JP2005321143A - Heat pipe joint, cooling device, electronic appliance and method of manufacturing heat pipe joint - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat pipe joint capable of achieving air-tightness while keeping flexibility. <P>SOLUTION: This heat pipe joint 1A is formed by cylindrically winding a sheet-shaped laminate film 2 composed of a resin layer and a metallic layer. The heat pipe joint 1A comprises a first joint part 5 joined with an outer periphery of an end part of a first heat pipe 3, and a second joint part 6 joined with an outer periphery of an end part of the second heat pipe 4. Further a third joint part 7 is formed to overlap and join end parts of the laminate film 2 in the circumferential direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a heat pipe joint for connecting heat pipes, a cooling device and an electronic device including the heat pipe joint, and a method for manufacturing the heat pipe joint. More specifically, a sheet-like laminated film composed of a resin layer and a metal layer is wound into a cylindrical shape to form a joint, so that airtightness is obtained while providing flexibility.

  In an electronic device such as a personal computer, for example, a cooling device in which a heat sink is directly attached to a heat generating component such as a CPU (central processing unit) is used.

  In recent years, the amount of heat generation has increased with the increasing trend of power consumption of heat-generating components, and there has been a demand for larger heat sinks. For this reason, a cooling device has been proposed in which a heat receiving member and a heat sink attached to a heat-generating component are separated, and the heat receiving member and the heat sink are connected by a heat pipe (see, for example, Patent Document 1).

  In addition, for electronic devices having a movable part such as a notebook personal computer, a cooling device including a joint for connecting heat pipes in a rotatable state has been proposed (for example, see Patent Document 2).

JP 2003-258472 A Japanese Patent Laid-Open No. 10-254583

  In a cooling device in which a heat receiving member and a heat sink are connected by a heat pipe, when the heat receiving member and the heat sink are fixed at different locations, the heat pipe has high rigidity, so it is difficult to securely fix each of the heat receiving member and the heat sink. There is a problem that there is.

  As a result, for example, when the heat receiving member is fixed to the heat generating component, there is a problem that the heat sink cannot be fixed to a predetermined mounting position due to an error of each part, a problem that the heat receiving member cannot be fixed in contact with the heat generating component reliably Arise.

  If the heat receiving member cannot be securely brought into contact with the heat generating component and fixed, there is a problem that the heat conduction efficiency is lowered and the desired cooling capacity cannot be obtained.

  Moreover, in the structure which connects a heat pipe with a joint, since it is difficult to maintain the airtightness in the joint part, it is the structure which connects the sealed heat pipes. For this reason, there was a problem that heat conduction efficiency was low.

  The present invention has been made to solve such a problem, a heat pipe joint capable of obtaining air tightness while having flexibility, a cooling device and an electronic apparatus provided with the heat pipe joint, and Is intended to provide a method of manufacturing a heat pipe joint.

  In order to solve the above-described problems, a heat pipe joint according to the present invention is a heat pipe joint that connects open ends of a heat pipe, and a sheet-like laminated film composed of a resin layer and a metal layer is wound into a cylindrical shape. A first joining portion joined to the outer periphery of the end portion of one heat pipe, a second joining portion joined to the outer periphery of the end portion of the other heat pipe, and a laminated film in the circumferential direction And a third joint part that overlaps and joins the end parts.

  In the heat pipe joint according to the present invention, the laminated film is wound in a cylindrical shape, so that the laminated film and the outer periphery of one heat pipe come into contact with each other in the circumferential direction at the first joint portion. Similarly, in the second joint portion, the outer periphery of the laminated film and the other heat pipe abuts over the circumferential direction.

  In the 1st junction part and the 2nd junction part, airtightness between a lamination film and each heat pipe is maintained by joining a lamination film and each heat pipe with an adhesive, for example.

  In addition, since the laminated film is wound in a cylindrical shape, the laminated films are brought into contact with each other over the extending direction of the heat pipe joint at the third joint portion. In the third joint portion, the laminated films are joined to each other by an adhesive or heat welding, so that the airtightness at the portion where the laminated films overlap is maintained.

  The cooling device according to the present invention incorporates the above-described heat pipe joint, and in the cooling device in which the heat receiving portion and the heat radiating portion are connected by a heat pipe, the heat pipe is connected to the heat receiving portion, and the heat radiating portion. A heat pipe joint that connects at least the open ends of the divided heat pipes, and the heat pipe joint is a sheet-like laminated film composed of a resin layer and a metal layer. A first joint that is wound in a cylindrical shape and joined to the outer periphery of the end of one heat pipe; a second joint that is joined to the outer periphery of the end of the other heat pipe; And a third joint portion that overlaps and joins the end portions of the laminated film in the direction.

