CN113811136A

CN113811136A - Bendable display device and heat dissipation device thereof

Info

Publication number: CN113811136A
Application number: CN202010538543.4A
Authority: CN
Inventors: 吴会鹏; 刘华; 施健; 靳林芳; 周阿龙
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-06-13
Filing date: 2020-06-13
Publication date: 2021-12-17
Anticipated expiration: 2040-06-13
Also published as: WO2021249316A1; CN113811136B; CN116782591A

Abstract

The present application provides a heat dissipation device, a bendable display device and a terminal device. The heat dissipation device is used for a bendable electronic device, and the heat dissipation device includes a bending heat-conducting portion for bending along with the bending of the electronic device, and The first heat conducting portion extends from the first side of the bent heat conducting portion and is used to dissipate heat for the electronic device; and the first fixing mechanism is used to movably fix the first heat conducting portion on the electronic device. An electronic device; wherein the first heat-conducting portion includes a first moving mechanism for cooperating with the first fixing mechanism to move the first heat-conducting portion relative to the first fixing mechanism. By moving the first heat-conducting portion relative to the first fixing mechanism, the first heat-conducting portion can be adapted to the change of the length of the cut surface during the bending and unfolding process of the electronic device, so that the repeated bending of the electronic device can be satisfied and the electronic device can be lifted. cooling capacity.

Description

Bendable display device and heat dissipation device thereof

Technical Field

The present disclosure relates to heat dissipation devices, and particularly to a bendable heat dissipation device and a bendable display device using the same.

Background

In order to satisfy the demand of consumers for both large screen experience and portable terminals, the folding terminal has become one of the important trends of the terminal device. Folding type terminal products, such as folding mobile phones, are large-screen terminals with portability realized by a flexible bending technology, and can be used as a tablet personal computer to bring large-screen experience when in an unfolded state, and the folding type terminal products can be used as mobile phones with better portability when in a bent state. The bendable terminal connects two support members through the bending member, and the support members support one display area respectively or together. In order to match with the experience of low time delay and high smoothness and reduce the wiring between the two main boards of the bendable terminal, main heating devices (such as a system chip, a camera module and the like) of the bendable terminal are often concentrated on one main board, so that the heat of the bendable terminal is concentrated on the side, and therefore a heat dissipation component capable of being bent repeatedly is needed to realize the transfer of the heat across the bending component, so that the heat of the two main boards is uniform.

In addition, during bending of the bendable terminal, the layers of devices are repeatedly stretched or compressed in different sections, it being understood that during bending, some devices are located on the inside of the bend and some devices are located on the outside of the bend. Referring to fig. 1a, 1b, a three-

layer device

10, 11, 12 is schematically shown, having a length L in an unfolded state as shown in fig. 1 a. When the bendable region 13 of the

devices

10, 11, 12 is bent in the bending direction as shown in fig. 1b, the device 11 is located inside the bend of the device 10 and the device 12 is located outside the bend of the device 10. When the

devices

10, 11, 12 are attached, e.g., glued, in sequence, the two ends of the

bent devices

10, 11, 12 remain aligned at a1-B1 and a2-B2, as shown in fig. 1B. Thus, the component 11 located inside the bend is compressed with respect to the component 10, while the component 12 located outside the bend is stretched with respect to the component 10, i.e. the component located inside the bend is compressed to a greater extent with respect to the component located outside the bend during the process of unfolding the bending device into the fold, whereas the component located outside the bend is stretched to a greater extent with respect to the component located inside the bend during the process of unfolding the bending device from the fold into the fold, contrary to the above-mentioned process. Since the heat conductive material in the conventional heat dissipation member itself does not have elasticity, i.e., does not have extensible properties such as tension or compression, when the heat dissipation member is repeatedly bent and unfolded by the bending apparatus, the properties of the heat dissipation member may be affected by the repeated compression and tension. Meanwhile, the foldable mobile phone can be bent repeatedly, the heat conduction effect of the elastic heat conduction material is poor, the heat transfer of the bending member cannot be realized, and the temperature equalization of the two sides of the foldable mobile phone cannot be realized.

A foldable terminal requires a bendable heat dissipating member that can accommodate stretching and compression in both folded and unfolded states while achieving heat transfer across the bend region to equalize the temperature on both sides of the foldable terminal.

Disclosure of Invention

The embodiment of the invention provides a bendable display device, a heat dissipation device of the bendable display device and terminal equipment, wherein the heat dissipation device is used for bendable electronic equipment and can adapt to the change of section lengths of different sections of the bendable electronic equipment in the bending and unfolding processes.

In a first aspect, embodiments of the present invention provide a heat dissipation device for a bendable electronic device. The heat sink includes a heat sink comprising: a bending heat conduction part which is used for bending along with the bending of the electronic equipment and unfolding along with the unfolding of the electronic equipment; a first heat conducting portion extending from a first side of the bent heat conducting portion for dissipating heat of the electronic device; and a first securing mechanism for removably securing the first thermally conductive portion to the electronic device; wherein the first heat conducting portion comprises a first moving mechanism for cooperating with the first fixing mechanism to move the first heat conducting portion relative to the first fixing mechanism. Through the first heat conducting part moving relative to the first fixing mechanism, the heat dissipation device can adapt to the change of the section lengths of different sections of the electronic equipment during bending and unfolding, and the heat dissipation device can achieve stretching and shrinking effects on the section of the heat dissipation device.

Based on the first aspect, in a first implementation manner of the first aspect, the first moving mechanism is a through hole on the first heat conduction portion, the first fixing mechanism is disposed in the through hole, and the through hole has a gap for providing a stroke of relative movement between the through hole and the first fixing mechanism. Through the gap reserved in the through hole, the through hole can move for a certain stroke relative to the first fixing mechanism, so that the first heat conducting part can move relative to the first fixing mechanism.

In a second implementation form of the first aspect, based on the first aspect, the first fixing mechanism is a protrusion fixed in the electronic device.

In a third implementation form of the first aspect, based on the first aspect and the second implementation form of the first aspect, the first fixing mechanism has a threaded hole and is fixed in the electronic device by a screw.

In a fourth implementation form of the first aspect, the first moving mechanism is one of a protrusion and a groove which are matched with each other, and the first fixing mechanism is the other of the protrusion and the groove which are matched with each other, wherein the groove is used for providing a moving track of the protrusion. By means of the projection and the recess, a reliable moving fit between the first moving mechanism and the first fixing mechanism can be provided in a simple structure.

In a fifth implementation manner of the first aspect, based on the first aspect and any one of the first to fourth implementation manners of the first aspect, when the bending thermal conduction portion is bent along with the electronic device, the first thermal conduction portion moves in a first direction with respect to the first fixing mechanism; when the bent heat conducting part is unfolded with the electronic equipment, the first heat conducting part moves towards the opposite direction of the first direction relative to the first fixing mechanism.

In a sixth implementation form of the first aspect, according to the first aspect, the first heat-conducting portion and the bent heat-conducting portion are integrally formed or separately formed.

Based on the first aspect, in a seventh implementation manner of the first aspect, the heat dissipation device further includes: a second heat conducting portion extending from a second side of the bent heat conducting portion, the second side being opposite the first side; and a second fixing mechanism for movably fixing the second heat-conducting portion to the electronic device, and the second heat-conducting portion includes a second moving mechanism for cooperating with the second fixing mechanism to move the second heat-conducting portion relative to the second fixing mechanism. The second heat conducting part and the first heat conducting part are respectively arranged on two bent sides of the electronic equipment, so that temperature equalization of the two bent sides of the electronic equipment can be realized, and the first heat conducting part and the second heat conducting part which respectively move relative to the first fixing mechanism and the second fixing mechanism are arranged, so that the heat dissipation device can adapt to the change of the section lengths of different sections of the electronic equipment in the bending and unfolding processes.

In an eighth implementation form of the first aspect, the heat dissipation device is a vapor chamber, a heat pipe, or a heat dissipation plate.

In a second aspect, an embodiment of the present invention provides a heat dissipation apparatus for a bendable electronic device, where the electronic device includes a first support member, a second support member, and a bending member located between the two support members, the heat dissipation apparatus including: a first heat conducting portion at least partially covering the first support member; a second heat conducting portion at least partially covering the second support member; a bent heat-conductive portion extending between the first heat-conductive portion and the second heat-conductive portion and having a wrinkle portion that occurs as the bent member is bent or unfolded; and the first limiting structure is arranged on a first side of the bending heat-conducting part and used for limiting a first movement range of the folded part on the first side of the bending heat-conducting part when the folded part appears on the bending heat-conducting part. The heat of the first supporting member and the heat of the second supporting member can be transferred between the first heat conducting part and the second heat conducting part through the bent heat conducting part, and the bent heat conducting part can form a folded part along with the bending or unfolding of the bent members, so that the supporting members on two sides are uniform in temperature and the sectional lengths of different sections can be adapted to the length change of the sections during the bending and unfolding.

