the bent heat conducting portion 903 is not attached to other structures or mechanisms.
The heat sink 900 shown in fig. 9 is disposed inside the first support structure 921, the second support structure 922, and the bend of the hinge structure 923. The heat sink 900 has a substantially planar folded heat conducting portion 903 in the unfolded state as shown in fig. 9a and a folded heat conducting portion 903 with a redundant portion extruded as shown in fig. 9 b. Wherein the bent heat conductive portion 903 is a heat conductive material that can be bent, the bent heat conductive material does not have to have elasticity. In the unfolding and folding process, the reserved redundant part can ensure that the length of the section where the heat conducting part 903 is bent can change, namely the redundant part generates folds when being compressed, and the folds of the redundant part are reduced and even flattened when being stretched.
Fig. 10 is a schematic cross-sectional view of a heat dissipating device 1000 according to another embodiment of the present invention. The heat sink 1000 in fig. 10 is similar to the heat sink 900 in fig. 9, and the same or similar reference numerals are used to designate the same or similar structures in both. The heat dissipating device 1000 includes a first heat conducting portion 1001, a second heat conducting portion 1002, and a bent heat conducting portion 1003, wherein the first heat conducting portion 1001 is fixed to a first support structure 1021 of the bendable electronic device, the second heat conducting portion 1002 is fixed to a second support structure 1022 of the electronic device, and the bent heat conducting portion 1003 is disposed above a bendable mechanism 1023, such as a hinge mechanism, between the first support structure 1021 and the second support structure 1022. The two ends of the bent heat conductive part 1003 may be embedded in or adhered to the corresponding two ends of the first heat conductive part 1001 and the second heat conductive part 1002 as described above in connection with fig. 4, and may be fixed to the first support structure 1021, the second support structure 1022, or the bendable mechanism 1023 by other fixing mechanisms.
In the embodiment shown in fig. 10, the heat dissipating device 1000 further includes a first fixing structure 1011 and a second fixing structure 1012 for fixing two sides of the bent heat conducting portion 1003, specifically, the fixing structures 1011, 1012 fix two sides of the bent heat conducting portion 1003 to the first supporting structure 1021 and the second supporting structure 1022, respectively, or to two ends of the hinge structure 1023, respectively. Between the fixed structures 1011, 1012, the bent thermally conductive section 1003 is suspended above the bending mechanism 1023, or the bent thermally conductive section 1003 is not attached to other structures or mechanisms.
The heat dissipating device 1000 shown in fig. 10 is disposed outside the first support structure 1021, the second support structure 1022, and the hinge structure 1023. The heat sink 1000 has a folded heat conductive portion 1003 with a redundant portion extruded as shown in fig. 10a in an unfolded state and a substantially planar folded heat conductive portion 1003 as shown in fig. 10b in a folded state.
In the embodiment shown in fig. 9 and 10, the bent heat conducting portion may be further disposed inside the hinge mechanism 923, 1023 and fixed with respect to the third member inside the hinge mechanism, and the bent heat conducting portion disposed inside the hinge mechanism 923 may be disposed inside or outside the bend of the third member, so that when disposed inside the hinge mechanism 923, the bent heat conducting portion may be compressed in an unfolded state or a folded state to generate a wrinkle portion in the redundant portion, and may be stretched in the folded state or the unfolded state to reduce the wrinkle portion, or even be flattened. Advantageously, the extruded redundant portion can be of any shape within its allowed space without prior machining to a particular shape and/or with regular folds. Therefore, the present application does not make any limitation on the shape of the pressed redundant portion.
In order to avoid the wrinkles generated by the redundant portion from affecting other components, such as the hinge mechanism being blocked by the folded portion, the heat dissipating device 900, 1000 in the present application further includes a limiting structure for limiting the moving range or the moving space of the redundant portion. The limit structure is described in detail below with reference to fig. 11 and 12.
Fig. 11 shows a schematic view of the limiting structures 110, 120 in an embodiment of the invention. The spacing structures 110, 111 are mounted relative to the folded thermally conductive portions 903/1003 as shown in fig. 11 a. The spacing structures 110, 111 may be spacing frames extending in the Y-direction, such as snaps, with the bent thermally conductive portions 903/1003 passing through the spacing frames 110, 111 in the X-direction, so that their redundant portions are limited by the spacing frames in the Z-direction. The height of the limit structure 110 in the Z direction is L1, and the height of the limit structure 111 in the Z direction is L2, wherein L1 and L2 may be set to the same or different heights. In the areas where the stopper structures 110, 111 are provided, the range of movement in the Z direction of the folded portion generated by bending the redundant portion of the heat conductive portion 903/1003 is substantially within L1 and L2, respectively. In the embodiment shown in fig. 11a, two limit structures 110, 111 are shown to limit the range of movement of the redundant part of the folded heat conducting part 903/1003 at different positions in the X-direction. It should be appreciated that fewer or more spacing structures may be provided on the heat sinks 900, 1000, and that the spacing structures may also have different shapes than those shown in fig. 11 a. Advantageously, in the embodiment of the present application, the bent heat conducting portion 903/1003 is bent or unfolded in the X direction, and since the limit structures 110, 111 are disposed along the Y direction and the width in the X direction is narrower, the limit structures are hardly affected by the stretching or compression of the cut surface when they move with the bending or unfolding of the bending mechanism.