  An electronic device according to the present invention includes the above-described cooling device, and in an electronic device including a heat generating component, and a cooling device in which a heat receiving portion and a heat radiating portion attached to the heat generating component are connected by a heat pipe. The pipe is divided into at least a heat pipe connected to the heat receiving part and a heat pipe connected to the heat radiating part, and includes a heat pipe joint that connects open ends of the divided heat pipes. Is formed by winding a sheet-like laminated film made of a resin layer and a metal layer into a cylindrical shape, and is joined to the outer periphery of the end of one heat pipe and the end of the other heat pipe A second joint portion joined to the outer periphery of the film, and a third joint portion for joining the end portions of the laminated film in the circumferential direction so as to overlap each other.

  In the cooling device and the electronic device according to the present invention, the heat receiving part absorbs the heat of the heat-generating component, so that the hydraulic fluid evaporates in one heat pipe on the heat absorption side. As described above, by connecting the heat pipes with a heat pipe joint that maintains hermeticity, the vapor of the hydraulic fluid moves from one heat pipe to the other heat pipe through the heat pipe joint.

  The other heat pipe is connected to the heat dissipating part to become a heat dissipating side, and the heat dissipating heat in the heat dissipating part cools the working fluid vapor and returns to the liquid phase. The hydraulic fluid that has returned to the liquid phase moves from one heat pipe to the other heat pipe through the heat pipe joint.

  The method for manufacturing a heat pipe joint according to the present invention is a method for manufacturing a heat pipe joint that connects open ends of heat pipes, with the end of one heat pipe facing the end of the other heat pipe, A sheet-like laminated film consisting of a resin layer and a metal layer is wound around both the end of one heat pipe and the end of the other heat pipe to form a cylindrical shape, and the laminated film is the outer periphery of the end of one heat pipe. Forming a first joining portion joined to the outer periphery of the other heat pipe and a second joining portion joining to the outer periphery of the end portion of the other heat pipe, and joining the end portions of the laminated films in the circumferential direction to overlap each other A junction is formed.

  In the method for manufacturing a heat pipe according to the present invention, the laminated film and the heat pipe are wound into a cylindrical shape, thereby forming a first joint where the laminated film and one heat pipe are in contact with each other in the circumferential direction. At the same time, a second joining portion is formed in which the laminated film and the other heat pipe are in contact with each other in the circumferential direction.

  Furthermore, the 3rd junction part which the edge parts of a laminated | multilayer film overlap and contact | abut by winding a laminated | multilayer film cylindrically is formed.

  Thereby, joining with each heat pipe and shape shaping | molding of a laminated | multilayer film are performed simultaneously, and a heat pipe coupling is formed.

  According to the heat pipe joint of the present invention, the airtightness of the joint portion between each heat pipe and the joint portion between the laminated films constituting the heat pipe joint is maintained. Therefore, heat exchange performance can be maintained.

  By connecting the heat pipes with such a heat pipe joint of the present invention, in the cooling device and the electronic device according to the present invention, the working fluid evaporated in the heat pipe on the heat absorption side passes through the heat pipe joint and is on the heat radiation side. It becomes possible to move to the heat pipe. Moreover, it becomes possible for the hydraulic fluid which has become a liquid phase in the heat pipe on the heat radiation side to move to the heat pipe on the heat absorption side through the heat pipe joint.

  And since no gas exchange occurs between the inside and outside of the heat pipe, the heat conduction performance between the heat receiving part and the heat radiating part can be maintained, and the desired cooling capacity can be maintained over a long period of time. Can do.

  Furthermore, since the laminated film which comprises a heat pipe joint has a softness | flexibility, the heat pipe joint comprised by winding this laminated film in a cylindrical shape has flexibility.

  Thereby, in the cooling device and electronic device of this invention, a part of heat pipe which connects a heat receiving part and a thermal radiation part becomes a form with flexibility.

  Therefore, in the electronic device of the present invention, the degree of freedom of arrangement of the heat radiating portion is increased with respect to the arrangement of the heat generating components. Further, when the heat receiving portion is attached to the heat generating component and the heat radiating portion is attached to a predetermined attachment position, errors in the attachment position and the like can be absorbed by the heat pipe joint, and reliable attachment can be performed.

  Further, in an electronic device having a movable part, the heat receiving part can be arranged in the casing on one side via the movable part, and the heat radiating part can be arranged in the casing on the other side.

  According to the method for manufacturing a heat pipe joint of the present invention, a laminated film is wound around one heat pipe and the other heat pipe to form a heat pipe joint. Therefore, joining with each heat pipe and shape forming of the laminated film are performed. It can be performed at the same time, and the heat pipe can be connected with a small number of work steps.

  Moreover, since the diameter of the heat pipe joint can be arbitrarily set according to the diameter of the heat pipe, the laminated film can be adhered and adhered to the outer periphery of each heat pipe, and airtightness can be obtained.