Based on the second aspect, in a first implementation manner of the second aspect, the heat dissipation device further includes: and the second limiting structure is arranged on a second side of the bending heat conduction part, the second side is opposite to the first side, and when the folded part appears on the bending heat conduction part, the second limiting structure is used for limiting a second movement range of the folded part on the second side of the bending heat conduction part. The folding part is limited in a certain movement range, so that the folding part can be ensured not to influence other components when being bent or unfolded, for example, the folding component is not clamped to influence the bending and/or unfolding of the folding component.

Based on the first implementation manner of the second aspect, in a second implementation manner of the second aspect, the first limiting structure and the second limiting structure form a limiting frame, and the bending heat conduction portion penetrates through the limiting frame to extend.

Based on the second aspect, in a third implementation manner of the second aspect, the first limiting structure includes a plurality of limiting blocks disposed at intervals on the first side of the bent heat conducting portion. The movement range of the fold part at different positions can be limited by arranging a plurality of limiting blocks at intervals, so that the fold part is ensured not to influence other components.

Based on the second aspect, in a fourth implementation manner of the second aspect, the first limiting structure includes a magnetic component, and the magnetic component generates a magnetic force on the bent heat conducting portion. The first limiting structure is used as a magnetic component, the moving range of the bent heat conducting part is limited through magnetic force, and the wrinkle part can be limited through a simpler structure.

In a fifth implementation manner of the second aspect, the first limiting structure includes a magnetic component, and the heat sink further includes: the structural part is arranged on a second side of the bent heat conducting part, the second side is opposite to the first side, and the magnetic part generates magnetic force on the structural part. The fold part of the heat conduction part is limited by the magnetic force between the structural part and the magnetic part, so that the fold part can be limited by a simple structure without using a metal or magnetic heat conduction part.

Based on the second aspect, in a sixth implementation manner of the second aspect, the first limiting structure comprises a first magnetic component, the second limiting structure comprises a second magnetic component, and the first magnetic component and the second magnetic component are arranged on the first side and the second side of the bending heat conduction part correspondingly to generate a magnetic force mutually.

In a third aspect, an embodiment of the present invention provides a bendable display device, including a display panel including a display area, the display area including a first display area, a second display area, and a bending area defined between the first display area and the second display area; a bendable device; and the heat dissipation device is positioned between the display panel and the bendable device, and the surface of the heat dissipation device is attached to the surface of the bendable device. The bendable apparatus includes a first support member for supporting a first area of the display panel corresponding to the first display area; a second support member for supporting a second region of the display panel corresponding to the second display region; and a bending member connected between the first and second support members to overlap the bending region, and guiding the display panel to bend or unfold the display panel with respect to the bending region. Wherein the heat dissipation device is the heat dissipation device in the first aspect and any implementation manner thereof. The heat of one supporting member in the bendable display device can be transferred to the supporting member on the other side by the heat dissipation device and the cross bending member, so that the heat dissipation area is enlarged, the temperature equalization of the supporting members on the two sides can be realized, and the heat dissipation capability of the whole terminal equipment is improved.

In a fourth aspect, an embodiment of the present invention provides a bendable display device, including a display panel including a display area, the display area including a first display area, a second display area, and a bending area defined between the first display area and the second display area; a bendable device; and the heat dissipation device is positioned between the display panel and the bendable device, and the surface of the heat dissipation device is attached to the surface of the bendable device. The bendable apparatus includes a first support member for supporting a first area of the display panel corresponding to the first display area; a second support member for supporting a second region of the display panel corresponding to the second display region; and a bending member connected between the first and second support members to overlap the bending region and guiding the display panel to start bending or spreading of the display panel with respect to the bending region. Wherein the heat dissipation device is the heat dissipation device in the second aspect and any implementation manner thereof. The heat of one supporting member in the bendable display device can be transferred to the supporting member on the other side by the heat dissipation device and the cross bending member, so that the heat dissipation area is enlarged, the temperature equalization of the supporting members on the two sides can be realized, and the heat dissipation capability of the whole terminal equipment is improved.

In a fifth aspect, the embodiment of the present invention provides a terminal device, which includes a foldable display device, where the foldable display device is the foldable display device described in the foregoing third aspect or the fourth aspect. The heat on one side of the supporting member can be transferred to the supporting member on the other side through the heat conducting material in the film-shaped heat dissipation member in a cross bending manner, so that the heat dissipation area is enlarged, the temperature equalization of the supporting members on two sides can be realized, and the whole heat dissipation capacity of the terminal equipment is improved. The heat of one supporting member in the bendable display device can be transferred to the supporting member on the other side by the heat dissipation device and the cross bending member, so that the heat dissipation area is enlarged, the temperature equalization of the supporting members on the two sides can be realized, and the heat dissipation capability of the whole terminal equipment is improved.

Drawings

In order to more clearly describe the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments will be briefly described below. It is obvious that these drawings are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

FIG. 1 is a schematic view of a foldable terminal in which the inner and outer layers are compressed or stretched;

FIG. 2 is a schematic view of a bendable electronic device;

FIG. 3 is a schematic cross-sectional view of a flexible vapor chamber and a membrane heat sink;

fig. 4 is a schematic view of a heat dissipation device according to an embodiment of the present invention;

fig. 5 is a schematic view of a heat dissipation device according to another embodiment of the present invention;

fig. 6 is a schematic view of a heat dissipation device according to another embodiment of the present invention;

FIG. 7 is a schematic plan view of a fastening mechanism provided in accordance with an embodiment of the present invention;

FIG. 8 is a schematic view of a securing mechanism provided in accordance with another embodiment of the present invention;

fig. 9 is a schematic cross-sectional view of a heat dissipation device according to another embodiment of the invention;

fig. 10 is a schematic cross-sectional view of a heat dissipation device according to another embodiment of the invention;

fig. 11 is a schematic view of a limiting structure according to an embodiment of the present invention;

fig. 12 is a schematic view of a limiting structure according to another embodiment of the present invention.

Detailed Description

First, a few concepts introduced in the present application will be described.

The heat conducting material is a metal or non-metal material with high heat conducting performance (the heat conductivity coefficient can be larger than 10W/(m.K), but the number is not limited by the value) and is used for realizing rapid heat conduction. In the present application, the heat conductive material may be graphite, aluminum foil, or copper foil.

The flexible material has strong flexibility, and can be deformed and folded. Flexible materials include, but are not limited to: foam, rubber, Polyimide (PI) or Polyamide (PA, alternatively referred to as nylon), or a composite material with other organic materials. It should be noted that a flexible material is understood to be a material that is flexible and can withstand appropriate deformation. Flexibility (or, in other words, flexibility), which is understood to be flexibility, as opposed to rigidity, is a physical property of a material. The flexible material deforms under force and the material itself does not return to its original shape after the force is lost, or it can return to its original shape as a resiliently flexible material. A flexible material is one that can be deformed (e.g., stretched, bent, twisted, squeezed, deformed, etc.) without substantially compromising performance, and thus, a flexible material can be said to be a material that has a high tensile strength and a high elongation. The deformed flexible material is not damaged in the deformed area, and the internal structure is not exposed. Flexible materials having smooth surfaces, after deformation, the deformed regions still present a smooth, seamless surface. In addition, the flexible material can be restored to the original shape through the action of external force after being bent for a plurality of times, and the service life is prolonged to a certain extent.

The glue layer is a material layer for adhesion, can also have certain elasticity, can be compressed or stretched, and can be one layer or multiple layers.

Referring to fig. 2 and fig. 2 are schematic views of a bendable electronic device 100, the bendable electronic device 100 may include a display panel 1, a bendable apparatus 2, and a heat dissipation apparatus 3. The display panel 1 may include a display region including a first display region 101, a second display region 102, and a bending region 103 defined between the first display region 101 and the second display region 102. The heat sink 3 is located inside or outside the foldable device 2, i.e. the heat sink 3 can be located on the side of the foldable device 2 close to the display panel 1 or on the side of the foldable device 2 away from the display panel 1.