Fig. 11b shows a cross-sectional view of the spacing structure of fig. 11a, it being understood that the present embodiment shows a rectangular spacing frame with rounded corners, which is not limiting to the present application, and in other embodiments the spacing structure may have other regular or irregular shapes.
Fig. 12 shows a schematic view of the spacing structures 120-123 in another embodiment of the present invention. Likewise, the limiting structures 120-123 are mounted with respect to the above-mentioned bent heat conducting portion 903/1003, and in particular, the limiting structures 120-123 are magnetic members mounted toward the bent heat conducting portion 903/1003, which further limit the movement of the redundant portion in the bent heat conducting portion 903/1003 by magnetic force, so as to avoid the influence of the wrinkle portion generated by the redundant portion on other components in the bendable electronic device.
As shown in fig. 12a, two magnetic members 120, 121 are provided on the structural member 124 along the X-direction, and are provided on a first side of the bent heat conducting portion 903/1003, and limit different areas of the bent heat conducting portion 903/1003, respectively, that is, limit the wrinkle portion generated in the bent heat conducting portion 903/1003 within a certain range on the first side. In one embodiment of the present application, the bent thermally conductive portions 903/1003 are of a thermally conductive material having magnetic properties or a thermally conductive material containing a magnetic metal, so as to be attracted by the magnetic members 120, 121 to limit movement of the redundant portions in the Z direction. In another embodiment of the present application, the structural member 125 is magnetic or contains a magnetic metal to attract the magnetic components 120, 121 to limit movement of the redundant portion of the folded conductive portion 903/1003 in the Z-direction.
As shown in fig. 12b, a plurality of magnetic members 120, 121, 122, 123 may be provided in the Z direction. On the structural member 124, two magnetic members 120, 121 are provided in the X-direction, i.e. the magnetic members 120, 121 are provided on a first side of the folded heat conducting portion 903/1003. On the structural member 125, two magnetic members 122, 123 are provided in the X direction, i.e., the magnetic members 122, 123 are provided on the second side of the bent heat conducting portion 903/1003. Wherein the magnetic members 120, 122 are substantially aligned in the Z-direction to limit movement of a portion of the folds of the folded thermally conductive portion 903/1003 in the Z-direction and the magnetic members 121, 123 are substantially aligned in the Z-direction to limit movement of another portion of the folds of the folded thermally conductive portion 903/1003 in the Z-direction.
Wherein the magnetic parts 120, 121 mainly define the fold portions generated in the bent heat conducting parts 903/1003 within a first range on a first side, and the magnetic parts 122, 123 mainly define the fold portions generated in the bent heat conducting parts 903/1003 within a second range on a second side.
It should be understood that in the embodiment shown in fig. 12, the magnetic component, or the pair of magnetic components, disposed in the X-direction may be one or more, the number of which is not limiting of the present application.
Wherein the structural members 124 and 125 may be components on the bendable electronic device, such as a center frame or a bending member. In another embodiment of the present application, the structural members 124 and 125 may be additionally added to fix the magnetic component on the electronic device, so as to limit the redundant portion of the bent heat conducting portion 903/1003, and the wrinkles generated by the limited redundant portion during the bending or unfolding process will not affect other components on the electronic device.
In one embodiment of the present application, the magnetic members 120, 121, 122, 123 may be a single member extending in the Y direction or may be a plurality of members sectionally arranged in the Y direction. In order to minimize the influence that the magnetic members 120, 121, 122, 123 may have on the electrical signal of the bendable electronic device, it is preferable to provide a plurality of magnetic members in sections in the Y direction to limit redundant portions in a plurality of areas where the magnetic members are provided.
The heat abstractor that this application provided relies on the redundant part of bending heat conduction part to realize the change of tangent plane length at the in-process of bending or expansion, and need not per se to have elasticity, simultaneously, this redundant part still provides the radiating area of increase, has improved radiating efficiency, and the heat conduction part of bending that has redundant part strides across the regional heat transfer of bending, can realize electronic equipment's both sides samming to but promote electronic equipment's of bending complete machine heat dissipation ability.
Meanwhile, the heat dissipation device provided by the application limits the movable range or the space of the redundant part through the limiting structure, so that the heat dissipation device is prevented from affecting other parts when generating wrinkles, and particularly, the bending component is prevented from being blocked by the redundant part in the bending or unfolding process.