  Hereinafter, a heat pipe joint, a cooling device, an electronic device, and a method for manufacturing a heat pipe joint according to the present invention will be described with reference to the drawings.

<Configuration of Heat Pipe Joint of First Embodiment>
FIG. 1 shows a configuration example of a heat pipe joint according to the first embodiment, FIG. 1 (a) is a side view, FIG. 1 (b) is a side sectional view, and FIG. 1 (c) is FIG. It is AA sectional drawing.

  The heat pipe joint 1 </ b> A of the first embodiment is formed by winding a sheet-like laminated film 2 into a cylindrical shape, and connects the first heat pipe 3 and the second heat pipe 4.

  The first heat pipe 3 and the second heat pipe 4 are tubular members made of, for example, copper material having good thermal conductivity. The first heat pipe 3 and the second heat pipe 4 have substantially the same diameter, and end portions on the side to be connected by the heat pipe joint 1A are respectively opened as shown in FIG. An opening 3 a is formed at the end of one heat pipe 3, and an opening 4 a is formed at the end of the second heat pipe 4.

  The inner peripheral surface of one end of the heat pipe joint 1A and the outer peripheral surface of the end on the opening 3a side of the first heat pipe 3 are in contact with each other in the circumferential direction to form the first joint 5. The The width in the extending direction of the heat pipe joint 1A of the first joint 5 is the length of the overlapping portion from the end face on the opening 3a side of the first heat pipe 3 to the end face on the one end side of the heat pipe joint 1A. Become.

  Further, the inner peripheral surface of the other end portion of the heat pipe joint 1A and the outer peripheral surface of the end portion on the opening 4a side of the second heat pipe 4 are in contact with each other in the circumferential direction so that the second joint portion 6 It is formed. The width of the second joint 6 in the extending direction of the heat pipe joint 1A is the length of the overlapping portion from the end face on the opening 4a side of the second heat pipe 4 to the end face on the other end side of the heat pipe joint 1A. It becomes.

  Furthermore, as shown in FIG.1 (c), it is comprised so that the edge parts of the laminated | multilayer film 2 may overlap in the circumferential direction, and the laminated | multilayer film 2 may overlap and contact | abut over the extending direction of 1 A of heat pipe joints. A third joint 7 is formed.

  In each joint part, a laminated film, a heat pipe, and laminated films are joined by adhesion or the like. Thereby, the airtightness in each junction is obtained.

  The laminated film 2 has a multilayer structure composed of a resin layer and a metal layer. For example, a metal foil such as aluminum or a metal thin film is attached to the resin film, or a metal foil or a metal thin film is laminated with at least two resin films. is there. Moreover, it is the structure which vapor-deposited aluminum etc. on the resin film.

  For this reason, the laminated film 2 may have a two-layer structure of a resin layer and a metal layer, or a three-layer structure in which a metal layer is laminated with a resin layer. Furthermore, a multilayer structure may be used. In addition, as a resin film, a polyethylene naphthalate film is used, for example.

  Thus, by using the laminated film 2 having a metal layer as the heat pipe joint 1A, the heat pipe joint 1A itself has high airtightness.

  FIG. 2 is a perspective view showing a shape example of the laminated film 2. When the heat pipe joint 1A is formed by winding the laminated film 2 in a cylindrical shape, the length L1 of the first side of the laminated film 2 that is the length in the extending direction of the heat pipe joint 1A is a predetermined width. The first joining portion 5 and the second joining portion 6 can be formed, and a predetermined gap is formed between the first heat pipe 3 and the second heat pipe 4.

  The length L2 of the second side orthogonal to the first side is longer than the circumferential length L3 of the first heat pipe 3 and the second heat pipe 4, and the laminated film 2 is wound into a cylindrical shape. When the heat pipe joint 1A is formed, the length is set such that the third joint 7 is formed with a predetermined width.

  Thereby, in the 1st junction part 5, the 2nd junction part 6, and the 7th junction part 7, joining, such as adhesion | attachment, can be performed using a predetermined area.

  FIG. 3 is a side view showing an example of use of the heat pipe joint 1A. Since the laminated film 2 uses a resin film as a base material, the laminated film 2 has flexibility and is flexible even if it is wound in a cylindrical shape to constitute the heat pipe joint 1A.

  As a result, the heat pipe joint 1A is deformed while maintaining the hollow structure in the portion between the first joint portion 5 and the second joint portion 6, and for example, the heat pipe joint 1A is bent to form the first heat The direction of the second heat pipe 4 with respect to the pipe 3 can be bent at the portion of the heat pipe joint 1A as indicated by a broken line.

  It is also possible to rotate the second heat pipe 4 in the axial direction with respect to the first heat pipe 3.

  Here, since each joining part is joining by adhesion etc. using a predetermined area, even if it receives the force by bending etc., peeling of a joining part does not generate | occur | produce easily and airtightness is maintained.