As shown in FIG. 2, the bendable apparatus 2 includes two support members 201, 202 and a bending member 203. The supporting member 201 supports a first region of the display panel 1 corresponding to the first display region 101; the support member 202 supports a second region of the display panel corresponding to the second display region 102; the bending member 203 is connected between the two support members 201, 202 to at least partially overlap the bending region 103, and guides the display panel 1 so that the display panel 1 is folded or unfolded with respect to the bending region 103, for example, folded in the direction a as shown in the figure. In other embodiments of the present invention, the folding can also be performed in the opposite direction of the direction a.

The heat dissipation device 3 in fig. 2 includes but is not limited to: flexible heat pipe, flexible temperature-uniforming plate or film-shaped heat-radiating plate. In table 1 below, various forms of the heat sink 3 are partially enumerated:

table 1

The examples of the heat sink 3 in table 1 all have good thermal conductivity and at the same time reliable bending properties, with a small loss of thermal conductivity after bending over ten thousand times.

The flexible portions of the flexible heat pipe and the flexible vapor chamber may include a flexible material, such as a flexible polymer material like PI or rubber, or a metal cover plate with a bending degree of freedom and a small stress at the bending position, such as a metal cover plate with dense mesh openings. The flexible heat pipe and the flexible temperature-equalizing plate can be integrally made of flexible materials to complete integral bending, or partially made of flexible materials to overlap the non-bending area to complete partial bending.

The heat pipe is a component for transferring a heat source to a far end, and is typically composed of a pipe shell, a liquid absorbing core and an end cover, wherein the pipe is pumped into a certain negative pressure and then filled with a proper amount of working substance (working medium), so that capillary pores of the liquid absorbing core tightly attached to the inner wall of the pipe are filled with liquid and then sealed. When one end of the heat pipe is heated, the working medium in the capillary core is evaporated and vaporized, the steam flows to the other end under a small pressure difference and is condensed into liquid after releasing heat, and the liquid flows back to the evaporation end along the porous material by virtue of capillary force and gravity, so that the heat is transferred circularly and continuously.

The uniform temperature plate can also be called a uniform heating plate, or a super heat conducting plate, a heat conducting plate and the like. The vapor chamber is mainly composed of a housing, a capillary structure, a working liquid, a supporting structure and the like, and a vacuum cavity is formed on the inner wall, as shown in fig. 3 a.

The film-shaped heat dissipation plate may include flexible and bending-resistant heat conduction materials such as graphite, and may also include other heat dissipation plates made of a combination of metal or nonmetal heat conduction materials and flexible materials, as shown in fig. 3a and 3 b.

Fig. 3a is a schematic cross-sectional view of a flexible vapor chamber 200.

As shown in fig. 3a, the flexible temperature equalization plate 200 comprises a first heat conduction portion 210, a second heat conduction portion 220, and a flexible heat conduction portion 230 therebetween. As shown in the figure, the first and second

heat conducting parts

210 and 220 are communicated with the cavities on the two sides through a capillary structure e to realize the integral heat equalization of the flexible temperature equalization plate 200; the flexible heat conducting portion 230 is comprised of a flexible material to meet the bending requirements. The first and second

heat conduction parts

210 and 220 include a condensation side housing a, an evaporation side housing b, and a side wall c, the condensation side housing a is connected with the evaporation side housing b through the side wall c and sealed, so as to define an internal cavity d of the temperature equalization plate 200, a capillary structure e is disposed in the internal cavity d, the internal cavity d is vacuumized and filled with a certain amount of working liquid, and the working liquid can be absorbed in the capillary structure e. In addition, since the internal cavity d is vacuumized, in order to prevent the outer shell of the vapor chamber 200 from being squashed by external air pressure, a support structure f may be further disposed in the internal cavity d, and both ends of the support structure f are respectively connected to the condensation-side outer shell a and the capillary structure e.

When heat is conducted from the heat source g to the evaporation-side housing b, the working liquid inside the capillary structure e absorbs the heat, and evaporation boiling phase transition starts to occur in an environment of low vacuum degree, and a liquid phase changes into a gas phase (arrows in the capillary structure e in fig. 3a indicate a possible flow direction of the working liquid in the liquid phase, and arrows outside the capillary structure e indicate a possible flow direction of the working liquid in the gas phase). The gaseous phase working fluid can fill the whole internal cavity d quickly, the phenomenon of condensation can be generated when the gaseous phase working fluid contacts a relatively cold area, so that the heat accumulated in evaporation is released, the condensed liquid phase working fluid returns to the evaporation heat source again due to the capillary adsorption effect of the capillary structure e, the process is repeated in the cavity, and the heat generated by the heat source g can be brought to the area of the temperature equalizing plate 200 far away from the heat source g by the circulation, so that the external environment is brought out.

Fig. 3b and 3c are schematic cross-sectional views of film-shaped

heat dissipation plates

300b and 300 c.

As shown in fig. 3b, the heat dissipation plate 300b is formed by stacking a layer of heat conductive material 301 and upper and lower layers of flexible material 302 along a horizontal direction shown in the figure, the heat conductive material and the flexible material may be adhered by an adhesive layer 303, and the adhesive layer 303 may be an adhesive such as a double-sided adhesive. Also schematically shown in fig. 3b are

support members

305, 306 of the bendable device 304 and a bending member 307 located therebetween, one surface of the heat spreader 300b being directly attached to the surface of the bendable device 304 or indirectly attached via another layer of flexible material or glue, in particular, the heat spreader 300b spans the two

support members

305, 306 to cover the bending member 307, thereby transferring heat between the two

support members

305, 306 across the bending member 307.

The heat sink plate may also be formed by stacking multiple layers of flexible heat conducting material, such as the heat sink plate 300c shown in fig. 3c with two layers of flexible heat conducting material stacked. The heat dissipation plate 300c includes two layers of flexible heat

conductive materials

311 and 312, each of which has a structure in which at least one heat conductive layer and at least one flexible layer are combined. Among them, one flexible layer 314 of the flexible heat conducting material 312 is close to or in contact with the heat generating component 320 near the left side of the heat dissipating plate 300b, absorbs heat released from the heat generating component 320, and then conducts to the heat conducting layer, and conducts from the heat conducting layer to an area far away from the heat generating component 320, such as the right side of the heat dissipating plate 300c, across the bending area (at the rotation axis).

It is understood that fig. 3b and 3c show schematic cross-sectional views of the

heat dissipation plates

300b and 300c, and the actual heat dissipation plates have a two-dimensional film shape with a thickness of the order of micrometers.

The application provides a heat dissipation device which can be applied to bendable terminal equipment and provides a heat dissipation solution for the bendable terminal equipment, and the bendable terminal equipment can be electronic equipment with flexibility or bendable shapes such as a mobile phone, a tablet computer, a notebook computer and multimedia playing equipment. The heat dissipation device provided by the present application can adapt to the length change on the section when the terminal is folded or unfolded, and advantageously, the heat dissipation device of the present application can be applied to heat dissipation members including, but not limited to, the above-mentioned flexible heat pipe, flexible temperature equalization plate or film-shaped heat dissipation plate.

Example one

Fig. 4 is a schematic diagram of a heat dissipation apparatus 400 according to an embodiment of the invention. Fig. 4a shows a schematic plan view of the heat dissipation device 400 in an unfolded state, fig. 4b shows a schematic perspective view of the heat dissipation device 400 in a folded state, and fig. 4c shows a schematic plan view of the first heat conduction portion 401 when the heat dissipation device 400 is in the folded state. In the example of fig. 4, the heat sink 400 is rectangular, but the heat sink 400 is not limited to being rectangular in the embodiment of the present application, and the heat sink 400 may have other irregular shapes. The heat sink 400 may be used in a bendable electronic device, such as the electronic device 100 shown in fig. 2, i.e. the heat sink 400 is one of the embodiments of the heat sink 3.

As shown in fig. 4a, the heat sink 400 includes a first heat conducting portion 401, a second heat conducting portion 402, and a bent heat conducting portion 403. The first heat-conducting portion 401 and the second heat-conducting portion 402 serve to absorb heat generated by heat-generating components on the electronic device 100 and to diffuse/release the heat to the surrounding environment. The bent heat-conductive portion 403 extends between the first heat-conductive portion 401 and the second heat-conductive portion 402, and serves to transfer heat between the heat-

conductive portions

401 and 402 so that both spread or release heat relatively evenly, thereby achieving heat equalization on both sides of the electronic apparatus 100. The bending heat conduction portion 403 is also folded along with the folding and unfolding of the electronic device 100, and therefore, the bending heat conduction portion 403 is placed opposite to the bending member 203 as shown in fig. 2, specifically, the bending heat conduction portion 403 is at least partially overlapped with the bending member 203, for example, the bending portion 203 of the heat dissipation device 400 is partially overlapped and disposed outside the bending member 203, such as the inner side of the bending, the outer side of the bending, or the bending portion 203 may be disposed inside the bending member 203.

