CN117082843B - Temperature equalizing plate and electronic equipment - Google Patents
Temperature equalizing plate and electronic equipment Download PDFInfo
- Publication number
- CN117082843B CN117082843B CN202311304629.0A CN202311304629A CN117082843B CN 117082843 B CN117082843 B CN 117082843B CN 202311304629 A CN202311304629 A CN 202311304629A CN 117082843 B CN117082843 B CN 117082843B
- Authority
- CN
- China
- Prior art keywords
- layer
- temperature
- flexible layer
- micro
- equalizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 229920000642 polymer Polymers 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 31
- 229910052802 copper Inorganic materials 0.000 claims description 30
- 239000010949 copper Substances 0.000 claims description 30
- 238000003466 welding Methods 0.000 claims description 13
- 239000004033 plastic Substances 0.000 claims description 8
- 239000000835 fiber Substances 0.000 claims description 7
- 239000005060 rubber Substances 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 14
- 230000000694 effects Effects 0.000 description 16
- 238000001704 evaporation Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000005452 bending Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 238000002791 soaking Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a temperature equalization plate and electronic equipment, and relates to the technical field of heat exchange. The temperature equalizing plate comprises at least two temperature equalizing layers which are sequentially stacked, and each temperature equalizing layer comprises a first flexible layer, a high polymer flexible layer and a second flexible layer which are sequentially stacked from bottom to top; in two adjacent temperature equalizing layers, a second flexible layer of the temperature equalizing layer positioned on the lower layer is connected with a first flexible layer of the temperature equalizing layer positioned on the upper layer, a steam channel is formed in one of the second flexible layer of the temperature equalizing layer positioned on the lower layer and the first flexible layer of the temperature equalizing layer positioned on the upper layer, a micro-nano runner is formed in the other of the two layers, the steam channel and the micro-nano runner form a vacuum runner in cross intercommunication, and liquid working media are filled in the vacuum runner. The problem that electronic equipment can't high-efficient heat dissipation has been solved to this scheme.
Description
Technical Field
The invention relates to the technical field of heat exchange, in particular to a temperature equalizing plate and electronic equipment.
Background
In recent years, foldable electronic devices such as a foldable mobile phone and a foldable computer are increasingly popular, and the foldable electronic device is generally provided with a hinge folding structure or a rotating shaft, so that heat generated by an electronic device on one side of the folding structure needs to be conducted from one side of the folding structure to the other side of the folding structure, thereby improving a heat dissipation effect.
In the related art, a planar heat pipe or a vapor chamber is generally used to dissipate heat from an electronic device on an electronic apparatus, but the planar heat pipe or vapor chamber is rigid and cannot have a bending effect, and therefore can only be disposed on both sides of a folded structure. Therefore, heat generated by the electronic device located at one side of the folding structure cannot be conducted from one side of the folding structure to the other side, and therefore the problem that the electronic device cannot efficiently dissipate heat cannot be solved.
Disclosure of Invention
The invention mainly aims to provide a temperature equalization plate and electronic equipment, and aims to solve the problem that the electronic equipment cannot efficiently dissipate heat.
In order to achieve the above object, the present invention provides a temperature equalization board applied to an electronic device, the electronic device having a folding structure, at least a part of the folding structure being disposed in the middle Wen Banyi so as to bend along with the folding structure, the temperature equalization board comprising:
the temperature equalization layer comprises a first flexible layer, a high polymer flexible layer and a second flexible layer which are sequentially stacked from bottom to top;
in two adjacent layers in the samming layer, the second flexible layer that is located the samming layer of lower floor with be located the upper strata the first flexible layer of samming layer is connected, and be located the lower floor the second flexible layer of samming layer and be located in one of the first flexible layer of samming layer of upper strata be formed with the steam channel, be formed with little nanometer runner in another wherein, the width of steam channel is greater than little nanometer runner's width, just the steam channel with little nanometer runner forms the vacuum runner of cross intercommunication, the vacuum runner intussuseption is filled with liquid working medium.
In an embodiment of the invention, the steam channels comprise a number of lateral steam channels arranged side by side and/or a number of longitudinal steam channels arranged side by side.
In an embodiment of the present invention, when the steam channels include a plurality of lateral steam channels arranged side by side and a plurality of longitudinal steam channels arranged side by side, the plurality of lateral steam channels and the plurality of longitudinal steam channels are arranged in a crisscross manner.
In an embodiment of the present invention, the micro-nano flow channel includes a plurality of lateral micro-nano flow channels arranged side by side and/or a plurality of longitudinal micro-nano flow channels arranged side by side.
In an embodiment of the present invention, when the micro-nano flow channel includes a plurality of lateral micro-nano flow channels arranged side by side and a plurality of longitudinal micro-nano flow channels arranged side by side, the plurality of lateral micro-nano flow channels and the plurality of longitudinal micro-nano flow channels are arranged in a crisscross manner.