<The manufacturing method of the heat pipe joint of 1st Embodiment>
Next, an embodiment of a method for manufacturing a heat pipe joint of the present invention will be described. FIG. 4 is a perspective view showing an example of a method for manufacturing the heat pipe joint of the present embodiment. The method for manufacturing the heat pipe joint of the present invention will be described as a method for manufacturing the heat pipe joint 1A of the first embodiment described above. To do.

  First, the laminated film 2 is cut into a predetermined shape as shown in FIG. Next, an adhesive is applied to the first joint forming portion 5 a on one end side of the laminated film 2. Similarly, an adhesive is applied to the second joint forming portion 6 a on the other end side of the laminated film 2.

  Further, an adhesive is applied to the third joint forming portion 7a. Here, as the adhesive, for example, a thermosetting epoxy adhesive is used. Furthermore, an adhesive having flexibility even after curing is desirable.

  The adhesive is applied to the end of the first heat pipe 3 on the opening 3a side with a predetermined width, and the adhesive is applied to the end of the second heat pipe 4 on the opening 4a side with a predetermined width. It may be applied. Alternatively, an adhesive may be applied to each of the laminated film 2 and each heat pipe.

  Next, as shown to Fig.4 (a), the edge part by the side of the opening 3a of the 1st heat pipe 3 is mounted in the one end side of the laminated film 2, and the 2nd heat is put on the other end side of this laminated film 2. The end of the pipe 4 on the opening 4a side is placed so that the opening 3a of the first heat pipe 3 and the opening 4a of the second heat pipe 4 are opposed to each other.

  And as shown in FIG.4 (b), the laminated | multilayer film 2 is wound cylindrically so that the outer peripheral surface of the 1st heat pipe 3 and the 2nd heat pipe 4 may be followed. At this time, the laminated film 2 is formed into a cylindrical shape so that the surface to which the adhesive is applied to form the third joint 7 overlaps the surface of the laminated film 2.

  When the adhesive is a thermosetting type, the adhesive is cured by heating to a predetermined temperature after winding the laminated film 2 as described above.

  As shown in FIG.4 (c), the laminated film 2 is wound around each heat pipe, and a predetermined part is adhere | attached, and the one end side of the laminated film 2 is the outer periphery of the 1st heat pipe 3 over the circumferential direction. Are bonded to form the first joint 5. Moreover, the other end side of the laminated film 2 is bonded to the outer periphery of the second heat pipe 4 in the circumferential direction, and the second joint portion 6 is formed.

  Further, the end portions of the laminated film 2 are overlapped and bonded in the circumferential direction, and the third joint portion 7 is formed. Thereby, the cylindrical heat pipe joint 1A is formed.

  In addition, although it is necessary to use an adhesive agent for joining the laminated film 2 and each heat pipe, the laminated films 2 can be joined together by heat welding. That is, the 3rd junction part 7 can be formed by uniting the part which the edge parts of the laminated | multilayer film 2 overlapped in the circumferential direction by heat welding.

  As described above, the laminated film 2 is wound around the first heat pipe 3 and the second heat pipe 4 to form the heat pipe joint 1A, thereby joining the heat pipes and shaping the laminated film 2 Can be performed simultaneously. Moreover, since the diameter of 1 A of heat pipe joints can be set arbitrarily according to the diameter of a heat pipe, 1 A of heat pipe joints can be stuck to the outer periphery of each heat pipe.

  And in 1 A of heat pipe joints, in the 1st junction part 5 and the 2nd junction part 6, the laminated | multilayer film 2 and each heat pipe are adhere | attached on the perimeter over the circumferential direction. Here, the length of the portion where the first heat pipe 3 and the heat pipe joint 1A overlap and the length of the portion where the second heat pipe 4 and the heat pipe joint 1A overlap can be ensured sufficiently and sufficiently. The joint portion 5 and the second joint portion 6 have a predetermined width in the extending direction of the heat pipe joint 1A.

  Thereby, ventilation between the outer peripheral surface of the first heat pipe 3 and the inner peripheral surface of the heat pipe joint 1A and between the outer peripheral surface of the second heat pipe 4 and the inner peripheral surface of the heat pipe joint 1A The airtightness between the heat pipe joint 1A and each heat pipe is maintained.

  Moreover, in the 3rd junction part 7, the overlapping parts of the laminated | multilayer film 2 are adhere | attached in the extending direction whole region of 1 A of heat pipe joints. The third joint 7 has a predetermined width in the circumferential direction of the heat pipe joint 1A so that the length of the portion where the laminated films 2 overlap each other in the circumferential direction of the heat pipe joint 1A can be secured sufficiently. have.

  Thereby, there is no ventilation between the laminated film 2 which overlaps, and the airtightness in the part which the laminated film 2 overlapped is hold | maintained.