In one embodiment of the present application, the first heat conducting portion 401, the second heat conducting portion 402, and the bent heat conducting portion 403 may be integrally formed (for example, integrally formed material having flexibility), such as the flexible heat dissipation plate shown in table 1, which is made of metal or non-metal material, or composite material thereof. In another embodiment of the present application, the first heat conducting portion 401, the second heat conducting portion 402, and the bent heat conducting portion 403 may be formed separately, in sections, or in layers (e.g., two sides are non-flexible heat conducting materials, and the bent portion is flexible heat conducting material), and are fixed by splicing, adhering, including but not limited to, fixing by gluing or embedding, wherein each of the portions may be formed by combining one or more layers of materials. The separately formed heat sink 400 may be a metal or non-metal material, or a composite material, or a two-phase member, such as a vapor chamber, a heat pipe, etc., as shown in table 1. For example, the first heat conducting portion 401 and the second heat conducting portion 402 may be made of a high heat conducting material, and the bent heat conducting portion 403 may be made of a flexible heat conducting material having flexibility and heat conductivity, and the joint surfaces of the two may be bonded together by an adhesive, so that when a main heat generating component is close to the first heat conducting portion 401, heat absorbed by the first heat conducting portion 401 from the heat generating component may be transferred to the second heat conducting portion 402 by the bent heat conducting portion 403, thereby achieving heat soaking extending in regions on two sides of the bend in the bendable electronic device 100.

In a particular embodiment, the heat sink 400 is located between the display panel 1 and the bendable device 2 shown in FIG. 2. Wherein the first heat conducting portion 401 is located between the supporting member 201 and the first region of the display panel 1 corresponding to the first display region 101, the second heat conducting portion 402 is located between the supporting member 202 and the second region of the display panel 1 corresponding to the second display region 102, and the bending heat conducting portion 403 is located between the bending member 203 and the bending region 103 of the display panel 1, the heat dissipation device 400 can be folded or unfolded with the bendable device 2, for example, folded in a direction a as shown in fig. 2 or folded in a direction opposite to the direction a.

Referring again to fig. 4a-4c, the heat sink 400 further includes a plurality of fixing

mechanisms

420, 421, 422, 423 for fixing the heat sink 400 to other components or structures in the electronic apparatus 100, for example, to the middle frame or some hardware components between the display panel 1 and the foldable device 2 shown in fig. 2, so that the heat sink 400 can be folded and unfolded with the foldable device 2. The fixing

mechanisms

420, 421, 422, 423 movably fix the heat sink 400 through corresponding through

holes

410, 411, 412, 413 of the heat sink 400, respectively, wherein after the corresponding fixing mechanism is installed on each through hole, the through holes further have a reserved gap (

gaps

40, 41, 42, 43 as shown in the figure) so that at least a portion of the heat sink 400 can move or slide relative to one or more of the fixing mechanisms. As shown in fig. 4a, the heat sink 400 is substantially planar in the unfolded state, the first heat conducting portion 401 is provided with fixing means 420, 421 abutting or being close to the left side edges of the through

holes

410, 411, respectively, and the second heat conducting portion 402 is provided with fixing means 422, 423 abutting or being close to the right side edges of the through

holes

412, 413, respectively.

As shown in fig. 4b, during the process of unfolding to folding the heat sink 400, the first heat conducting portion 401 slides relative to the

fixing mechanism

420, 421 within the range allowed by the reserved gap of the through

holes

410, 411, for example, slides in the opposite direction of X, and/or the second heat conducting portion 402 slides relative to the

fixing mechanism

422, 423 within the range allowed by the reserved gap of the through

holes

412, 413, for example, slides in the direction of X. That is, the first heat conduction portion 401 and/or the second heat conduction portion 402 slide in a direction away from the bent heat conduction portion 403. It should be understood that the maximum sliding travel of the heat-conducting portion is related to the clearance reserved in the through hole, for example, when a fixing mechanism provided on the first heat-conducting portion 401 abuts against the other side of the corresponding through hole, the first heat-conducting portion 401 no longer slides. In another embodiment of the present application, the first heat conducting portion 401 and/or the second heat conducting portion 402 may also slide in a direction approaching the bent heat conducting portion 403, as shown in fig. 5 b. This embodiment will be described in detail later with reference to fig. 5.

In the present specification, for convenience of description, the X direction may be regarded as a direction that is always attached to the surface of the heat dissipation device 400, the X direction is defined as a direction from the first heat conduction portion 401 toward the second heat conduction portion 402, and may be a bending direction along with the folding and unfolding of the heat dissipation device 400, as shown in fig. 4b, the X direction is a direction in which the second heat conduction portion 402 is away from the bent heat conduction portion 403, and the opposite direction of the X may be a direction in which the first heat conduction portion 401 is away from the bent heat conduction portion 403. In addition, the Y direction can be considered to be in the surface of the heat sink 400 and perpendicular to the X direction, while the Z direction is perpendicular to the X, Y direction, or the Z direction is perpendicular to the surface of the heat sink 400. It should be understood from the drawings that, when the X direction is regarded as a bending direction during the folding and unfolding of the heat sink 400, the Y direction is still in the surface of the heat sink 400 and is perpendicular to the X direction, so the Y direction is still a straight line direction, and the Z direction perpendicular to the X and Y is changed along with the bending of the X direction, or the Z direction is perpendicular to the surface of the heat sink 400 at any point on the surface of the heat sink 400.

Referring again to FIG. 4a, the maximum inner diameter of the through hole 410 in the X direction is LX0_INThe maximum outer diameter of the fixing mechanism 420 in the X direction is LX0_OUTWherein, LX0_IN＞LX0_OUTWhen the fixing mechanism 420 is disposed or mounted in the through-hole 410, the through-hole 410 has a gap 40, and the sum of the lengths of the gap 40 in the X direction should be LX0_GAP＝LX0_IN-LX0_OUTTherefore, the maximum stroke of the heat sink 400 sliding in the X direction relative to the fixing mechanism 420, i.e. the maximum moving stroke, should be substantially equal to the total length LX0 of the gap 40 in the X direction_GAP。

Similarly, the maximum stroke of the through

holes

411, 412, 413 for allowing the fixing

mechanisms

421, 422, 423, respectively, to slide in the X direction is the total length LX1 of the

gaps

41, 42, 43, respectively, in the X direction_GAP、LX2_GAP、LX3_GAP. It should be understood that LX0_GAP、LX1_GAP、LX2_GAP、LX3_GAPMay be provided in the same or different lengths. Preferably, the reserved gaps of the through holes provided on the first heat conducting portion 401 have the same first length SX1 in the X direction, wherein SX1 is LX0_GAP＝LX1_GAPThe reserved gap of the through hole arranged on the second heat conducting part 402 has the same second length SX2 in the X direction, wherein SX2 is LX2_GAP＝LX3_GAP. At this time, when the heat sink 400 is folded and unfolded following the foldable device 2, the first heat conduction portion 401 has a maximum sliding stroke SX1, and the second heat conduction portion 402 has a maximum sliding stroke SX 2.

Advantageously, the embodiment of the present application may movably mount the heat sink 400 in the electronic device 100 by the fixing mechanism cooperating with the through hole, and when the electronic device 100 is folded or unfolded, the heat sink may slide relative to the fixing mechanism through the reserved gap of the through hole, so as to adapt to the change of the section on which the heat sink is located during the folding or unfolding process. The heat dissipation device 400 provided by the present application does not need to have a telescopic performance, and when the heat dissipation device slides relative to the fixing mechanism, the thickness of the heat dissipation device in the direction perpendicular to the tangent plane does not change, and no interference is caused to other components in the electronic device 100. Therefore, the heat dissipation device 400 provided by the present application can better realize the heat transfer of the bendable electronic device in the folding state, the unfolding state, or the folding and unfolding processes, thereby satisfying the requirement of temperature equalization on two sides of the electronic device.