In an embodiment of the present invention, at least two temperature equalizing layers include a first temperature equalizing layer, a second temperature equalizing layer and a third temperature equalizing layer that are sequentially stacked from bottom to top;
the steam channel is formed in the second flexible layer of the first temperature-equalizing layer, the micro-nano flow channel is formed in the first flexible layer of the second temperature-equalizing layer, and the steam channel in the second flexible layer of the first temperature-equalizing layer and the micro-nano flow channel in the first flexible layer of the second temperature-equalizing layer form the vacuum flow channel;
the micro-nano flow channel is formed in the second flexible layer of the second temperature equalizing layer, the steam channel is formed in the first flexible layer of the third temperature equalizing layer, and the micro-nano flow channel in the first flexible layer of the second temperature equalizing layer and the steam channel in the first flexible layer of the third temperature equalizing layer form another vacuum flow channel.
In an embodiment of the invention, the first flexible layer and/or the second flexible layer is a copper layer.
In one embodiment of the present invention, the thickness of the copper layer is defined as d 1 Then the condition is satisfied: d is less than or equal to 10 mu m 1 ≤30μm。
In an embodiment of the present invention, two adjacent copper layers are welded and fixed into an integral structure at a low temperature.
In an embodiment of the present invention, two adjacent copper layers are fixed into an integral structure by low-temperature diffusion welding.
In an embodiment of the present invention, a welding temperature of two adjacent copper layers is 180 ℃ to 350 ℃.
In an embodiment of the present invention, the polymer flexible layer is at least one layer selected from a plastic layer, a rubber layer and a fiber layer.
In one embodiment of the present invention, the thickness of the polymer flexible layer is defined as d 2 Then the condition is satisfied: d is less than or equal to 1 mu m 2 ≤30μm；
And/or define the width of the steam channel as W 1 Then satisfy condition W 1 ＞200μm；
And/or define the width of the micro-nano flow channel as W 2 Then satisfy condition W 2 ＜100μm；
And/or the liquid working medium is one of deionized water, ethanol and fluorocarbon.
The invention also proposes an electronic device comprising:
a body having a folded structure;
the temperature equalization plate as described above, at least a portion of the folded structure of the temperature equalization plate Wen Banyi is configured to bend with the folded structure.
The temperature equalization plate comprises at least two temperature equalization layers which are sequentially stacked, each temperature equalization layer comprises a first flexible layer, a high-molecular flexible layer and a second flexible layer which are sequentially stacked from bottom to top, and the first flexible layer and the second flexible layer can be specifically flexible copper layers or other material layers capable of being bent, and the high-molecular flexible layer can be specifically plastic, rubber, fiber or other material layers capable of being bent, so that the temperature equalization plate can be bent under the action of external force and cannot be broken in the bending process. And in two adjacent temperature equalizing layers, a steam channel is formed in one of a second flexible layer positioned in a lower temperature equalizing layer and a first flexible layer positioned in an upper temperature equalizing layer, a micro-nano flow channel is formed in the other one of the two temperature equalizing layers, the steam channel and the micro-nano flow channel form a vacuum flow channel which is in cross intercommunication, a liquid working medium is filled in the vacuum flow channel, the width of the steam channel is larger than that of the micro-nano flow channel, namely, the scale effect capillary force of the micro-nano flow channel is larger than that of the steam channel.
Therefore, when the temperature equalization plate provided by the scheme is applied to the electronic equipment, at least part of the temperature equalization plate can be arranged according to the folding structure of the electronic equipment as the temperature equalization plate can be bent under the action of external force. When the folding structure is bent, the temperature equalizing plate can be bent along with the folding structure, so that heat generated by an electronic device positioned on one side of the folding structure can be smoothly conducted to the other side from one side of the folding structure through the temperature equalizing plate, so that the heat radiating area of the electronic device is increased.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic structural view of an embodiment of a temperature equalization plate according to the present invention;
FIG. 2 is a schematic diagram of a temperature equalizing layer according to an embodiment of the invention;
FIG. 3 is a schematic view of a vapor channel in an embodiment of a isopipe of the present invention;
FIG. 4 is a schematic diagram of a micro-nano flow channel in an embodiment of a temperature equalization plate according to the present invention;
FIG. 5 is a schematic diagram of a temperature equalization plate applied to a head-mounted device;
fig. 6 is a schematic structural diagram of the temperature equalizing plate applied to a folding mobile phone;
fig. 7 is a schematic structural diagram of the temperature equalizing plate applied to a folding computer.
Reference numerals illustrate:
the achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
The invention provides a temperature equalization plate 100 and an electronic device 1000, and aims to solve the problem that the electronic device 1000 cannot efficiently dissipate heat.