Therefore, the heat dissipation device can be applied to various bendable or foldable electronic equipment, and the heat conduction material in the heat dissipation device does not need to have telescopic performance, so that the heat conduction material can be bent or unfolded along with the whole machine in the bendable electronic equipment and is compressed on the tangent plane of the inner side of bending or stretched on the tangent plane of the outer side of bending, and therefore the heat dissipation effect is ensured and meanwhile the bending reliability is also provided.
It should be understood that, the specific materials and/or structures of the first heat conducting portion, the second heat conducting portion and the bent heat conducting portion of the heat dissipating device in the foregoing embodiments are not limited in any way, and may be a heat dissipating plate formed by a flexible material and/or a heat conducting material and/or a composite material, or may be a heat dissipating device corresponding to a two-phase structure such as a temperature equalizing plate or a heat pipe.
For example, the heat conducting material in the heat dissipating device may be a liquid or granular material with high heat conductivity, which has a high heat conductivity, so that it can conduct heat rapidly to achieve the heat dissipating function.
It should be noted that in the case where the heat conductive material is a liquid or granular material, the heat conductive material needs to be enclosed in a closed space by other materials to avoid leakage, causing pollution and damage to electronic equipment. In this case, the material for sealing the heat conductive material may be a flexible material as proposed in the present application, or may be another material having a certain flexibility, which is not particularly limited in the present application.
Although the exemplary embodiments of the present invention have been described above with respect to the present invention, the present invention is not limited to these embodiments, and these exemplary embodiments may be used in combination or may modify partial configurations within the scope of the technical idea of the present invention.

Claims (9)

1. A heat sink for a bendable electronic device, the electronic device comprising a first support member, a second support member, and a bending member between the two support members, the heat sink comprising:
a first thermally conductive portion at least partially covering the first support member;
a second thermally conductive portion at least partially covering the second support member;
a bent heat conduction portion extending between the first heat conduction portion and the second heat conduction portion, and having a wrinkle portion occurring as the bending member is bent or unfolded in a first direction; and
The first limiting structure is arranged on the first side of the bent heat conducting part and is arranged at intervals with the first heat conducting part, extends along the second direction, and is used for limiting a first moving range of the folded part along the third direction of the first side of the bent heat conducting part when the folded part appears on the bent heat conducting part, and is perpendicular to the first direction, the second direction and the third direction.
2. The heat sink of claim 1, wherein the heat sink further comprises:
the second limiting structure is arranged on a second side of the bent heat conducting part, the second side is opposite to the first side, and when the bent heat conducting part is provided with the fold part, the second limiting structure is used for limiting a second movement range of the fold part on the second side of the bent heat conducting part.
3. The heat dissipating device of claim 2, wherein the first and second spacing structures comprise a spacing frame, and the folded thermally conductive portion extends through the spacing frame.
4. The heat dissipating device of claim 1, wherein said first limiting structure comprises a plurality of limiting blocks disposed at spaced intervals on said first side of said bent heat conducting portion.
5. The heat dissipating device of claim 1, wherein said first limiting structure comprises a magnetic member that generates a magnetic force on said bent heat conducting portion.
6. The heat dissipating device of claim 1, wherein the first limiting structure comprises a magnetic component, and the heat dissipating device further comprises:
the structural part is arranged on the second side of the bent heat conduction part, the second side is opposite to the first side, and the magnetic part generates magnetic force on the structural part.
7. The heat dissipating device of claim 2, wherein the first spacing structure comprises a first magnetic component and the second spacing structure comprises a second magnetic component, the first magnetic component and the second magnetic component being disposed on the first side and the second side of the folded heat conducting portion, respectively, to generate magnetic forces with each other.
8. A bendable display device, comprising:
a display panel including a display region including a first display region, a second display region, and a bending region defined between the first display region and the second display region;
A bendable device, the bendable device comprising,
a first support member for supporting a first region of the display panel corresponding to the first display region;
a second supporting member for supporting a second region of the display panel corresponding to the second display region; and
a bending member connected between the first and second support members to overlap the bending region and guiding the display panel to start bending or unfolding of the display panel with respect to the bending region; and
the heat dissipation device is positioned between the display panel and the bendable device, the surface of the heat dissipation device is attached to the surface of the bendable device, and the heat dissipation device is the heat dissipation device according to any one of claims 1-7.
9. A terminal device comprising a bendable display device, the bendable display device being the bendable display device of claim 8.
CN202010538543.4A 2020-06-13 2020-06-13 Bendable display device and heat dissipation device thereof Active CN113811136B (en)

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CN202310594255.4A CN116782591A (en) 2020-06-13 2020-06-13 Bendable display device and heat dissipation device thereof
CN202010538543.4A CN113811136B (en) 2020-06-13 2020-06-13 Bendable display device and heat dissipation device thereof
PCT/CN2021/098495 WO2021249316A1 (en) 2020-06-13 2021-06-05 Foldable display device and heat dissipation device thereof

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CN218784044U (en) * 2022-10-18 2023-03-31 广东畅能达科技发展有限公司 Bendable soaking plate
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