In one embodiment of the present application, the reserved gap of the through hole may also provide a moving space in the Y direction. For example, the maximum inner diameter of the through-hole 410 in the Y direction is LY0_INThe maximum outer diameter of the fixing mechanism 420 in the Y direction is LY0_OUTWherein, LY0_IN≥LY0_OUTWhen the fixing mechanism 420 is disposed or installed in the through-hole 410, the sum of the lengths of the gaps 40 in the Y direction should be LY0_GAP＝LY0_IN-LY0_OUTTherefore, the heat sink 400 can move or slide in the Y direction relative to the fixing mechanism 420, and the maximum moving stroke thereof should be substantially equal to the total length LY0 of the gap 40 in the Y direction_GAP。

Similarly, the maximum stroke of the through

holes

411, 412, 413 that can also allow the fixing

mechanisms

421, 422, 423, respectively, to slide in the Y direction is the total length LY1 of the

gaps

41, 42, 43, respectively, in the Y direction_GAP、LY2_GAP、LY3_GAP. It should be understood that LY0_GAP、LY1_GAP、LY2_GAP、LY3_GAPMay be provided with the same or different lengths and preferably with the same third length SY, i.e. LY0_GAP＝LY1_GAP＝LY2_GAP＝LY3_GAPSY, the maximum stroke of the heat sink 400 sliding in the Y direction with respect to the fixing mechanism is the third length SY. In a preferred embodiment, SY < SX1, and SY < SX 2. It should be understood that,the heat dissipation device 400 provided in the present application may also be fixed relative to the fixing mechanism in the Y direction, and whether it is movable and slidable in the Y direction is not a limitation to the present application.

Fig. 4c shows that in the bent state, the first heat conduction portion 401 of the heat sink 400 abuts against the right edge of the through hole 40 after moving or sliding in the opposite direction of X, and the maximum movement stroke of the first heat conduction portion 401 is the first length SX1 from fig. 4a to fig. 4 c. Preferably, the bendable electronic device is fully folded when the first heat conductive portion 401 of the heat dissipation apparatus 400 is moved in the X-direction by the first length SX1 as shown in fig. 4c, and fully unfolded when the first heat conductive portion 401 of the heat dissipation apparatus 400 is moved in the X-direction by the first length SX1 as shown in fig. 4 a. However, this is not intended to be limiting, and in other embodiments, when the foldable electronic device is fully folded, the displacement of the first heat conducting portion 401 of the heat dissipation device 400 in the direction opposite to the direction X is smaller than the first length SX, i.e. the through hole of the first heat conducting portion 401 has a clearance larger than the actual moving stroke. Similarly, the gap reserved by the through hole on the second heat conduction part 401 can be equal to or larger than the actual movement stroke.

Referring to fig. 4b again, as shown in the figure, the fixing

mechanisms

420, 421, 422, 423 of the heat dissipation device 400 are fixed on the first member 45 of the bendable electronic apparatus, and the heat dissipation device 400 is located inside the bend of the first member 45, so that when the bendable electronic apparatus is folded, the first heat conduction portion 401 and the second heat conduction portion 402 of the heat dissipation device 400 are stretched in the opposite direction of the X direction and the X direction with respect to the fixing mechanism and the first member 45, respectively; when the bendable electronic device is unfolded, the process is reversed. Thus, the heat dissipation device 400 can adapt to the length change of the section of the bendable electronic device along with the unfolding and folding of the bendable electronic device.

It should be understood that, in order to prevent the heat sink 400 from being detached from the first member 45, in an embodiment of the present application, a third member is further disposed inside the bent portion of the heat sink 400 to be attached to the heat sink 400, so that the heat sink 400 is not detached from the first member 45 due to the through

holes

410, 411, 412, 413. In another embodiment of the present application, the

fixing mechanism

420, 421, 422, 423 may further include a portion extending in the X direction, such as an umbrella portion, which spans the through-

holes

410, 411, 412, 413, thereby preventing the heat sink 400 from being detached from the first member 45.

In one embodiment of the present application, the first component 45 may be, for example, a middle frame, a bending mechanism, or the like of the bendable electronic device, for example, the heat dissipation device 400 may be fixed to the middle frame by the fixing

mechanisms

420, 421, 422, 423, so that the heat dissipation device 400 is attached to a display screen, a power supply, or other electronic components for heat dissipation. In an embodiment of the present application, the first component 45 may be a combination of multiple components, for example, the heat sink 400 may be fixed to the middle frame by fixing

mechanisms

420 and 422, and fixed to the bending mechanism by fixing

mechanisms

421 and 423, so that the heat sink 400 is attached to the display screen, the power supply, or other electronic components for heat dissipation.

Specifically, from the expanded state shown in fig. 4a to the bent state shown in fig. 4b, the section of the heat sink 400 located inside the bend with respect to the first member is compressed with respect to the first member, and therefore, the slidable portion of the heat sink 400 is extended in the direction of the section thereof, which is the opposite direction to the direction in which the section is compressed. Specifically, the heat sink 400 slides relative to the

fixing mechanism

420, 421, 422, 423, wherein the first heat conducting portion 401 slides in the direction of X for a first stroke (the first stroke may be at most SX1) as shown in fig. 4b, and/or the second heat conducting portion 402 slides in the direction of X for a second stroke (the second stroke may be at most SX2) as shown in fig. 4 b. When the heat sink 400 returns from the folded state shown in fig. 4b to the unfolded state shown in fig. 4a, the first heat conduction portion 401 and/or the second heat conduction portion 402 slide in the opposite directions.

Fig. 5 is a schematic view of a heat dissipation device 500 according to another embodiment of the invention. In the embodiment shown in fig. 5, the fixing

mechanisms

520, 521, 522, 523 of the heat sink 500 are fixed to the second member 55 of the bendable electronic device, and the heat sink 500 is located outside the bend of the second member 55. The heat sink 500 contracts in its longitudinal direction relative to the securing mechanism and the second member 55 during bending of the bendable electronic device, as opposed to the bendable electronic device during unfolding. Thus, the heat dissipation device 500 can adapt to the length of the section of the bendable electronic device as the device is unfolded and bent. Although the heat dissipation device 500 has a structure that is substantially the same as or similar to the heat dissipation device 400 in a different position (outside the bend or inside the bend) relative to the first component 45 and the second component 55, the same or similar structure is denoted by the same or similar reference numerals in fig. 5, and the description thereof is omitted.

In one embodiment of the present application, the second component 55 may be, for example, a middle frame, a bending mechanism, etc. of the bendable electronic device, for example, the heat dissipation device 500 is fixed to the middle frame by the fixing

mechanisms

520, 521, 522, 523, so that the heat dissipation device 500 can be attached to a display, a power supply, or other electronic components for heat dissipation. In an embodiment of the present application, the second component 55 may be a combination of multiple components, for example, the heat sink 500 may be fixed to the middle frame by fixing

mechanisms

520 and 522, and fixed to the bending mechanism by fixing

mechanisms

521 and 523, so that the heat sink 500 is attached to the display screen, the power supply, or other electronic components for heat dissipation.

Specifically, from the unfolded state shown in fig. 5a to the folded state shown in fig. 5b, the section of the heat sink 500 located outside the fold with respect to the second member is stretched with respect to the second member, and therefore, the slidable portion of the heat sink 500 is retracted in the direction of the section thereof, which is the opposite direction to the direction in which the section is stretched. Specifically, the heat sink 500 slides relative to the fixing

mechanisms

520, 521, 522, 523, wherein the first heat conducting portion 501 slides in the X direction for a first stroke as shown in fig. 5b, and/or the second heat conducting portion 502 slides in the X direction for a second stroke as shown in fig. 5 b. When the heat sink 500 returns from the folded state shown in fig. 5b to the unfolded state shown in fig. 5a, the first heat conduction portion 501 and/or the second heat conduction portion 502 slide in the opposite directions.

Fig. 6 is a schematic diagram of a heat dissipation apparatus 600 according to another embodiment of the invention. The heat sink 600 is similar in construction to the heat sinks 400, 500 and therefore like reference numerals have been used. The first heat conducting portion 601 of the heat dissipating device 600 can move or slide, which is the same as or similar to the previous embodiment, and is not described herein. The second heat conducting portion 602 of the heat dissipating device 600 is bonded to the heat source or the structural member of the bendable electronic apparatus by a glue layer for fixing, for example, by a back glue, a glue and a heat generating component 630. Advantageously, the second heat conducting portion 602 is fixed to the heat generating component 630 to better absorb heat from the heat generating component 630 for fast heat dissipation, when the foldable electronic device is in a folded state, or in an unfolded state, or in a folded or unfolded process, the heat dissipation apparatus 600 is stretched at the outer side of the bend relative to the first or second component, or compressed at the inner side of the bend relative to the first or second component, and the first heat conducting portion 601 slides in the X direction or the X direction relative to the fixing

mechanisms

620 and 621. Therefore, the heat dissipation device 600 provided by the application does not need to have stretchable performance, can adapt to section change when the whole machine is bent or unfolded no matter at the inner side of bending or at the outer side of bending, and can realize heat transfer crossing the bending area, so that the two sides of the whole machine are uniformly heated.