The specific structures of the temperature equalization plate 100 and the electronic device 1000 of the present invention will be described below:
as shown in fig. 1 to 4, in an embodiment of the invention, the temperature-equalizing plate 100 is applied to an electronic device 1000, the electronic device 1000 has a folding structure 210, and at least part of the temperature-equalizing plate 100 is disposed according to the folding structure 210 so as to bend along with the folding structure 210; the temperature equalization plate 100 comprises at least two temperature equalization layers 10 which are sequentially stacked, wherein the temperature equalization layers 10 comprise a first flexible layer 11, a high polymer flexible layer 12 and a second flexible layer 13 which are sequentially stacked from bottom to top;
in the two adjacent temperature equalizing layers 10, a second flexible layer 13 of the temperature equalizing layer 10 positioned at the lower layer is connected with a first flexible layer 11 of the temperature equalizing layer 10 positioned at the upper layer, a steam channel 10d is formed in one of the second flexible layer 13 of the temperature equalizing layer 10 positioned at the lower layer and the first flexible layer 11 of the temperature equalizing layer 10 positioned at the upper layer, a micro-nano flow channel 10e is formed in the other one of the second flexible layer 13 and the first flexible layer 11, the width of the steam channel 10d is larger than that of the micro-nano flow channel 10e, the steam channel 10d and the micro-nano flow channel 10e form a cross intercommunication vacuum flow channel, and liquid working medium is filled in the vacuum flow channel.
It can be understood that, in the temperature equalization plate 100 provided by the present invention, at least two temperature equalization layers 10 are sequentially stacked, and each temperature equalization layer 10 includes a first flexible layer 11, a polymer flexible layer 12 and a second flexible layer 13 sequentially stacked from bottom to top, because the first flexible layer 11 and the second flexible layer 13 can be specifically flexible copper layers or other flexible material layers capable of being bent, and the polymer flexible layer 12 can be specifically plastic, rubber, fiber or other flexible material layers capable of being bent, the temperature equalization plate 100 can be bent under the action of external force, and breakage can not occur in the bending process. In addition, in the two adjacent temperature equalizing layers 10, a steam channel 10d is formed in one of the second flexible layer 13 in the lower temperature equalizing layer 10 and the first flexible layer 11 in the upper temperature equalizing layer 10, the other one of the two layers is formed with a micro-nano flow channel 10e, the steam channel 10d and the micro-nano flow channel 10e form a vacuum flow channel which is in cross intercommunication, a liquid working medium is filled in the vacuum flow channel, and the width of the steam channel 10d is larger than the width of the micro-nano flow channel 10e, namely, the scale effect capillary force of the micro-nano flow channel 10e is larger than that of the steam channel 10d.
Therefore, when the temperature-equalizing plate 100 according to the present embodiment is applied to the electronic device 1000, at least a portion of the temperature-equalizing plate 100 can be disposed according to the folding structure 210 because the temperature-equalizing plate 100 can be bent under the action of an external force. When the folding structure 210 is folded, the temperature equalizing plate 100 can be folded along with the folding structure 210, so that heat generated by an electronic device located at one side of the folding structure 210 can be smoothly conducted from one side of the folding structure 210 to the other side through the temperature equalizing plate 100, so as to increase the heat dissipation area of the electronic device, because one end of the temperature equalizing plate 100, which is close to the electronic device (a heat source of electronic equipment), is a evaporation end, and one end, which is far away from the electronic device, of the temperature equalizing plate 100 is a condensation end, a liquid working medium in a vacuum flow channel in the temperature equalizing plate 100 is vaporized at the evaporation end to form steam so as to take away heat, and the steam enters the steam channel 10d from the micro-nano flow channel 10e, is transmitted to the condensation end through the steam channel 10d to condense and liquefy the liquid working medium so as to release heat, and then enters the micro-nano flow channel 10e again through the steam channel 10d, and the liquid working medium returns to the evaporation end through capillary force of the micro-nano flow channel 10e, so that the work cycle is completed, and the heat generated by the electronic device can be quickly taken away, so as to improve the heat dissipation effect on the electronic device 1000.
And, the samming board 100 that this application provided is constituteed through adopting samming layer 10 that at least two-layer range upon range of setting in proper order to through realizing the high-efficient safe operation of samming board 100 under steam channel 10d and micro-nano runner 10 e's effect, so that samming board 100's thickness can also reach high-efficient radiating effect under the condition of being less than 0.15mm, realize samming board 100's ultra-thin design, with the difficult problem of effectively solving electronic equipment 1000 can not high-efficient radiating, be favorable to realizing folding electronic equipment 1000's performance promotion and marketing.
The evaporation end of the temperature equalization plate 100 is an end close to a heat source of the electronic device 1000, and the heat source of the electronic device 1000 is a location where heat is generated by the electronic device. The condensing end of the temperature equalizing plate 100 is an end far from the heat source of the electronic device 1000, and the end far from the heat source of the electronic device 1000 includes a position of a housing or other structure that does not generate heat.
It should be noted that the folding structure 210 may be a hinge or a rotation shaft.