<Configuration and Manufacturing Method of Heat Pipe Joint of Second Embodiment>
FIG. 5 shows a configuration example of the heat pipe joint according to the second embodiment, FIG. 5 (a) is a partially broken side view, and FIG. 5 (b) is a half sectional view.

  The heat pipe joint of the second embodiment is provided with a reinforcing portion in order to suppress deformation due to bending. Here, in FIG. 5, the same parts as those described in FIG. 1 and the like are denoted by the same reference numerals and detailed description thereof is omitted.

  In the example of FIG. 5A, the heat pipe joint 1B is a double structure of the first laminated film 2a and the second laminated film 2b, and is between the first laminated film 2a and the second laminated film 2b. The wire 8 is sandwiched.

  The first laminated film 2a has the same configuration as the laminated film 2 described with reference to FIG. 1, and is bonded to the first heat pipe 3 at the first joint portion 5, and the second heat pipe at the second joint portion 6. 4 and bonded.

  Although not shown in FIG. 5A, the circumferential ends of the first laminated film 2a are overlapped and bonded by the third bonding portion.

  The wire 8 is a metal or resin wire, and is wound around the first laminated film 2a in a spiral shape, for example, over the extending direction of the heat pipe joint 1B.

  The second laminated film 2b has the same configuration as the laminated film 2 described with reference to FIG. 1, and the wire 8 is covered in a cylindrical shape around the first laminated film 2a around which the wire 8 is spirally wound. . In addition, also in the 2nd laminated film 2b, it is good to superpose | stack the edge part of the circumferential direction, and to perform adhesion | attachment etc.

  As a result, the spiral wire 8 is sandwiched between the first laminated film 2a and the second laminated film 2b so as to be integrated.

  In the above configuration, when the direction of the second heat pipe 4 is bent with respect to the first heat pipe 3 as shown by a broken line as shown in FIG. While maintaining this shape, the second heat pipe 4 is curved according to the angle.

  This prevents the heat pipe joint 1B from being crushed when the heat pipe joint 1B is bent.

  The outline of the manufacturing method of the heat pipe joint 1B will be described. First, the first heat pipe 3 and the second heat pipe 4 are wound around the first laminated film 2a by the procedure described in FIG. The pipe 3 and the second heat pipe 4 are connected.

  Next, the wire 8 is wound spirally around the cylindrical first laminated film 2a. The wire 8 may be bonded to the first laminated film 2a.

  Next, the second laminated film 2b is wound in a cylindrical shape on the first laminated film 2a around which the wire 8 is spirally wound. And the 1st lamination film 2a and the 2nd lamination film 2b are united by adhesion or heat welding.

  Thus, the heat pipe joint 1B is formed in which the spiral wire 8 is sandwiched between the first laminated film 2a and the second laminated film 2b.

  As a modification of the heat pipe joint 1 </ b> B, a position where the wire 8 is wound is a portion between the first joint portion 5 and the second joint portion 6. In this case, the width of the second laminated film 2b along the extending direction of the heat pipe joint 1B may be a width that covers only the portion around which the wire 8 is wound.

  The width of the second laminated film 2b may be longer than the width of the first laminated film 2a, and the second laminated film 2b may be configured to be joined to each heat pipe.

  Further, the annular wire 8 may be wound around a plurality of locations. Moreover, you may abbreviate | omit the coating | cover with the 2nd laminated film 2b by fixing the wire 8 to the 1st laminated film 2a by adhesion | attachment etc.

  In the example of FIG. 5B, the heat pipe joint 1 </ b> C forms the bellows portion 9 by making a part of the laminated film 2 corrugated. The heat pipe joint 1 </ b> C is bonded to the first heat pipe 3 at the first joint 5 and is bonded to the second heat pipe 4 at the second joint 6.

  Although not shown in FIG. 5B, the circumferential ends of the laminated film 2 are overlapped and bonded by the third bonding portion.

  The bellows portion 9 is corrugated along the extending direction of the heat pipe joint 1C. Here, the bellows portion 9 is formed between the first joint portion 5 and the second joint portion 6 so that the joint portion between each heat pipe and the heat pipe joint 1C is in surface contact.

  In the above configuration, for example, when the direction of the second heat pipe 4 is bent with respect to the first heat pipe 3 as shown by a broken line as shown in FIG. The second heat pipe 4 is bent according to the angle of the second heat pipe 4 while maintaining the radial shape.

  This prevents the heat pipe joint 1C from being crushed when the heat pipe joint 1C is bent.

  The outline of the manufacturing method of the heat pipe joint 1C will be described. First, a part of the laminated film 2 described with reference to FIG. And the laminated film 2 is wound around the 1st heat pipe 3 and the 2nd heat pipe 4 in the procedure demonstrated in FIG. 4, and the 1st heat pipe 3 and the 2nd heat pipe 4 are connected.