In another embodiment of the present application, the second heat conducting portion 602 can also be moved or slid by fixing the first heat conducting portion 601 and the heat source or the structural member together by an adhesive or glue. When the bendable electronic device is bent or unfolded, the second heat conducting portion 602 slides telescopically relative to the fixing mechanism, thereby adapting to the change of the section in which the bendable electronic device is located when the bendable electronic device is compressed or stretched.

In the embodiments of fig. 4 to 6 of the present application, bending thermal conductive portion 403/503/603 may be configured to be fixed with respect to bending member 203, for example, by being adhered to bending member 203 by adhesive, or configured to move or slide with respect to bending member 203, for example, configured to float or attach to bending member 203 or attach to another component, so that during bending or unfolding of electronic device 100, bending thermal conductive portion moves or slides with respect to bending member 203. It should be understood that the direction and the maximum stroke of the sliding movement of the bent heat-conducting portion 403 are determined by the allowance of the through holes provided in the first heat-conducting portion 401 and the second heat-conducting portion 402, i.e., by the above-mentioned maximum movement strokes SX1, SX 2. The provision of the bent heat-conducting portion 403 as being fixed or movable is not intended to limit the present application, and therefore, the manner of fixing thereof is not limited in any way herein.

Fig. 7 is a schematic plan view of a securing mechanism 70-73 provided in accordance with an embodiment of the present invention. Securing

mechanisms

70, 71, 72, 73 include

structural members

702, 712, 722, 732, respectively. The structural members are generally rectangular, square, circular, etc., and the corners of the structural members may be radiused to avoid stress concentrations. It should be understood that the structural members on the heat sink may also have other shapes than those illustrated in fig. 7. The

structural members

702, 712, 722, 732 may be protruding members on other structures of the foldable electronic device, or may be separate components from the other structures, and may be attached by screws or by adhesive bonding. For example, the

structural members

702, 712 may also include screw holes 703, 713, respectively, to mate with screws (not shown) to secure the heat sink to other structures of the bendable electronic device, such as a center frame. In another embodiment of the present application, the structural member may include a plurality of screw holes.

Also shown in fig. 7 are through

holes

701, 711, 721, 731 on the heat sink. The via profile is generally rectangular, square, circular, oval, etc., and the corners of the via may be radiused to avoid stress concentrations. It should be understood that the through holes in the heat sink may also have other shapes than the shape illustrated in fig. 7. The fixing means 70, 71, 72, 73 shown in fig. 7 are respectively provided in the through

holes

701, 711, 721, 731, and since these through holes have the reserved

gaps

700, 710, 720, 730, respectively, the fixing means can be provided at the middle of the corresponding through holes, or near the left and right edges, or near the upper and lower edges. Preferably, when the foldable electronic device is in the unfolded state or the folded state, the fixing mechanism is disposed to abut against the edge of the through hole in the X direction, so as to provide a maximum movement stroke for the heat dissipation device during the folding process or the unfolding process, so as to cope with the compression or stretching of the section of the heat dissipation device.

The fixing mechanism may also be provided to abut against an edge of the through-hole in the Y direction, or provided at the middle of the through-hole in the Y direction, and the heat sink may move or slide in the Y direction relative to the fixing mechanism. The movement of the heat sink in the Y direction is not limited in any way herein.

Although fig. 7 shows various forms of through holes and fixing mechanisms, it should be understood that in another embodiment of the present application, the through holes and the fixing mechanisms provided on the heat dissipation device may have different forms, wherein, as long as there are two structures with gaps left on the heat dissipation device, the two structures can move relatively by being matched in the reserved gaps to meet the movement stroke required by the heat dissipation device to be compressed or stretched during the bending or flattening process, which is one of the implementations of the heat dissipation device provided by the present application.

Fig. 8 shows a schematic diagram of

heat dissipation devices

800 and 810 according to another embodiment of the invention. Unlike the aforementioned heat dissipation devices 400, 500, and 600, the first heat conduction portion of the

heat dissipation device

800, 810, and/or the first heat conduction portion is not provided with a through hole, but is provided with a protrusion on the surface thereof. The first heat conducting portion 801 and the second heat conducting portion 802 of the heat dissipation device 800 are respectively provided with

protrusions

804, 805, 806, 807, and the second heat conducting portion 812 of the heat dissipation device 800 is provided with protrusions 814, 815. Each protrusion is matched with a sliding groove, a sliding rail or a sliding rail arranged on the bendable electronic equipment to move or slide. When the

heat dissipation devices

800 and 810 are bent or unfolded along with the bendable electronic device, the protrusions move along the sliding grooves, the sliding ways, or the sliding rails, that is, the first heat conduction portions 801 and the first

heat conduction portions

802 and 812 move relative to the sliding grooves, the sliding ways, or the sliding rails, so that the

heat dissipation devices

800 and 810 can adapt to length changes of different sections when the bendable electronic device is bent or unfolded.

In the embodiment shown in fig. 8, the protrusion may be disposed on one side of the bending direction (e.g., the heat dissipation device 810) or the other side of the bending direction (e.g., the heat dissipation device 800), and it should be understood that the position of the protrusion and the shape of the protrusion are not limited to the present application, and in other embodiments of the present application, the protrusion may have a shape different from that shown in fig. 8 and be disposed on the first heat conduction portion and/or the second heat conduction portion in a region different from that shown in fig. 8.

In another embodiment of the present application, a protrusion may be disposed on the bendable electronic device, and the

heat dissipation device

800, 810 has a sliding groove, a sliding rail, or a sliding rail that matches the protrusion, so that the

heat dissipation device

800, 810 can move relative to the protrusion.

Since the

heat dissipation devices

800 and 810 only move or slide in a different manner from the previous embodiments, other aspects are the same as or similar to the previous embodiments, and thus are not described herein again. Furthermore, it should be understood that the heat dissipating devices in the above embodiments may be combined with each other, for example, the heat dissipating devices may be provided with protrusions and through holes at the same time, so as to satisfy the requirement of moving or sliding in different areas respectively in cooperation with the sliding grooves or the fixing mechanisms.

In the heat dissipation device in the above embodiment of the present application, the fixing mechanism is matched with the reserved gap, or the sliding groove is matched with the protrusion, so that at least one part of the heat dissipation device slides in the bending or unfolding process. The above embodiments show the through holes/protrusions disposed at different positions on the first heat conducting portion and/or the second heat conducting portion, it should be understood that only one through hole/protrusion may be disposed on the first heat conducting portion to match with the fixing mechanism/sliding slot on the electronic device, or only one through hole/protrusion may be disposed on the second heat conducting portion to match with the fixing mechanism/sliding slot on the electronic device, in such embodiments, the first heat conducting portion and/or the second heat conducting portion may also move relative to the fixing mechanism/sliding slot to adapt the heat dissipating device to the change of the section length during the expansion or bending process of the electronic device, so the technical solution provided by the present application can be applied to the heat dissipating device of various bendable or foldable electronic devices, which ensures reliability, meanwhile, the heat dissipation effect is better.

Example two

Fig. 9 is a schematic cross-sectional view of a heat sink 900 according to another embodiment of the invention. The heat dissipation device 900 includes a first thermal conductive portion 901, a second thermal conductive portion 902, and a bending thermal conductive portion 903, wherein the first thermal conductive portion 901 is fixed to a first support structure 921 of the bendable electronic device, the second thermal conductive portion 902 is fixed to a second support structure 922 of the electronic device, and the bending thermal conductive portion 903 is disposed above a bendable mechanism 923, such as a hinge mechanism, between the first support structure 921 and the second support structure 922. The two ends of the bent thermal conduction portion 903 may be embedded or bonded on the corresponding two ends of the first thermal conduction portion 901 and the second thermal conduction portion 902 as described above with reference to fig. 4, or may be fixed on the first support structure 921, the second support structure 922, or the bending mechanism 923 by other fixing mechanisms.

In the embodiment shown in fig. 9, the heat dissipation device 900 further includes a first fixing structure 911 and a second fixing structure 912 for fixing two sides of the bent thermal conductive portion 903, respectively, and specifically, the fixing

structures

911 and 912 fix two sides of the bent thermal conductive portion 903 on the first supporting structure 921 and the second supporting structure 922, respectively, or fix two ends of the hinge structure 923, respectively. Between the fixed

structures

911 and 912, the bending heat conducting portion 903 is suspended above the bending mechanism 923, or the bending heat conducting portion 903 is not attached to other structures or mechanisms.