In some embodiments, when the vapor channel 10d is formed in the first flexible layer 11 in the upper temperature equalizing layer 10, the micro-nano flow channel 10e is formed in the second flexible layer 13 in the lower temperature equalizing layer 10, a first groove with an open bottom may be formed at the bottom of the first flexible layer 11 in the upper temperature equalizing layer 10, and a second groove with an open top may be formed at the top of the second flexible layer 13 in the lower temperature equalizing layer 10, so that the first groove is the vapor channel 10d, and the second groove is the micro-nano flow channel 10e.
In some embodiments, the first flexible layer 11 and/or the second flexible layer 13 may be a layered structure supported by a copper layer, a graphite layer, or the like. The materials of the first flexible layer 11 and the second flexible layer 13 may be the same or different, and the present application is not particularly limited herein.
In some embodiments, the polymeric flexible layer 12 may specifically be at least one of a plastic layer, a rubber layer, a fiber layer, and the like.
In some embodiments, the vapor channel 10d and the micro-nano flow channel 10e may be formed by etching, embossing, electroforming, or the like.
In the practical application process, in the two adjacent temperature equalizing layers 10, the second flexible layer 13 of the temperature equalizing layer 10 positioned on the lower layer and the first flexible layer 11 of the temperature equalizing layer 10 positioned on the upper layer can be specifically connected in a manner of welding, bonding, plugging and the like, so as to ensure the connection stability between the two adjacent temperature equalizing layers 10.
In the practical application process, the temperature equalizing plate 100 may be specifically provided with two, three, four or other layers of temperature equalizing layers 10 stacked in sequence.
In some embodiments, when the temperature-equalizing plate 100 is sequentially stacked with two temperature-equalizing layers 10, the two temperature-equalizing layers 10 may be defined as a lower temperature-equalizing layer 10 and an upper temperature-equalizing layer 10, and at this time, micro-nano flow channels 10e may be formed in the second flexible layer 13 in the lower temperature-equalizing layer 10 and steam channels 10d may be formed in the first flexible layer 11 in the upper temperature-equalizing layer 10; alternatively, the steam channel 10d may be formed in the second flexible layer 13 in the lower temperature equalizing layer 10, and the micro-nano flow channel 10e may be formed in the first flexible layer 11 in the upper temperature equalizing layer 10.
In other embodiments, when the temperature-equalizing plate 100 is sequentially stacked with three temperature-equalizing layers 10, the three temperature-equalizing layers 10 may be defined as a lower temperature-equalizing layer 10, a middle temperature-equalizing layer 10, and an upper temperature-equalizing layer 10, and at this time, micro-nano flow channels 10e may be formed in the second flexible layer 13 in the lower temperature-equalizing layer 10, and steam channels 10d may be formed in the first flexible layer 11 in the middle temperature-equalizing layer 10; alternatively, the steam channel 10d may be formed in the second flexible layer 13 in the lower temperature equalizing layer 10, and the micro-nano flow channel 10e may be formed in the first flexible layer 11 in the middle temperature equalizing layer 10. Also, a micro-nano flow channel 10e may be formed in the second flexible layer 13 in the middle-layer uniform temperature layer 10, and a steam channel 10d may be formed in the first flexible layer 11 in the upper-layer uniform temperature layer 10; alternatively, the steam channel 10d may be formed in the second flexible layer 13 in the middle-layer soaking layer 10, and the micro-nano flow channel 10e may be formed in the first flexible layer 11 in the upper-layer soaking layer 10.
As shown in fig. 1 and 3, in an embodiment of the present invention, the steam channel 10d includes a plurality of lateral steam channels 10d1 arranged side by side and/or a plurality of longitudinal steam channels 10d2 arranged side by side.
It can be appreciated that the two adjacent transverse steam channels 10d1 and the two adjacent longitudinal steam channels 10d2 can have a supporting structure, so that the strength of the first flexible layer 11 and/or the second flexible layer 13 is ensured by the supporting structure, so that the collapse phenomenon of the first flexible layer 11 and/or the second flexible layer 13 is avoided, the flowing of the liquid working medium in the steam channels 10d is influenced, and the efficient heat dissipation effect of the temperature equalizing plate 100 on the electronic device 1000 is further influenced. In addition, by providing a plurality of lateral steam channels 10d1 and/or a plurality of longitudinal steam channels 10d2, the liquid working medium can flow to each position of the temperature equalization plate 100 more uniformly, so that the efficient heat dissipation effect of the temperature equalization plate 100 on the electronic device 1000 can be improved.
Further, referring to fig. 1 and 3 in combination, in an embodiment of the temperature equalization plate 100 of the present invention, when the steam channel 10d includes a plurality of lateral steam channels 10d1 arranged side by side and a plurality of longitudinal steam channels 10d2 arranged side by side, the plurality of lateral steam channels 10d1 and the plurality of longitudinal steam channels 10d2 are arranged in a crisscross manner.