<Configuration and operation of cooling device and electronic device>
FIG. 6 is a side sectional view showing a configuration example of the cooling device of the present embodiment. The cooling device 11 of the present embodiment has a configuration in which the heat receiving member 12 and the heat sink 13 are connected by a heat pipe, and the heat pipe is divided and connected by the heat pipe joint 1A described above.

  The heat receiving member 12 is an example of a heat receiving portion, and is, for example, a block of copper material having good heat conductivity. The heat sink 13 is an example of a heat radiating portion, and heat radiating fins are arranged side by side. The heat sink 13 has a configuration in which, for example, heat radiation fins are formed of a thin plate material, and a plurality of heat radiation fins are stacked at a narrow pitch.

  The heat pipe is composed of a first heat pipe 3 serving as one heat pipe and a second heat pipe 4 serving as the other heat pipe. The first heat pipe 3 and the second heat pipe 4 are connected by, for example, the heat pipe joint 1A described with reference to FIG.

  The end of the first heat pipe 3 opposite to the side connected by the heat pipe joint 1 </ b> A is connected to the heat receiving member 12. The end of the first heat pipe 3 on the side connected to the heat receiving member 12 is sealed.

  The end of the second heat pipe 4 opposite to the side connected by the heat pipe joint 1 </ b> A is connected to the heat sink 13. The end of the second heat pipe 4 on the side connected to the heat sink 13 is sealed. The heat pipe is evacuated, for example, and a predetermined amount of hydraulic fluid such as pure water is sealed therein.

  The cooling device 11 having such a configuration is mounted on an electronic device 14 such as a personal computer. The electronic device 14 includes, for example, a CPU 15 as a heat generating component. The heat receiving member 12 of the cooling device 11 is attached to the CPU 15. The board 16 on which the CPU 15 is mounted includes an attachment mechanism 17 that uses a coil spring or a leaf spring to press the heat receiving member 12 against the CPU 15 to bring it into surface contact.

  The electronic device 14 includes a housing 18 having a chassis or the like, and the substrate 16 is fixed to the housing 18. Further, the heat sink 13 of the cooling device 11 is fixed to the housing 18 with screws 19 or the like.

  Next, the operation of the cooling device 11 will be described including the operation of the electronic device 14. When the electronic device 14 is operated, the CPU 15 generates heat. Since the heat receiving member 12 of the cooling device 11 is in surface contact with the CPU 15, the heat generated in the CPU 15 is conducted to the heat receiving member 12, and the heat generated in the CPU 15 is absorbed by this heat conduction.

  The heat conducted from the CPU 15 to the heat receiving member 12 is conducted to the heat sink 13 by the first heat pipe 3, the heat pipe joint 1 </ b> A, and the second heat pipe 4.

  That is, when the heat receiving member 12 absorbs the heat of the CPU 15, the hydraulic fluid evaporates in the first heat pipe 3 on the heat absorption side. As described above, by connecting the heat pipes with the heat pipe joint 1A in which the airtightness is maintained, the vapor of the working fluid passes from the first heat pipe 3 to the second heat pipe 4 through the heat pipe joint 1A. Moving.

  The second heat pipe 4 is connected to the heat sink 13 to become a heat radiating side, and by radiating heat with the heat sink 13, the second heat pipe 4 is cooled, and the vapor of the working fluid is cooled and returned to the liquid phase. . The hydraulic fluid that has returned to the liquid phase moves from the second heat pipe 4 to the first heat pipe 3 through the heat pipe joint 1A.

  Due to the phase change and movement of the hydraulic fluid, heat is transferred from the heat receiving member 12 to the heat sink 13.

  In the configuration in which the heat receiving member 12 and the heat sink 13 are connected by a heat pipe, and in the configuration in which the heat sink 13 is fixed to the housing 18 or the like at a position away from the heat receiving member 12, the heat pipe is divided by the heat pipe joint 1A or the like. By connecting, the heat receiving member 12 and the heat sink 13 can be fixed securely.

  That is, by connecting the first heat pipe 3 and the second heat pipe 4 with a heat pipe joint 1A having flexibility, a part of the heat pipe connecting the heat receiving member 12 and the heat sink 13 is flexible. It becomes a form to have.

  Thereby, the attachment of the first heat pipe 13 to the heat receiving member 12, the attachment of the second heat pipe 4 to the heat sink 13, the attachment of the heat receiving member 12 to the CPU 15, and the attachment of the heat sink 13 to the housing 18. At this time, it becomes possible to absorb errors and the like of each part by deformation of the heat pipe joint 1A.

  Accordingly, it is possible to improve the heat conduction efficiency by attaching the heat receiving member 12 in a state of being in surface contact with the CPU 15 reliably. Moreover, since a part of heat pipe becomes a form with flexibility, the handling of the heat pipe in the housing | casing 18 becomes easy, and the freedom degree of arrangement | positioning of the heat sink 13 increases.