Fig. 9 shows that the heat sink 900 is disposed inside the bends of the first support structure 921, the second support structure 922, and the hinge structure 923. The heat sink 900 has a substantially planar bent heat conducting portion 903 in an unfolded state as shown in fig. 9a, and a bent heat conducting portion 903 extruded with a redundant portion in a folded state as shown in fig. 9 b. The bending heat-conducting portion 903 is a heat-conducting material that can be bent, and the bent heat-conducting material does not need to have elasticity. During the unfolding and folding processes, the bent heat conducting part 903 can meet the length change of the section where the bent heat conducting part is located through the reserved redundant part, namely the redundant part generates folds when compressed, and the folds of the redundant part are reduced when the folded heat conducting part is stretched, and even the folds are flattened.

Fig. 10 is a schematic cross-sectional view of a heat dissipation device 1000 according to another embodiment of the invention. The heat sink 1000 of fig. 10 is similar to the heat sink 900 of fig. 9, and the same or similar reference numerals are used to identify the same or similar structures therein. The heat dissipation device 1000 includes a first thermal conductive portion 1001, a second thermal conductive portion 1002, and a bending thermal conductive portion 1003, wherein the first thermal conductive portion 1001 is fixed to a first support structure 1021 of the bendable electronic device, the second thermal conductive portion 1002 is fixed to a second support structure 1022 of the electronic device, and the bending thermal conductive portion 1003 is disposed above a bendable mechanism 1023, such as a hinge mechanism, between the first support structure 1021 and the second support structure 1022. The two ends of the bent heat-conducting portion 1003 may be embedded or bonded on the corresponding two ends of the first heat-conducting portion 1001 and the second heat-conducting portion 1002 as described above with reference to fig. 4, or may be fixed to the first support structure 1021, the second support structure 1022, or the bending mechanism 1023 by other fixing mechanisms.

In the embodiment shown in fig. 10, the heat dissipation device 1000 further includes a first fixing structure 1011 and a second fixing structure 1012 for fixing two sides of the bent thermal conductive portion 1003, respectively, and specifically, the fixing

structures

1011 and 1012 fix two sides of the bent thermal conductive portion 1003 to the first support structure 1021 and the second support structure 1022, respectively, or to two ends of the hinge structure 1023, respectively. Between the fixed

structures

1011 and 1012, the bending heat-conducting portion 1003 is suspended above the bending mechanism 1023, or the bending heat-conducting portion 1003 is not attached to other structures or mechanisms.

Fig. 10 shows heat dissipation device 1000 disposed at the bent outer sides of first support structure 1021, second support structure 1022, and hinge structure 1023. The heat sink 1000 has a bent heat-conducting portion 1003 extruded with a redundant portion in an unfolded state as shown in fig. 10a, and has a bent heat-conducting portion 1003 having a substantially planar surface in a folded state as shown in fig. 10 b.

In the embodiment shown in fig. 9 and 10, the bending heat-conducting portion may be further disposed inside the

hinge mechanisms

923, 1023 and fixed to the third component inside the hinge mechanisms, and the bending heat-conducting portion disposed inside the hinge mechanism 923 may be located inside or outside the bend of the third component, so that when disposed inside the hinge mechanism 923, the bending heat-conducting portion may be compressed in the expanded state or the folded state to generate the wrinkle portion in the redundant portion, and may be stretched in the folded state or the expanded state to reduce the wrinkle portion, or even flatten the wrinkle portion. Advantageously, the extruded redundant portion can assume any shape within the space allowed by it, without having to be previously machined to a specific, and/or regular, corrugated shape. Therefore, the present application does not set any limit to the shape of the extruded redundant part.

In order to avoid the influence of the wrinkles generated by the redundant parts on other components, such as the wrinkles jamming the hinge mechanism, etc., the heat dissipation devices 900 and 1000 of the present application further include a limiting structure for limiting the movement range or the movement space of the redundant parts. The stopper structure is described in detail below with reference to fig. 11 and 12.

Fig. 11 shows a schematic view of the limiting structures 110, 120 in an embodiment of the invention. The limiting structures 110, 111 are mounted with respect to the above-mentioned bent heat conducting portion 903/1003, as shown in fig. 11 a. The limiting structures 110 and 111 may be limiting frames extending in the Y direction, such as snaps, and the bent heat conduction portion 903/1003 passes through the limiting frames 110 and 111 in the X direction, so that redundant portions thereof are limited by the limiting frames in the Z direction. The height of the stopper structure 110 in the Z direction is L1, and the height of the stopper structure 111 in the Z direction is L2, where L1 and L2 may be set to the same or different heights. In the region where the stopper structures 110, 111 are provided, the moving range in the Z direction of the folded portion generated by bending the redundant portion of the heat conductive portion 903/1003 is substantially within L1 and L2, respectively. In the embodiment shown in fig. 11a, two limiting structures 110, 111 are shown to limit the range of movement of the redundant portion of the bent heat conducting portion 903/1003 at different positions in the X direction. It should be understood that fewer or more retaining structures may be provided on the heat sinks 900, 1000, and that the retaining structures may also have different shapes than those shown in fig. 11 a. Advantageously, in the embodiment of the present application, the bending heat conduction portion 903/1003 is bent or unfolded in the X direction, and since the limiting structures 110 and 111 are arranged in the Y direction and have a narrow width in the X direction, the limiting structures are hardly affected by the stretching or compressing of the cut surfaces when moving along with the bending or unfolding of the bending mechanism.

Fig. 11b is a cross-sectional view of the limiting structure in fig. 11a, and it should be understood that the limiting structure in the embodiment of the present application is a rectangular limiting frame with rounded corners, which is not intended to limit the present application, and in other embodiments, the limiting structure may have other regular or irregular shapes.

Fig. 12 is a schematic diagram illustrating a limiting

structure

120 and 123 according to another embodiment of the invention. Similarly, the limiting

structure

120 and 123 are mounted relative to the bending heat conducting portion 903/1003, and specifically, the limiting

structure

120 and 123 is a magnetic component mounted toward the bending heat conducting portion 903/1003, which further limits the movement of the redundant portion in the bending heat conducting portion 903/1003 by magnetic force to prevent the wrinkle portion generated by the redundant portion from affecting other components in the bendable electronic device.

As shown in fig. 12a, two

magnetic members

120 and 121 are disposed on the structural member 124 along the X direction, and are disposed on a first side of the bending heat conduction portion 903/1003, and respectively limit different regions of the bending heat conduction portion 903/1003, that is, a wrinkle portion generated in the bending heat conduction portion 903/1003 is limited to a certain range on the first side. In one embodiment of the present application, the bent heat conducting portion 903/1003 is a thermally conductive material with magnetic properties or a thermally conductive material containing a magnetic metal, so that the movement of the redundant portion in the Z direction is restricted by the attraction of the

magnetic members

120, 121. In another embodiment of the present application, the structural member 125 is magnetic or includes a magnetic metal so as to attract the

magnetic members

120, 121 to limit movement of the redundant portion of the bent thermally conductive portion 903/1003 in the Z-direction.

As shown in fig. 12b, a plurality of

magnetic members

120, 121, 122, 123 may be provided in the Z-direction. On the structural member 124, two

magnetic members

120, 121 are provided in the X direction, that is, the

magnetic members

120, 121 are provided on the first side of the bent heat conductive portion 903/1003. On the structural member 125, two

magnetic members

122, 123 are provided along the X direction, that is, the

magnetic members

122, 123 are provided on the second side of the bent heat conducting portion 903/1003. Wherein the

magnetic members

120, 122 are substantially aligned in the Z-direction to restrict movement of a portion of the pleats of the folded thermally conductive section 903/1003 in the Z-direction, and the

magnetic members

121, 123 are substantially aligned in the Z-direction to restrict movement of another portion of the pleats of the folded thermally conductive section 903/1003 in the Z-direction.

The

magnetic members

120 and 121 mainly define the folded portions of the bent heat-conducting portion 903/1003 in the first range on the first side, and the

magnetic members

122 and 123 mainly define the folded portions of the bent heat-conducting portion 903/1003 in the second range on the second side.

It should be understood that in the embodiment shown in fig. 12, the magnetic member, or the pair of magnetic members, arranged in the X direction may be one or more, and the number of the arrangement is not limited to the present application.

The

structural members

124 and 125 may be parts of a bendable electronic device, such as a center frame or a bending member, among others. In another embodiment of the present application, the

structural members

124 and 125 may be additionally added to fix the magnetic components on the electronic device, so as to limit the redundant portion of the bending heat-conducting portion 903/1003, and the wrinkles of the limited redundant portion during the bending or unfolding process will not affect other components on the electronic device.