By the arrangement, the vapor channel 10d can form a cross structure, so that the liquid working medium can flow to each position of the temperature equalization plate 100 more uniformly, and the high-efficiency heat dissipation effect of the temperature equalization plate 100 on the electronic equipment 1000 can be further improved.
As shown in fig. 1 and 4, in an embodiment of the present invention, the micro-nano flow channel 10e includes a plurality of lateral micro-nano flow channels 10e1 arranged side by side and/or a plurality of longitudinal micro-nano flow channels 10e2 arranged side by side.
It can be understood that a supporting structure is also provided between the two adjacent lateral micro-nano flow channels 10e1 and the two adjacent longitudinal micro-nano flow channels 10e2, so that the strength of the first flexible layer 11 and/or the second flexible layer 13 is ensured by the supporting structure, and the collapse phenomenon of the first flexible layer 11 and/or the second flexible layer 13 is avoided, so that the flowing of the liquid working medium in the micro-nano flow channels 10e is influenced, and the efficient heat dissipation effect of the temperature equalization plate 100 on the electronic device 1000 is further influenced. In addition, by the plurality of lateral micro-nano flow passages 10e1 and the plurality of longitudinal micro-nano flow passages 10e2 which are arranged side by side, liquid working media can flow to each position of the temperature equalizing plate 100 more uniformly, and therefore, the efficient heat dissipation effect of the temperature equalizing plate 100 on the electronic equipment 1000 can be improved.
As shown in fig. 1 and fig. 4, in an embodiment of the present invention, when the micro-nano flow channel 10e includes a plurality of lateral micro-nano flow channels 10e1 arranged side by side and a plurality of longitudinal micro-nano flow channels 10e2 arranged side by side, the plurality of lateral micro-nano flow channels 10e1 and the plurality of longitudinal micro-nano flow channels 10e2 are arranged in a crisscross manner.
It can be understood that the micro-nano flow channels 10e can also form a cross structure, so that the liquid working medium can flow to each position of the temperature equalization plate 100 more uniformly, and the efficient heat dissipation effect of the temperature equalization plate 100 on the electronic device 1000 can be further improved.
In some embodiments, in order to make the liquid working medium smoothly conduct to the condensing end after evaporating and taking away heat in the vapor channel 10d for condensation and releasing energy, and make the liquid working medium smoothly return to the evaporating end in the micro-nano flow channel 10e in a capillary suction manner, the width of the vapor channel 10d may be larger than the width of the micro-nano flow channel 10e. Further, under the same unit area, the number of the transverse micro-nano flow channels 10e1 can be more than the number of the transverse steam channels 10d1, and the number of the longitudinal micro-nano flow channels 10e2 can be more than the number of the longitudinal steam channels 10d2, so as to fully improve the efficient heat dissipation effect of the temperature equalizing plate 100 on the electronic device 1000.
As shown in fig. 1, in an embodiment of the present invention, at least two temperature equalizing layers 10 include a first temperature equalizing layer 10a, a second temperature equalizing layer 10b and a third temperature equalizing layer 10c, which are sequentially stacked from bottom to top; a steam channel 10d is formed in the second flexible layer 13 of the first temperature equalizing layer 10a, a micro-nano flow channel 10e is formed in the first flexible layer 11 of the second temperature equalizing layer 10b, and a vacuum flow channel is formed between the steam channel 10d in the second flexible layer 13 of the first temperature equalizing layer 10a and the micro-nano flow channel 10e in the first flexible layer 11 of the second temperature equalizing layer 10 b; the micro-nano flow channel 10e is formed in the second flexible layer 13 of the second temperature equalizing layer 10b, the steam channel 10d is formed in the first flexible layer 11 of the third temperature equalizing layer 10c, and the micro-nano flow channel 10e in the first flexible layer 11 of the second temperature equalizing layer 10b and the steam channel 10d in the first flexible layer 11 of the third temperature equalizing layer 10c form another vacuum flow channel.
It can be appreciated that two mutually independent vacuum flow channels can be formed in the temperature equalization plate 100, and each vacuum flow channel is equivalent to a cavity structure, that is, a mutually independent double-cavity structure can be formed in the temperature equalization plate 100, so that the temperature equalization plate 100 can operate more efficiently and safely, and heat generated by an electronic device can be rapidly taken away under the action of liquid working medium in the double-cavity structure, so that the problem that the electronic device 1000 cannot dissipate heat efficiently is effectively solved.
As shown in fig. 1 and 2, in one embodiment of the present invention, the first flexible layer 11 and/or the second flexible layer 13 are copper layers.