  Since the heat pipe joint 1A has airtightness between the inside and outside of the heat pipe while ensuring flexibility, the heat conduction performance between the heat receiving member 12 and the heat sink 13 can be maintained. The cooling capacity of the period can be maintained over a long period of time.

  In the example of FIG. 6, the heat pipe is divided into two parts between the heat receiving member 12 and the heat sink 13. However, the heat pipe may be divided into three parts or more and connected by the heat sink joint 1 </ b> A or the like. Moreover, as a heat pipe joint, the thing of the form shown in FIG. 5, etc. may be sufficient.

  FIG. 7 is a partially broken side view showing a configuration example of an electronic apparatus according to another embodiment. The electronic device 21 of the present embodiment is, for example, a notebook personal computer, in which a first housing 22a and a second housing 22b are connected by a bending movable portion 23 by a hinge portion (not shown), and the first housing The second housing 22b is foldable with respect to 22a.

  The first housing 22a includes a keyboard (not shown) and the like and a CPU 24 as a heat generating component. The second housing 22b includes a display (not shown) and a heat sink 25.

  In order to dissipate the heat of the CPU 24 mounted on the first housing 22a by the heat sink 25 mounted on the second housing 22b, a heat receiving member 26 attached to the CPU 24 and a cooling device 27 using a heat pipe are provided. Prepare.

  In the cooling device 27, the heat pipe is constituted by the first heat pipe 3 and the second heat pipe 4, and the first heat pipe 3 is connected to the heat receiving member 26. Further, the second heat pipe 4 is connected to the heat sink 25.

  Then, the first heat pipe 3 and the second heat pipe 4 are connected by a heat pipe joint 1A or the like. A connection location by the heat pipe joint 1A is arranged at a movable portion by the bending movable portion 23.

  In the electronic device 21 configured as described above, the cooling operation by the heat receiving member, the heat pipe, and the heat sink is the same as the operation described in FIG. In the electronic device 21, the second housing 22b is used at an arbitrary angle with respect to the first housing 22a.

  Here, by connecting the first heat pipe 3 and the second heat pipe 4 with a heat pipe joint 1A having flexibility, the heat pipe joint 1A can be selected according to the use angle of the second housing 22b. Is curved.

  Thereby, heat conduction becomes possible between the first heat pipe 3 and the second heat pipe 4 regardless of the use angle of the second casing 22b. In addition, the second housing 22b can be folded with respect to the first housing 22a.

  Therefore, the heat of the CPU 24 mounted on the first casing 22a that is one casing connected by the bending movable part 23 is transferred to the heat sink 25 that is mounted on the second casing 22b that is the other casing. A configuration to dissipate heat can be realized. Therefore, the size of the heat sink 25 and the degree of freedom of arrangement increase.

  Since the heat pipe joint 1A has airtightness between the inside and outside of the heat pipe while having flexibility, the heat conduction performance between the heat receiving member 26 and the heat sink 25 can be maintained. The cooling capacity of the period can be maintained over a long period of time.

  In the example of FIG. 7, the heat pipe is divided into two parts between the heat receiving member 26 and the heat sink 25. However, the heat pipe may be divided into three parts or more and connected by the heat sink joint 1A or the like. Moreover, as a heat pipe joint, the thing of the form shown in FIG. 5, etc. may be sufficient.

  The present invention can be applied to a cooling device or the like for an electronic device installed in a moving body such as a vehicle.

The structural example of the heat pipe joint of 1st Embodiment is shown, FIG. 1 (a) is a side view, FIG.1 (b) is side sectional drawing, FIG.1 (c) is AA of FIG.1 (a). It is sectional drawing. It is a perspective view which shows the example of a shape of a laminated film. It is a side view which shows the usage example of a heat pipe joint. It is a perspective view which shows the example of a manufacturing method of the heat pipe joint of this Embodiment. The structural example of the heat pipe joint of 2nd Embodiment is shown, Fig.5 (a) is a partially broken side view, FIG.5 (b) is a half sectional view. It is a sectional side view which shows the structural example of the cooling device of this Embodiment. It is a partially broken side view which shows the structural example of the electronic device of other embodiment.