In one embodiment of the present application, the

magnetic members

120, 121, 122, 123 may be a single member extending in the Y direction, or may be a plurality of members arranged in segments in the Y direction. In order to minimize the possible influence of the

magnetic members

120, 121, 122, 123 on the electrical signals of the bendable electronic device, it is preferable to dispose a plurality of magnetic members in segments in the Y direction to limit redundant portions in a plurality of regions where the magnetic members are disposed.

The application provides a heat abstractor relies on the redundant part of the heat conduction part of bending to realize the change of tangent plane length at the in-process of bending or expanding, and itself need not to have elasticity, and simultaneously, this redundant part still provides the heat radiating area of increase, has improved the radiating efficiency, and the heat conduction part of bending that has redundant part strides over the regional heat transfer of bending, can realize electronic equipment's both sides samming to promote the complete machine heat-sinking capability of the electronic equipment of can bending.

Meanwhile, the heat dissipation device provided by the application limits the moving range or space of the redundant part through the limiting structure, avoids the influence on other parts when wrinkles are generated, and particularly does not enable the bending component to be blocked by the redundant part in the bending or unfolding process.

Therefore, the heat dissipation device provided by the application can be applied to various bendable or foldable electronic equipment, the heat conduction material in the heat dissipation device does not need to have the telescopic performance, namely, the heat conduction material can be bent or unfolded along with the whole machine in the bendable electronic equipment, and the section of the inner side of the bend is compressed or stretched on the section of the outer side of the bend, so that the heat dissipation effect is ensured, and meanwhile, the bending reliability is also provided.

It should be understood that the present application does not limit the specific material and/or structure of the first heat conducting portion, the second heat conducting portion and the bent heat conducting portion of the heat dissipating device in the above embodiments in any way, and the heat dissipating device may be a heat dissipating plate formed by a flexible material and/or a heat conducting material and/or a composite material, or a heat dissipating device corresponding to a two-phase structure such as a vapor chamber or a heat pipe.

For example, the heat conducting material in the heat dissipation device may be a liquid or granular material with a high thermal conductivity coefficient, which has a high thermal conductivity coefficient, so that it can conduct heat quickly to achieve the function of heat dissipation.

It should be noted that, in the case that the heat conductive material is a liquid or granular material, the heat conductive material needs to be enclosed in a closed space by other materials to avoid leakage, which causes pollution and damage to the electronic device. In this case, the material for enclosing the heat conductive material may be a flexible material proposed in the present application, and may also be other materials having a certain flexibility, which is not particularly limited in the present application.

Although the exemplary embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and these exemplary embodiments may be used in combination or may be modified in part of the configuration within the scope of the technical idea of the present invention.

Claims

1. A heat dissipation device for bendable electronic equipment, wherein the heat dissipation device comprises:

a bending heat conducting portion, used for bending along with the bending of the electronic device, and unfolding as the electronic device is unfolded;

a first thermally conductive portion extending from the first side of the bent thermally conductive portion for dissipating heat from the electronic device; and

a first fixing mechanism for movably fixing the first heat-conducting portion to the electronic device;

Wherein, the first heat-conducting portion includes a first moving mechanism for cooperating with the first fixing mechanism to move the first heat-conducting portion relative to the first fixing mechanism.

2 . The heat dissipation device according to claim 1 , wherein the first moving mechanism is a through hole on the first heat-conducting portion, the first fixing mechanism is disposed in the through hole, and the The through hole has a gap, and the gap is used to provide a relative movement stroke of the through hole and the first fixing mechanism.

3 . The heat dissipation device of claim 2 , wherein the first fixing mechanism is a protruding portion fixed in the electronic device. 4 .

4 . The heat dissipation device according to claim 3 , wherein the first fixing mechanism has threaded holes and is fixed in the electronic device by screws. 5 .

5 . The heat dissipation device of claim 1 , wherein the first moving mechanism is one of a protrusion and a groove that cooperate with each other, and the first fixing mechanism is the protrusion and groove that cooperate with each other. 6 . The other one of the grooves, wherein the groove is used to provide a movement trajectory of the protrusion.

6. The heat dissipation device according to any one of claims 1-5, characterized in that,

When the bending heat-conducting portion is bent with the electronic device, the first heat-conducting portion moves in a first direction relative to the first fixing mechanism;

When the bent heat-conducting portion is unfolded with the electronic device, the first heat-conducting portion moves in a direction opposite to the first direction relative to the first fixing mechanism.

7 . The heat dissipation device according to claim 1 , wherein the first heat-conducting portion and the bent heat-conducting portion are formed integrally or separately. 8 .

8. The heat dissipation device according to claim 1, wherein the heat dissipation device further comprises:

a second thermally conductive portion extending from a second side of the bent thermally conductive portion, the second side being opposite the first side; and

a second fixing mechanism for movably fixing the second heat-conducting portion to the electronic device, and the second heat-conducting portion includes a second moving mechanism for cooperating with the second fixing mechanism to make the first The two thermally conductive portions move relative to the second securing mechanism.

9 . The heat dissipation device of claim 1 , wherein the heat dissipation device is a vapor chamber, a heat pipe, or a heat dissipation plate. 10 .

10. A heat dissipation device for a bendable electronic device, the electronic device comprising a first support member, a second support member and a bending member located between the two support members, wherein the heat dissipation device is include:

a first thermally conductive portion at least partially covering the first support member;

a second thermally conductive portion at least partially covering the second support member;

a bent thermally conductive portion extending between the first thermally conductive portion and the second thermally conductive portion, and a corrugated portion appears as the bent member is bent or unfolded; and

The first limiting structure is arranged on the first side of the bent heat-conducting portion. When the wrinkled portion appears in the bent heat-conducting portion, the first limiting structure is used to limit the wrinkled portion to the A first range of movement of the first side of the thermally conductive portion is bent.

11. The heat dissipation device of claim 10, wherein the heat dissipation device further comprises:

The second limiting structure is disposed on the second side of the bent thermally conductive portion, the second side is opposite to the first side, and when the folded portion appears in the bent thermally conductive portion, the first Two limiting structures are used to limit a second movement range of the corrugated portion on the second side of the bent heat-conducting portion.

12 . The heat dissipation device of claim 11 , wherein the first limiting structure and the second limiting structure constitute a limiting frame, and the bent heat-conducting portion extends through the limiting frame. 13 .

13 . The heat dissipation device of claim 10 , wherein the first limiting structure comprises a plurality of limiting blocks disposed at intervals on the first side of the bent heat-conducting portion. 14 .

14 . The heat dissipation device of claim 10 , wherein the first limiting structure comprises a magnetic component, and the magnetic component generates a magnetic force on the bent heat-conducting portion. 15 .

15. The heat dissipation device of claim 10, wherein the first limiting structure comprises a magnetic component, and the heat dissipation device further comprises:

A structural member, the structural member is disposed on a second side of the bent heat-conducting portion, the second side is opposite to the first side, and the magnetic component generates a magnetic force on the structural member.

16. The heat dissipating device of claim 11, wherein the first limiting structure comprises a first magnetic component, the second limiting structure comprises a second magnetic component, and the first magnetic component is connected to the first magnetic component. The second magnetic components are correspondingly arranged on the first side and the second side of the bent heat-conducting portion to generate magnetic force with each other.

17. A bendable display device, wherein the bendable display device comprises:

a display panel, including a display area, the display area includes a first display area, a second display area, and a bending area defined between the first display area and the second display area;

A bendable device, the bendable device comprising,

a first support member for supporting a first area of the display panel corresponding to the first display area;

a second support member for supporting a second area of the display panel corresponding to the second display area; and

a bending member connected between the first support member and the second support member to overlap the bending area, and guiding the display panel so that the display panel is bent relative to the bending area or expand; and

A heat dissipation device, located between the display panel and the bendable device, the surface of the heat dissipation device is attached to the surface of the bendable device, and the heat dissipation device is any of the claims 1-9 A heat sink of the kind described.

18. A bendable display device, wherein the bendable display device comprises:

A bendable device, the bendable device comprising,

a bending member, connected between the first support member and the second support member to overlap the bending area, and guiding the display panel to start the display panel to be bent relative to the bending area or expand; and

A heat dissipation device, located between the display panel and the bendable device, the surface of the heat dissipation device is attached to the surface of the bendable device, and the heat dissipation device is any of the claims 10-16 A heat sink of the kind described.

19. A terminal device, comprising a bendable display device, the bendable display device being the bendable display device of claim 17.

20. A terminal device, comprising a bendable display device, the bendable display device being the bendable display device of claim 18.