It can be appreciated that, on the premise that the copper material has a certain flexibility, connection with the same material or with the polymer material can be better achieved, so by setting the first flexible layer 11 and/or the second flexible layer 13 as copper layers, in the same uniform temperature layer 10, the first flexible layer 11 can be better connected below the polymer flexible layer 12, and the second flexible layer 13 can be better connected above the polymer flexible layer 12; in addition, in the two adjacent temperature equalizing layers 10, the second flexible layer 13 in the temperature equalizing layer 10 positioned below and the first flexible layer 11 in the temperature equalizing layer 10 positioned above can be better connected; in addition, since the polymer flexible layer 12 is relatively soft, and the hardness of the copper material is higher than that of the polymer flexible layer 12, the polymer flexible layer 12 can be effectively supported by the copper layer, so that the polymer flexible layer 12 can be shaped better.
In one embodiment of the present invention, as shown in FIG. 2, the thickness of the copper layer (either the first flexible layer 11 or the second flexible layer 13) is defined as d 1 Then the condition is satisfied: d is less than or equal to 10 mu m 1 Less than or equal to 30 mu m; by setting the thickness of the copper layer to be 10 μm-30 μm, the steam channel 10d or the micro-nano flow channel 10e can be conveniently formed in the copper layer, and the influence on the whole bending performance of the temperature equalizing plate 100 due to the overlarge thickness of the copper layer can be avoided.
As shown in fig. 2, in an embodiment of the present invention, two adjacent copper layers are welded and fixed into an integral structure at low temperature. So set up, can realize sealing connection through the low temperature welding between the copper layer and become integrated into one piece structure, not only can guarantee the connection compactness between the two-layer samming layer 10 that is adjacent, can also effectively guarantee steam channel 10d and micro-nano runner 10 e's leakproofness to effectively reduce the risk of outside seepage of liquid working medium in steam channel 10d and the micro-nano runner 10e.
In the practical application process, the mode of adopting low-temperature welding between two adjacent copper layers can be specifically as follows: low temperature diffusion welding, nano copper powder/nano copper paste welding or ultrasonic welding.
As shown in fig. 2, in an embodiment of the present invention, two adjacent copper layers are fixed into an integral structure by low-temperature diffusion welding. By the arrangement, two adjacent copper layers can be mutually close to each other under the action of low temperature and pressure, plastic deformation is locally generated, mutual diffusion is generated among atoms, and a new diffusion layer is formed at an interface, so that reliable connection is realized, connection tightness between two adjacent temperature equalizing layers 10 is further improved, and tightness of a steam channel 10d and a micro-nano runner 10e is further improved.
As shown in FIG. 2, in one embodiment of the present invention, the soldering temperature of two adjacent copper layers is 180-350 ℃. By controlling the welding temperature of two adjacent copper layers to be 180-350 ℃, the two adjacent temperature equalizing layers 10 can have a more stable connection effect.
As shown in fig. 1 and 2, in an embodiment of the present invention, the polymer flexible layer 12 is at least one of a plastic layer, a rubber layer, and a fiber layer.
As can be appreciated, since the polymer material has good thermal conductivity, by setting the polymer flexible layer 12 as at least one of a plastic layer, a rubber layer and a fiber layer, heat generated by an electronic device on one side of the folding structure 210 can be quickly conducted into the steam channel 10d after passing through the polymer flexible layer 12, so as to take away heat after being vaporized at the evaporating end by the liquid working medium in the steam channel 10d; meanwhile, the high polymer material also has good bending property, so that the use requirement of repeated folding can be met.
As shown in FIG. 2, in one embodiment of the present invention, the thickness of the polymer flexible layer 12 is defined as d 2 Then the condition is satisfied: d is less than or equal to 1 mu m 2 Less than or equal to 30 mu m; by setting the thickness of the polymer flexible layer 12 between 1 μm and 30 μm, the heat generated by the electronic device on one side of the folding structure 210 can be smoothly transferred into the steam channel 10d after passing through the polymer flexible layer 12, and meanwhile, the influence on the whole bending performance of the temperature equalization plate 100 due to the overlarge thickness of the polymer flexible layer 12 can be avoided.
As shown in FIG. 3, in one embodiment of the present invention, the width W of the steam channel 10d is defined 1 Then satisfy condition W 1 > 200 μm; by setting the width of the steam channel 10d to be larger than 200 μm, the liquid working medium can be more smoothly conducted to the condensing end after being vaporized in the steam channel 10d to take away heat, so as to condense and release energy.
As shown in FIG. 4, in one embodiment of the present invention, the micro-nano flow channel 10e is defined as W 2 Then satisfy condition W 2 Less than 100 μm; by setting the width of the micro-nano flow channel 10e to be smaller than 100 μm, the liquid working medium can be returned to the evaporation end more smoothly in the micro-nano flow channel 10e in a capillary suction manner.
In one embodiment of the present invention, as shown in fig. 1, the liquid working medium is one of deionized water, ethanol, and fluorocarbon.
It can be appreciated that the liquid working medium can absorb heat rapidly and take away the heat generated by the electronic device after vaporization, so as to ensure efficient heat dissipation of the electronic device 1000.