Explanation of symbols

1A to 1C ... heat pipe joint, 2 ... laminated film, 2a ... first laminated film, 2b ... second laminated film, 3 ... first heat pipe, 3a ... -Opening part, 4 ... 2nd heat pipe, 4a ... Opening part, 5 ... 1st junction part, 5a ... 1st junction part formation location, 6 ... 2nd Junction part, 6a ... 2nd junction part formation part, 7 ... 3rd junction part, 7a ... 3rd junction part formation part, 8 ... wire, 9 ... bellows part, DESCRIPTION OF SYMBOLS 11 ... Cooling device, 12 ... Heat receiving part, 13 ... Heat sink, 14 ... Electronic equipment, 15 ... CPU, 16 ... Board | substrate, 17 ... Mounting mechanism, 18 ... Housing, 19 ... Screw, 21 ... Electronic equipment, 22a ... First housing, 22b ... Second housing, 23 ... Bending movable part, ... CPU, 25 ... heat sink, 26 ... heat-receiving member, 27 ... cooling device

Claims (20)

In the heat pipe joint that connects the open ends of the heat pipe,
Constructed by winding a sheet-like laminated film consisting of a resin layer and a metal layer into a cylindrical shape,
A first joining portion joined to the outer periphery of one end of the heat pipe;
A second joint joined to the outer periphery of the other end of the heat pipe;
A heat pipe joint, comprising: a third joint portion that overlaps and joins the end portions of the laminated film in the circumferential direction. The heat pipe joint according to claim 1, wherein the first joint, the second joint, and the third joint are joined by adhesion. The heat pipe joint according to claim 1, wherein the first joint and the second joint are joined by adhesion, and the third joint is joined by heat welding. The heat pipe joint according to claim 1, further comprising a reinforcing portion that maintains a shape of a portion between the first joint portion and the second joint portion. The heat pipe joint according to claim 4, wherein the reinforcing portion is configured by winding a wire. The heat pipe joint according to claim 4, wherein the reinforcing portion is configured by forming a bellows portion between the first joint portion and the second joint portion. In the cooling device in which the heat receiving part and the heat radiating part are connected by a heat pipe,
The heat pipe is at least divided into a heat pipe connected to the heat receiving portion and a heat pipe connected to the heat radiating portion,
Comprising a heat pipe joint for connecting the open ends of the divided heat pipes;
The heat pipe joint is
Constructed by winding a sheet-like laminated film consisting of a resin layer and a metal layer into a cylindrical shape,
A first joining portion joined to the outer periphery of one end of the heat pipe;
A second joint joined to the outer periphery of the other end of the heat pipe;
A cooling device, comprising: a third bonding portion that overlaps and bonds the end portions of the laminated film in the circumferential direction. The cooling device according to claim 7, wherein the first joint portion, the second joint portion, and the third joint portion are joined by bonding. The cooling device according to claim 7, wherein the first joint portion and the second joint portion are joined by bonding, and the third joint portion is joined by thermal welding. The cooling device according to claim 7, further comprising a reinforcing portion that holds a shape of a portion between the first joint portion and the second joint portion. The cooling device according to claim 10, wherein the reinforcing portion is configured by winding a wire. The cooling device according to claim 10, wherein the reinforcing portion is configured by forming a bellows portion between the first joint portion and the second joint portion. Heat-generating parts,
In an electronic apparatus comprising a heat receiving part attached to the heat generating component and a cooling device in which a heat radiating part is connected by a heat pipe
The heat pipe is at least divided into a heat pipe connected to the heat receiving portion and a heat pipe connected to the heat radiating portion,
Comprising a heat pipe joint for connecting the open ends of the divided heat pipes;
The heat pipe joint is
Constructed by winding a sheet-like laminated film consisting of a resin layer and a metal layer into a cylindrical shape,
A first joining portion joined to the outer periphery of one end of the heat pipe;
A second joint joined to the outer periphery of the other end of the heat pipe;
An electronic apparatus comprising: a third bonding portion that overlaps and bonds end portions of the laminated film in a circumferential direction. The electronic device according to claim 13, wherein the first joint portion, the second joint portion, and the third joint portion are joined by adhesion. The electronic device according to claim 13, wherein the first joint portion and the second joint portion are joined by adhesion, and the third joint portion is joined by thermal welding. The electronic apparatus according to claim 13, further comprising a reinforcing portion that maintains a shape of a portion between the first joint portion and the second joint portion. The electronic device according to claim 16, wherein the reinforcing portion is configured by winding a wire. The electronic device according to claim 16, wherein the reinforcing portion is configured by forming a bellows portion between the first joint portion and the second joint portion. In the manufacturing method of the heat pipe joint that connects the open ends of the heat pipes,
One end of the heat pipe and the other end of the heat pipe are opposed,
A sheet-like laminated film composed of a resin layer and a metal layer is wound around both the end of the one heat pipe and the end of the other heat pipe as a cylindrical shape,
The laminated film forms a first joint that joins the outer periphery of the end of the one heat pipe, and a second joint that joins the outer periphery of the end of the other heat pipe,
The manufacturing method of the heat pipe joint characterized by forming the 3rd junction part which overlaps and joins the edge parts of the said laminated | multilayer film in the circumferential direction. The adhesive is preliminarily applied to a part where the first joint part is formed, a part where the second joint part is formed, and a part where the third joint part is formed. The manufacturing method of the heat pipe joint of 19.

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