As shown in fig. 5 to 7, the present invention further provides an electronic device 1000, where the electronic device 1000 includes the body 200 and the temperature equalization board 100 as described above, and the specific structure of the temperature equalization board 100 refers to the above embodiment, and since all the technical solutions of all the embodiments are adopted in the present electronic device 1000, at least all the beneficial effects brought by the technical solutions of the embodiments are provided, and will not be described in detail herein. Wherein the body 200 has a folded structure 210; at least a portion of the temperature equalization plate 100 is disposed along the folding structure 210 to bend along with the folding structure 210.
Specifically, the temperature equalization board 100 may be disposed on the electronic device 1000 by means of bonding, welding, plugging, clamping, etc., so that at least a portion of the temperature equalization board 100 is disposed according to the folding structure 210, which is not limited herein.
The evaporation end of the temperature equalization plate 100 is an end close to a heat source of the electronic device 1000, and the heat source of the electronic device 1000 is a location where heat is generated by the electronic device. The condensing end of the temperature equalizing plate 100 is the end far from the heat source of the electronic device 1000, and the end far from the electronic device 1000 includes a housing or other structure where no heat is generated.
In this embodiment, the electronic device 1000 may be a headset, a folding mobile phone, a folding computer, or the like.
For the head-mounted device, in some embodiments, when the head-mounted device is glasses, the electronic devices of the glasses are usually arranged on the glasses legs, and the heat generated by the electronic devices can be transferred to the glasses frame through the temperature equalizing plate 100 to dissipate heat, so that the heat dissipation area of the electronic devices is increased, and the effect of improving the heat dissipation of the glasses is achieved.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.
Claims (9)
1. A samming board for an electronic device, the electronic device having a folding structure, at least a portion of the samming board Wen Banyi being disposed in the folding structure so as to be folded along with the folding structure, the samming board comprising:
the temperature equalization layer comprises a first flexible layer, a high polymer flexible layer and a second flexible layer which are sequentially stacked from bottom to top;
in the two adjacent temperature equalizing layers, a second flexible layer of the temperature equalizing layer positioned at the lower layer is connected with a first flexible layer of the temperature equalizing layer positioned at the upper layer, a steam channel is formed in one of the second flexible layer of the temperature equalizing layer positioned at the lower layer and the first flexible layer of the temperature equalizing layer positioned at the upper layer, a micro-nano flow channel is formed in the other one of the second flexible layer and the first flexible layer, the width of the steam channel is larger than that of the micro-nano flow channel, the steam channel and the micro-nano flow channel form a cross-communicating vacuum flow channel, and the vacuum flow channel is filled with a liquid working medium;
the steam channels comprise a plurality of transverse steam channels and a plurality of longitudinal steam channels, wherein the transverse steam channels and the longitudinal steam channels are arranged side by side;
the micro-nano flow channels comprise a plurality of transverse micro-nano flow channels arranged side by side and a plurality of longitudinal micro-nano flow channels arranged side by side, and the transverse micro-nano flow channels and the longitudinal micro-nano flow channels are arranged in a crisscross manner;
defining the width of the steam channel as W 1 Then satisfy condition W 1 ＞200μm；
Defining the width of the micro-nano flow channel as W 2 Then satisfy condition W 2 ＜100μm。
2. The temperature equalization plate according to claim 1, wherein at least two temperature equalization layers comprise a first temperature equalization layer, a second temperature equalization layer and a third temperature equalization layer which are sequentially stacked from bottom to top;
the steam channel is formed in the second flexible layer of the first temperature-equalizing layer, the micro-nano flow channel is formed in the first flexible layer of the second temperature-equalizing layer, and the steam channel in the second flexible layer of the first temperature-equalizing layer and the micro-nano flow channel in the first flexible layer of the second temperature-equalizing layer form the vacuum flow channel;
the micro-nano flow channel is formed in the second flexible layer of the second temperature equalizing layer, the steam channel is formed in the first flexible layer of the third temperature equalizing layer, and the micro-nano flow channel in the first flexible layer of the second temperature equalizing layer and the steam channel in the first flexible layer of the third temperature equalizing layer form another vacuum flow channel.
3. The isopipe of claim 1 wherein the first flexible layer and/or the second flexible layer is a copper layer.
4. The isopipe of claim 3 wherein the copper layer is defined to have a thickness d 1 Then the condition is satisfied: d is less than or equal to 10 mu m 1 ≤30μm。
5. A temperature equalization plate as recited in claim 3, wherein adjacent two of said copper layers are cryogenically welded together to form a unitary structure.
6. The temperature uniformity plate according to claim 5, wherein two adjacent copper layers are fixed into an integral structure by low-temperature diffusion welding.
7. The isopipe of claim 6 wherein the welding temperature of two adjacent copper layers is 180 ℃ to 350 ℃.
8. The temperature equalization plate according to claim 1, wherein the polymer flexible layer is at least one of a plastic layer, a rubber layer and a fiber layer;
and/or define the thickness d of the polymer flexible layer 2 Then the condition is satisfied: d is less than or equal to 1 mu m 2 ≤30μm；
And/or the liquid working medium is one of deionized water, ethanol and fluorocarbon.
9. An electronic device, comprising:
a body having a folded structure;
the temperature uniformity plate of any one of claims 1 to 8, at least a portion of the folded structure of the uniformity Wen Banyi being arranged to bend with the folded structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311304629.0A CN117082843B (en) | 2023-10-10 | 2023-10-10 | Temperature equalizing plate and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311304629.0A CN117082843B (en) | 2023-10-10 | 2023-10-10 | Temperature equalizing plate and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117082843A CN117082843A (en) | 2023-11-17 |
| CN117082843B true CN117082843B (en) | 2023-12-22 |
Family
ID=88702697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311304629.0A Active CN117082843B (en) | 2023-10-10 | 2023-10-10 | Temperature equalizing plate and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117082843B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111913547A (en) * | 2020-08-10 | 2020-11-10 | 山东超越数控电子股份有限公司 | Method for achieving high-power-consumption fan-free uniform-temperature heat dissipation |
| CN212300050U (en) * | 2020-04-30 | 2021-01-05 | 爱美达（上海）热能系统有限公司 | Temperature equalizing plate |
| CN112638123A (en) * | 2020-12-11 | 2021-04-09 | 浙江大学 | Heterogeneous temperature equalizing device |
| WO2021249316A1 (en) * | 2020-06-13 | 2021-12-16 | 华为技术有限公司 | Foldable display device and heat dissipation device thereof |
| CN116182608A (en) * | 2021-11-26 | 2023-05-30 | 华为技术有限公司 | Temperature equalizing plate with fine structure layer |
-
2023
- 2023-10-10 CN CN202311304629.0A patent/CN117082843B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN212300050U (en) * | 2020-04-30 | 2021-01-05 | 爱美达（上海）热能系统有限公司 | Temperature equalizing plate |
| WO2021249316A1 (en) * | 2020-06-13 | 2021-12-16 | 华为技术有限公司 | Foldable display device and heat dissipation device thereof |
| CN111913547A (en) * | 2020-08-10 | 2020-11-10 | 山东超越数控电子股份有限公司 | Method for achieving high-power-consumption fan-free uniform-temperature heat dissipation |
| CN112638123A (en) * | 2020-12-11 | 2021-04-09 | 浙江大学 | Heterogeneous temperature equalizing device |
| CN116182608A (en) * | 2021-11-26 | 2023-05-30 | 华为技术有限公司 | Temperature equalizing plate with fine structure layer |
Non-Patent Citations (1)
| Title |
|---|
| 电子元器件冷却中的对流换热;潘阳;顾文斌;;电子机械工程(第04期);第52-61页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117082843A (en) | 2023-11-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2021143674A1 (en) | Mobile terminal, vapor chamber and preparation method therefor, and electronic device | |
| WO2022033289A1 (en) | Flat plate heat pipe and manufacturing method therefor, and heat exchanger | |
| KR100659582B1 (en) | Loop type micro heat transport device | |
| WO2021136073A1 (en) | Heat dissipation device, preparation method for heat dissipation device, and electronic apparatus | |
| TW202037871A (en) | Flexible vapor chamber | |
| JP2023527593A (en) | flexible display | |
| JPH04226058A (en) | Fluid-cooling hat | |
| TWI688741B (en) | Method for making ultra-thin heat pipe plate with printing wick structure | |
| CN112135488A (en) | Heat conduction structure, preparation method thereof and electronic equipment | |
| CN117082843B (en) | Temperature equalizing plate and electronic equipment | |
| WO2023216482A1 (en) | Mobile terminal, vapor chamber, and method for manufacturing vapor chamber | |
| WO2021018004A1 (en) | Heat conduction device and terminal device | |
| TW202026582A (en) | A method of manufacturing the integral thin film plate type heat pipe for sus material smartphone frame | |
| WO2024188003A1 (en) | Heat dissipation structure and electronic device | |
| CN117042422B (en) | Temperature equalizing plate and electronic equipment | |
| CN106856645A (en) | Radiator structure and preparation method thereof | |
| CN112105223B (en) | Heat radiating device for electronic equipment and electronic equipment | |
| US20210293485A1 (en) | Bendable vapor chamber structure | |
| WO2023024564A1 (en) | Housing assembly and electronic device | |
| WO2018157545A1 (en) | Thermally-conductive component and mobile terminal | |
| CN114390869B (en) | Unidirectional heat transfer pipe with Y-shaped diversion table liquid suction core and processing method thereof | |
| CN113465431B (en) | Temperature equalizing plate and terminal equipment | |
| WO2020073905A1 (en) | Method for manufacturing ultrathin heat tube plate with printed capillary structure | |
| CN117647128B (en) | Flexible vapor chamber and preparation method thereof | |
| KR20210003051A (en) | Elastic heat-dissipation structure and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |